200822990 九、發明說明： 【發明所屬之技術領域】 、，本發明係關於在常溫或加熱下具可塑性之燒結性金屬 粒子組成物、其製造方法、包含該燒結性金屬粒子組成物 之片狀黏δ劑、及將上述金屬粒子組成物夾入複數個金屬 衣構件之間並藉由加熱等而使燒結性金屬粒子相互燒結 之金屬製構件之黏合方法。 【先前技術】 眾所周知，使銀、銅、鎳等金屬之微細粒子分散於硬化 性樹脂組成物中而製備成之導電膏或導熱膏，可藉由加熱 而硬化’從而形成導電性被膜或熱傳導性被膜，故而可應 用於下述用途：於印刷電路基板上形成導電性電路；形成 %阻益或電容器等各種電子零件&各種顯示元件之電 極；形成電磁波屏蔽罩用導電性被膜；將電容器、電阻、 二極體、記憶體、及運算元件（CPU，central pr〇cessing t中央處理單元）等晶片零件黏合或黏著於基板上； 形成太陽能電池之電極，尤其是形成使用有非晶石夕半導體 ^:進行高溫處理之太陽能電池之電極；以及形成積層 y電容器、積層陶究電感器、積層陶究致動器等晶片型 陶^電子零件之外部電極等（例如，日本專利特開測-00 iU1 ) 〇 作;:：，由：為糊膏狀，故而於進行上述形成作業或黏合 作業時，、不易使其形成為特定之形狀、大小或厚度。又， 導電性被膜或熱傳導性祐胺 又 ，、埒ν性被膑包含金屬粒子及硬化之樹 312ΧΡ/發明說明書(補件)/96-07/96109690 6 200822990 脂’而由於硬化之樹月旨具有電絕緣性且 而並導雷4*4 、替ϊ ^ 季乂〗、’故 向厂v電性及熱傳導性之大小存在界限。 近年來，由於晶片零件之古} 樺加，不徭亜#钽日 冋月匕化，晶片零件之發熱量 :力二:僅要求提昇電傳導性’亦要求提昇熱傳導 相應地存在界限。 為=方面’於日本專利特公平7—111981中揭 =Γ化性樹腊之導電.導熱膏，包含貴金屬(例如銀) 2及有㈣劑’且藉由加熱而燒結之貴金屬糊f;以及藉 ^電子衣置與基板之間將該貴金屬糊膏加熱燒結，而^ — 汉上之方法。又，於日本專利特開2005 — 21 6508中，揭示有包含自平均粒徑為請5 “之金（An)粉、銀（Ag)粉或把（pd)粉中選擇之一種以上 ，金屬粉及有機溶劑的金屬糊膏以及於半導體晶圓上將 該金屬糊膏加熱燒結而形成凸塊之方法。 然而，存在下述問題，即，上述糊膏狀之金屬粒子組成 物係比重較大之金屬粒子與比重較小之揮發性分散媒的 混合物’由於兩者之比重差而導致兩者容易分離。又，由 於為糊膏狀，故而存在下述問題，，於應用時不易使直 形成為特定之形狀、大小或厚度，並且形狀、大小、或厚 度易於隨時間變化。 [專利文獻1 ]曰本專利特開2 〇 〇 3 — 5 5 7 01 [專利文獻2]日本專利特公平7 — 111981 [專利文獻3]日本專利特開2〇〇5_ 2165〇8 【發明内容】 312XP/發明說明書(補件 y96-07/96l〇9690 7 200822990 (發明所欲解決之問題） 子出不存在上述問題之燒結性金屬粒 =公性金屬粒子與常溫下呈固體狀而當加数時合炫 w亚揮务之分散媒混合，形成糊 4得具可塑性之燒結性金屬粒子組成物，即， =與揮發性分散料會分離，且易於獲得特定之形狀、 二、或厚度’並且形狀保持性優異，從而完成本發明。 :^之目的在於提供燒結性金屬粒子與揮發性分散媒 =^離’易於獲得特定之形狀、大小、或厚度，並且形 狀保持性優異之燒結性金屬粒子組成物、其製造方法、片 ，黏合劑、及使用該片狀黏合劑而將金屬製構 合的方法。 (解決問題之手段） 上述目的藉由下述發明而達成： [1 ]種燒結性金屬粒子組成物，其特徵在於，其包含： (A)ioo重量份之平均粒徑為〇 〇〇1〜5〇 之燒結性金 屬粒子，以及（B)3〜1〇〇重量份之分散媒，該分散媒於常 /里下為固體狀，而於金屬粒子（A)之燒結溫度以下之溫度 下會熔融並揮發；並且，此燒結性金屬粒子組成物於常溫 或加熱下具可塑性。 [1 1 ]如[1 ]之燒結性金屬粒子組成物，其中，燒結性 金屬粒子係銀粒子。 [1〜2]如[1]或[1 一 1]之燒結性金屬粒子組成物，其 312XP/發明說明書(補件)/96-07/96109690 8 200822990 中刀政媒（B)係醇類、烴類、酮類或脂肪酸類。 & [ 2 ] —種燒結性金屬粒子組成物之製造方法，其係如申 請專利範圍第1項之燒結性金屬粒子組成物的製造方 法，其特徵在於：將（A)1〇〇重量份之平均粒徑為Q〇〇1 50 # m之燒結性金屬粒子、與（B)3〜丨〇〇重量份之於常 溫:為固體狀而於金屬粒子（A)之燒結溫度以下之溫度下 會溶融亚揮發之分散媒，於分散媒⑻之炫點以上之溫度 下’吧合，开》成糊膏狀，並冷卻至常溫。 [2 1 ]如[2 ]之燒結性金屬粒子組成物之製造方法，其 中，燒結性金屬粒子係銀粒子。 [2 2 ]如[2 ]或[2 — 1 ]之燒結性金屬粒子組成物之製造 方法其中，为散媒（B)係醇類、烴類、酮類或脂肪酸類。 [3] —種金屬製構件之黏合劑，其特徵在於包含[丨]之燒 結性金屬粒子組成物，且為片狀。 [3 — 1]如[3]之金屬製構件之黏合劑，其中，燒結性金 屬粒子係銀粒子。 [3—2]如[3]或[3—丨]之金屬製構件之黏合劑，其中， 分散媒（B)係醇類、烴類、酮類或脂肪酸類。 [4] 一種金屬製構件之黏合方法，其特徵在於：使如 之燒結性金屬粒子組成物或[3]之黏合劑介在於複數個金 屬製構件之間，加熱至分散媒（B)之熔點以上之溫度而使 分散媒（B)揮散，且藉由加熱、一面加壓一面加熱、一面 加壓一面施加超音波振動、或者一面加壓加熱一面施加超 音波振動，而使金屬粒子（A)彼此燒結，從而將複數個金 312XP/發明說明書(補件)/96-07/96109690 〇 200822990 屬製構件彼此黏合。 1]如[4]之金屬製構件之黏合方法，其中，於分散 媒（B)之熔點為i〇(rc以下之情況時，於i〇(rc〜4〇〇c下 使金屬粒子（A)彼此燒結。 [4-2]如[4]或[4-1]之金屬製構件之黏合方法，其 中，燒結性金屬粒子係銀粒子。 、U-3]如[4W4_n^4—2]之金屬製構件之黏合方 法，其中，分散媒（B)係醇類、烴類、嗣類或脂肪酸類。 (發明效果） 、 本發明之燒結性金屬粒子組成物，於常溫或加執下且可 塑性，故而比重較大之金屬粒子與比重較小之揮發齡散 媒不會分離，易於獲得特定之形狀，並㈣狀保持性優異。 本發明之片狀黏合劑，於常溫或加熱下具可塑性，故而 比重較大之金屬粒子與比重較小之揮發性分散 離，操作性優異。 ^發明之燒結性金屬粒子組成物之製造方法，可高效率 且簡便地製造於常溫或加熱下具可塑性之燒結性金屬粒 子組成物。 本發明之金屬製構件之溆人士 4 pi 黏口方法，係使用於常溫或加埶 下具可塑性之燒結性金屬粒子組成物，故而可高精度且牢、 固地使複數個金屬製構件相互黏合。 【實施方式】 本發明之燒祕金屬㈣M絲之特齡於 (A)100重量份之平均粒俨A S * 才仫為0.001〜50 #ηι的燒結性金 312XP/發明說明書(補件)/96-07/96109690 10 200822990 屬粒子；以及（B)3〜100重量份之於常溫下為固體狀而於 金屬粒子（A)之燒結溫度以下之溫度下會熔融並揮發的分 散媒；並且，此燒結性金屬粒子組成物於常溫下為固體 狀’且於常溫或加熱下具可塑性。 燒結性金屬粒子（A)之材質，只要是於常溫下為固體， 且藉由加熱、一面加壓一面加熱、加壓及施加超音波振 動、或者加壓加熱及施加超音波振動而易於燒結者即可， 可例示金、銀、銅、鈀、鎳、錫、鋁及該等金屬之合金。 該等中，較佳為銀、銅、鎳，考慮到加熱燒結性、熱傳導 性及導電性等方面，尤佳為銀。銀粒子亦可為表面之一部 分或全部成為氧化銀者。 燒結性金屬粒子（A)之表面狀態並無限定，亦可於其表 面上附著有有機物。只要不阻礙燒結性，則附著於表面上 之有機物之種類及量並無限定。此種有機物，可例示於製 造燒結性金屬粒子（A)時所使用之還原劑、分散劑、及穩 、定劑等，並且可例示片化時所使用之潤滑劑。 作為潤滑劑，較佳為高脂肪酸、高脂肪酸金屬鹽、高脂 肪酸醯胺或高脂肪酸酯，尤佳為高脂肪酸。潤滑劑之附著 里，根據燒結性金屬粒子（A)之粒徑、比表面積、形狀等 而變化，但較佳為燒結性金屬粒子（4)之3重量％以下，更 佳為1重量％以下。其原因在於，若潤滑劑之附著量過多， 則加熱燒結性將會降低。 燒結性金屬粒子（A)之平均粒徑為〇〇〇1〜5〇 平均粒徑係藉由雷射繞射散射式粒度分佈測定法而獲^ 312XP/發明說明書(補件)/96-07/96109690 200822990 之原粒子的平均粒徑。 、 得難以燒結。因此，較佳 粒C50心’則會變 以下。於未達所謂之奈米佳為20“ 面活性過強，故而有可 凊况時，由於表 保存穩疋性降低。因此 ：、、且成物之 0.1〜10 #m。 勹U.1以"1以上，更佳為 燒結性金屬粒子（A) 方體狀、片狀、p 為球狀、大致球狀、大致立 較佳為片狀。 亏呆耗疋性之方面， 尤佳為係將利用還原 者。再者，楹w曰 子片化而獲得 再者k出有大篁還原法之銀粒子之製造方法。通常 ==’藉由料酸銀水料中加人氫氧仙水溶液而 二=化銀’於其中加人福馬林等還原劑之水溶液進行 還原’猎此生成銀粒子，並進行水洗、過濾、乾燥等。 附著有潤滑劑之片狀燒結性金屬粒子w)，可藉由下述 方式而製造（參照日本專利特公昭4〇一 6971、特開2〇〇3 一 55701之[0004]段）：於球狀等粒狀之燒結性金屬粒子 中添加潤滑劑，並利用球磨機等進行粉碎。 將粒狀之燒結性金屬粒子及高脂肪酸、高脂肪酸金屬 鹽、局脂肪酸酯、高脂肪酸醯胺等潤滑劑，與陶瓷製之球 狀物一併投入至旋轉式圓筒裝置（例如球磨機）中，利用球 狀物對燒結性金屬粒子進行物理性敲擊，藉此可容易地加 工成片狀（鱗片狀）。此時，使用以提昇潤滑性之高脂肪 酸、高脂肪酸金屬鹽、高脂肪酸酯、高脂肪酸醯胺等親油 312XP/發明說明書(補件)/96-07/96109690 12 200822990 性有機物附著於片狀之燒結性金屬粒子上。作為此種高脂 肪酸，可例示十二烷酸、肉豆蔻酸、棕櫚酸、硬脂酸、油 酸、亞麻油酸、次亞麻油酸，較佳為高飽和脂肪酸。作為 此種高飽和脂肪酸，可例示十二烷酸、肉豆蔻酸、棕橺酸、 硬脂酸。 片狀燒結性金屬表面（A)較佳為，其一半以上或全部由 此種高脂肪酸等所被覆。如此般金屬表面由潤滑劑所被覆 之燒結性金屬粒子（A)表現出親油性，提昇了與分散媒 之親和性，故而進一步提昇燒結性金屬粒子組成物之保存 穩定性。然而，若潤滑劑之附著量過多，則有時會降低燒 結性，故而較佳為〇.〇1〜3重量％，更佳為〇1〜1重量 潤滑劑之附著量可藉由通常之方法而加以測定。例如可 例示下述方法：於氮氣中加熱至潤滑劑之沸點以上並測定 出重量減少量之方法；以及於氧氣氣流中對燒結性金屬粒 子（A)進行加熱，使附著於燒結性金屬粒子（A)上之潤滑劑 中之碳變成二氧化碳，藉由紅外線吸收光譜法對二氧化碳 進行定量分析之方法等。 反 表面由潤滑劑所被覆之燒結性金屬粒子（A )亦可藉由禹 常之方法而製造。 9 k 例如，可藉由將金屬粒子浸潰於潤滑劑之溶液中，取出 金屬粒子並加以乾燥而製造。 必需的是，本發明之燒結性金屬粒子組成物中之分散媒 (B) ’於常溫下為固體狀，且於燒結性金屬粒子（a)之烤妗 溫度以下之溫度下會熔融並揮發。其原因在於，若揮 312XP/發明說明書(補件)/96-07/96109690 13 200822990 常溫下例# 5t：〜阶下並非為固體狀，則本發 、結性金屬粒子組成物於常溫下無法形成為固 ，二為使得於常溫下為固體，熔點必須高於常溫。然而一， 若=點過於接近常溫，則於氣溫較高之日子或室溫較高之 場中將無法保持形狀，故而較佳為，較常溫高以上。 具體而言較佳為，溶點為40°C以上。 然而，由於加熱燒結通常係於1〇〇〜3〇〇〇c下進行，故 而分散媒（B)之熔點較佳為低於該溫度範圍之燒結溫度， 其沸點較佳為在該溫度範圍之燒結溫度以下。具體而古， 其沸點較佳為6(TC〜30(TC。其原因在於’若沸點未達36〇 °c，則於製備燒結性金屬粒子組成物之作業期間，溶劑會 容易揮散，若沸點大於300°C，則燒結後亦很有可能 留分散媒（B)。 曰 作為此種分散媒（B )，可例示鄰苯三盼、對曱基苯醇、 鄰甲基苯醇、順式3, 3, 5-三甲基環己醇、松油醇、14一 環己烧二曱醇、1，4-環己二醇、四曱基乙二醇等醇類、聯 二苯、萘、1，2, 4, 5-四甲苯等烴類，二苯曱醯曱烷、查s同、 及乙醯基環己烷等酮類，以及十二烷酸、癸酸等脂肪酸 類。分散媒（B)亦可並用2種以上，但其混合物於常溫下 必須為固體狀。 對於为散媒（B)之添加置而g ’係每1 〇 〇重量份之燒结 性金屬粒子（A)則添加3〜100重量份之分散媒（B)。但 是，由於將根據燒結性金屬粒子（A)之粒徑、形狀、比重 等及分散媒（B)之性狀而改變適當之量，故而上述添加量 312χΡ/發明說明書(補件)/96-07/96109690 14 200822990 ^對於使分散媒（B )與燒結性金屬粒子（A )之混合物於分 政媒（B)之熔點以上成為糊膏狀而言充足之量，且係對於 j常溫下成為半固體狀或固體狀而言充足之量。只要不違 背本發明之目的，本發明之燒結性金屬粒子組成物除了包 ，，結性金屬粒子（A)及分散媒（B)以外，亦可含有少量或 微量之非金屬系之粉末、金屬化合物或金屬錯合物、觸變 劑、穩定劑、著色劑等添加物。 物觸文 本發明之燒結性金屬粒子組成物，於常溫或加熱下具可 2 !·生。萬/皿下之可塑,!·生，係如適度含水之黏土 2性質。即’可塑性表示於常溫下為半固體狀藉二見 f力可谷易地產生塑性變形的性質。例如係如下所述之性 質、’，即’「即便將立方體狀之燒結性金屬粒子組成物載置 於平板上亦不會產生變形。然而，當將硬質板放置於立方 體上，並向下方按㈣硬質板時，該立方體之厚度將變薄 :向：平：向擴展開 '然而，即便停止按壓，厚度及面積 =不“灰復至原本狀態」。加熱下之可塑性，係如埶可塑 性塑料所表現出之性質。即係如下所述之性質’即、，「於 :溫下為固體狀，且即便施加應力亦不會產生變形，但者 =-溫度以上時’會成為半固體狀，當施加應二 易產生塑性變形」。 才备 本發明之燒結性金m组成物較佳為，於常溫 狀（包含薄膜狀）。薄片之大小並無限定，又，薄片之= 亦無限定，較佳為50 #m〜1 mm之均勻之厚度。予又 若為片狀，騎於使其介在於2片平坦之^製構件之 312XP/發明說明書(補件)抓〇7/961〇969〇 200822990 屬制;^為便利。薄片、形狀較佳設為欲黏合之金 屬:構件之大小、形；J大，或者設為需要黏合之大小、形狀。 片狀燒結性金屬粒子組成物， 綠肋望+人® 4丄 J J包3片狀、溥膜狀、 便係與燒結性金屬粒子⑷相同之 孟屬或不同之金屬，於燒結時亦 本發明之燒結性金屬粒子組成物於常溫下金為屬』片 2體狀’但當藉由加熱而達到分散媒⑻之㈣以上之 呀’分散媒(B)會熔融而成為糊膏狀，並開始揮散。 〇而’根據分散媒⑻之種類，亦有進__步升溫時才合開 始揮散之情況。當於分散媒⑻揮散期間或者完全‘散 後，達到燒結性金屬粒子（A)之燒結溫度以上時，燒結性 金屬粒子（A)燒結，若將其冷卻則形成固體狀之金屬。若 燒結性金屬粒子（A)於燒結中途接觸於金屬製構件，則該 固體狀之金屬將黏著於該金屬製構件上。此時較佳為、，= 結性金屬粒子（A)與金屬製構件係相同之金屬，但^ 便為不同之金屬，只要是燒結時易於黏著之金屬即 可0 燒結性金屬粒子（A)之加熱燒結溫度必須為分散媒（B) 之溶點以上，且為分散媒（B)可揮散之溫度以上的溫度。 