200835886 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種發光二極體照明燈具之設計，特別 是關於一種高功率發光二極體照明燈具與其散熱模組，可 替代白熾燈泡以及螢光燈源。 【先前技術】 1997年所舉行之防止地球暖化的京都會議中，日本被 • 要求在2008年至2012年期間其溫室效應氣體排放量應較 1990年代減少6%，因此佔有民生用能源20%以上的照明 用電，其節能照明技術之開發就顯得極為重要。而發光二 極體（LED )是一種藉外加電壓激發電子而放射出光的光 電半導體元件’因其具有耗電量低及哥命長之優點’各國 無不積極研發其相關技術，目前實際應用上大都只是運用 在低功率的指示燈範圍，但近年來高功率發光二極體的技 術蓬勃發展，發光瓦數也逐漸提高而有取代現行傳統白熾 — 燈泡照明之趨勢，且發光二極體的發光效率被期望在不久 的未來能超過每瓦80流明，這約為傳統白熾鎢絲燈泡發光 效率的六倍。為了讓LED照明設備得到足夠的光通量，目 前設計有群組式的LED燈具，例如設計成一打或者數百盞 集聚一起的LED而被廣泛地運用在戶外展示、照明。 【發明内容】 本發明所欲解決之技術問題 200835886 然而，隨著高功率發光二極體的發展，其所產生的熱 亦逐漸提高，使得散熱技術成為目前最重要之課題。由於 高功率發光二極體之發光點區域會形成高溫的熱點（Hot Spot)，而目前高功率發光二極體的發光效率技術之所以無 法快速提升，其最大的瓶頸就在於無法有效「散熱」，以及 當接合點的溫度超過120°C時會發生LED效能衰減、壽命 減短乃至於有燒毁的危機。因此高功率發光二極體的發光 材料遭受高溫破壞而導致發光效率驟降，其原因即為溫度 過高所致，若能提供有效之散熱機制，則便可提昇照明燈 具之效能、壽命及產品可靠度。 緣此，本發明之主要目的即是提供一種高功率發光二 極體照明燈具與其散熱模組，用以將高功率發光二極體所 產生之熱能快速有效地逸散。 本發明解決問題之技術手段 本發明為解決習知技術之問題所採用之技術手段係提 供一種高功率發光二極體照明燈具與其散熱模組，其包括 有一 LED熱傳基座、至少一 LED陣列、至少一熱管及一 散熱模組。該LED熱傳基座具有至少一 LED配置面和至 少一熱管套孔，該LED配置面係位於該LED熱傳基座之 外侧面。該LED陣列包括有數個LED，各LED係以一預 設投射角度設置於該LED配置面。該熱管具有一受熱區 段、一冷凝區段及連接於該受熱區段及冷凝區段之一傳導 區段，且其内部容置有一工作流體，該受熱區段係延伸套 6 200835886 置在該LED熱傳基座之熱管套孔内，該傳導區段係由該 LED熱傳基座延伸出。而該散熱模組係設置於該熱管之^ 凝區段。M LED所產生之減會經由該咖熱傳基座傳 導至該熱管之受熱區段’而使該熱管之卫作流體受熱蒸發 經傳導區段流向該熱管之冷凝區段，設置於該熱管之冷^ 區段之散減組再吸㈣受熱蒸發之Μ流體所攜帶二 此並將其逸散。 、 於本發明之較佳實施例中，該散熱模組係、為散執键 片，其係可以銘擠、鑄造、射出或機械加工等方式製^ 以利用-較大之熱管或多根不同尺寸之熱管^片 !異的解f”’而在自然對流之條件下有效消除高::！ ^光一極體產品熱應力集中的困擾。 本發明對照先前技術之功效 經由本發明所採用之技術手段，可以將高功率發光二 ^體所產生的熱有效迅速地料至易於散熱之材/再: ”逸散至料，避免熱量#巾而 & 力不均而造成發光二極體元件之不穩定及損壞。‘、、又' 且因一般傳統式熱管及散熱韓 又因其構造簡單，製程、組裝亦較簡:市==’ :=用’包括室内照明、路燈、及所有相關高功;二 體之散熱途控等，以配合不同散熱形式之 發明不只符合專利要件之新穎性與進步性，=洋—A 性上也倍受期待。 ，在產業利用 7 200835886 本發明所採用的具體實施例，將藉由以下之實施例及 附呈圖式作進一步之說明。 ' 【實施方式】 請參閱第-至第三圖所示，第一圖係顯示本發明高功 率發，二極體㈣燈具與其散熱模組第—實施例之立體 圖’第-圖係顯不本發明高功率發光二極體照明燈具與其 散熱模組第一實施例之側視圖’第三圖係顯示本笋明二 率發光二極體照明燈具與其散熱模組第—實施例移除其燈 罩後之立體圖。本發明高功率發光二極體照明燈具與其散 熱模組第-實施例⑽係包括—LED熱傳基座卜至少一 LED陣列2、-熱管3、-散熱模組4和—燈罩卜200835886 IX. Description of the invention: [Technical field of the invention] The present invention relates to the design of a light-emitting diode lighting fixture, in particular to a high-power light-emitting diode lighting fixture and a heat-dissipating module thereof, which can replace the incandescent bulb and the firefly Light source. [Prior Art] In the Kyoto Conference on Preventing Global Warming held in 1997, Japan was required to reduce its greenhouse gas emissions by 6% from 2008 to 2012, thus accounting for 20% of energy used for people's livelihood. The above lighting power consumption, the development of its energy-saving lighting technology is extremely important. The light-emitting diode (LED) is an optoelectronic semiconductor component that emits light by applying a voltage to excite electrons. Because of its low power consumption and longevity, countries are actively developing their related technologies. Most of them are only used in the low-power indicator range. However, in recent years, the technology of high-power LEDs has flourished, and the number of watts has gradually increased. It has replaced the trend of traditional incandescent bulbs and the illumination of LEDs. Efficiency is expected to exceed 80 lumens per watt in the near future, which is about six times the luminous efficiency of traditional incandescent tungsten bulbs. In order to obtain sufficient luminous flux for LED