TW200822357A - Organic electroluminescence device and fabricating method thereof - Google Patents
Organic electroluminescence device and fabricating method thereof Download PDFInfo
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200822357 … \jo i yjKj^yi rW 19660twf.doc/n 九、發明說明: 【發明所屬之技術領域】 本發明是有關於一種發光元件及其製作方法,且特別 是有關於一種有機電致發光元件(〇rganic Electroluminescence Device,OEL)及其製作方法。 【先前技術】 有機電致發光元件具有自發光、廣視角、高應答速度、 低驅動電壓、全色彩等特點,目前已可實用化進而應用於 有機電致發光顯示器(Organic Electroluminescence Display)中。一般而言,有機電致發光元件包括陽極、陰 極,及位在兩電極之間的有機發光層。當電流通過陽極與 陰極間,使電子和電洞在有機官發光層内結合而產生激子 (exciton)時,便可以使有機發光層依照其材料之特性, 而產生不同顏色之放光機制。 一般而§’為了提昇有機電致發光元件的光線利用效 率’通常會再設置另一層增光層(light enhanced layer)。 圖1繪示為習知一種有機電致發光元件的示意圖。請參照 圖1 ’此有機電致發光元件100包括玻璃基板110、陽極 120、有機發光層130、陰極140、蓋板150以及增光層160。 特別是’從有機發光層130出射之光線132可透過增光層 160進行增光,進而提昇光線利用效率。 然而,在如圖1所示的有機電致發光元件1〇〇的製造 過程中,由於是將增光層160黏合於蓋板150上,以致在 蓋板150與增光層160之間常會造成空氣間隙17〇。因此, 5 200822357TW 19660_/η 部分光線132會因為空氣間隙170的影響而產生不必要之 散射,所以,會降低增光層160的增光效果。為解決此問 題,習知技術中大多是利用折射率匹配膠(refraction index matching glue)(未緣示)填補空氣間隙170,或者是以設 置微透鏡陣列(microlens array)的方式以提昇光線利用效 .率。 圖2繪示為習知另一種有機電致發光元件的示意圖。 請參照圖2,此有機電致發光元件200包括玻璃基板210、 Θ 陽極220、有機發光層230、陰極240以及蓋板250。值得 注意的是,在此有機電致發光元件200的製作方法中,首 先利用反應性離子蝕刻法(Reactive Ion Etching,RIE)在 玻璃基板210上製作出微透鏡陣列212。接著,繼續在玻 璃基板210上製作陽極220、有機發光層230、陰極240 以及蓋板250等構件。 承上述,由於在出光路徑上設置有微透鏡陣列212, 所以可提昇此有機電致發光元件200的光線利用效率。但 U 是,上述利用反應性離子蝕刻法在玻璃基板210上製作微 透鏡陣列212的製程複雜,因此,其不利於大量生產有機 電致發光元件200,也不利於降低製作成本。 【發明内容】 有鑑於此’本發明之目的是提供一種有機電致發光元 件’除增加出光效率外且可解決光線散射的問題,並能降 低製作成本。 本發明之另一目的是提供一種有機電致發光元件的 200822357 …AT W 19660twf.doc/n 製作方法,以解決在膜層間產生空氣間隙的問題,且能降 低製作成本。 為達上述或是其他目的,本發明提出一種有機電致發 光元件,其包括:高分子基板、多數增光結構、抗水氧層、 ,一電極、有機發光層以及第二電極。高分子基板具有一 第一表面與一第二表面。增光結構設置於第一表面上。抗 水氧層設置於第二表面上。第一電極設置於抗水氧層上。 有機發光層設置於第一電極上。第二電極設置於有機發光 層上。 在本發明之一實施例中,上述之增光結構與高分子基 板為一體成型。 在本發明之一實施例中,上述之抗水氧層之材質是選 自於光阻材料、環氧樹脂、氧化矽' 氮化矽、聚對二甲苯 (parylene)及其組合其中之一。 在本發明之一實施例中,上述之高分子基板之材質是 可模塑成型之高分子材料。 ϋ 林發明之-實施射’上述之高分子基板之材質是 選自於聚甲基丙烯酸甲酯(ρΜΜΑ)、聚二甲基矽氧烷 (PDMS)、聚醯亞胺(p〇iyimide)、聚碳酸醋(pc)、 聚苯乙烯(ps)、聚乙烯對苯二甲酸酯(PET)及其組人 其中之一。 在本發明之-實施例中,上述之有機電致發光元件更 包括-保護層,設置於第二電極上,而保護層之材質例如 是選自於玻璃、金屬、高分子聚合物及其組合其中之一。 200822357 uoiw^yiTW 19660twf.doc/n 包括-封膠,包覆有機發光層。 无元件更 在本發明之-實施例中,上述之第— 透明導電材質,而透明導電材質例如是銦锡氧化=貝=括 氧化物或奈米等級厚度之薄金屬。 匆、銦鋅 在本發明之一實施例中,上述之^ ^ , 金屬。 T上这之弟—電極之材質包括 Γ200822357 ... \jo i yjKj^yi rW 19660twf.doc/n IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting element and a method of fabricating the same, and more particularly to an organic electroluminescent element (〇rganic Electroluminescence Device, OEL) and its making method. [Prior Art] The organic electroluminescent element has characteristics of self-luminous, wide viewing angle, high response speed, low driving voltage, full color, etc., and has been put into practical use in an organic electroluminescence display. In general, an organic electroluminescent device comprises an anode, a cathode, and an organic light-emitting layer positioned between the two electrodes. When an electric current is passed between the anode and the cathode to cause electrons and holes to be combined in the organic light-emitting layer to generate an exciton, the organic light-emitting layer can be made to emit light of different colors according to the characteristics of the material. In general, § 'in order to improve the light utilization efficiency of the organic electroluminescent element', another light enhancing layer is usually provided. FIG. 1 is a schematic view of a conventional organic electroluminescent device. Referring to Fig. 1 ', the organic electroluminescent device 100 includes a glass substrate 110, an anode 120, an organic light-emitting layer 130, a cathode 140, a cap plate 150, and a light-increasing layer 160. In particular, the light ray 132 emitted from the organic light-emitting layer 130 can be enhanced by the light-increasing layer 160, thereby improving light utilization efficiency. However, in the manufacturing process of the organic electroluminescent element 1 shown in FIG. 1, since the light-increasing layer 160 is adhered to the cap plate 150, an air gap is often caused between the cap plate 150 and the brightness enhancement layer 160. 