於將本發明之燒結性金屬粒子組成物用於複數個金屬 製構件之黏合之情況時，使本發明之燒結性金屬粒子組成 物介在於金屬製構件之間，加熱至分散媒（B)之熔點以 上’或者加熱至分散媒（B)之熔點以上並且分散媒（B)可揮 散之溫度以上且燒結性金屬粒子（A)可燒結之溫度以上。 312XP/發明說明書(補件)/96-07/96109690 16 200822990 具體而言，於分散媒（B)之熔點為i〇(rCH下之情況時， 該溫度較佳為100°c以上400°C以下之溫度，更佳為150 °C以上300°C以下之溫度。 其原因在於，於未達1〇〇。〇之溫度下燒結之金屬稀少， 且若超過40(TC，則分散媒（B)會爆沸蒸發，從而有可能 會對金屬製構件之形狀造成不良影響。 此時，亦可對燒結性金屬粒子組成物施加壓力，或者施 加壓力及超音波振動。若施加壓力，則可提昇燒結性，若 施加壓力及超音波振動，則可進一步提昇燒結性。 對本發明之燒結性金屬粒子組成物進行加熱等，使燒結 性金屬粒子（A)燒結而形成之固體狀金屬之形狀，並不限 定於片狀，亦可為帶狀、線狀、圓盤狀、塊狀、點狀、不 定形狀。 當對本發明之燒結性金屬粒子組成物進行加熱、一面加 壓一面加熱、一面加壓一面施加超音波振動、或者一面加 壓加熱一面施加超音波振動時，分散媒（B)會熔融並揮 散，且燒結性金屬粒子（A)燒結，藉此形成強度及電傳導 陡及熱傳導性優異之固體狀金屬。該固體狀金屬會黏著於 所接觸之金屬製構件例如鍍金基板、銀基板、鍍銀金屬基 板、銅基板等金屬系基板以及電絕緣性基板上之電極等金 屬部分，故而可用於金屬系基板之黏合以及具有金屬部分 之電子零件、f子裝置、電氣零件、電氣裝置等之黏合。 尤其是於燒結性金屬粒子（A)為銀粒子之情況時，可形成 具有較高強度以及極高電傳導性及熱傳導性的固體狀 312XP/發明說明書(補件)/96-07/96109690 17 200822990 銀’故而較佳。作為此種黏合，可例示電容器、電阻等晶 片零件與電路基板之黏合，二極體、記憶體、CPU等半導 -曰曰片/、弓丨線框或電路基板之黏合，以及高發熱之cpu晶 片與冷卻板之黏合。 超音波振動之頻率為2 kHz以上，較佳為10 kHz以上。 其上限並無特別限制，但考慮到超音波振動裝置之能力方 面，其上限為500 kHz左右。又，由於超音波振動之振幅 會影響到燒結性，故而較佳為〇· 1〜40 /zm，更佳為〇·3 2〇从m，進而更佳為〇·5〜12 。再者，為使超音波 振動準確地傳遞至燒結性金屬粒子組成物，較佳為將超音 波振動之發送部分直接按壓於燒結性金屬粒子組成物 上或者較佳為’介隔包含不易吸收超音波振動之素材的 覆蓋材料等，而將超音波振動之發送部分按壓於燒結性金 屬粒子組成物上。 對燒結性金屬粒子組成物之按壓壓力較佳為〇· 9 kPa(〇.〇9gf/mm2)以上，更佳為 9kPa(〇.92gf/_2)以上， 進而更佳為39kPa(3.98 gf/mm2)以上。按壓壓力之上限， 為進行黏合之構件不受破壞之壓力之最大值。 一面加壓加熱一面施加超音波振動而進行燒結之情況 時之加熱溫度’只要是高於常溫，分散媒（B)可揮散，且 燒結性金屬粒子（A)可燒結之溫度即可。然而，若超過4〇〇 C ’則分散媒（B)會爆沸蒸發，從而有可能會對固體狀金 屬之形狀造成不良影響，因此較佳為4〇〇°c以下，且未達 該燒結性金屬粒子（A)之熔點的溫度，更佳為3〇〇〇c以下。 312XP/發明說明書(補件)/96·07/961〇9690 18 200822990 本發明之燒結性金屬粒子組成物，於將燒結性金屬粒子 (A)燒結後不會殘留分散媒，故而無須洗蘇燒結物，但亦 可使用有機溶劑加以洗滌。 於本發明之燒結性金屬粒子組成物為片狀之情況時，較 佳為將其夾持於玻璃板、塑料薄膜等保護材料之間而加以 保存。又’為提昇保存穩定性，亦可將其冷藏保管，作為 保管溫度，可例示l〇°C以下。 [實施例] 以下揭示本發明之實施例及比較例。實施例及比較例 中’份表示重量份。燒結性金屬粒子組成物之片狀物之製 作方法、燒結性金屬粒子組成物之形狀保持性、以及燒結 性金屬粒子組成物黏著固體狀金屬之黏著強度，係藉由下 述方法而進行測定的。再者，未特別揭示之情況時之溫度 為25°C。 ’凰又 [燒結性金屬粒子組成物之片狀物之製作方法] 將本發明之燒結性金屬粒子組成物夾持於2片聚四氣 乙烯薄片之間，使用加熱至分散媒（B)之熔點+ 1〇它之加 壓機而施加壓力，以使燒結性金屬粒子組成物之厚度成為 300 #m，冷卻至未達分散媒（B)之熔點後，取出結性 金屬粒子組成物’裁剪成特定之大小，製成片狀。 [燒結性金屬粒子組成物之形狀保持性] 於覓25 mmx長25 mmx厚1 _之鍍銀銅板！上，載置焊 結性銀粒子組成物2以使大小為縱1〇·〇職乂橫1〇 〇二 且厚度為300 //m，測定於25°C下靜置1小時後之燒結2 312XP/發明說明書(補件)/96-07/96109690 19 200822990 之大小，以縱長及橫長之平均值而表示。於 物2為糊膏狀之情況時，使用具有大小 :且及二Γ “m且厚度為300…開口部的 t及刮水板’將糊膏狀組成物印刷塗#於鍍銀銅板上， 敎於饥下靜置i小時後之境結性銀粒子組成物之大 小，以縱長及横長之平均值而表示。 [黏著強度A] 於寬25 _x長75 mmx厚1 _之鍍銀銅板上，放置寬5 丽x長ΛΓ厚1GG ^之片狀燒結性銀粒子組成物，於 其上搭載寬5 _長5 _厚〇·5 _之銀製晶片後，於強 制循環式烘箱内在20(TC下加熱i小時，藉此使銀製晶片 ，者於鐘銀銅板上。自烘箱中取出測試體並放置至冷卻， 取終銀粒子燒結而將該銅板與該銀製晶片黏著。將以如此 之方式而獲得之黏著強度測定用測試體安裝於黏晶強度 測疋測忒機上，使用黏晶強度測定測試機之黏晶裝置，以 23 mm/分之速度按壓銀製晶片之側面，將銀製晶片與鍍銀 銅板間之黏合部剪力破壞時之負重作為黏著強度（單位： kgf)。再者，黏著強度測試係進行3次，將其平均值作為 黏著強度A。 ~ [黏著強度B] 於寬25 _x長75 mmx厚lmm之鍍銀銅板上，放置5 mmx5 _x厚10Q //m之片狀燒結性銀粒子組成物，於其上搭載 寬5 mmx長5 mmx厚〇· 5 mm之銀製晶片，從而製作出黏著 強度測定用前軀體。將黏著強度測定用前軀體安裝於超音 312XP/發明說明書(補件)/96-07/96109690 20 200822990 波熱麗著襄置上’於超音波振動之頻率為3〇咖、超音 波振動之振幅為4 βηι、按壓壓力為1〇〇N/cm2之條件下曰， 自上方將超音波熱壓著裝置之壓著部（探針）按壓於黏箬 強度測定用前軀體之銀製晶片之上部，一面施加超音波 動一面於20(TC之溫度下壓著3〇秒鐘。自超音波敎壓著 裝置中取出測試體並放置至冷卻，最終銀粒子燒結而將該 銅板與該銀製晶片相黏著。將以如此之方式而獲得之黏著 強度測定用測試體安裝於黏晶強度測定測試機上，使料 晶強度測定測試機之黏晶裝置…3 mm/分之速度按壓 銀製晶片之側面’將銀製晶片與鍍銀銅板間之黏合部剪力 破壞時之負重作為黏著強度(單位：kgf)。再者，黏著強 度測試係進行3次，將其平均值作為黏著強度B。 [實施例1] 於玻璃製容器中，投入100份之市售之將藉由還原法所 製造，銀粒子片化而獲得且原粒子之平均粒徑為4 藉由雷射繞射法而測定）的片狀銀粒子，並投入25份 之1，2, 4, 5-四曱苯（和光純藥工業股份有限公司銷售之試 劑’熔點為8(TC，彿點為19rc)作為分散媒⑻，於9〇 C之熱板上充分擾拌’製成均勻之糊膏。自熱板上取下該 容器，放置於25°C之環境中。將該糊膏狀之燒結性銀粒 子組成物夹持於2片厚度為130 之聚醯亞胺薄片之 間’使用加熱1 9(TC之加壓機進行加壓，使得該燒結性 銀粒子組成物之厚度成為__。將該燒結性銀粒子組 成物連同聚醯亞胺薄片一起自加壓機中取出並冷卻，自聚 312XP/發明說明書(補件)/96-07/96109690 200822990 亞胺薄片上剝離该燒結性銀粒子組 物二該片狀組成物包含均句分散有銀粒子之二 甲苯^ 25 C下為堅硬之固體狀，而當升溫至9()。匸時則 成為糊膏狀。即，該#狀組成物具熱可塑性。 測疋该燒結性銀粒子組成物之形狀保持性、及燒結性銀 粒子組成物黏著固體狀金屬之黏著強度，將結果歸納表示 於表1巾。根據以上之結果可知，該燒結性銀粒子組成物 中片狀銀粒子與丨，2, 4, 5-四甲苯不會分離，形狀保持 性優異，並且可用於牢固地黏合金屬製構件。 [實施例2] :貫施例1中，使用四甲基乙二醇（和光純藥工業股份 有限公司銷售之試劑，熔點為42t，沸點為175。〇取代 1，2, 4, 5-四甲苯，除此以外，以與實施例】相同之方式製 備出燒結性金屬粒子組成物。該燒結性銀粒子組成物於 9〇°C下為糊膏狀。將該燒結性銀粒子組成物夾持於2片厚 度為130 /zm之聚醯亞胺薄片之間，使用加熱至9〇Qc之 加壓機進行加壓，使得其厚度成為3〇〇 。將該燒結性 銀粒子組成物連同聚醯亞胺薄片一起自加壓機中取出並 冷卻，自聚醯亞胺薄片上剝離該燒結性銀粒子組成物，獲 得片狀組成物。該片狀組成物包含均勻分散有銀粒子之四 甲基乙二醇，於25°C下為堅硬之固體狀，而當升溫至8〇 °C時則成為糊膏狀。即，該片狀組成物具熱可塑性。測定 該燒結性銀粒子組成物之形狀保持性、以及燒結性銀粒子 組成物黏著固體狀金屬之黏著強度，將其結果歸納表示於 312XP/發明說明書(補件)/96-07/96109690 22 200822990 表1中。根據以上之結果可知，該燒結性銀粒子組成物 中片狀銀粒子與四甲基乙二醇不會分離，形狀保持性優 異’並且可用於牢固地黏合金屬製構件。 [實施例3 ] 丄於實施例2巾，使用22份之四甲基乙二醇及3份之节 。酉予（和光純藥ji業股份有限公司銷1之試劑，熔點為一工5 C，沸點為205°C )取代25份之四甲基乙二醇，除此以外， 以與實施例2相同之方式製備出燒結性銀粒子組成物。該 燒結性銀粒子組成物於9(rc下為糊膏狀。將該燒結性銀 粒子組成物夾持於2片厚度為130 之聚醯亞胺薄片之 間，使用加熱至90 C之加壓機進行加壓，使得其厚度成 為3 0 0 # m。將该燒結性銀粒子組成物連同聚醯亞胺薄片 起自加壓機中取出並冷卻，自聚醯亞胺薄片上剝離該燒 結性銀粒子組成物，獲得片狀組成物。片狀組成物係良好 地分散有銀粒子及四甲基乙二醇及苄醇之均勻且堅硬之 固體狀。測定該燒結性銀粒子組成物之形狀保持性、以及 燒結性銀粒子組成物黏著固體狀金屬之黏著強度，將結果 歸納表示於表1中。根據以上之結果可知，該燒結性銀粒 子組成物中，銀粒子與四甲基乙二醇及苄醇不會分離，形 狀保持性優異，並且可用於牢固地黏合金屬製構件。 [比較例1] 於貫施例1中’使用^--焼（和光純藥工業股份有限公 司銷售之試劑，熔點為-26 °C，沸點為196 °c )取代 1 ’ 2, 4, 5-四甲苯作為分散媒，除此以外，以與實施例1相 312XP/發明說明書(補件)/96-07/96109690 23 200822990 同之方式製備出燒結性銀粒子組成物。該燒結性銀粒子組 成物於25°C下亦為具有流動性之糊膏狀，但無法成型成 片狀。測定該燒結性銀粒子組成物之形狀保持性、以及燒 結性銀粒子組成物黏著固體狀金屬之黏著強度，將結果歸 納表示於表1中。 [比較例2 ] 於100份之市售之將藉由還原法所製造之銀粒子片化 而獲得且原粒子之平均粒徑為3.0 /zm(藉由雷射繞射法 ' 而測定）的片狀銀粒子（銀表面由0· 5重量％之硬脂酸所覆 蓋，且該銀粒子具有斥水性）中，添加15份之乙二醇（和 光純藥工業股份有限公司銷售之試劑，介電係數為39. 0， 熔點為-13°C，沸點為198°C)作為分散媒，使用旋轉式混 練機均勻混合，藉此製備出糊膏狀銀粒子組成物。 該燒結性銀粒子組成物於25°C下亦為具有流動性之糊 膏狀，但無法成型成片狀。測定該燒結性銀粒子組成物之 形狀保持性、以及燒結性銀粒子組成物黏著固體狀金屬之 黏著強度，將結果歸納表示於表1中。 [表1 ] 實施例1 實施例2 實施例3 比車交例1 比較例2 燒結性金屬粒子 雜子 銀粒子 銀粒子 銀粒子 銀粒子 分散媒之熔點(。C) 80 42 -15 -26 -13 分散媒之沸點(°c) 191 175 205 196 198 分散媒之性狀(25〇C) 固體 固體 固體 液體 液體 燒結性金屬粒子組成物之性狀 固體 固體 固體 糊膏 糊膏 燒結性金屬粒子組成物之大小，最初(mm) 10.0 10.0 10.0 10.0 — 燒結性金屬粒子組成物之大小，1小時後（mm) 10.0 10.0 10.0 11.5 — 黏著強度A(kgf) 16 18 17 12 14 黏著強度B(kgf) 12 一 一 一 — 312XP/發明說明書(補件)/96-07/96109690 24 200822990 (產業上之可利用性） 、本么明之燒結性金屬粒子組成物中，燒結性金屬粒子與 媒不會分離’並且形狀保持性優異，故而可用於將電 谷：、電阻、二極體、記憶體、運算元件(CPU)等晶片零 件高精度地黏合於基板上。 7 【圖式簡單說明】 圖1係實施例中之燒結性金屬粒子組成物之形狀保持 性之測定之平面圖。 