lighting equipment, group-designed LED luminaires, such as LEDs designed to be assembled in a dozen or hundreds of cymbals, are widely used for outdoor display and lighting. SUMMARY OF THE INVENTION Technical Problem to Be Solved by the Invention 200835886 However, with the development of high-power light-emitting diodes, the heat generated by them is gradually increasing, making heat-dissipation technology the most important issue at present. Since the light-emitting point area of the high-power light-emitting diode forms a high-temperature hot spot, the current luminous efficiency of the high-power light-emitting diode cannot be quickly improved, and the biggest bottleneck is that it cannot effectively "dissipate heat". And when the junction temperature exceeds 120 ° C, LED performance degradation, life shortening and even burnout crisis. Therefore, the luminescent material of the high-power light-emitting diode suffers from high temperature damage, resulting in a sudden drop in luminous efficiency, which is caused by excessive temperature. If an effective heat dissipation mechanism is provided, the performance, life and products of the lighting fixture can be improved. Reliability. Accordingly, the main object of the present invention is to provide a high-power light-emitting diode lighting fixture and a heat-dissipating module for quickly and efficiently dissipating thermal energy generated by a high-power light-emitting diode. The technical means for solving the problems of the present invention provides a high-power light-emitting diode lighting fixture and a heat-dissipating module thereof, which comprise an LED heat-transfer base and at least one LED array. At least one heat pipe and one heat dissipation module. The LED heat transfer base has at least one LED arrangement surface and at least one heat pipe sleeve surface, the LED arrangement surface being located on an outer side of the LED heat transfer base. The LED array includes a plurality of LEDs, each LED being disposed on the LED configuration surface at a predetermined projection angle. The heat pipe has a heat receiving section, a condensing section and a conducting section connected to the heated section and the condensing section, and a working fluid is accommodated therein, and the heated section is extended by the sleeve 6 200835886 In the heat pipe sleeve hole of the LED heat transfer base, the conductive section is extended by the LED heat transfer base. The heat dissipation module is disposed in the condensation section of the heat pipe. The reduction generated by the M LED is conducted to the heated section of the heat pipe via the coffee heat transfer base, so that the heat pipe of the heat pipe is heated and evaporated to the condensation section of the heat pipe through the conduction section, and is disposed on the heat pipe. The depletion group of the cold ^ section is re-sucked (4) and carried by the evaporating enthalpy fluid and dissipated. In a preferred embodiment of the present invention, the heat dissipation module is a loose key piece, which can be extruded, cast, shot or machined to utilize - a larger heat pipe or a plurality of different Dimensional heat pipe ^Different solution f"' and effectively eliminate high in the condition of natural convection::! ^The problem