TW200839972A - Electronic device, electronic device-mounted electronic apparatus, electronic device-mounted article and method of manufacturing electronic device - Google Patents

Abstract

It is an object of the present invention to provide an electronic device or the like that reduces bending stress applied to a circuit chip and prevents disconnection of a conductor pattern. The device includes: a base 11; a conductor pattern 12 formed on the base; and a circuit chip 13 electrically connected to the conductor pattern 12. The device further includes a circular reinforcing member 16 that is disposed on the base 11 while surrounding the circuit chip 13 and has such an inner structure that plural concentric circles 16a and 16b are formed. The device further includes a sealing body 15a that fills the inside of the reinforcing member 16 while covering an upper part of the circuit chip 13 and seals the circuit chip 13 on the base 11.

Description

200839972 九、發明說明： 發明領域 本發明係有關於電子裝置、安裝有電子裝置之電子機 5 器、設有電子裝置之物品及電子裝置之製造方法。 【先前技術】 發明背景 迄今廣為人知的是構成為在印刷線路板等基體上搭載 電路晶片之電子裝置’此種電子裝置係運用在内建於電子 10 機器以控制該電子機器或作成個體與外部機器交換資訊之 用途。已知電子裝置之一例係利用電波以非接觸方式與讀 寫器所代表之外部機器進行資訊交換之各種RFID(射頻識 別，Radio Frequency roentification)標籤，該RFID標籤之一 種係揭示有構成為於由塑膠或紙等所構成之基片上搭載電 15 波通信用之導線(conduct〇r pattern)與1C晶片者(例如參照曰 本專利特開2001 — 156110號公報）。一般認為此種形式之 RFID標籤的利用形態係黏貼在物品等並藉由與外部機器交 換有關該物品之資訊而進行物品之識別等。 第1圖係顯示習知技藝之RFID標籤之一例之模式截面 20 圖。 在此所示之RFID標籤90係於可彎折且例如由pet膜等 所構成之基體91上形成由導線所構成之天線92,同時於其 上搭載電路晶片93。該電路晶片93係裝入用以經由天線92 與外部機器間傳達資訊之電路，且該電路晶片93之形成於 200839972 其下面之連接端子93a係藉由軟焊等與天線92電連接，更藉 由接著劑94固定於基體91上。又，kRFID標籤9〇之基體91 上設置有覆蓋電路晶片93之封裝劑95及配置成包圍電路晶 片93之環狀補強體96，再者，構成為組合基體91、天線％、 5電路晶片93、封裝劑95及補強體96之標籤本體全體係藉由 覆盡材97來覆蓋。於封裝劑95中，填埋環狀補強體96内侧 之内侧部分95a係覆蓋電路晶片93上部，且藉由基體91封裝 電路晶片93。 RHD標籤90係例如裝設、利用在衣服等柔軟材質之物 1〇品上，且清洗時會有彎折之情形產生。RFID標籤90係於電 路晶片93之周邊設置封裝劑95及補強體96並保護電路晶片 93 ’因此’即使彎折亦可防止電路晶片93本身之破裂或剝 離。 然而’於RFID標籤9〇中，雖然可藉由補強體96來保護 15電路晶片93，然而卻有補強體％周邊之部分被破壞之虞， 舉例g之，若彎曲應力作用於基體91，則應力會集中於天 線92自補強體96露出之部分（第丨圖中以虛線的圓所示之部 分）而有天線92斷線之虞。 又，此種因補強體96周邊部分之破壞所造成之問題並 20不限於RFID標_，而是在柔軟性屈指可數的基體上搭 電路晶片之電子裝置中共同之問題。 β 【明内】 發明之揭示 有鑑於前述問題，本發明之目的係提供可降低對電路 6 200839972 曰曰片之彎曲應力且亦可避免導線斷線之電子裝置、安裝有 該電子裝置之電子機器、設有該電子裝置之物品及電子裝 置之製造方法。 用以運成1Γ述目的之本發明200839972 IX. Description of the Invention: Field of the Invention The present invention relates to an electronic device, an electronic device mounted with the electronic device, an article provided with the electronic device, and a method of manufacturing the electronic device. [Background of the Invention] BACKGROUND OF THE INVENTION It is heretofore known that an electronic device configured to mount a circuit chip on a substrate such as a printed wiring board is used in an electronic device to control the electronic device or to manufacture an individual and an external device. The purpose of exchanging information. One example of a known electronic device is a variety of RFID (Radio Frequency Roentification) tags that use a radio wave to exchange information with an external device represented by a reader/writer in a non-contact manner, and a type of the RFID tag is disclosed as being composed of A conductor for conducting a 15-wave communication and a 1C chip are mounted on a substrate made of plastic or paper (see, for example, Japanese Patent Laid-Open Publication No. 2001-156110). It is considered that the use form of the RFID tag of this type is attached to an article or the like and the article is identified by exchange of information on the article with an external device. Fig. 1 is a schematic cross-sectional view showing an example of an RFID tag of the prior art. The RFID tag 90 shown here is formed by forming an antenna 92 composed of a wire on a base 91 which is bendable and formed, for example, of a PET film, and the like, and a circuit wafer 93 is mounted thereon. The circuit chip 93 is provided with a circuit for transmitting information between the external device via the antenna 92, and the connection terminal 93a of the circuit chip 93 formed at 200839972 is electrically connected to the antenna 92 by soldering or the like. It is fixed to the base 91 by an adhesive 94. Further, the base 91 of the kRFID tag 9 is provided with an encapsulant 95 covering the circuit wafer 93 and an annular reinforcing body 96 disposed to surround the circuit wafer 93. Further, the combined substrate 91, the antenna %, and the 5 circuit chip 93 are formed. The label body of the encapsulant 95 and the reinforcing body 96 is covered by the covering material 97. In the encapsulant 95, the inner portion 95a of the inside of the buried annular reinforcing body 96 covers the upper portion of the circuit wafer 93, and the circuit wafer 93 is encapsulated by the substrate 91. The RHD label 90 is installed, for example, on a soft material such as clothes, and is bent at the time of washing. The RFID tag 90 is provided with an encapsulant 95 and a reinforcing body 96 around the circuit chip 93 and protects the circuit chip 93'. Therefore, even if it is bent, the circuit wafer 93 itself can be prevented from being broken or peeled off. However, in the RFID tag 9 ,, although the 15 circuit wafer 93 can be protected by the reinforcing body 96, the peripheral portion of the reinforcing body % is destroyed. For example, if the bending stress acts on the substrate 91, The stress is concentrated on the portion of the antenna 92 exposed from the reinforcing body 96 (the portion indicated by the dotted circle in the figure) and the antenna 92 is broken. Further, such a problem caused by the destruction of the peripheral portion of the reinforcing body 96 is not limited to the RFID tag, but is a problem common to electronic devices in which a circuit chip is mounted on a flexible flexible substrate. β [Brief Description of the Invention] In view of the foregoing, it is an object of the present invention to provide an electronic device capable of reducing the bending stress on the cymbal of the circuit 6 200839972 and also avoiding wire breakage, and an electronic device to which the electronic device is mounted And an article for manufacturing the electronic device and an electronic device. The invention for carrying out the purpose of 1 description