、 【主要元件符號說明】 1 鑛銀銅板 2 燒結性金屬粒子組成物 312XP/發明說明書(補件)/96-07/96109690 25200822990 IX. Description of the Invention: [Technical Field] The present invention relates to a sinterable metal particle composition which is plastic at normal temperature or under heating, a method for producing the same, and a sheet-like viscosity comprising the composition of the sinter metal particle The δ agent and a bonding method of a metal member in which the metal particle composition is sandwiched between a plurality of metal members and the sinter metal particles are sintered to each other by heating or the like. [Prior Art] It is known that a conductive paste or a thermal conductive paste prepared by dispersing fine particles of a metal such as silver, copper or nickel in a curable resin composition can be hardened by heating to form a conductive film or thermal conductivity. The film can be used for forming a conductive circuit on a printed circuit board, forming various electronic parts such as a resistor or a capacitor, and electrodes of various display elements; forming a conductive film for an electromagnetic wave shield; A wafer component such as a resistor, a diode, a memory, and an arithmetic element (CPU, central processing unit) is bonded or adhered to the substrate; an electrode for forming a solar cell, especially an amorphous semiconductor semiconductor ^: an electrode for a solar cell to be subjected to high-temperature treatment; and an external electrode for forming a wafer type ceramic electronic component such as a laminated y capacitor, a laminated ceramic inductor, a laminated ceramic actuator, etc. (for example, Japanese Patent Special Open-00 iU1) ;作;::, by: is a paste-like shape, so it is not easy to carry out the above-mentioned forming operation or bonding industry. Which is formed of a specific shape, size or thickness. In addition, the conductive film or the heat-conducting amine, the 埒ν-type 膑 contains the metal particles and the hardened tree 312 ΧΡ / invention manual (supplement) / 96-07/96109690 6 200822990 grease ' It is electrically insulating and has a limit of 4*4, ϊ^ 乂 、, and 'there is a limit to the electrical and thermal conductivity of the factory. In recent years, due to the ancient parts of wafer parts, Huajia, not 徭亜#钽日冋月匕, the heat of the wafer parts: Force 2: only required to improve the electrical conductivity' also requires an increase in heat conduction. For the = aspect of the Japanese Patent Special Fair 7-111981 revealed = the conductivity of the degenerate tree wax. a thermal paste comprising a noble metal (for example, silver) 2 and a noble metal paste f having a (four) agent and sintered by heating; and heating and sintering the noble metal paste between the electronic device and the substrate, and method. Further, in Japanese Patent Laid-Open No. 2005-21 6508, it is disclosed that one or more selected from the group consisting of gold (An) powder, silver (Ag) powder or (pd) powder having an average particle diameter of 5", metal powder And a metal paste of an organic solvent and a method of heating and sintering the metal paste on a semiconductor wafer to form a bump. However, there is a problem that the paste-like metal particle composition has a large specific gravity The mixture of the metal particles and the volatile dispersing medium having a small specific gravity is easy to separate due to the difference in specific gravity between the two particles. Further, since it is in the form of a paste, the following problems occur, and it is difficult to form the straight into the application. The specific shape, size, or thickness, and the shape, size, or thickness are apt to change with time. [Patent Document 1] Japanese Patent Laid-Open No. 2 〇〇 3 — 5 5 7 01 [Patent Document 2] Japanese Patent Special Fair 7 — 111981 [Patent Document 3] Japanese Patent Laid-Open No. 2〇〇5_ 2165〇8 [Summary of the Invention] 312XP/Invention Manual (Supplement y96-07/96l〇9690 7 200822990 (Problem to be solved by the invention) Problem sinter gold The granule=the sinter metal particles are solid at the normal temperature and are mixed with the dispersing medium of the smear w when the addition is added to form the sinter metal particle composition having the plasticity of the paste 4, ie, = volatile dispersion material The invention is completed, and it is easy to obtain a specific shape, a thickness, or a thickness, and the shape retention is excellent, thereby completing the present invention. The purpose of the invention is to provide a sinterable metal particle and a volatile dispersion medium. A sinter metal particle composition having a size, a thickness, or a thickness and excellent shape retention, a method for producing the same, a sheet, a binder, and a method of bonding a metal using the sheet-like binder. The above object is achieved by the following invention: [1] A sinterable metal particle composition comprising: (A) a sinter metal having an average particle diameter of 1 to 5 Å in parts by weight of ioo a particle, and (B) a dispersion medium of 3 to 1 part by weight, the dispersion medium being solid at normal/inside, and melting and volatilizing at a temperature below the sintering temperature of the metal particle (A); This burning [1] The composition of the sinterable metal particles according to [1], wherein the sinterable metal particles are silver particles. [1 to 2] such as [1] or [1-11] Sintered metal particle composition, 312XP / invention specification (supplement) / 96-07/96109690 8 200822990 Knife medium (B) is an alcohol, a hydrocarbon, a ketone or a fatty acid. [2] A method for producing a sinter metal particle composition, which is a method for producing a sinter metal particle composition according to the first aspect of the invention, characterized in that (A) 1 part by weight The sinter metal particles having an average particle diameter of Q 〇〇 1 50 # m and (B) 3 to 丨〇〇 by weight at room temperature: solid at a temperature below the sintering temperature of the metal particles (A) The dissolving medium of the volatilization is melted, and the mixture is turned into a paste at a temperature higher than the scent of the dispersion medium (8), and is cooled to room temperature. [2] The method for producing a sinter metal particle composition according to [2], wherein the sinterable metal particles are silver particles. [2 2] The method for producing a sinter metal particle composition according to [2] or [2-1], wherein the solvent (B) is an alcohol, a hydrocarbon, a ketone or a fatty acid. [3] A binder for a metal member characterized by comprising a sintered metal particle composition of [丨] and having a sheet shape. [3] The adhesive of a metal member according to [3], wherein the sinterable metal particles are silver particles. [3-2] A binder for a metal member such as [3] or [3-—], wherein the dispersing medium (B) is an alcohol, a hydrocarbon, a ketone or a fatty acid. [4] A method for bonding a metal member, characterized in that a sinter metal particle composition or a binder of [3] is interposed between a plurality of metal members and heated to a melting point of the dispersion medium (B) The dispersion medium (B) is volatilized by the above temperature, and ultrasonic vibration is applied while being heated while being heated, and ultrasonic vibration is applied while being pressurized, or ultrasonic vibration is applied while being pressurized, and the metal particles (A) are applied. They are sintered to each other to bond a plurality of gold 312XP/invention manual (supplement)/96-07/96109690 〇200822990 members to each other. 