of thermal stress concentration of the light-polar product. The invention adopts the technology adopted by the invention against the efficacy of the prior art. Means, the heat generated by the high-power light-emitting diode can be efficiently and rapidly fed to the material that is easy to dissipate heat/re: "dissipate to the material, avoid heat", and the unevenness of the force causes the light-emitting diode element to be Unstable and damaged. ',, and ' because of the traditional heat pipe and heat dissipation Han because of its simple structure, process and assembly is also simple: City == ': = use 'including indoor lighting, street lights, and all related high-power; two body The invention of heat dissipation and other methods to match different heat dissipation forms not only meets the novelty and progress of patent requirements, but also the expectation of foreign-A nature. In the industrial use 7 200835886 The specific embodiments of the present invention will be further described by the following embodiments and accompanying drawings. [Embodiment] Please refer to the first to third figures. The first figure shows the high-powered hair of the present invention, and the two-dimensional (four) lamp and its heat-dissipating module are in a three-dimensional view of the first embodiment. Inventive high-power light-emitting diode lighting fixture and its heat-dissipating module, the side view of the first embodiment, the third figure shows that the bamboo shooter two-emission light-emitting diode lighting fixture and its heat-dissipating module - the embodiment removes the lampshade Stereo view. The high-power light-emitting diode lighting fixture and the heat-dissipating module of the present invention (10) include - LED heat transfer base, at least one LED array 2, - heat pipe 3, - heat dissipation module 4, and - lamp cover
第四圖係顯不本發明高功率發光二極體照明燈具與其 散熱模組第-實施例移除其燈罩後各構件之拆解示意圖， 第五圖係顯示本發明高功率發光二極體照明燈具與其散敎 挺組第-實施例移除其燈罩後各構件之立體分解圖，第六 圖係顯示本發明高功率發光二極體㈣燈具與其散熱模組 之咖熱傳基座與設置於其上之LED陣列之頂視圖，第 七圖係顯示本發明高功率發光二極體照明燈具與其散敎模 組第—實施例移除其燈罩後之側視圖，第八圖係顯示第七 圖中8 — 8斷面之剖視圖。 一 κ LED —傳基座1係具有至少一 LED配置面J J、一 套孔12、至少-熱應力抵緊壁結;f冓14以及一内侧環 °亥LED配置面11係位於該LED熱傳基座1之外側 200835886 面。該熱管套孔12係開設於該LED熱傳基座1之内部中 央並貫穿該LED熱傳基座！之頂面和底面，因而形成該内 側環面15。該熱應力抵緊壁結構14係包括一貫孔⑷和 -連通道H2，該貫孔141係、開設於該⑽熱傳基座】内 部之選定位置，該連通道142係連通該熱f套孔12和該貫 孔141 ’並且該熱應力抵緊壁結構14係可供至少一電穿 設於其中。 «亥LED陣列2係包括有複數個led21和電路板22， 該LED21係設置於該電路板U上，且該電路板22係開設 有-鏤空區域221以使各LED21之底面平貼於該咖熱 傳基座1之LED配置面u。其中該LED配置面u係佈設 有-層導熱介質，㈣平其與各進21之間麵面之不平 整並減低接觸熱阻，且該咖熱傳基座！係以散熱之材質 所製成，可快速吸收、傳導和逸散該LED21所產生之熱能。 並且該LED陣列2係為可更換式，可更換不同型號之高功 率、高瓦數LED。 該熱管3係具有—受熱區段31、-冷凝區段32及連 接於該受熱區段31及冷《段32之-傳導區段33，且其 内部容置有-卫作流體，該受熱區段31係延伸套置在該 LED熱傳基座1之熱管套孔該傳導區段33係由該LED 熱傳基座1延伸出。當該LED熱傳基座1與該熱管3逐漸 升溫時，由於接觸壓力增加、該LED熱傳基座丨之内側環 面15與4熱官3之接觸面積增大，因而該led埶傳基座 i之熱應力抵緊壁結構14會使該咖熱傳基座）失扣於 9 200835886 % 該熱管3且可降低該LED熱傳基座〗與該熱管3之間的接 觸熱阻，以利其間之熱能傳.導。而該散熱模組4係設置於 該熱管3之冷凝區段32。 