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20 體，導線，係佈線在前述基體上者；電路晶片，係與前述 ^線電連接者；補強體，係於前述基體上配置成包圍前述 电路晶片並具有環狀之外形，且内部結構具有相互呈同心 =複數環者；及封裝體，係填埋前述補鍾之_並覆蓋 則述電路晶片上部，且於前述基體上封裝該電路晶片者。 由於本發明電子裝置之封裝體係具有填埋環狀補強體 之内侧亚覆蓋電路晶片上部且於前述基體上封裝電路晶片 之結構，因此即使基體彎折，應力亦不會作用於電路晶片， ^可防止電路晶片之破裂或剝離。再者，由 =中配置成包圍電路晶片之補強體係内部結構具有相互 環，因此，因電子裝置之彎折而作用之應力 均刀政至稷數環，故可抑制導線之斷線。 由接it於前述本發明之電子裝置中，前述補強體宜藉 由接者劑填埋前述複數環之相互間。 於藉由接著劑填埋複數環之相互間之結構中，除了補 強體之複數環以外，因電子 ’、 散至複數環間之接著劑。、3❿作用之應力亦會分 又，於前述本發明之電子裝置 _ 複數環中最外月夕, 別述補強體之前述 柔軟。卜周0宜相較於剩餘之環中至少任-者之環 7 200839972 可進一步地 於電子裝置遍及全體而彎折時，應力特別容易作用於 補強體取外周之環，藉由使最相之環柔軟， 降低作用於最外周之環的應力。 t二前述本發明之電子裝置中，前述補_之前述 複數故中取外周之㈣環徑向寬度可相較於剩餘之環中至 少任产者之_寬度狹窄，$，於電子裝置中，前述補強 體之前述複數環中最外周之環於前述基體之厚度方向之厚 度可相較於剩餘之環狀補強部之至少任_者之環的厚度 薄0 10 冑由使最外周之環的環徑向寬度狹窄或厚度削薄，而 即使藉由同-材料來形成複數環，亦可使最外周之環柔軟。 又，於前述本發明之電子裝置中，前述補強體宜旦有 連接部，且該連接部連接前述複數環中至少二個環，並藉 由與環之材料相同的材料一體地形成。 15 #由相同的材料~體地形成二個環與連接該環之連接 部時，於電子裝置之製造中只要配置該一體化之構件即可 使二個環相互地以適當間隔定位並同時地配置，因此電子 裝置之製造會變得容易。 又，财述本發明之前述電子裝置可為RFm標籤，且該 2〇 RHD標籤係使前述導線具有作為通信用天線之機能，並使 前述電路晶片經由該導線進行無線通信者。 由於在安裝於商品或卡#之狀S下制之RFID標籤 、考折之情形多’因此本發明之電子裝置適合於RFID標籤。 又，用以達成爾述目的之本發明之電子機器係具有電 8 200839972 子裝置及安裝有該電子裝置且藉由該電子裝置之動作來驅 動之機器本體部，又，前述電子裝置包含有：基體；導線， 係佈線在前述基體上者；電路晶片，係與前述導線電連接 者；補強體，係於前述基體上配置成包圍前述電路晶片並 5具有環狀之外形，且内部結構具有相互呈同心之複數環 者；及封裝體，係填埋前述補強體之内侧並覆蓋前述電路 晶片上部，且於前述基體上封襄該電路晶片者。a body, a wire, is wired on the substrate; a circuit chip is electrically connected to the wire; and a reinforcing body is disposed on the substrate to surround the circuit chip and has an annular shape, and the internal structure has And the package body is filled with the above-mentioned supplementary clock and covers the upper portion of the circuit wafer, and the circuit chip is packaged on the substrate. Since the package system of the electronic device of the present invention has the structure of filling the upper portion of the inner sub-cover circuit of the annular reinforcing body and encapsulating the circuit wafer on the substrate, the stress does not act on the circuit chip even if the substrate is bent. Prevent cracking or peeling of the circuit chip. Furthermore, the internal structure of the reinforcing system which is arranged to surround the circuit chip by = has a mutual ring. Therefore, since the stress acting on the bending of the electronic device is a knife-to-number loop, the wire breakage can be suppressed. In the electronic device of the present invention, the reinforcing body should be filled with the plurality of rings by the splicing agent. In the structure in which the plurality of rings are buried by the adhesive, in addition to the complex ring of the reinforcing body, the electrons are scattered to the inter-ring of the plurality of rings. The stress of the action of 3 ❿ is also divided. In the outermost moon of the above-mentioned electronic device _ plural ring, the aforementioned soft body of the reinforcing body is soft.卜周0 is preferred to the ring of at least any of the remaining rings. 7 200839972 Further, when the electronic device is bent over the whole, the stress is particularly easy to act on the outer ring of the reinforcing body, by making the most The ring is soft, reducing the stress on the outermost ring. In the electronic device of the present invention, the radial width of the (four) ring of the outer plurality of the aforementioned plurality of complements may be narrower than the width of at least any of the remaining rings, $, in the electronic device, The thickness of the outermost circumference of the plurality of rings of the reinforcing body in the thickness direction of the base body may be thinner than the thickness of the ring of at least any of the remaining annular reinforcing portions by 10 10 胄 from the outermost circumference of the ring The radial width of the ring is narrow or the thickness is thinned, and even if the plural ring is formed by the same material, the outermost ring can be made soft. Further, in the electronic device of the present invention, the reinforcing body preferably has a connecting portion, and the connecting portion connects at least two of the plurality of rings, and is integrally formed by the same material as the material of the ring. 15 # When the two materials are integrally formed from the same material to the connection portion connecting the rings, the two components can be positioned at an appropriate interval and simultaneously at the same time as long as the integrated member is disposed in the manufacture of the electronic device. Configuration, so the manufacture of electronic devices will become easy. Further, the electronic device of the present invention may be an RFm tag, and the 2R RHD tag has a function as a communication antenna for the lead wire, and the circuit chip is wirelessly communicated via the wire. The electronic device of the present invention is suitable for an RFID tag because of the fact that the RFID tag is manufactured under the article S of the product or the card. Moreover, the electronic device of the present invention for achieving the object of the present invention has an electric device 8 200839972 sub-device and a main body portion to which the electronic device is mounted and driven by the operation of the electronic device, and the electronic device includes: a circuit; the wire is wired on the substrate; the circuit chip is electrically connected to the wire; and the reinforcing body is disposed on the substrate to surround the circuit chip and has an annular shape, and the internal structure has mutual a plurality of concentric rings; and a package for filling the inside of the reinforcing body and covering the upper portion of the circuit chip, and sealing the circuit chip on the substrate.