1] The method of bonding a metal member according to [4], wherein, when the melting point of the dispersion medium (B) is i 〇 (rc or less, the metal particles (A) are obtained under rc~4〇〇c [4-2] The method of bonding a metal member according to [4] or [4-1], wherein the sinterable metal particles are silver particles. U-3] such as [4W4_n^4-2] The method for bonding a metal member, wherein the dispersing medium (B) is an alcohol, a hydrocarbon, a hydrazine or a fatty acid. (Effect of the invention) The sinter metal particle composition of the present invention is at room temperature or elevated Since the plasticity is large, the metal particles having a large specific gravity are not separated from the volatile-aged medium having a small specific gravity, and a specific shape is easily obtained, and the (four) shape retention property is excellent. The sheet-like adhesive of the present invention has plasticity at normal temperature or under heating. Therefore, the metal particles having a large specific gravity are dispersed with a small specific gravity, and the workability is excellent. The method for producing the sintered metal particle composition of the invention can be efficiently and easily produced at room temperature or under heating. Sintered metal particle composition. The metal member of the present invention The 4 pi adhesive method is a composition of a sinterable metal particle having a plasticity at room temperature or under pressure, so that a plurality of metal members can be bonded to each other with high precision and firmly and firmly. [Embodiment] The burnt metal (4) M wire is at the age of (A) 100 parts by weight of the average particle size AS * is 0. 001~50 #ηι Sintering Gold 312XP/Invention Manual (Supplement)/96-07/96109690 10 200822990 genus particles; and (B) 3 to 100 parts by weight of solid particles at room temperature (A) a dispersing medium which melts and volatilizes at a temperature lower than the sintering temperature; and the sinter metal particle composition is solid at normal temperature' and has plasticity at normal temperature or under heating. The material of the sinterable metal particles (A) is a solid which is solid at normal temperature, and is heated, pressurized, and subjected to ultrasonic vibration, pressure heating, and ultrasonic vibration by heating. That is, gold, silver, copper, palladium, nickel, tin, aluminum, and alloys of the metals can be exemplified. Among these, silver, copper, and nickel are preferable, and silver is particularly preferable in view of heat sinterability, thermal conductivity, and electrical conductivity. The silver particles may also be part of the surface or all of them become silver oxide. The surface state of the sinter metal particles (A) is not limited, and an organic substance may be attached to the surface. The type and amount of the organic substance adhering to the surface are not limited as long as the sinterability is not inhibited. The organic substance may, for example, be a reducing agent, a dispersing agent, a stabilizer, a fixing agent or the like used in the production of the sinter metal particles (A), and may be exemplified by a lubricant used for tableting. As the lubricant, a high fatty acid, a high fatty acid metal salt, a high fatty acid decylamine or a high fatty acid ester is preferable, and a high fatty acid is particularly preferable. The adhesion of the lubricant varies depending on the particle size, specific surface area, shape, and the like of the sinter metal particles (A), but is preferably 3% by weight or less, more preferably 1% by weight or less, of the sinter metal particles (4). . The reason for this is that if the amount of adhesion of the lubricant is too large, the heat sinterability is lowered. The average particle diameter of the sinter metal particles (A) is 〇〇〇1 to 5 〇, and the average particle diameter is obtained by laser diffraction scattering particle size distribution measurement. 312XP/Invention Manual (Supplement)/96-07 /96109690 200822990 The average particle size of the primary particles. It is difficult to sinter. Therefore, the preferred particle C50 core' will be changed to the following. If the surface is too strong, it is too strong, so when the condition is too high, the stability of the table is reduced. Therefore, the product is 0. 1~10 #m.勹U. 1 is preferably 1 or more, more preferably sinter metal particles (A) in the form of a square body or a sheet, p is spherical, substantially spherical, and substantially preferably in the form of a sheet. In terms of depletion and depletion, it is especially preferred that the department will use the restorer. Further, a method of producing silver particles having a large reduction method is obtained. Usually ==' by adding an aqueous solution of hydroxyxanthine to the silver acid water, and adding a solution of a reducing agent such as formalin to the silver acid water to reduce the amount of silver particles, and washing and filtering, Drying, etc. The sheet-like sinterable metal particles w) to which the lubricant is attached can be produced by the following method (refer to paragraph [0004] of Japanese Patent Publication No. Sho. No. 4,691, JP-A No. 2, No. 3, No. A lubricant is added to the granulated sinter metal particles, and is pulverized by a ball mill or the like. The granular sinter metal particles and lubricants such as high fatty acid, high fatty acid metal salt, local fatty acid ester, and high fatty acid decylamine are put together with ceramic balls into a rotary cylinder device (for example, a ball mill). In the middle, the sinter metal particles are physically knocked by the balls, whereby they can be easily processed into a sheet shape (scale shape). At this time, use high-fat fatty acid, high fatty acid metal salt, high fatty acid ester, high fatty acid guanamine and other lipophilic 312XP/invention specification (supplement)/96-07/96109690 12 200822990 On the sinter metal particles. As such a fatty acid, dodecanoic acid, myristic acid, palmitic acid, stearic acid, oleic acid, linoleic acid, and linoleic acid are preferable, and a highly saturated fatty acid is preferable. As such a highly saturated fatty acid, dodecanoic acid, myristic acid, palmitic acid, or stearic acid can be exemplified. The sheet-like sinterable metal surface (A) is preferably such that more than half or all of it is coated with such a high fatty acid or the like. The sinter metal particles (A) coated with the lubricant on the metal surface exhibit oleophilic properties and improve the affinity with the dispersion medium, so that the storage stability of the sinter metal particle composition is further improved. However, if the amount of the lubricant attached is too large, the sintering property may be lowered, so that it is preferably 〇. 