17〇. Therefore, 5 200822357TW 19660_/η part of the light 132 will be unnecessarily scattered due to the influence of the air gap 170, so the brightness enhancement effect of the brightness enhancement layer 160 will be lowered. In order to solve this problem, most of the conventional techniques use a refractive index matching glue (not shown) to fill the air gap 170, or a microlens array to improve the light utilization efficiency. .rate. 2 is a schematic view of another conventional organic electroluminescent device. Referring to Fig. 2, the organic electroluminescent device 200 includes a glass substrate 210, a germanium anode 220, an organic light-emitting layer 230, a cathode 240, and a cap plate 250. It is to be noted that in the method of fabricating the organic electroluminescent device 200, the microlens array 212 is first formed on the glass substrate 210 by reactive ion etching (RIE). Next, members such as the anode 220, the organic light-emitting layer 230, the cathode 240, and the cap plate 250 are formed on the glass substrate 210. As described above, since the microlens array 212 is provided on the light exiting path, the light use efficiency of the organic electroluminescent element 200 can be improved. However, U is that the above-described process for fabricating the microlens array 212 on the glass substrate 210 by the reactive ion etching method is complicated, and therefore, it is disadvantageous for mass production of the organic electroluminescent element 200, and is also disadvantageous for reducing the manufacturing cost. SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide an organic electroluminescence device which can solve the problem of light scattering in addition to increasing light extraction efficiency and can reduce the manufacturing cost. Another object of the present invention is to provide a method for fabricating an organic electroluminescent device of 200822357 ... AT W 19660 twf.doc/n to solve the problem of creating an air gap between layers, and to reduce the manufacturing cost. To achieve the above or other objects, the present invention provides an organic electroluminescent device comprising: a polymer substrate, a plurality of light-increasing structures, an anti-aqueous layer, an electrode, an organic light-emitting layer, and a second electrode. The polymer substrate has a first surface and a second surface. The brightness enhancement structure is disposed on the first surface. The water resistant layer is disposed on the second surface. The first electrode is disposed on the water and moisture resistant layer. The organic light emitting layer is disposed on the first electrode. The second electrode is disposed on the organic light emitting layer. In an embodiment of the invention, the light-increasing structure is integrally formed with the polymer substrate. In an embodiment of the invention, the material of the water-resistant layer is one selected from the group consisting of a photoresist material, an epoxy resin, yttrium oxide tantalum nitride, parylene, and a combination thereof. In an embodiment of the invention, the