於本么明之电子機器中，舉例言之，即使於電子機器 本身彎折或是修理或檢查時電子裝置彎折，亦可抑制導: 10之斷線，因此可提升電子機器之可靠性。In the electronic device of Benming, for example, even if the electronic device is bent or repaired or inspected, the electronic device is bent, and the wire breakage of the guide 10 can be suppressed, thereby improving the reliability of the electronic device.

又’用以達成前述目的之本發明之設有電子袭置之物 α 口係由電子裝置及裝設有該電子裝置之被裝設物品所構 成，又，前述電子裝置包含有：基體；導線，係佈線在前 达基體上者；電路晶片，係與前述導線電連接者；補強體， 15係於前述基體上配置成包圍前述電路晶片並具有環狀之外 开 /且内部結構具有相互呈同心之複數環者；及封裝體， 雜埋前述補強體之内侧並覆蓋前述電路晶片上部，且於 前述基體上封裝該電路晶片者。 例如裂設有R™標籤等電子裝置之物品會有連電子 2〇裝置-起彎折之情形，然而，此時亦可抑制電路晶片之破 裂或剝離及導線之斷線。 又 用以達成刖述目的之本發明之電子裝置之製造方 法包含有：連接程序，係於佈線有導線之基體_導線上 連接電路晶片者；接著_布程序，錄布接著劑並覆蓋 9 200839972 前述電路晶片上部者；補強體配置程序，係於前述基體上 將具有環狀之外形且内部結構具有複數環之補強體配置成 包圍前述電路晶片，且使前述複數環相互呈同心，並作成 前述接著劑至少填埋前述補強體之内侧之狀態者；及硬化 5程序’係藉由使前述接著劑硬化，使該接著劑於前述基體 上封裝前述電路晶片，同時使前述補強體固定於該基體上 者。 在本發明之電子裝置之製造方法中，於前述基體上將 補強體配置成包圍電路晶片且使複數環相互呈同心，並使 10填埋補強體内側之狀態之接著劑硬化，藉此，可製造應力 會分散至複數環之電子裝置。 如前所述，若依據本發明，則可避免彎曲應力集中於 電路晶片，且亦可避免應力集中於導線。 圖式簡單說明 15 第1圖係顯示習知技藝之RFID標籤之一例之模式截面 圖。 第2圖係顯示為本發明第1實施形態之^^仍標籤之截 面圖。 第3圖係顯示為本發明實施形態之RFID標籤之平面 20 圖。 第4(a)至4(e)圖係說明第2及3圖所示之RFID標籤之製 造方法圖。 第5圖係顯示為本發明電子裝置之第2實施形態之 RFID標籤之平面圖。 200839972 第6圖係顯示為本發明電子裝置之第3實施形態之 RFID標籤之戴面圖。 第7圖係顯示為本發明電子裝置之第4實施形態之 RFID標戴之截面圖。 5 第8圖係說明裝設有RFID標籤之衣服之製造方法圖。 第9圖係顯示作為本發明一實施形態之印刷電路板裝 置及女裝有該印刷電路板裝置之桌上計算器之概略圖。 t實施方式2 發明之較佳實施形態 ίο 以下參照圖式說明本發明之實施形態。 第2及3圖係分別顯示為本發明電子裝置之第1實施形 態之RFID標籤之截面圖及平面圖。另，於第2圖之截面圖 中’為了使結構清楚易見，相較於第3圖之平面圖而放大顯 示RFID標籤之中央部分。 15 該第2及3圖所示之RFID標籤10係封裝體及補強體之 結構與第1圖所示之RFID標籤90不同，除了該點以外，其他 則與第1圖所示之RFID標籤9Ό相同，即，於可撓性之基體11 上形成天線12同時搭載電路晶片13，且藉由接著劑14固定 該電路晶片13。又，於基體丨丨上設置有覆蓋電路晶片13上 20部之封裝劑15及配置成包圍電路晶片13之環狀補強體16， 再者’構成為組合基體11、天線12、電路晶片13、封裝劑 15及補強體16之裝置全體係藉由覆蓋材π來覆蓋。另，於 第3圖之平面圖中，為了内部結構之易見度，故省略覆蓋材 17之圖示。 11 200839972 補強體16係具有由配置成相互呈同心之内周側之内周 • 環16a與外周側之外周環16b二個圓環所構成之内部結構， 同時具有圓環狀之外形。外周環偷及内周環16a係由不同 種類之樹脂材料所構成，且外周環16b係藉由比内周環“a ' 5錄之材料來形成，舉例言之，内周環16a之材料係採用壓 克力（PMAA)，然而，除了壓克力以外，亦可採用如聚縮醛 (POM)、聚苯硫_(PPS)，又，舉例言之，外周環⑽之材料 Φ 係採用比内周環16a之材料柔軟之聚丙烯(PP)，然而，除了 $丙烯以外，亦可採用如ABS樹脂(ABS)、缝乙浠樹脂 10 (PVC)。又赘内周環⑽及外周環偷之材料亦可採用含有同 一種類之樹脂作為主成分且可依據添加物之種類或添加量 來調整柔軟度之材料。 封裝劑15係劃分成填埋補強體16，内側之内側部i5a、填 埋内周環16a與外周環16b間之中間部15b、自外侧包圍外侧 15部15c之外側部15c。於封裝劑15中，填埋補強體16内側之 • Θ侧部丨域覆蓋電路晶片13上部，且於基體11上封裝電路 晶片13。 在此，天線I2係相當於本發明中所述之導線之一例， 料劑15之_則域彳目纽本㈣切狀補強體之 • 20 -例，中間部15b係相當於本發明中所述之接著劑之一例， 内周環16a與外周環16b則相當於本發明中所述之環之一 例’又’外周環係相當於本發明中所述之最外周之環之 一例。 該RFID標籤10係由於配置成包圍電路晶片之補強體 12 200839972 16具有内周環16a與外周環16b，且因RFID標籤10之彎折而 作用之應力會分散至内周環16a與外周環16b，因此，町抑 制應力集中於天線12自内周環16a露出之部分及應力集中 於自外周環16b露出之部分兩者，並可防止天線丨2之斷線。Further, the electronic device-attached substance α of the present invention for achieving the above object is composed of an electronic device and an article to be mounted on which the electronic device is mounted, and the electronic device includes: a substrate; a wire The circuit is electrically connected to the front substrate; the circuit chip is electrically connected to the wire; the reinforcing body 15 is disposed on the substrate to surround the circuit chip and has an annular shape and the internal structure has mutual a plurality of concentric rings; and a package, the inner side of the reinforcing body is buried and covers the upper portion of the circuit chip, and the circuit chip is packaged on the substrate. For example, an article in which an electronic device such as an RTM tag is spliced may be bent by an electronic device, but at this time, cracking or peeling of the circuit chip and disconnection of the wire may be suppressed. Further, the manufacturing method of the electronic device of the present invention for achieving the purpose of the present invention includes: a connection program for connecting a circuit chip to a substrate on which a wire is wired and a wire; and then a filming procedure, recording an adhesive and covering 9 200839972 In the upper portion of the circuit chip, the reinforcing body is disposed on the substrate, and the reinforcing body having a ring shape and having a plurality of rings in the internal structure is disposed to surround the circuit chip, and the plurality of rings are concentric with each other, and the foregoing The adhesive agent at least fills the inner side of the reinforcing body; and the hardening 5 program' is to cure the adhesive by causing the adhesive to encapsulate the circuit wafer on the substrate while fixing the reinforcing body to the substrate The above. In the method of manufacturing an electronic device according to the present invention, the reinforcing body is disposed on the substrate so as to surround the circuit wafer, and the plurality of rings are concentric with each other, and the adhesive in the state of filling the inside of the reinforcing body is hardened. The manufacturing stress is dispersed to the electronic device of the plurality of rings. As described above, according to the present invention, it is possible to prevent the bending stress from being concentrated on the circuit wafer, and also to avoid stress concentration on the wire. BRIEF DESCRIPTION OF THE DRAWINGS 15 Fig. 1 is a schematic cross-sectional view showing an example of an RFID tag of the prior art. Fig. 2 is a cross-sectional view showing the label of the first embodiment of the present invention. Fig. 3 is a plan view showing the plane of the RFID tag according to the embodiment of the present invention. Figures 4(a) through 4(e) are diagrams showing the method of manufacturing the RFID tag shown in Figures 2 and 3. Fig. 5 is a plan view showing the RFID tag of the second embodiment of the electronic device of the present invention. 