〇1 to 3% by weight, more preferably 〇1 to 1 by weight The amount of lubricant attached can be measured by a usual method. For example, a method of heating to a boiling point of a lubricant or more and measuring a weight loss amount in nitrogen gas; and heating the sinter metal particle (A) in an oxygen gas stream to adhere to the sinter metal particle (for example) can be exemplified ( A) A method in which carbon in the lubricant is converted into carbon dioxide, and carbon dioxide is quantitatively analyzed by infrared absorption spectroscopy. The sinterable metal particles (A) coated on the reverse surface by a lubricant can also be produced by an ordinary method. 9 k For example, it can be produced by immersing metal particles in a solution of a lubricant, taking out metal particles, and drying them. In the sinterable metal particle composition of the present invention, the dispersion medium (B)' is solid at normal temperature, and is melted and volatilized at a temperature lower than the baking temperature of the sinter metal particles (a). The reason is that if the 312XP/invention specification (supplement)/96-07/96109690 13 200822990 at room temperature is the case #5t: the step is not solid, the composition of the hair and the metal particles cannot be at room temperature. The formation is solid, and the second is to make it solid at normal temperature, and the melting point must be higher than normal temperature. However, if the = point is too close to the normal temperature, the shape will not be maintained on the day when the temperature is high or the room where the room temperature is high, so it is preferable to be higher than the normal temperature. Specifically, it is preferred that the melting point is 40 ° C or higher. However, since the heating and sintering are usually carried out at 1 〇〇 to 3 〇〇〇c, the melting point of the dispersion medium (B) is preferably a sintering temperature lower than the temperature range, and the boiling point is preferably in the temperature range. Below the sintering temperature. Specifically, the boiling point is preferably 6 (TC~30 (TC. The reason is that if the boiling point is less than 36 〇 ° C, the solvent will easily volatize during the operation of preparing the sinter metal particle composition, if the boiling point When it is more than 300 ° C, it is also likely to leave a dispersion medium (B) after sintering. As such a dispersion medium (B), phthalimide, p-nonyl phenyl alcohol, o-methyl phenyl alcohol, cis is exemplified. 3, 3, 5-trimethylcyclohexanol, terpineol, 14-cyclohexanol, 1,4-cyclohexanediol, tetradecyl glycol and other alcohols, biphenyl, naphthalene, Hydrocarbons such as 1,2,4, 5-tetramethylbenzene, ketones such as diphenyl decane, s s, and ethyl cyclohexane, and fatty acids such as dodecanoic acid and citric acid. (B) Two or more types may be used in combination, but the mixture must be solid at room temperature. For the addition of the solvent (B), the sinter metal particles (A) are added per part by weight. Then, 3 to 100 parts by weight of the dispersion medium (B) is added. However, since the appropriate amount is changed depending on the particle size, shape, specific gravity, and the like of the sinter metal particle (A) and the properties of the dispersion medium (B), The above-mentioned addition amount 312 χΡ / invention specification (supplement) / 96-07/96109690 14 200822990 ^ for the mixture of the dispersion medium (B) and the sinter metal particles (A) above the melting point of the sub-media (B) becomes a paste It is sufficient in the form of a sufficient amount to be semi-solid or solid at normal temperature j. The sinter metal particle composition of the present invention is not only coated, but also a knot metal as long as it does not contradict the object of the present invention. In addition to the particles (A) and the dispersing medium (B), a small amount or a small amount of a non-metallic powder, a metal compound or a metal complex, a thixotropic agent, a stabilizer, a coloring agent, or the like may be contained. The composition of the sinter metal particles can be made at room temperature or under heating. The plasticity can be molded under the dish, and the plastic is like a moderately water-containing clay. That is, the plasticity is semi-solid at normal temperature. The properties of the plastic deformation are easily obtained by the f-force, for example, the property as described below, 'that is,' even if the cubic sinter metal particle composition is placed on a flat plate, deformation does not occur. However, when When the plate is placed on the cube and pressed down (4) to the hard plate, the thickness of the cube will be thinner: To: Flat: Expand to open' However, even if the pressure is stopped, the thickness and area = not "grey to the original state" The plasticity under heating is a property exhibited by a plasticity plastic, that is, the property as described below, ie, "is: solid at a temperature, and does not cause deformation even if stress is applied, but = - When the temperature is higher than the temperature, it will be semi-solid, and it will be plastically deformed when applied. The sinter-gold composition of the present invention is preferably at room temperature (including a film). Further, the thickness of the sheet is not limited, and is preferably a uniform thickness of 50 #m to 1 mm. If it is in the form of a sheet, it is 312XP/inventive manual (supplement) which is made up of two flat members. It is made up of 7/961〇969〇 200822990; The sheet and shape are preferably set to be the metal to be bonded: the size and shape of the member; J is large, or is set to a size and shape to be bonded. The sheet-like sinterable metal particle composition, the green ribs + human® 4 丄 JJ package 3 pieces, the enamel film, and the sinter metal particles (4) are the same or different metals, and are also invented at the time of sintering. The composition of the sinter metal particle is a slab of the slab of the sinter metal at room temperature, but when it is heated to reach (4) or more of the dispersing medium (8), the dispersing medium (B) melts and becomes a paste, and starts. Fluttering. Depending on the type of dispersing medium (8), there is also a case where the temperature is increased when the temperature is increased. When the dispersion medium (8) is volatilized or completely dispersed to reach the sintering temperature of the sinter metal particles (A), the sinter metal particles (A) are sintered, and if they are cooled, a solid metal is formed. When the sinter metal particles (A) are in contact with the metal member during the sintering, the solid metal adheres to the metal member. In this case, it is preferable that the = metal particles (A) are the same metal as the metal member, but they are different metals, as long as they are easily adhered during sintering. 