material of the polymer substrate is a moldable polymer material. The material of the polymer substrate described above is selected from the group consisting of polymethyl methacrylate (pΜΜΑ), polydimethyl methoxy hydride (PDMS), and polypimide (p〇iyimide). Polycarbonate (pc), polystyrene (ps), polyethylene terephthalate (PET) and one of its group. In an embodiment of the invention, the organic electroluminescent device further includes a protective layer disposed on the second electrode, and the material of the protective layer is, for example, selected from the group consisting of glass, metal, high molecular polymer, and combinations thereof. one of them. 200822357 uoiw^yiTW 19660twf.doc/n Includes - sealant, coated with an organic light-emitting layer. In the embodiment of the present invention, the above-mentioned first transparent conductive material, and the transparent conductive material is, for example, indium tin oxide = shell = oxide or nanometer-thickness thin metal. Immersed, indium zinc In one embodiment of the invention, the above ^ ^ , metal. The younger brother of T - the material of the electrode includes Γ
U 為達上述或是其他目的,本發明再 發光元件’其包括基板、第一電極、有機:光;有= f晉^子基板、多數增光結構以及抗水氧層= 权置於基板上。有機發光層設置於第—電極上 = 設置於有機發光層上。高分子基板設置於第二f j極 方’此南分子基板具有一第一表面與电上 表面對向於第二電極。增光結構設置於=:而:一 氧層設置於第-表面側或第二表面側。 、 抗水 板為實施财,上叙增絲構減分子基 在本發明之一實施例尹,當上述 一表面側時,有機電致發光元件更包括設 抗水氧層與第二雷榀夕„ * 〇 ^ 級衝層ΰ又置於 自於光阻材料η曰。,缓衝層之材質例如是選 ==之,氧切、氮切、聚㈣笨 二表面側且覆:增二:: 200822357 uoiuu4yiiW 19660twf.doc/n 電極上。 在本發明之一實施例中,當上述之抗水氧層設置於第 二表面侧且覆蓋增光結構時,有機電致發光元件更包括一 緩衝層,設置於高分子基板與第二電極之間。並且,緩衝 層之材質例如是選自於光阻材料、環氧樹脂、氧化矽、氮 化石夕、聚對二甲苯及其組合其中之一。 在本發明之-實施例中,上述之抗水氧層之材質是選 自於光阻材料、環氧樹脂、氧化⑦、氮切、聚對二甲笨 及其組合其中之一。 可模中’上述之高分— 在本發明之一實施例中,上述之 ==,甲醋、聚二甲基嫩、= 之j W乙烯、聚乙烯對苯二甲_旨及其組合其中 o 更包之—實闕巾,上述之有機電致發光元件, 更括封膠,包覆該有機發光層。 金屬在本發明之_實施例中,上述之第—電極之材質包括 透明=之:實施Γ:上述之第二電極之材質包括 辞氧化物或奈“;::質包括銦錫氧化物、銦 發光提出—種有機電致 作方法,包括下列步驟。首先,提供-高分 9 200822357 υο iuu4^i Γ W 19660twf.doc/n 子基板,其具有一第一表面與一第二表面,其中,# 面,形成有多數增光結構。接著,於第二表面铡形=二表 =氧層。再來,於抗水氧層上形成一第一電極。^之,抗 第一電極上形成一有機發光層。之後,於有機發 成-第二電極。 4盾上形 在本發明之一實施例中,上述之於第一表面 光結構的方法包括壓模法或射出成型法。 v成曰 o o 在本發明之-實施例中,上述之於第二表 水氧層之方法包括塗佈法或蒸鍍法。 /几 在本發明之一實施例中,上述之有機電致發 袅作方法,更包括於第二電極上形成一保護層。 、 在本發明之一實施例中,上述之有機電致發光元 衣作方法,更包括提供一封膠以包覆有機發光層。 為達上述或是其他目的,本發明再提出—種有機 =元件的製作方法,包括下列步驟。首先,提二:致 者於基板上形成第-電極。再來,於第—電極上 層。接著’於有機發光層上形成第二電極。繼i, /、一咼分子基板,使高分子基板設置於第二電極之上 ’其中,高分子基板具有第—表面與第二表面,第 =向於2二電極,4二表面側形成有錄增光結構: 4 ,於第一表面側或第二表面側形成一抗水氧層。 f本發明之—實補巾,上述之提供高分子基板之方 之列步驟。首先,於基板上形成—高分子材料層。 ,1用一模具壓此高分子材料層,以於第二表面側形 200822357 uoiuuHyifW 19660twf.doc/n 成增光結構。 在本發明之一實施例中,當上述之抗水氧層形成於第 一表面側時,此有機電致發光元件的製作方法更包括於抗 水氧層與第二電極之間形成一缓衝層。 在本發明之一實施例中,當上述之抗水氧層形成於第 二表面側時,高分子基板是直接設置於第二電極上。 在本發明之一實施例中,當上述之抗水氧層形成於第 二表面侧時,此有機電致發光元件的製作方法更包括於高 分子基板與第二電極之間形成一緩衝層。 在本發明之一實施例中,上述之有機電致發光元件的 製作方法更包括提供一封膠,以包圍有機發光層。 本發明的有機電致發光元件因採用具有增光結構的高 分子基板,而能夠提昇此高分子基板的光線利用效率。再 者,此有機電致發光元件中採用抗水氧層,而能夠提昇高 为子基板的防水性能。此外,本發明的有機電致發光元件 的製作方法是藉由壓模法或射出成型法以製作上述的高分 子,板。因此,能夠大量地製造有機電致發光元件,以降 低製作成本。再者,此有機電致發光元件的製作方法在製 作過程^可以防止空氣間隙的產生,以避免光線產生散射。 為讓本發明之上述和其他目的、特徵和優點能更明顯 ,下文特舉較佳實施例,並配合所附圖式,作詳細說 明如下。 11 200822357 06100491 i'W 19660twf.doc/n 【實施方式】 第一實施例 圖3A〜3F繪示為本發明第一實施例之一種有機電致 發光元件的製作流程剖面示意圖。此實施例是有關於一種 底發光式(bottom emission)有機電致發光元件的製作。 請參照圖3A,首先提供一高分子基板310,其具有一 第一表面312與一第二表面314,其中,第一表面312側 形成有多數增光結構320。在本實施例中,於第一表面312 側形成增光結構320的方法可以是壓模法(m〇iding method )或射出成型法(injecti〇I1 molding method )。特別 是’增光結構320與高分子基板310可以是一體成型的構 造。相對於習知技術中,如圖2所繪示之利用反應性離子 餘刻法製作微透鏡陣列212的方法,此製作具有增光結構 320的尚分子基板31〇的方法較為簡單,所以可大量生產 以降低製作成本。 另外’如圖3A所繪示之高分子基板310的材質例如 是可模塑成型之高分子材料。更詳細而言,高分子基板31〇 的材質可以是選自於聚甲基丙烯酸曱酯(PMMA)、聚二 甲基石夕氧院(PDMS)、聚醢亞胺(p〇iyimide)、聚碳酸 酉曰(pc)、聚苯乙烯(Ps)、聚乙烯對苯二曱酸酯(pET) 及其組合其中之一。所以,可以在高分子基板310上容易 地做出增光結構320之形狀,並能使高分子基板31()與增 光結構320容易透光。 