200839972 Fig. 6 is a perspective view showing the RFID tag of the third embodiment of the electronic device of the present invention. Fig. 7 is a cross-sectional view showing the RFID tag of the fourth embodiment of the electronic device of the present invention. 5 Fig. 8 is a view showing a manufacturing method of clothes equipped with an RFID tag. Fig. 9 is a schematic view showing a printed circuit board device according to an embodiment of the present invention and a desktop calculator having the printed circuit board device. t EMBODIMENT 2 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figs. 2 and 3 are a cross-sectional view and a plan view, respectively, showing the RFID tag of the first embodiment of the electronic device of the present invention. Further, in the cross-sectional view of Fig. 2, in order to make the structure clear, the central portion of the RFID tag is enlarged as compared with the plan view of Fig. 3. The structure of the RFID tag 10 package and the reinforcing body shown in Figs. 2 and 3 is different from the RFID tag 90 shown in Fig. 1, except for this point, the other is the RFID tag 9 shown in Fig. 1. Similarly, the antenna 12 is formed on the flexible base 11 while the circuit wafer 13 is mounted, and the circuit wafer 13 is fixed by the adhesive 14. Further, a package 15 covering the 20 portions of the circuit wafer 13 and an annular reinforcing body 16 disposed to surround the circuit wafer 13 are provided on the substrate, and the combination of the substrate 11, the antenna 12, and the circuit chip 13 is provided. The entire system of the encapsulant 15 and the reinforcing body 16 is covered by the covering material π. Further, in the plan view of Fig. 3, the illustration of the covering member 17 is omitted for the visibility of the internal structure. 11 200839972 The reinforcing body 16 has an inner structure composed of two rings of the inner circumference side ring 16a and the outer circumference side outer circumference ring 16b which are disposed on the inner peripheral side which are concentric with each other, and has an annular outer shape. The outer peripheral ring stealing and inner peripheral ring 16a is composed of different kinds of resin materials, and the outer peripheral ring 16b is formed by a material recorded by the inner circumferential ring "a'5. For example, the inner peripheral ring 16a is made of a material. Acrylic (PMAA), however, in addition to acrylic, such as polyacetal (POM), polyphenylene sulfide (PPS), and, by way of example, the material of the outer ring (10) is Φ compared to the inner circumference. The material of the ring 16a is soft polypropylene (PP). However, in addition to propylene, materials such as ABS resin (ABS), acetal resin 10 (PVC), and inner ring (10) and outer ring are also used. It is also possible to use a material containing the same kind of resin as a main component and adjusting the softness depending on the type or amount of the additive. The encapsulant 15 is divided into a landfill reinforcing body 16, an inner side portion i5a, and a landfill inner circumference. The intermediate portion 15b between the ring 16a and the outer peripheral ring 16b surrounds the outer side portion 15c of the outer 15 portion 15c from the outer side. In the encapsulant 15, the side portion of the inner side of the reinforcing body 16 covers the upper portion of the circuit chip 13, and The circuit chip 13 is packaged on the substrate 11. Here, the antenna I2 is equivalent to the present invention. In one example of the wire described in the section, the material 15 is in the form of a cross-shaped reinforcing body, and the intermediate portion 15b corresponds to an example of the adhesive described in the present invention. 16a and the outer peripheral ring 16b correspond to an example of the ring described in the present invention, and the outer ring ring is equivalent to one of the outermost peripheral rings described in the present invention. The RFID tag 10 is configured to surround the circuit chip. The reinforcing body 12 200839972 16 has the inner peripheral ring 16a and the outer peripheral ring 16b, and the stress acting due to the bending of the RFID tag 10 is dispersed to the inner peripheral ring 16a and the outer peripheral ring 16b. Therefore, the suppression stress is concentrated in the antenna 12 from the inside. The portion where the circumferential ring 16a is exposed and the stress are concentrated on both portions exposed from the outer peripheral ring 16b, and the disconnection of the antenna cymbal 2 can be prevented.