0 Sintered metal particles (A) The heating and sintering temperature must be equal to or higher than the melting point of the dispersion medium (B), and is a temperature higher than the temperature at which the dispersion medium (B) can be volatilized. When the sinter metal particle composition of the present invention is used for bonding a plurality of metal members, the sinter metal particle composition of the present invention is interposed between the metal members and heated to the dispersion medium (B). The temperature above the melting point is equal to or higher than the melting point of the dispersion medium (B) and the temperature at which the dispersion medium (B) can be volatilized is higher than the temperature at which the sinterable metal particles (A) can be sintered. 312XP/Invention Manual (Supplement)/96-07/96109690 16 200822990 Specifically, when the melting point of the dispersion medium (B) is i〇 (in the case of rCH, the temperature is preferably 100°C or more and 400°C). The temperature below is more preferably from 150 ° C to 300 ° C. The reason is that the metal is sintered at a temperature of less than 1 〇〇, and if it exceeds 40 (TC, the dispersion medium (B) It may boil and evaporate, which may adversely affect the shape of the metal member. At this time, pressure may be applied to the composition of the sinter metal particle, or pressure and ultrasonic vibration may be applied. If pressure is applied, the pressure may be increased. Sinterability, when the pressure and the ultrasonic vibration are applied, the sinterability can be further improved. The sinter metal particle composition of the present invention is heated to sinter the metal particles (A) to form a solid metal shape. It is not limited to a sheet shape, and may be a strip shape, a linear shape, a disk shape, a block shape, a dot shape, or an indefinite shape. When the sinterable metal particle composition of the present invention is heated, it is heated while being pressurized, and pressurized. Applied on one side When the ultrasonic vibration is applied or the ultrasonic vibration is applied while the pressure is applied, the dispersion medium (B) is melted and volatilized, and the sinter metal particles (A) are sintered to form a solid having excellent strength and electrical conductivity and excellent thermal conductivity. Metal. The solid metal adheres to a metal member such as a gold-plated substrate, a silver substrate, a silver-plated metal substrate, a copper substrate, or the like, and a metal portion such as an electrode on an electrically insulating substrate, so that it can be used for a metal system. Adhesion of the substrate and bonding of electronic parts having metal parts, f sub-devices, electrical parts, electrical devices, etc. Especially when the sinter metal particles (A) are silver particles, they can be formed with high strength and high density. Solid Conductive and Thermal Conductive Solid 312XP/Invention Manual (Supplement)/96-07/96109690 17 200822990 Silver is preferred. As such a bond, bonding of a wafer component such as a capacitor or a resistor to a circuit board can be exemplified. Bonding of semiconductors, memories, CPUs, etc., semi-conductor-/slices, wireframes or circuit boards, and high-heating cpu wafers and cooling The frequency of the ultrasonic vibration is 2 kHz or more, preferably 10 kHz or more. The upper limit is not particularly limited, but the upper limit is about 500 kHz in consideration of the capability of the ultrasonic vibration device. Also, due to the ultrasonic wave The amplitude of the vibration affects the sinterability, so it is preferably 〇·1 to 40 /zm, more preferably 〇·3 2〇 from m, and more preferably 〇·5~12. Further, in order to vibrate the ultrasonic wave Accurately transferred to the sinter metal particle composition, it is preferred that the transmitting portion of the ultrasonic vibration is directly pressed against the sinter metal particle composition or preferably a covering material containing a material that does not easily absorb ultrasonic vibration. The transmitting portion of the ultrasonic vibration is pressed against the composition of the sinter metal particle. The pressing pressure of the composition of the sinter metal particles is preferably 〇·9 kPa (〇. 〇9gf/mm2) or more, more preferably 9kPa (〇. 92gf / _2) or more, and more preferably 39kPa (3. 98 gf/mm2) or more. The upper limit of the pressing pressure is the maximum value of the pressure at which the bonded member is not damaged. In the case where the ultrasonic vibration is applied while applying ultrasonic vibration while being heated under pressure, the heating temperature 'is preferably higher than the normal temperature, the dispersion medium (B) can be volatilized, and the sinterable metal particles (A) can be sintered. However, if it exceeds 4 〇〇C ', the dispersing medium (B) will boil and evaporate, which may adversely affect the shape of the solid metal. Therefore, it is preferably 4 〇〇 ° C or less, and the sintering is not achieved. The temperature of the melting point of the metal particles (A) is more preferably 3 〇〇〇 c or less. 312XP/Invention Manual (Supplement)/96·07/961〇9690 18 200822990 The sinterable metal particle composition of the present invention does not leave a dispersion medium after sintering the sinter metal particles (A), so that it is not necessary to be washed and sintered. However, it can also be washed with an organic solvent. In the case where the sinter metal particle composition of the present invention is in the form of a sheet, it is preferably held between a protective material such as a glass plate or a plastic film and stored. Further, in order to improve the storage stability, it may be stored in a refrigerator, and the storage temperature may be, for example, 10 ° C or less. [Examples] Examples and comparative examples of the present invention are disclosed below. In the examples and comparative examples, 'parts represent parts by weight. The method for producing a sheet of the sinter metal particle composition, the shape retainability of the sinter metal particle composition, and the adhesion strength of the sinter metal particle composition to the solid metal are measured by the following method. . Further, the temperature at 25 ° C was not specifically disclosed. 