接著,請參照圖3β,於第二表面314上形成一抗水 12 200822357 ^0iuu4yifW 19660twf.doc/n 氧層330。在一實施例中,於第二表面314上形成抗水氧 層330之方法例如是塗佈法(coating method)、蒸鑛法 (evaporation method)或其他適當之方法,而抗水氧層33〇 之材質例如是選自於光阻材料、環氧樹脂、氧化石夕、氮化 矽、聚對二甲苯。一般而言,高分子基板31〇的防水性能 不佳。所以,藉由抗水氧層330的設置而能提昇高分子基 板310的防水性能。 o o 再來,請參照圖3C,於抗水氧層330上形成一第一 電極340。在一實施例中,形成此第一電極34〇的方法可 以是濺鍍法、蒸鍍法或其他適當的方法,而第一電極34〇 之材質包括透明導電材質,而此透明導電材f例如是鋼锡 氧化物(IT0)、銦鋅氧化物(IZ0)或其他適當的材質。 繼之,請參照圖3D,於第一電極340上形成一右嬙恭 光層350。在一實施例中,形成此有機發光層35〇之方^For the above or other purposes, the re-light-emitting element of the present invention includes a substrate, a first electrode, an organic: light, a sub-substrate, a plurality of light-increasing structures, and a water-repellent layer on the substrate. The organic light-emitting layer is disposed on the first electrode and is disposed on the organic light-emitting layer. The polymer substrate is disposed at a second f j pole side. The south molecular substrate has a first surface opposite to the electrical upper surface to the second electrode. The light-increasing structure is disposed at =: and: an oxygen layer is disposed on the first surface side or the second surface side. The water-repellent board is implemented, and the molecular weight-reducing molecular group is in the embodiment of the present invention. When the surface side is on the surface side, the organic electroluminescent element further comprises an anti-aqueous layer and a second thunder. „ * 〇^ The graded layer is placed on the photoresist material η曰. The material of the buffer layer is, for example, ===, oxygen cut, nitrogen cut, poly (four) stupid surface and cover: increase two: In an embodiment of the present invention, when the water-resistant oxygen barrier layer is disposed on the second surface side and covers the light-increasing structure, the organic electroluminescent device further includes a buffer layer. The material of the buffer layer is, for example, selected from the group consisting of a photoresist material, an epoxy resin, a cerium oxide, a cerium nitride, a parylene, and a combination thereof. In the embodiment of the present invention, the material of the water-resistant oxygen layer is one selected from the group consisting of photoresist materials, epoxy resins, oxide 7, nitrogen cut, polyparaphenyl, and combinations thereof. The above high score - in one embodiment of the invention, the above ==, methyl vinegar Polydimethyl dimethyl, = j W ethylene, polyethylene terephthalate _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Light-emitting layer. Metal In the embodiment of the present invention, the material of the first electrode includes transparent=: implementation: the material of the second electrode includes the word oxide or naphthalene;;: the quality includes indium tin oxide Material, indium luminescence proposed - an organic electro-operation method, including the following steps. First, a high-density 9 200822357 υο iuu4^i Γ W 19660 twf.doc/n sub-substrate having a first surface and a second surface, wherein the # surface, is formed with a plurality of light-increasing structures. Next, the second surface is 铡 = two tables = oxygen layer. Further, a first electrode is formed on the water-resistant oxygen layer. ^, an organic light-emitting layer is formed on the first electrode. Thereafter, the second electrode is formed organically. 