5特別是由於外周環16 b相較於内周環16 a柔軟，因此，於RF1P 標籤10遍及全體而彎折時，可抑制應力集中在配置於最外 周之外周環16b。又，該RFID標籤10係受補強體16包園真電 路晶片13之上部藉由填埋補強體丨6内部之封裝劑i 5之内側 部15覆蓋’同時電路晶片13藉由該内側部i5a與基體11之合 10作來封裝，因此，亦可防止應力集中於電路晶片13，真亦 可防止電路晶片13之破裂或剝離等。又，由於内周環i6a與 外周環16b間係藉由封裝劑15之中間部15b來填埋，因此， 作用於内周環16a與外周環16b間之應力會分散至中間部 15b。 15 接著，說明RFID標籤之製造方法。 第4圖係說明第2及3圖所示之RFID標籤之製造方法 圖。 第4(a)至4(e)圖係依序地顯示製造RHD標籤之各程序。 為了得到RFID標籤10，首先，於第4(a)圖所示之連接 20程序中’在佈線有天線12之基體11的天線12上連接電路曰曰 片13。 日日 其次’於第4(b)圖所示之接著劑塗布程序中，塗布由熱 硬化性樹脂所構成之液狀封裝劑15p並覆蓋電路晶片13上 部’又’封裝劑15p亦塗布於電路晶片13之周邊。 13 200839972 • 其次’於第4(C)及4(d)圖所示之補強體配置程序中，將 ‘ 内周環16a及外周環16b定位成包圍電路晶片13並搭載於基 體11上。若使内周環16a及外周環16b配置成沉入封裝劑I5p 中’則封裝劑15p會被分成内周環16a之内側、内周環16a與 5外周環161)間、外周環16b之外側三處，然後，如第4(d)圖所 示’利用加熱使封裝劑15p硬化，藉此，可藉由硬化之封裝 劑15—體地結合内周環16a與外周環16b並完成補強體16。 φ 又，於内周環16a之内側形成内侧部i5a。 其次，於第4(e)圖所示之覆蓋程序中，藉由覆蓋材17 10自表裏面兩側覆蓋基體11，又，覆蓋材17係藉由加熱及加 壓來密接，若完成覆蓋程序，則可得到第2圖所示之 標籤10。 於前述實施形態中，補強體16之外周環16b與内周環 16 a之柔軟度可藉由相互利用不同的材料來構成而加以調 15整，不過，接著說明複數環藉由同一材料來形成之本發明 % 之第2實施形態及第3實施形態。於以下第2實施形態之說明 中，與到目别為止所說明之實施形態中之各要素相同的要 素係附上同一符號來表示，並說明與前述實施形態之相異 處。 20 第5圖係顯示為本發明電子裝置之第2實施形態之 ' RFID標籤之平面圖。 該第5圖所示之RFID標籤20係補強體26之結構與第2 及3圖所示之RFID標籤1〇不同，構成RnD標籤2〇之補強體 26的外周侧之外周環26b與内周侧之内周環26a係藉由同一 14 200839972 ’ 材料來形成，又，外周環26b之該外周環26b之徑向寬度係 * 相較於内周環26a之徑向寬度狹窄，除了該點以外，第5圖 所示之RFID標籤2〇係與第2及3圖所示之RFID標籤1 〇相同。In particular, since the outer peripheral ring 16b is softer than the inner peripheral ring 16a, when the RF1P tag 10 is bent over the entire circumference, it is possible to suppress stress from being concentrated on the outer peripheral ring 16b disposed at the outermost periphery. Further, the RFID tag 10 is covered by the reinforcing body 16 and the upper portion of the wafer 13 is covered by the inner portion 15 of the encapsulant i 5 inside the buried reinforcing body 6 while the circuit chip 13 is separated from the inner portion i5a. The combination of the base 11 is encapsulated, so that stress can be prevented from being concentrated on the circuit wafer 13, and it is also possible to prevent cracking or peeling of the circuit wafer 13. Further, since the inner peripheral ring i6a and the outer peripheral ring 16b are filled by the intermediate portion 15b of the encapsulant 15, the stress acting between the inner peripheral ring 16a and the outer peripheral ring 16b is dispersed in the intermediate portion 15b. 15 Next, a method of manufacturing an RFID tag will be described. Fig. 4 is a view showing a method of manufacturing the RFID tag shown in Figs. 2 and 3. Figures 4(a) through 4(e) show the procedures for manufacturing RHD tags in sequence. In order to obtain the RFID tag 10, first, in the connection 20 program shown in Fig. 4(a), the circuit chip 13 is connected to the antenna 12 on which the base 11 of the antenna 12 is wired. In the adhesive application procedure shown in FIG. 4(b), the liquid encapsulant 15p composed of a thermosetting resin is applied and covers the upper portion of the circuit wafer 13 and the encapsulant 15p is also applied to the circuit. The periphery of the wafer 13. 13 200839972 • Next, in the reinforcing body arrangement procedure shown in Figs. 4(C) and 4(d), the inner circumference ring 16a and the outer circumference ring 16b are positioned so as to surround the circuit wafer 13 and mounted on the base 11. When the inner peripheral ring 16a and the outer peripheral ring 16b are arranged to sink into the encapsulant I5p, the encapsulant 15p is divided into the inner side of the inner peripheral ring 16a, the inner peripheral ring 16a and the outer peripheral ring 161, and the outer peripheral ring 16b. In three places, then, as shown in Fig. 4(d), the encapsulant 15p is hardened by heating, whereby the inner peripheral ring 16a and the outer peripheral ring 16b can be integrally bonded by the hardening encapsulant 15 to complete the reinforcing body. 16. φ Further, an inner portion i5a is formed inside the inner peripheral ring 16a. Next, in the covering procedure shown in Fig. 4(e), the covering member 17 is covered with the substrate 11 from both sides of the front and back, and the covering member 17 is adhered by heating and pressing, and the covering procedure is completed. Then, the label 10 shown in Fig. 2 can be obtained. In the above embodiment, the softness of the outer peripheral ring 16b and the inner peripheral ring 16a of the reinforcing body 16 can be adjusted by using different materials from each other. However, the plural rings are formed by the same material. The second embodiment and the third embodiment of the present invention. In the following description of the second embodiment, the same elements as those in the embodiments described above will be denoted by the same reference numerals and will be described as different from the above-described embodiments. Fig. 5 is a plan view showing the RFID tag of the second embodiment of the electronic device of the present invention. The structure of the RFID tag 20 reinforcing body 26 shown in Fig. 5 is different from the RFID tag 1〇 shown in Figs. 2 and 3, and the outer peripheral side of the reinforcing body 26 constituting the RnD tag 2 is surrounded by the outer circumference 26b and the inner circumference. The inner peripheral ring 26a of the side is formed by the same 14 200839972' material, and the radial width of the outer peripheral ring 26b of the outer peripheral ring 26b is narrower than the radial width of the inner peripheral ring 26a, except for this point. The RFID tag 2 shown in Fig. 5 is the same as the RFID tag 1 所示 shown in Figs. 2 and 3.