'Phoenix' [Method for producing a sheet of a sinterable metal particle composition] The sinterable metal particle composition of the present invention is sandwiched between two sheets of polytetraethylene ethylene sheets and heated to a dispersion medium (B). The pressure is +1 〇, and the pressure is applied to the presser so that the thickness of the sinter metal particle composition becomes 300 #m, and after cooling to the melting point of the dispersion medium (B), the composition of the knot metal particles is removed. In a specific size, it is made into a sheet. [Shape retention of sinter metal particle composition] Silver plated copper plate with 觅25 mmx length 25 mmx thickness 1 _! On the top, the soldered silver particle composition 2 is placed so that the size is 1 〇 〇 〇 且 且 且 and the thickness is 300 // m, and the sintering is performed after standing at 25 ° C for 1 hour. The size of the 312XP/invention specification (supplement)/96-07/96109690 19 200822990 is expressed as the average of the length and the horizontal length. When the object 2 is in the form of a paste, the paste-like composition is printed and coated on a silver-plated copper plate using a t and a wiper having a size of "m and a thickness of 300...the opening". The size of the composition of the structured silver particles after stagnation for 1 hour, expressed as the average of the length and the horizontal length. [Adhesive strength A] Silver plated copper plate with width 25 _x length 75 mmx thickness 1 _ On the top, a sheet of sinter-sintered silver particles having a width of 5 liters, a length of 1 gram, and a thickness of 1 GG ^ was placed thereon, and a silver wafer having a width of 5 _ long 5 _ thick 〇 · 5 _ was placed thereon, and then placed in a forced circulation oven at 20 ( Heating at TC for 1 hour, thereby making a silver wafer on a silver-plated copper plate. The test body is taken out from the oven and placed to cool, and the final silver particles are sintered to adhere the copper plate to the silver wafer. The obtained test body for measuring the adhesion strength was mounted on a die-carrying strength measuring machine, and the side of the silver wafer was pressed at a speed of 23 mm/min using a die-bonding device of a die strength measuring tester, and the silver wafer was The weight of the bond between the silver-plated copper plates during the shear failure is the adhesion strength (unit : kgf). Furthermore, the adhesion strength test was performed 3 times, and the average value was taken as the adhesion strength A. ~ [Adhesion strength B] on a silver plated copper plate with a width of 25 _x length of 75 mmx and a thickness of lmm, and placed 5 mmx5 _x thick 10Q //m sheet-like sinter-silver particle composition, and a silver wafer having a width of 5 mm x 5 mm x 〇 5 mm was mounted thereon to prepare a precursor for measuring the adhesion strength. The precursor for measuring the adhesion strength was prepared. Installed in Supersonic 312XP/Invention Manual (Supplement)/96-07/96109690 20 200822990 The number of vibrations in the ultrasonic vibration is 3 〇, the amplitude of ultrasonic vibration is 4 βηι, pressing pressure Under the condition of 1〇〇N/cm2, the pressing portion (probe) of the ultrasonic heat pressing device is pressed against the upper portion of the silver wafer of the precursor for measuring the strength of the adhesive from above, and the ultrasonic wave is applied. Pressed at 20 TC for 3 sec. The test body was taken out from the ultrasonic squeezing device and placed until cooling, and finally the silver particles were sintered to adhere the copper plate to the silver wafer. In such a manner And the obtained test body for measuring the adhesion strength is mounted on the die-bonding crystal On the strength measuring test machine, the die bonding device of the material crystal strength measuring test machine is pressed against the side of the silver wafer at a speed of 3 mm/min. 'The load when the adhesion between the silver wafer and the silver-plated copper plate is broken is the adhesive strength. (Unit: kgf). Further, the adhesion strength test was performed 3 times, and the average value was taken as the adhesion strength B. [Example 1] In a glass container, 100 parts of the commercially available one was put by a reduction method. Produced, silver particles obtained by chip formation and having an average particle diameter of 4 as measured by a laser diffraction method, and 25 parts of 1,2,4,5-tetradecylbenzene ( The reagents sold by Wako Pure Chemical Industries Co., Ltd.'s melting point of 8 (TC, Fob Point is 19 rc) as a dispersing medium (8), fully disturbed on a 9 〇C hot plate to make a uniform paste. The container was removed from the hot plate and placed in an environment of 25 °C. The paste-like sinterable silver particle composition was sandwiched between two sheets of polyimine sheets having a thickness of 130. 'The pressurization was performed using a heating press of 19 (TC) to make the sinterable silver particles. The thickness of the material becomes __. The sinter silver particle composition is taken out from the press together with the polyimide film and cooled, and the self-polymerization 312XP/invention specification (supplement)/96-07/96109690 200822990 imine The sinter-silver particle group is peeled off from the sheet. The sheet-like composition contains a solid solid in which the silver particles are dispersed in a uniform amount of xylene, and when it is heated to 9 (), it becomes a paste. That is, the #-form composition has thermoplasticity. The shape retention of the composition of the sinter-silver particle and the adhesion strength of the sinter-silver particle composition to the solid metal are measured, and the results are summarized in Table 1. According to the above results, it is understood that the flaky silver particles are not separated from ruthenium and 2,4,5-tetramethylbenzene, and are excellent in shape retention and can be