TW200833877A - Electrodeposition electrolyte with chloroplatic acid, ethylene glycol, and metal chloride - Google Patents
Electrodeposition electrolyte with chloroplatic acid, ethylene glycol, and metal chlorideInfo
- Publication number
- TW200833877A TW200833877A TW096104809A TW96104809A TW200833877A TW 200833877 A TW200833877 A TW 200833877A TW 096104809 A TW096104809 A TW 096104809A TW 96104809 A TW96104809 A TW 96104809A TW 200833877 A TW200833877 A TW 200833877A
- Authority
- TW
- Taiwan
- Prior art keywords
- ethylene glycol
- metal chloride
- metal
- acid
- electrodeposition
- Prior art date
Links
Abstract
An acidic solution at least containing chloroplatic acid, ethylene glycol, and other metal chloride as an electrodeposition electrolyte is disclosed in this patent. The solution is put into a reactor. Upon applying a negative potential, at least platinum metal is deposited onto the surface of an electric conducting object. The acid solution provides the ionic conductivity during the electrodeposition process and the ethylene glycol makes the dechlorination of the metal chloride more effective. At the same time, the ethylene glycol acts as a stabilizer which can prevent the metal deposited onto the surface of the electric conducting object from agglomeration so that the metal particles are well dispersed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096104809A TW200833877A (en) | 2007-02-09 | 2007-02-09 | Electrodeposition electrolyte with chloroplatic acid, ethylene glycol, and metal chloride |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096104809A TW200833877A (en) | 2007-02-09 | 2007-02-09 | Electrodeposition electrolyte with chloroplatic acid, ethylene glycol, and metal chloride |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200833877A true TW200833877A (en) | 2008-08-16 |
Family
ID=44819259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096104809A TW200833877A (en) | 2007-02-09 | 2007-02-09 | Electrodeposition electrolyte with chloroplatic acid, ethylene glycol, and metal chloride |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200833877A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI405713B (en) * | 2010-06-24 | 2013-08-21 | Hon Hai Prec Ind Co Ltd | Method for making raman scattering substrate |
CN114182285A (en) * | 2021-12-23 | 2022-03-15 | 台州学院 | Pt nano-particle with interphase distribution vacancy and preparation method thereof |
-
2007
- 2007-02-09 TW TW096104809A patent/TW200833877A/en unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI405713B (en) * | 2010-06-24 | 2013-08-21 | Hon Hai Prec Ind Co Ltd | Method for making raman scattering substrate |
CN114182285A (en) * | 2021-12-23 | 2022-03-15 | 台州学院 | Pt nano-particle with interphase distribution vacancy and preparation method thereof |
CN114182285B (en) * | 2021-12-23 | 2022-11-22 | 台州学院 | Pt nano-particle with interphase distribution vacancy and preparation method thereof |
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