由於外周環26b之徑向寬度相較於内周環26a之徑向寬 ’ 5度狹窄，因此外周環26b會比内周環26a柔軟，故，於rFID 標籤20彎折時可抑制應力集中於外周環26b。 第6圖係顯示為本發明電子裝置之第3實施形態之 RFID標鐵之截面圖。 於該第6圖所示之RFID標籤30中，構成補強體％之外 10周側之外周環36b與内周側之内周環36a係藉由同一材料來 形成，又，外周環36b於基體11之厚度方向之厚度相較於内 周環36a之厚度薄，除了該點以外，第6圖所示2Rfid標籤 30係與第2及3圖所示之RFID標籤1〇相同。 第6圖所示之RFID標籤3〇係由於外周環36b於基體 15厚度方向之厚度相較於内周環36a之厚度薄，因此外周環 • 會比内周環36a柔軟，故，於RFm標籤3〇彎折時可抑制 應力集中於外周環36b。 第7圖係顯不為本發明電子裝置之第4實施形態之 RHD標籤之截面圖。 20 該第7圖所示之11™標籤4〇之補強體46係具有外周側 . 之外周環杨、内周侧之内周環他及連接外周環46b與内周 環偏之連接料e，且外騎_、㈣環術及連接部如 係藉由相同之材料-體地形成，又，補強體私係具有於製 造RFID標籤4〇前之零件個體時外周環偏與内周環咖以^ 15 200839972 圍電路晶片13之預定間隔配置成同心狀之結構，除了該點 以外，第7圖所示之RFro標籤40係與第2及3圖所示之RFID 標籤10相同。製造RFID標籤40時，將業已使内周環46a、外 周環46b及連接部46c —體化之補強體46搭載於基體11上包 5圍電路晶片13之位置，藉此，可同時地構成外周環46b之定 位與内周環46a之定位。 接著，前述RFID標籤之應用例係說明為本發明設有電 子裝置之物品之一實施形態的裝設有RFID標籤1 〇之衣服。 第8圖係說明裝設有RFID標籤之衣服之製造方法圖。 10 舉例言之，如第8圖所示，第2及3圖所示之RFID標籤 10係藉由黏貼等裝設在衣服5之標籤5a，又，於裝設在衣服 5之RFID標籤10記憶顯示衣服5之屬性之資訊，舉例言之， 藉由無線通信將J AN編碼等衣服5之屬性資訊自資訊寫入 裝置6送信至RHD標籤10，且使電路晶片13(參照第2圖）記 15 憶該屬性資訊。 於前述實施形態中，電子裝置係說明111711)標籤之例 子，然而本發明之電子裝置並不限MRFID標籤，舉例言之， 可適用於在可撓性基體上搭載有電路晶片之印刷電路板裝 置。 20 第9圖係顯示作為本發明一實施形態之印刷電路板裝 置及安裝有該印刷電路板裝置之桌上計算器之概略圖。 弟9圖所示之桌上计异器7包含有計算器本體部π及安 裝於計异器本體部71之印刷電路板裝置75。印刷電路板裝 置75係具有與第2及3圖所示iRFID標籤1〇相同之結構， 16 200839972 • 即，於作為基體之撓性印刷電路77(FPC77)上搭载電路晶片 ‘ 76，又，雖然省略圖示，然而，於FPC77上，具有相互呈同 心之複數環之補強體係配置成包圍電路晶片，再者，封裝 體係具有填埋補強體之内侧並覆蓋電路晶片上部且藉由 • 5 FPC77封裝電路晶片76之結構，不過，印刷電路板裝置75 之電路晶片在具有計算器本體部71之控制機能方面，以及 於FPC77上佈線有在電路晶片76與計算器本體部71間傳達 ^ 彳§號之佈線型樣以取代天線方面係與第2圖所示之RHD標 籤10不同。於計算器本體部71係具有進行各種顯示之顯示 10窗部71a及操作鍵71b，且依據電路晶片76之動作來驅動， 又’安裝有印刷電路板裝置75之桌上計算器7係即使計算器 本體部71撓曲，亦可防止於印刷電路板裝置75中之佈線型 樣之斷線。 另’在此說明桌上計算器7之計算器本體部71撓曲之情 15 形’然而本發明並不限於此，舉例言之，亦可適用於電子 • 裝置在彎曲狀態下安裝於具有硬殼之機器本體部之電子機 為’或者因修理或保養而自機器本體部取出電子裝置時電 子裝置容易彎曲之電子機器。又，本發明並不限於桌上計 异斋’可適用在安裝有於可撓性基體上搭載電路晶片之電 2〇子裝置的行動電話等各種電子機器。 又，於前述實施形態中說明RFID標籤之複數例子，然 而本發明之電子裝置並不限於各實施形態中所說明之各構 以’亦可組合各實施形態之要素，舉例言之，亦可藉由不 同之材料來形成補強體所具有之複數環，同時將該等複數 17 200839972 %作成厚度或粗度相互不同者，又，舉例言之，補強體亦 可為藉由連接部連接厚度或粗度相互不同之複數環的一體 結構。 ~ 又，於前述實施形態中說明補強體由二個環所構成 者，然而本發明並不限於此，補強體亦可由三個以上之環 所構成。Since the radial width of the outer peripheral ring 26b is narrower than the radial width of the inner peripheral ring 26a by 5 degrees, the outer peripheral ring 26b is softer than the inner peripheral ring 26a, so that the stress concentration on the outer periphery can be suppressed when the rFID tag 20 is bent. Ring 26b. Fig. 6 is a cross-sectional view showing the RFID target of the third embodiment of the electronic device of the present invention. In the RFID tag 30 shown in FIG. 6, the outer peripheral ring 36b and the inner peripheral ring 36a on the inner peripheral side are formed of the same material on the ten-week side other than the reinforcing body %, and the outer peripheral ring 36b is formed on the base. The thickness of the thickness direction of 11 is thinner than the thickness of the inner peripheral ring 36a. Except for this point, the 2Rfid tag 30 shown in Fig. 6 is the same as the RFID tag 1〇 shown in Figs. 2 and 3. In the RFID tag 3 shown in Fig. 6, since the thickness of the outer peripheral ring 36b in the thickness direction of the base 15 is thinner than the thickness of the inner peripheral ring 36a, the outer peripheral ring is softer than the inner peripheral ring 36a, so that the RFm tag 3 When the yoke is bent, stress concentration on the outer peripheral ring 36b can be suppressed. Fig. 7 is a cross-sectional view showing the RHD label of the fourth embodiment of the electronic device of the present invention. 20 The 11TM tag 4〇 reinforcing body 46 shown in FIG. 7 has an outer peripheral side. The outer peripheral ring Yang, the inner peripheral ring of the inner peripheral side, and the connecting material e connecting the outer peripheral ring 46b and the inner peripheral ring are And the outer riding _, (4) ringing and the connecting part are formed by the same material-body, and the reinforcing body has the outer part of the outer ring and the inner circumference of the front part of the RFID tag. ^ 15 200839972 The predetermined interval of the peripheral circuit chips 13 is arranged in a concentric shape. Except for this point, the RFro tag 40 shown in Fig. 7 is the same as the RFID tag 10 shown in Figs. 2 and 3. When the RFID tag 40 is manufactured, the reinforcing body 46 in which the inner peripheral ring 46a, the outer peripheral ring 46b, and the connecting portion 46c are formed is mounted on the base 11 at a position surrounding the circuit chip 13, thereby constituting the outer periphery at the same time. The positioning of the ring 46b and the positioning of the inner peripheral ring 46a. Next, an application example of the RFID tag will be described as an embodiment in which an RFID tag 1 is attached to an embodiment in which an electronic device is provided. Fig. 8 is a view showing a manufacturing method of a garment equipped with an RFID tag. For example, as shown in Fig. 8, the RFID tag 10 shown in Figs. 2 and 3 is attached to the label 5a of the garment 5 by pasting or the like, and is also stored in the RFID tag 10 of the garment 5. The information indicating the attribute of the clothes 5 is, for example, the attribute information of the clothes 5 such as the J AN code is transmitted from the information writing device 6 to the RHD tag 10 by wireless communication, and the circuit chip 13 (refer to FIG. 2) is recorded. 