4 Shield Top Form In one embodiment of the invention, the method of the first surface light structure comprises a compression molding method or an injection molding method. v 曰 o o In the embodiment of the invention, the method for the second surface water oxygen layer comprises a coating method or an evaporation method. In one embodiment of the invention, the above organic electrophotographic method further comprises forming a protective layer on the second electrode. In an embodiment of the invention, the above method for fabricating an organic electroluminescent device further comprises providing a glue to coat the organic light-emitting layer. To achieve the above or other objects, the present invention further proposes a method for fabricating an organic element comprising the following steps. First, mention two: The initiator forms a first electrode on the substrate. Then, on the first layer of the electrode. A second electrode is then formed on the organic light-emitting layer. Following i, /, a molecular substrate, the polymer substrate is disposed on the second electrode. The polymer substrate has a first surface and a second surface, and the second surface is formed on the second surface. Recording lightening structure: 4, forming an anti-aqueous oxygen layer on the first surface side or the second surface side. f. The invention of the present invention, the above-mentioned step of providing a polymer substrate. First, a polymer material layer is formed on the substrate. (1) Pressing the polymer material layer with a mold to form a light-increasing structure on the second surface side shape 200822357 uoiuuHyifW 19660twf.doc/n. In an embodiment of the invention, when the anti-aqueous oxygen layer is formed on the first surface side, the method for fabricating the organic electroluminescent device further comprises forming a buffer between the anti-aqueous layer and the second electrode. Floor. In an embodiment of the invention, when the water-resistant oxygen barrier layer is formed on the second surface side, the polymer substrate is directly disposed on the second electrode. In an embodiment of the invention, when the water-resistant oxygen barrier layer is formed on the second surface side, the method of fabricating the organic electroluminescent device further comprises forming a buffer layer between the high molecular substrate and the second electrode. In an embodiment of the invention, the method for fabricating the above organic electroluminescent device further comprises providing a glue to surround the organic light-emitting layer. The organic electroluminescence device of the present invention can improve the light use efficiency of the polymer substrate by using a high molecular weight substrate having a light-increasing structure. Further, in the organic electroluminescence device, a water-repellent layer is used, and the water resistance of the sub-substrate can be improved. Further, the method of producing the organic electroluminescence device of the present invention is to produce the above-described high molecular weight plate by a compression molding method or an injection molding method. Therefore, the organic electroluminescent element can be manufactured in a large amount to reduce the manufacturing cost. Furthermore, the method of fabricating the organic electroluminescent device can prevent the generation of air gaps during the manufacturing process to avoid scattering of light. The above and other objects, features and advantages of the present invention will become more apparent from [Embodiment] First Embodiment Figs. 3A to 3F are schematic cross-sectional views showing a manufacturing process of an organic electroluminescence device according to a first embodiment of the present invention. This embodiment is related to the fabrication of a bottom emission organic electroluminescent device. Referring to FIG. 3A, a