當該LED陣列2之LED21通電發光時，其所產生之 熱能會經由該LED熱傳基座〗傳導至該熱管3之受熱區段 3卜而使位於該受熱區段31之玉作流體受熱蒸發，由於受 熱瘵發之工作流體與位於該冷凝區段32之液態工作流體之The fourth figure shows a disassembled schematic diagram of the components of the high-power light-emitting diode lighting fixture and the heat-dissipating module thereof after removing the lampshade, and the fifth figure shows the high-power light-emitting diode lighting of the present invention. The luminaire and its divergent group are in an embodiment to remove the three-dimensional exploded view of the components after the lampshade, and the sixth figure shows the high-power light-emitting diode (four) lamp and the heat-dissipating module of the present invention. The top view of the LED array thereon, the seventh figure shows the side view of the high-power light-emitting diode lighting fixture and the diverging module of the present invention after removing the lampshade, and the eighth figure shows the seventh figure. A cross-sectional view of the section 8-8. A κ LED-transfer pedestal 1 has at least one LED arranging surface JJ, a set of holes 12, at least a thermal stress abutting wall knot; an 冓14 and an inner ring 亥hai LED arranging surface 11 are located in the LED heat transfer The outer side of the base 1 is 200835886. The heat pipe sleeve 12 is formed in the center of the LED heat transfer base 1 and penetrates the LED heat transfer base! The top surface and the bottom surface thus form the inner side annulus 15. The thermal stress abutting wall structure 14 includes a consistent hole (4) and a connecting passage H2. The through hole 141 is formed at a selected position inside the (10) heat transfer base, and the connecting passage 142 is connected to the hot f sleeve. 12 and the through hole 141' and the thermal stress abutting wall structure 14 is adapted to be at least electrically disposed therein. The LED array 2 includes a plurality of LEDs 21 and a circuit board 22, and the LEDs 21 are disposed on the circuit board U, and the circuit board 22 is provided with a hollowed out area 221 to make the bottom surface of each LED 21 flat on the coffee. The LED configuration surface u of the heat transfer pedestal 1. The LED configuration surface u is provided with a layer of heat-conducting medium, (4) the unevenness of the surface between the LED and the inlet 21 is reduced, and the contact thermal resistance is reduced, and the coffee heat transfer base is provided! It is made of heat-dissipating material to quickly absorb, conduct and dissipate the heat generated by the LED21. Moreover, the LED array 2 is replaceable and can replace high-power, high-wattage LEDs of different models. The heat pipe 3 has a heat-receiving section 31, a condensing section 32, and a heat-conducting section 31 and a cold-segment-conducting section 33, and a heat-receiving zone is accommodated therein. The segment 31 extends from the heat pipe sleeve of the LED heat transfer base 1 and the conductive portion 33 extends from the LED heat transfer base 1. When the LED heat transfer pedestal 1 and the heat pipe 3 are gradually heated, the contact area is increased, and the contact area between the inner annular surface 15 and the thermal member 3 of the LED heat transfer base 增大 is increased, so the led 埶 base The thermal stress of the seat i against the wall structure 14 causes the heat transfer base to be deducted from the heat pipe 3 and can reduce the thermal contact resistance between the LED heat transfer base and the heat pipe 3, In the meantime, the heat can pass. The heat dissipation module 4 is disposed in the condensation section 32 of the heat pipe 3. When the LED 21 of the LED array 2 is energized to emit light, the heat energy generated by the LED array 2 is conducted to the heated section 3 of the heat pipe 3 via the LED heat transfer base, so that the jade fluid located in the heated section 31 is heated and evaporated. Due to the heated working fluid and the liquid working fluid located in the condensing section 32