15 Recall the attribute information. In the above embodiment, the electronic device is an example of a 111711) tag. However, the electronic device of the present invention is not limited to an MRFID tag. For example, it can be applied to a printed circuit board device in which a circuit chip is mounted on a flexible substrate. . Fig. 9 is a schematic view showing a printed circuit board device according to an embodiment of the present invention and a desktop calculator to which the printed circuit board device is mounted. The table counter 7 shown in Fig. 9 includes a calculator main body portion π and a printed circuit board device 75 mounted on the counter main body portion 71. The printed circuit board device 75 has the same configuration as the iRFID tag 1A shown in FIGS. 2 and 3, and 16 200839972. That is, the circuit chip '76 is mounted on the flexible printed circuit 77 (FPC77) as a substrate, and The illustration is omitted. However, on the FPC77, a reinforcing system having a plurality of rings concentric with each other is disposed to surround the circuit wafer. Further, the package system has a buried reinforcement body and covers the upper portion of the circuit wafer and is packaged by the • 5 FPC77. The structure of the circuit chip 76, however, the circuit chip of the printed circuit board device 75 has the control function of the calculator body portion 71, and the wiring on the FPC 77 communicates between the circuit chip 76 and the calculator body portion 71. The wiring pattern is different from the RHD tag 10 shown in FIG. 2 in that it replaces the antenna. The calculator main unit 71 has a display 10 window portion 71a and an operation key 71b for performing various types of display, and is driven in accordance with the operation of the circuit chip 76, and the table calculator 7 on which the printed circuit board device 75 is mounted is even calculated. The body portion 71 is deflected to prevent disconnection of the wiring pattern in the printed circuit board device 75. In addition, the calculator body portion 71 of the table calculator 7 is illustrated as being deflected. However, the present invention is not limited thereto. For example, it can also be applied to an electronic device mounted in a bent state with a hard shape. The electronic device of the main body of the casing is an electronic device in which the electronic device is easily bent when the electronic device is taken out from the main body of the machine due to repair or maintenance. Further, the present invention is not limited to the use of a variety of electronic devices such as a mobile phone equipped with an electric device for mounting a circuit chip on a flexible substrate. Further, in the above-described embodiment, a plurality of examples of the RFID tag will be described. However, the electronic device of the present invention is not limited to the respective configurations described in the respective embodiments, and elements of the respective embodiments may be combined. For example, it may be borrowed. The plurality of rings formed by the reinforcing body are formed by different materials, and the plurality of layers 17 200839972 % are made to have different thicknesses or thicknesses. Further, for example, the reinforcing body may be connected to the thickness or the thick portion by the connecting portion. An integral structure of multiple rings with different degrees. Further, in the above embodiment, the reinforcing body is composed of two rings. However, the present invention is not limited thereto, and the reinforcing body may be composed of three or more rings.

又’於前述實施形態中說明具有覆蓋材之例子，然而 本發明之電子裝置並不限於此，亦可為未設置有覆蓋材者。 C阖式簡單說明】 1〇 第1圖係顯示習知技藝之RFID標籤之一例之模式截 圖。 第2圖係顯示為本發明第1實施形態之RFII>標籤之截 面圖。 第3圖係顯示為本發明實施形態之RFID標籤之平面 15圖。 第4(a)至4(e)圖係說明第2及3圖所示之RFID標籤之製 造方法圖。 第5圖係顯示為本發明電子裝置之第2實施形態之 RFID標籤之平面圖。 2〇 第6圖係顯示為本發明電子裝置之第3實施形態之 RFID標籤之截面圖。 第7圖係顯示為本發明電子裝置之第4實施形態之 RFID標籤之截面圖。 第8圖係說明裝設有RFID標籤之衣服之製造方法圖。 18 200839972 第9圖係顯示作為本發明一實施形態之印刷電路板裝 置及安裝有該印刷電路板裝置之桌上計算器之概略圖。Further, in the above embodiment, an example in which a covering material is provided will be described. However, the electronic device of the present invention is not limited thereto, and may be a member not provided with a covering material. Brief Description of C Type] 1〇 Fig. 1 is a schematic cross-sectional view showing an example of an RFID tag of the prior art. Fig. 2 is a cross-sectional view showing the RFII> tag according to the first embodiment of the present invention. Fig. 3 is a plan view showing the plane of the RFID tag according to the embodiment of the present invention. Figures 4(a) through 4(e) are diagrams showing the method of manufacturing the RFID tag shown in Figures 2 and 3. Fig. 5 is a plan view showing the RFID tag of the second embodiment of the electronic device of the present invention. Fig. 6 is a cross-sectional view showing the RFID tag of the third embodiment of the electronic device of the present invention. Fig. 7 is a cross-sectional view showing the RFID tag of the fourth embodiment of the electronic device of the present invention. Fig. 8 is a view showing a manufacturing method of a garment equipped with an RFID tag. 18 200839972 Fig. 9 is a schematic view showing a printed circuit board device according to an embodiment of the present invention and a desktop calculator to which the printed circuit board device is mounted.