polymer substrate 310 is first provided, which has a first surface 312 and a second surface 314. A plurality of light-increasing structures 320 are formed on the first surface 312 side. In the present embodiment, the method of forming the light-increasing structure 320 on the side of the first surface 312 may be a m〇iding method or an injection molding method. In particular, the 'light-increasing structure 320 and the polymer substrate 310 may be integrally formed. Compared with the prior art, as shown in FIG. 2, the method for fabricating the microlens array 212 by the reactive ion remnant method, the method for fabricating the molecular substrate 31 having the light-increasing structure 320 is relatively simple, so that mass production can be performed. To reduce production costs. Further, the material of the polymer substrate 310 as shown in Fig. 3A is, for example, a moldable polymer material. More specifically, the material of the polymer substrate 31A may be selected from polymethyl methacrylate (PMMA), polydimethyl oxalate (PDMS), polyfluorene (p〇iyimide), poly One of strontium carbonate (pc), polystyrene (Ps), polyethylene terephthalate (pET), and combinations thereof. Therefore, the shape of the light-increasing structure 320 can be easily made on the polymer substrate 310, and the polymer substrate 31 () and the light-increasing structure 320 can be easily transmitted. Next, referring to FIG. 3β, a water resistant layer 12 200822357 ^0iuu4yifW 19660twf.doc/n oxygen layer 330 is formed on the second surface 314. In one embodiment, the method of forming the water-resistant oxygen layer 330 on the second surface 314 is, for example, a coating method, an evaporation method, or other suitable method, and the water-oxygen-resistant layer 33〇 The material is, for example, selected from the group consisting of photoresist materials, epoxy resins, oxidized oxides, tantalum nitride, and parylene. In general, the waterproof property of the polymer substrate 31 is not good. Therefore, the waterproof property of the polymer substrate 310 can be improved by the arrangement of the water-resistant oxygen layer 330. o o Next, referring to FIG. 3C, a first electrode 340 is formed on the water-resistant oxygen layer 330. In one embodiment, the method of forming the first electrode 34A may be a sputtering method, an evaporation method, or other suitable method, and the material of the first electrode 34〇 includes a transparent conductive material, and the transparent conductive material f is, for example. It is steel tin oxide (IT0), indium zinc oxide (IZ0) or other suitable material. Then, referring to FIG. 3D, a right-handed chevron layer 350 is formed on the first electrode 340. In an embodiment, the surface of the organic light-emitting layer 35 is formed.
例如為塗佈法、蒸鍍法或其他適當的方法,並且,本發明 對於有機發光層350之種類不作任何限制。 X 之後,請參照圖3E,於有機發光層35〇上形成一 電極360。形成此第二電極遍的方法可以是濺錢法 鍍法或其他適當的方法,而第二電極36〇之材 : 屬,並且,本發明並不限定金屬之種類。 、匕以 經過如圖3A〜圖3E的製作步驟後,即可形成如圖犯 所〜不之下發光式的有機電致發光元件3⑻。此 發光元件300包括高分子基板31〇、多數增光結構^抗 水氧層330、第-電極34〇、有機發光層35〇以及第二電極 13 19660twf.doc/n 200822357rwFor example, a coating method, an evaporation method, or other appropriate methods, and the present invention does not impose any limitation on the kind of the organic light-emitting layer 350. After X, referring to Fig. 3E, an electrode 360 is formed on the organic light-emitting layer 35A. The method of forming the second electrode pass may be a sputtering method or other suitable method, and the second electrode 36 is of the genus, and the invention does not limit the kind of the metal. Then, after the production steps as shown in Figs. 3A to 3E, the organic electroluminescent element 3 (8) of the light-emitting type is formed. The light-emitting element 300 includes a polymer substrate 31, a plurality of light-increasing structures, an anti-oxygen layer 330, a first electrode 34, an organic light-emitting layer 35, and a second electrode. 13 19660twf.doc/n 200822357rw