間存在[力差，此壓力差會將受熱蒸發之卫作流體迅速經 由该傳導區段33推動至該冷凝區段32。 文熱?务發之工作流體被推 1人口次又放 之工作流體所攜帶之熱能並將其逸散，且使該受熱塞發之 =作流體冷卻凝結歧狀，冷卻凝結後之較卫作:體再 错該熱管3本身之毛細結構的毛細力回流至該受熱區段 t此反覆循環而快速有效地將該LED所產生之熱 散至外界。 δχ燈罩5係遮蓋於該LED熱傳基座 〇 ，一一 ▲茲 JLED 陣 1 、该熱管3、和該散熱模組4之外部，且該燈於 散熱模組4外部之鄰近位置係職有複數個散㈣口^ =空=對流之方式而使該散熱模“所吸收之熱 面‘二二5係可與該散熱模组4相接，其相接之介 可直接二广、、之介面材f，此介面材質可為黏稠之液體、 处之值二 片、相變化固體或其他介面材質，以利敎 月 該燈罩5亦可與該散熱模組4保持一預定距 200835886 離，或可加裝風扇以加強空氣之對流而加速熱能之逸散， 亚在該燈罩5外部塗佈、黏貼或綑綁—層高放射率物質以 利用其輻射將熱直接放射至遠方。There is a [force difference) which will rapidly push the heated vaporized fluid to the condensing section 32 via the conducting section 33. The working fluid of the enthusiasm is pushed by the population and then the thermal energy carried by the working fluid is dissipated, and the heated plug is used to make the fluid cool and condense, and the cooling is condensed. The volumetric force of the capillary structure of the heat pipe 3 itself is returned to the heated section t, and the cycle is repeated to quickly and efficiently dissipate the heat generated by the LED to the outside. The δ χ 罩 5 系 遮 遮 遮 LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED A plurality of scattered (four) ports ^ = empty = convection mode, so that the heat-dissipating mold "the absorbed hot surface" 22 can be connected with the heat-dissipating module 4, and the interface can be directly connected to the two, and The interface material f can be a viscous liquid, a value of two pieces, a phase change solid or other interface material, so that the lamp cover 5 can also be kept away from the heat dissipation module 4 by a predetermined distance of 200835886, or A fan may be added to enhance the convection of the air to accelerate the escape of thermal energy, and the outer cover of the lamp cover 5 is coated, adhered or bundled with a layer of high emissivity material to radiate heat directly to the far side.
亚且該LED熱傳基座！係具有至少一光源輔助結構 13 ’該光源輔助結構13係、由該咖配置φ n之兩旁鄰近 位置向外延伸出一預定長度，用以聚焦或發散該LED陣列 2之咖21所投射之光源。於本實施例中，該l则之底 面係平貼於該LED配置面u，且該咖配置面u係平行 於^齡3，以使該LED21所產生之光源之投射方向垂直 於：，官3而向其四周投射。或者’亦可經由折彎該[翻 之支架、斜向欲入該電路板22於該咖配置面u等方式， 而= LED21以-預設投㈣度設置於該咖熱傳基座} =配置面U，以使該LED21所產生之光源向該 ㈣基座1之斜下方或斜上方等各方向投射。 至第十二圖所示’第九圖係顯示本發明高 功率电光二極體照明燈具與其 燈罩後之立體圖，第十圖㈣：Γ 施例移除其 弟十圖係顯不本發明高功率發井二 照明燈具與其散熱模組第二實施卿除其燈罩後各 拆解不意圖，第十一圖係領 明产呈功率發光二極體照 丘摘組第二實施例移除其燈罩後之側視圖， 弟十-圖係顯示第十—圖中12—12斷面之剖視圖。 本發明高功率發光二極體照明燈具與 ，例之結構設計大致上與前述第一實施例相同、= 之構件乃標示以相同之元件編號，以資對應。其差異在； 200835886 該LED熱傳基座1之頂面和底面，用以套置複數個熱管3, 亦即各熱管3係環列地套置於該LED熱傳基座1内部，且 各熱管套孔12係鄰近於各LED配置面11，以利該LED陣 列2之LED21所產生之熱能經由該LED熱傳基座1傳導至 該熱管3之受熱區段31。 舉凡熟悉此技藝者皆能輕易得知，本發明所提供之高 功率發光二極體照明燈具與其散熱模組中，該熱管3可為管 狀、矩形、或平板狀等多種樣式，尺寸可依需求改變且係以 導熱之材質製造；而該散熱模組4之樣式可為十字、圓柱、 鰭片狀等，且其係可以鋁擠、鑄造、射出或機械加工等方式 製造。 由以上之實施例可知，本發明所提供之高功率發光二 極體照明燈具與其散熱模組確具產業上之利用價值，故本發 明業已符合於專利之要件。惟以上之敘述僅為本發明之較佳 實施例說明，凡精於此項技藝者當可依據上述之說明而作其 它種種之改良，惟這些改變仍屬於本發明之發明精神及以下 所界定之專利範圍中。 【圖式簡單說明】 第一圖係顯示本發明高功率發光二極體照明燈具與其散熱 模組第一實施例之立體圖； 第二圖係顯示本發明高功率發光二極體照明燈具與其散熱 模組第一實施例之侧視圖； 第三圖係顯示本發明高功率發光二極體照明燈具與其散熱 12 200835886 十 模組第一實施例移除其燈罩後之立體圖； 第四圖係顯不本發明高功率發光二極體照明燈具與其散熱 模組第-實施例移除其燈罩後各構件之拆解示意、 圖； 第五圖係顯示本發明高功率發光二極體照明燈具與其散熱 模組第-實施例移除其燈罩後各構件之立體分解 圖； • 帛六圖係顯示本發明高功率發光二極體照明燈具與其散熱 模組之LED熱傳基座與設置於其上之咖陣列之頂 視圖； ' 第七圖係肩示本發明高功率發光二極體照明燈具與其散熱 模組第一實施例移除其燈罩後之側視圖； ^八圖係顯示第七圖中8 — 8斷面之剖視圖； 第九圖得肩示本發明高功率發光二極體照明燈具與其散熱 柄組第二實施例移除其燈罩後之立體圖； 鲁 帛十®係顯示本發明高功率發光二極體㈣燈具與其散熱 模組第二實施例移除其燈罩後各構件之拆解示咅 圖； ^ 第十一圖係顯示本發明高功率發光二極體照明燈具與其散 — 熱模組第二實施例移除其燈罩後之側視圖； 第十二圖係顯示第十一圖中12—12斷面之剖視圖。 