【主要元件符號說明】 5.. .衣服 5a...標籤 6.. .資訊寫入裝置 7…桌上計算器 10，20，30，40，90·..RFID標籤 11，91…基體 12，92···天線 13，76，93…電路晶片 14，94…接著劑 15，15p，95…封裝劑 15a...内側部 15b...中間部 15c...外側部 16，26，36，46，96...補強體 16a ’ 26a ’ 36a ’ 46a···内周環 16b，26b，36b，46b.··外周環 17，97...覆蓋材 46c...連接部 71.. .計算器本體部 71a...顯示窗部 71b.··操作鍵 75.. .印刷電路板裝置 77…撓性印刷電路 93a...連接端子 95a...内側部分 19[Description of main component symbols] 5.. Clothes 5a...Label 6... Information writing device 7... Desktop calculator 10, 20, 30, 40, 90·.. RFID tag 11, 91... Base 12 , 92··· Antenna 13, 76, 93... circuit wafer 14, 94... adhesive 15, 15p, 95... encapsulant 15a... inner portion 15b... intermediate portion 15c... outer portion 16, 26 36, 46, 96... Reinforcing body 16a '26a ' 36a ' 46a · Inner circumference ring 16b, 26b, 36b, 46b. · Peripheral ring 17, 97... Covering material 46c... Connecting portion 71 .. calculator main body portion 71a... display window portion 71b.··operation key 75.. printed circuit board device 77...flexible printed circuit 93a...connection terminal 95a...inside portion 19

Claims (1)

十、申請專利範圍： 1. 一種電子裝置，包含有： 基體； 導線，係佈線在前述基體上者； 電路晶片，係與前述導線電連接者； 補強體，係於前述基體上配置成包圍前述電路晶片 並具有環狀之外形，且内部結構具有相互呈同心之複數 環者；及 封裝體，係填埋前述補強體之内侧並覆蓋前述電路 晶片上部，且於前述基體上封裝該電路晶片者。 2. 如申請專利範圍第1項之電子裝置，其中前述補強體係 藉由接著劑填埋前述複數環之間而形成者。 3. 如申請專利範圍第1項之電子裝置，其中前述補強體之 前述複數環中最外周之環係相較於剩餘之環中至少任 一者之環柔軟者。 4·如申請專利範圍第1項之電子裝置，其中前述補強體之 前述複數環中最外周之環的環徑向寬度係相較於剩餘 之環中至少任一者之環的寬度狹窄者。 5. 如申請專利範圍第1項之電子裝置，其中前述補強體之 前述複數環中最外周之環於前述基體之厚度方向之厚 度係相較於剩餘之環狀補強部之至少任一者之環的厚 度薄者。 6. 如申請專利範圍第1項之電子裝置，其中前述補強體係 具有連接部，且該連接部連接前述複數環中至少二個 200839972 環，並藉由與環之材料相同的材料一體地形成。 7. 如申請專利範圍第1項之電子裝置，其中前述電子裝置 係RFID標籤，且該RFID標籤係使前述導線具有作為通 信用天線之機能，並使前述電路晶片經由該導線進行無 5 線通信者。 8. —種電子機器，係具有電子裝置、及安裝有該電子裝置 且藉由該電子裝置之動作來驅動之機器本體部者，又， 前述電子裝置包含有： 基體； 10 導線，係佈線在前述基體上者； 電路晶片，係與前述導線電連接者； 補強體，係於前述基體上配置成包圍前述電路晶片 並具有環狀之外形，且内部結構具有相互呈同心之複數 I班· XL %嘗，及 15 封裝體，係填埋前述補強體之内側並覆蓋前述電路 晶片上部，且於前述基體上封裝該電路晶片者。 9. 一種物品，係由電子裝置、及裝設有該電子裝置之被裝 設物品所構成者，又，前述電子裝置包含有： 基體； 20 導線，係佈線在前述基體上者； 電路晶片，係與前述導線電連接者； 補強體，係於前述基體上配置成包圍前述電路晶片 並具有環狀之外形，且内部結構具有相互呈同心之複數 環者；及 21 200839972 * 封裝體，係填埋前述補強體之内侧並覆蓋前述電路 ^ 晶片上部，且於前述基體上封裝該電路晶片者。 ίο.—種電子裝置之製造方法，包含有： ' 連接程序，係於佈線有導線之基體的該導線上連接 5 電路晶片者， 接著劑塗布程序，係塗布接著劑並覆蓋前述電路晶 片上部者； ^ 補強體配置程序，係於前述基體上將具有環狀之外 響 形且内部結構具有複數環之補強體配置成包圍前述電 10 路晶片，且使前述複數環相互呈同心，並作成前述接著 劑至少填埋前述補強體之内側之狀態者；及 硬化程序，係藉由使前述接著劑硬化，使該接著劑 於前述基體上封裝前述電路晶片，同時使前述補強體固 定於該基體上者。 22X. Patent application scope: 1. An electronic device comprising: a substrate; a wire, which is wired on the substrate; a circuit chip electrically connected to the wire; and a reinforcing body disposed on the substrate to surround the foregoing The circuit chip has a ring-shaped outer shape, and the inner structure has a plurality of rings concentric with each other; and the package body fills the inner side of the reinforcing body and covers the upper portion of the circuit chip, and the circuit chip is packaged on the substrate . 2. The electronic device of claim 1, wherein the reinforcing system is formed by filling an intermediate layer between the plurality of rings. 3. The electronic device of claim 1, wherein the outermost peripheral ring of the plurality of rings of the reinforcing body is softer than the ring of at least one of the remaining rings. 4. The electronic device of claim 1, wherein the radially outer ring of the outermost ring of the plurality of rings of the reinforcing body is narrower than the width of the ring of at least one of the remaining rings. 5. The electronic device of claim 1, wherein the outermost circumference of the plurality of rings of the reinforcing body has a thickness in a thickness direction of the base body compared to at least one of the remaining annular reinforcement portions. The thickness of the ring is thin. 6. The electronic device of claim 1, wherein the reinforcing system has a connecting portion, and the connecting portion connects at least two of the plurality of rings of the above-mentioned plurality of rings, and is integrally formed by the same material as the material of the ring. 7. The electronic device of claim 1, wherein the electronic device is an RFID tag, and the RFID tag has the function of the wire as a communication antenna, and the circuit chip is subjected to 5-wire communication via the wire. By. 8. An electronic device comprising: an electronic device; and a machine body unit mounted with the electronic device and driven by the operation of the electronic device, wherein the electronic device comprises: a base body; The circuit substrate is electrically connected to the wire; the reinforcing body is disposed on the substrate to surround the circuit chip and has an annular shape, and the internal structure has a plurality of I-class XL which are concentric with each other. The % and the 15 package are filled with the inner side of the reinforcing body and covering the upper portion of the circuit chip, and the circuit chip is packaged on the substrate. 9. An article comprising: an electronic device, and an installed article in which the electronic device is mounted, wherein the electronic device comprises: a substrate; 20 wires, which are wired on the substrate; and a circuit chip, And a reinforcing body, the reinforcing body is disposed on the substrate to surround the circuit chip and has a ring shape, and the internal structure has a plurality of rings concentric with each other; and 21 200839972 * package, fill The inner side of the reinforcing body is buried and covers the upper portion of the circuit, and the circuit chip is packaged on the substrate. Οο. </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> <RTIgt; The reinforcing body configuration program is configured to arrange a reinforcing body having a ring-shaped outer shape and an inner structure having a plurality of rings on the substrate to surround the electric 10-way wafer, and to make the plurality of rings concentric with each other and to form the foregoing a method of curing at least the inner side of the reinforcing body; and a curing process of curing the adhesive to cause the adhesive to encapsulate the circuit wafer on the substrate while fixing the reinforcing body to the substrate By. twenty two