W 1 V/V/1:7 上 JTW 360。其中’高分子基板310具有一第一表面312與一第二 表面314。增光結構320設置於第一表面312上。抗水氧 層330設置於第二表面314上。第一電極34〇設置於抗水 氧層330上。有機發光層350設置於第一電極34〇上。第 二電極360設置於有機發光層350上。 oW 1 V/V/1:7 on JTW 360. The polymer substrate 310 has a first surface 312 and a second surface 314. The light enhancement structure 320 is disposed on the first surface 312. The water vapor resistant layer 330 is disposed on the second surface 314. The first electrode 34 is disposed on the water-resistant layer 330. The organic light emitting layer 350 is disposed on the first electrode 34A. The second electrode 360 is disposed on the organic light emitting layer 350. o
特別是,由於第一電極340是透明導電材質,且第二 電極360是金屬材質,所以,有機發光層35〇發出之光線 會透過高分子基板310而朝下方出光。此外,有關於上述 所有構件的材質以及優點已於上述有機電致發光元件3〇〇 的製作方法中所述及,在此將不予以重述。 再者,此實施例之有機電致發光元件3〇〇的製作方 法,更包括在第二電極360上形成一保護層37〇,如圖3]ρ =繪示。此保護層370之材質例如是選自於玻璃、金屬、 高分子聚合物(polymer)及其組合其中之一。 並且,凊再參照圖3F,此實施例之有機電致發光元件 3〇〇的製作方法’更包括提供—封膠通以包覆有機發光 層350。此封膠讀質可以是紫外光固化膠、熱固化 勝或是其他類似的材質。所以’利用保護層謂、封膠谓 對於有機電致發光元件,進行縣,可崎—步防止外 界水氣進入有機發光層350中。如此, 致發光it件3GG的制壽命。 i =上所述’第-實關巾的錢電致發光元件的 法,其是^顏法或㈣賴作具有增光結 構20的南分子基板310,因此,可大量進㈣造並㈣ 200822357 u〇iUU4yifW 19660twf.doc/n 有機電致發光元件300的製作成本。 此外’有機電致發光元件300藉由增光結構320而能 夠提昇光線利用效率。並且,藉由抗水氧層330的設置, 而能有效地提昇有機電致發光元件300的防水性能。 第二實施例 圖4A〜4F繪示為本發明第二實施例之有機電致發光 元件的製作流程剖面示意圖。此實施例是有關於一種上發 光式(top emission)有機電致發光元件的製作。 請參照圖4A,首先提供一基板410。此基板410可以 疋玻璃基板、塑膠基板或是其他種類的基板。 接著,請參照圖4B,於基板410上形成第一電極420。 在一實施例中,形成此第一電極42〇的方法可以是濺鍍 法療鐘法或其他適當的方法,而第一電極420之材質例 如是金屬,本發明並不限定金屬的種類。 再來’请參照圖4C ’於第一電極420上形成有機發 光層430。在一實施例中,形成此有機發光層430之方法 例如為塗佈法、蒸錢法或其他適當的方法,而本發明對於 有機發光層430之種類不作任何限制。 接著,請參照圖4D,於有機發光層430上形成第二 電極440。在一實施例中,形成此第二電極440的方法可 以疋賤鑛法、蒸錢法或其他適當的方法。此第二電極440 之材質包括透明導電材質,而透明導電材質例如是銦錫氧 化物(IT0)、銦鋅氧化物(IZ0)、奈米等級厚度之薄金 15 200822357 uo I υυ^^ι rw 19660twf.doc/n 屬或其他適當的材質。 繼之,請參照圖4E,提供一高分子基板450,使高分 子基板450設置於第二電極440之上方,其中,高分子基 板450具有第一表面452與第二表面454,第一表面452 對向於第二電極440,且第二表面454上形成有多數增光 結構460。在本實施例中,高分子基板450是利用壓模法 或射出成型法而製作的構件。此高分子基板450的材質已 於第一實施例中所述,在此不予以重述。 請參照圖4F,接著,於該第一表面侧452形成一抗水 氧層470。形成此抗水氧層470方法例如是塗佈法或其他 適當之方法,而抗水氧層470之材質例如是光阻材料、環 氧樹脂、氧化矽、氮化矽、聚對二甲苯及其組合其中之一。 在此實施例中,當上述之抗水氧層47〇是形成於第一 表面452側時,此有機電致發光元件的製作方法更包括於 抗水氧層470與第二電極440之間形成一緩衝層48〇。形 成此緩衝層480之方法例如是塗佈法或其他適當的方法, ,緩衝層480之材質例如是選自於光阻材料、環氧樹脂、 氧化矽、氮化矽、聚對二甲苯或與其類似的材質。更^細 而由在第二電極440上先塗佈緩衝層48〇,可以防 止抗水氧層470直接接觸第二電極440,以避免抗水氧犀 470對第二電極440造成破壞。 曰 經由上述圖4A〜4F的步驟,即可形成如圖4F所繪示 :頂發光式的有機電致發光元件4〇〇。此有機電致發二 4〇〇包括基板410、第一電極420、有機發光層43〇、第 200822357 uoiuuh^iiW 19660twf.doc/n 二電極440、南分子基板450、多數增光結構460以及抗水 氧層470。第一電極420設置於基板410上。有機發光層 430設置於第一電極420上。第二電極440設置於有機發 光層430上。高分子基板450設置於第二電極440之上方, 此高分子基板450具有一第一表面452與一第二表面 454,而第一表面452對向於第二電極440。增光結構460 設置於第二表面454上。抗水氧層470設置於第一表面侧 452。特別是,在本實施例中,當抗水氧層470設置於該第 D 一表面侧452時,此有機電致發光元件400更包括一緩衝 層480,設置於抗水氧層470與第二電極440之間。 有關於上述構件之材質,已於上述有機電致發光元件 400的製作方法中所述,在此不予以重述。另外,請繼續 參照圖4F,也可以再利用封膠490以包覆有機發光層 430,進一步提昇有機電致發光元件400的防水性能。 综上所述,第二實施例中的有機電致發光元件4〇〇的 製作方法,其是利用壓模法或射出成型法製作具有增光結 〇 構46〇的高分子基板450,因此,可大量製作高分子基板 450,進而降低有機電致發光元件400的製作成本。此外, 有機電致發光元件400藉由增光結構460而能夠提昇增光 效率。並且,藉由抗水氧層470的設置,而能夠有效地提 昇有機電致發光元件400的防水性能。特別是,藉^缓衝 層480的設置可以避免抗水氧層470對第二電極4\〇造成 破壞。 17 200822357 uoiwuh^iTW 19660twf.doc/n 第三實施例 第二實施例與弟一實施例類似,也是關於一種上發光 式有機電致發光元件的製作方法及其結構。圖5繪示為本 發明弟二實施例之有機電致發光元件的示意圖。 請共同參照圖4A〜4E與圖5,首先,第三實施例利 用如圖4A〜4D繪示之步驟製作具有基板41〇、第一電極 420、有機發光層430、與第二電極440的有機電致發光元 件。接著,如圖4E所繪示,提供一高分子基板45〇。 值得注意的是,本實施例與第二實施例之間的差別在 於·弟二實施例並不在第二電極440與高分子基板450之 間开>成抗水氧層470。