【主要元件符號說明】 100高功率發光二極體照明燈具與其散熱模組 13 200835886Ya and the LED heat transfer base! Having at least one light source auxiliary structure 13', the light source auxiliary structure 13 is extended by a predetermined length from two adjacent positions of the coffee arrangement φ n for focusing or diverging the light source projected by the coffee maker 2 of the LED array 2 . In this embodiment, the bottom surface of the layer is flatly attached to the LED arrangement surface u, and the coffee arrangement surface u is parallel to the age 3 so that the projection direction of the light source generated by the LED 21 is perpendicular to: 3 and cast it around. Or 'can also be bent over the [turned bracket, obliquely into the circuit board 22 in the coffee configuration surface u, etc., and = LED21 is set to the top of the coffee heat transfer base with a predetermined pitch (four degrees)} = The surface U is disposed such that the light source generated by the LED 21 is projected in various directions such as obliquely downward or obliquely upward of the (4) susceptor 1. To the twelfth figure, the ninth diagram shows a perspective view of the high-power electro-optical diode lighting fixture of the present invention and its lampshade, and the tenth figure (four): Γ the embodiment removes the tenth figure of the system and does not show the high power of the invention. The second implementation of the second well lighting fixture and its heat dissipation module is not intended to be dismantled after the lampshade. The eleventh figure is the second embodiment of the power-emitting diodes. The side view, the younger ten-picture shows a cross-sectional view of the section 10-12 in the figure. The structural design of the high-power light-emitting diode lighting fixture of the present invention is substantially the same as that of the first embodiment, and the components are marked with the same component numbers. The difference is: 200835886 The top surface and the bottom surface of the LED heat transfer base 1 are used for arranging a plurality of heat pipes 3, that is, the heat pipes 3 are arranged in a ring array inside the LED heat transfer base 1 and each The heat pipe sleeve hole 12 is adjacent to each LED arrangement surface 11 so that the heat energy generated by the LED 21 of the LED array 2 is conducted to the heat receiving section 31 of the heat pipe 3 via the LED heat transfer base 1 . Anyone familiar with the art can easily know that in the high-power light-emitting diode lighting fixture and the heat-dissipating module provided by the invention, the heat pipe 3 can be tubular, rectangular, or flat, and the like. The heat dissipation module 4 can be made of a material such as a cross, a cylinder, a fin, or the like, and can be manufactured by aluminum extrusion, casting, injection, or machining. It can be seen from the above embodiments that the high-power light-emitting diode lighting fixture and the heat-dissipating module provided by the invention have industrial use value, and therefore the