TW200833621A - High heat transfer pressure plate for glass molding - Google Patents

High heat transfer pressure plate for glass molding

Info

Publication number
TW200833621A
TW200833621A TW96104659A TW96104659A TW200833621A TW 200833621 A TW200833621 A TW 200833621A TW 96104659 A TW96104659 A TW 96104659A TW 96104659 A TW96104659 A TW 96104659A TW 200833621 A TW200833621 A TW 200833621A
Authority
TW
Taiwan
Prior art keywords
heating
heat transfer
pressure plate
layer
high heat
Prior art date
Application number
TW96104659A
Other languages
Chinese (zh)
Inventor
Jen-Hsuan Huang
Wen-Ren Liao
guan-hong Lin
qing-hong Chen
Pei-Jun Zhong
si-yun Chen
Original Assignee
Kinik Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kinik Co filed Critical Kinik Co
Priority to TW96104659A priority Critical patent/TW200833621A/en
Publication of TW200833621A publication Critical patent/TW200833621A/en

Links

Abstract

The present invention provides a structure of high heat transfer pressure plate for glass molding and a manufacturing method of the same comprising the following steps: (A) providing a heating layer, wherein the heating layer contains at least a heating unit; and (B) forming a strengthen layer on the surface of the heating layer, and the material of the strengthen layer is selected from groups of diamond-like carbon, diamond, cubic boron nitride, silicon carbide, polycrystalline diamond, silicon carbide/titanium, polycrystalline cubic boron nitride, and combinations thereof. Therefore, this invention may effectively improve life-span for use and heat transfer efficiency of the heat pressure plate to prevent damage of heating components on inner side of heating pressure plate and the plate during repeated heating pressing process; furthermore, the high heat transfer effect of the strengthen layer may shorten the processing time effectively to improve processing efficiency.
TW96104659A 2007-02-08 2007-02-08 High heat transfer pressure plate for glass molding TW200833621A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96104659A TW200833621A (en) 2007-02-08 2007-02-08 High heat transfer pressure plate for glass molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96104659A TW200833621A (en) 2007-02-08 2007-02-08 High heat transfer pressure plate for glass molding

Publications (1)

Publication Number Publication Date
TW200833621A true TW200833621A (en) 2008-08-16

Family

ID=44819219

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96104659A TW200833621A (en) 2007-02-08 2007-02-08 High heat transfer pressure plate for glass molding

Country Status (1)

Country Link
TW (1) TW200833621A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI667206B (en) * 2018-04-12 2019-08-01 秦文隆 Heated heating field device under molded three-dimensional glass continuous forming device
CN112873972A (en) * 2021-02-23 2021-06-01 郑州华晶金刚石股份有限公司 Preparation process of graphite column for diamond synthesis

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI667206B (en) * 2018-04-12 2019-08-01 秦文隆 Heated heating field device under molded three-dimensional glass continuous forming device
CN112873972A (en) * 2021-02-23 2021-06-01 郑州华晶金刚石股份有限公司 Preparation process of graphite column for diamond synthesis
CN112873972B (en) * 2021-02-23 2023-02-24 郑州华晶金刚石股份有限公司 Preparation process of graphite column for diamond synthesis

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