used for firmly bonding metal members. Example 2]: In Example 1, using four Ethylene glycol (a reagent sold by Wako Pure Chemical Industries Co., Ltd., having a melting point of 42 t and a boiling point of 175. The hydrazine is substituted for 1,2,4,5-tetramethylbenzene, except that it is prepared in the same manner as in the examples). A composition of a sinterable metal particle. The composition of the sinterable silver particle is a paste at 9 ° C. The sinter composition of silver particles is sandwiched between two sheets of polyimide film having a thickness of 130 /zm. The pressure was increased to 3 Torr using a press machine heated to 9 〇 Qc. The sinter silver particle composition was taken out from the press together with the polyimide film and cooled, and self-polymerized. The sinter silver particle composition was peeled off from the yttrium imide sheet to obtain a sheet-like composition containing tetramethylethylene glycol in which silver particles were uniformly dispersed, and was a hard solid at 25 ° C. When the temperature is raised to 8 ° C, it becomes a paste. That is, the sheet-like composition has thermoplasticity. The shape retainability of the composition of the sintered silver particles and the adhesion of the sintered silver particle composition to the solid metal are measured. The adhesion strength, the results are summarized in 31 2XP/Invention Manual (Supplement)/96-07/96109690 22 200822990 In Table 1. According to the above results, it is understood that the flaky silver particles are not separated from the tetramethyl glycol in the composition of the sinterable silver particles, and the shape is Excellent retention' and can be used to firmly bond metal members. [Example 3] In the case of Example 2, 22 parts of tetramethyl glycol and 3 parts of the section were used. Sintered silver particles were prepared in the same manner as in Example 2 except that the reagent of the company 1 was melted at a concentration of 5 C and the boiling point was 205 ° C instead of 25 parts of tetramethyl glycol. The composition of the sinterable silver particle is a paste at 9 (rc). The sinterable silver particle composition was sandwiched between two sheets of polyimine sheets having a thickness of 130, and pressurized with a press machine heated to 90 C so that the thickness thereof was 300 ° m. The sinterable silver particle composition and the polyimide film were taken out from the press and cooled, and the sintered silver particle composition was peeled off from the polyimide film to obtain a sheet-like composition. The sheet-like composition was well dispersed with silver particles and a uniform and hard solid of tetramethylethylene glycol and benzyl alcohol. The shape retainability of the composition of the sinterable silver particles and the adhesion strength of the sinterable silver particle composition to the solid metal were measured, and the results are summarized in Table 1. According to the above results, in the sinterable silver particle composition, the silver particles are not separated from tetramethylethylene glycol and benzyl alcohol, and are excellent in shape retention and can be used for firmly bonding a metal member. [Comparative Example 1] In Example 1, the use of ^--焼 (a reagent sold by Wako Pure Chemical Industries, Ltd., melting point of -26 ° C, boiling point of 196 ° C) was substituted for 1 ' 2, 4, 5 A sinterable silver particle composition was prepared in the same manner as in Example 1 312XP/Invention Manual (Supplement)/96-07/96109690 23 200822990, except that tetramethylbenzene was used as the dispersion medium. The sinterable silver particle composition was also in the form of a paste having a fluidity at 25 ° C, but could not be formed into a sheet shape. The shape retainability of the composition of the sinterable silver particles and the adhesion strength of the solid particles of the sintered silver particle composition were measured, and the results are shown in Table 1. [Comparative Example 2] The commercially available silver particles obtained by the reduction method were obtained by tableting in 100 parts and the average particle diameter of the original particles was 3. 0 / zm (measured by laser diffraction method) of flake silver particles (silver surface covered with 0.5% by weight of stearic acid, and the silver particles have water repellency), adding 15 parts Ethylene glycol (a reagent sold by Wako Pure Chemical Industries Co., Ltd., with a dielectric constant of 39. 0, a melting point of -13 ° C and a boiling point of 198 ° C) were uniformly mixed as a dispersing medium using a rotary kneader to prepare a paste-like silver particle composition. The sinterable silver particle composition was also in the form of a paste having a fluidity at 25 ° C, but could not be formed into a sheet shape. The shape retention of the composition of the sinterable silver particles and the adhesion strength of the sinter-silver particle composition to the solid metal were measured, and the results are summarized in Table 1. [Table 1] Example 1 Example 2 Example 3 Example of car-crossing Example 1 Comparative Example 2 Sintering metal particle heteroparticle Silver particle Silver particle Silver particle Silver particle dispersion medium melting point (.C) 80 42 -15 -26 - 13 Boiling point of dispersing medium (°c) 191 175 205 196 198 Properties of dispersing medium (25〇C) Properties of solid solid liquid liquid sinter metal particle composition Solid solid solid paste paste Sintered metal particle composition Size, initial (mm) 10. 0 10. 0 10. 0 10. 0 — The size of the sinter metal particle composition, after 1 hour (mm) 10. 0 10. 0 10. 0 11. 5 — Adhesion strength A (kgf) 16 18 17 12 14 Adhesion strength B (kgf) 12 One-one - 312XP / invention manual (supplement) / 96-07/96109690 24 200822990 (industrial availability), this In the composition of the sinterable metal particles of Momo, the sinterable metal particles are not separated from the medium, and the shape retention property is excellent, so that they can be used for wafers such as electric valleys, resistors, diodes, memories, and arithmetic elements (CPU). The parts are bonded to the substrate with high precision. [Brief Description of the Drawings] Fig. 1 is a plan view showing the measurement of the shape retention of the composition of the sinter metal particles in the examples. [Description of main component symbols] 1 Mineral silver plate 2 Sintered metal particle composition 312XP/Invention manual (supplement)/96-07/96109690 25