invention has met the requirements of the patent. The above description is only for the preferred embodiment of the present invention, and those skilled in the art can make other various improvements according to the above description, but these changes still belong to the inventive spirit of the present invention and the following definitions. In the scope of patents. BRIEF DESCRIPTION OF THE DRAWINGS The first figure shows a perspective view of a first embodiment of a high-power light-emitting diode lighting fixture and a heat-dissipating module thereof according to the present invention; the second figure shows a high-power light-emitting diode lighting fixture and a heat-dissipating mold thereof according to the present invention. A side view of the first embodiment of the present invention; the third figure shows a high-power light-emitting diode lighting fixture of the present invention and its heat dissipation 12 200835886 The first embodiment of the ten-module is removed from the lampshade; the fourth figure is not shown The invention discloses a high-power light-emitting diode lighting fixture and a heat-dissipating module thereof. The first embodiment shows a disassembled schematic diagram of the components after removing the lampshade, and the fifth figure shows the high-power light-emitting diode lighting fixture and the heat-dissipating module thereof according to the present invention. The first embodiment removes the exploded view of the components after the lampshade; • the six-figure diagram shows the LED heat transfer base of the high-power light-emitting diode lighting fixture and the heat-dissipating module thereof, and the coffee array disposed thereon The top view of the first embodiment of the present invention is a side view of the high-power light-emitting diode lighting fixture and its heat-dissipating module after removing the lampshade; A cross-sectional view of the section 8-8; the ninth figure shows a perspective view of the second embodiment of the high-power light-emitting diode lighting fixture and the heat-dissipating handle set of the present invention after removing the lampshade; The second embodiment of the power illuminating diode (4) luminaire and its heat dissipating module removes the disassembly of the components after the lampshade; ^ the eleventh figure shows the high power illuminating diode illuminating device of the present invention and its heat dissipation The second embodiment of the module is removed from the side view of the lampshade; the twelfth figure shows a cross-sectional view of the section 12-12 in the eleventh figure. [Main component symbol description] 100 high power LED lighting fixture and its heat dissipation module 13 200835886
1 LED熱傳基座 11 LED配置面 12 熱管套孔 13 光源輔助結構 14 熱應力抵緊壁結構 141 貫孔 142 連通道 15 内側環面 2 LED陣列 21 LED 22 電路板 221 鏤空區域 3 熱管 31 受熱區段 32 冷凝區段 33 傳導區段 4 散熱模組 5 燈罩 51 散熱開口 141 LED heat transfer base 11 LED configuration surface 12 Heat pipe sleeve hole 13 Light source auxiliary structure 14 Thermal stress abutment wall structure 141 Through hole 142 Connection channel 15 Inner ring surface 2 LED array 21 LED 22 Circuit board 221 Hollow area 3 Heat pipe 31 Heated Section 32 Condensation section 33 Conduction section 4 Heat dissipation module 5 Shade 51 Heat dissipation opening 14