如圖5所示,當抗水氧層470形成 於第二表面454側時,高分子基板450是直接設置於第二 電極440上。 經過上述步驟之後,形成如圖5所繪示之有機電致發 光几件401,包括基板410、第一電極420、有機發光層430、 第一電極440、高分子基板450、多數增光結構460以及抗 〇 水氧層470。第一電極420設置於基板410上。有機發光 層430設置於第一電極42〇上。第二電極44〇設置於有機 發光層430上。高分子基板45〇設置於第二電極44〇上, 此高分子基板450具有一第一表面452與一第二表面 454 ’而第一表面452對向於第二電極440。增光結構460 设置於第二表面454上。抗水氧層470設置於第二表面側 452。關於上述構件之材質已如上所述,在此將不予以重述。 特別是’本實施例中,當抗水氧層47〇設置於第二表 18 200822357 uoiuu^ifW 19660twf.doc/n 面454侧且覆盍增光結構46〇時,高分子基板位於第 二電極440上。如此,可省略缓衝層48〇的製作,以簡化 有機電致發光元件401之結構。 並且,高分子基板450本身即可作為保護層以保護此 有機電致發光元件401。再者,直接覆蓋於高分子基板45〇 的苐一表面454上的抗水氧層470,可以提昇高分子基板 450的防水性能,以防止水氣破壞有機發光層43〇。 另外,請繼續參照圖5,也可以再利用封膠490以包 ( f有機發光層430而封裝有機電致發光元件4〇1,進而提 昇有機電致發光元件401的防水性能。 第四實施例 第四實施例與第三實施例類似。兩者的差別如下所 述。在第三實施例的步驟中,其是利用壓模法或射出成型 法另行製作出具有增光結構460之高分子基板450,如圖 4E所繪示。然而,在第四實施例中,提供高分子基板45〇 ϋ 的步驟是在有機電致發光元件上直接進行。 圖6Α〜6Β繪示為本發明第四實施例之提供高分子基 板的步驟的示意圖。請共同參照圖4Α〜4£)、圖6Α〜6Β 以及圖5,首先,本實施例也是利用如圖4α〜4D繪示之 步驟製作具有基板410、第一電極420、有機發光層430、 與第二電極440的有機電致發光元件。之後,再採用如圖 6Α〜6Β之步驟,直接在有機電致發光元件上製作具有增 光結構460的高分子基板450。 200822357 uoiuu4yifW 19660twf.doc/n 請先參照圖6A,首先於基板410上形成-高分子材 料層二5〇a。形成此高分子材料層之方法可以是塗佈 法、蒸鍍法或是其他適當的方法,而高分子材料層 450a 的材質例如是可模塑成型之高分子材料。更詳細而言,高 分子材料層450a的材質可以是選自於聚甲基丙稀酸甲 醋、聚二曱基石夕氧烧、聚酿亞胺、聚碳酸醋、聚苯乙稀、 聚^烯對苯二曱_旨或其他適當的材質。值觀意的是, 此南分子材料層450a製作在有機電致發光元件上,並覆蓋 第二電極440。 之後,如圖6B所繪示,利用一模具5〇〇對此高分子 材料層45〇a進行壓模動作,以於第二表& —侧形成增光 結,460。此模具40〇的壓模動作是沿著下壓方向a進行 壓b因此’此步驟可以直接在有機f致發光元件上形成 具有增光結構460的高分子基板45G,並且在下壓動作的 過程中’可以消除各個膜層間的空氣間隙(未繪示)。因 此丄此有機發光層4 3 〇發出的光線不會受到空氣間隙存在 的影響’而可以提昇有機電致發光元件的增光效率。 ^ 特別是,也可以進一步在高分子基板450上形成抗水 氧層470,並形成封膠490以包覆有機發光層430,以形成 與圖5纟會料目同之有機電致發光元件綱。另外,經過上 述步驟所製作的有機電致發光元件的結構與第三實施例的 f機電致發光元件相同(如® 5所繪示),其構件、材質 專’在此不予以重述。 20 200822357 uoiuuwifW 19660twf.doc/n 第五實施例 第五實施例與第二實施例類似,也是關於—種上發光 式(top emission)有機電致發光元件的製作。 又In particular, since the first electrode 340 is made of a transparent conductive material and the second electrode 360 is made of a metal material, the light emitted from the organic light-emitting layer 35 passes through the polymer substrate 310 and is emitted downward. Further, the materials and advantages of all of the above members are described in the above-described method of fabricating the organic electroluminescent device 3, and will not be repeated here. Furthermore, the method for fabricating the organic electroluminescent device 3 of this embodiment further includes forming a protective layer 37 on the second electrode 360, as shown in FIG. 3]. The material of the protective layer 370 is, for example, one selected from the group consisting of glass, metal, polymer, and a combination thereof. Further, referring to Fig. 3F, the method of fabricating the organic electroluminescent device 3 of this embodiment further includes providing a sealant to coat the organic light-emitting layer 350. The sealant can be UV curable, heat cured or other similar materials. Therefore, the use of a protective layer or a sealant means that the organic electroluminescence element is subjected to a prefecture, and the outer water vapor is prevented from entering the organic light-emitting layer 350. In this way, the life of the light-emitting piece 3GG is made. i = the method of the above-mentioned "electro-electroluminescent element of the sturdy towel", which is a luminescence method or (4) reliance on the south molecular substrate 310 having the light-increasing structure 20, and therefore, can be made in a large amount (4) and (4) 200822357 u 〇iUU4yifW 19660twf.doc/n The manufacturing cost of the organic electroluminescent element 300. Further, the organic electroluminescent element 300 can improve the light use efficiency by the light-increasing structure 320. Moreover, the waterproof performance of the organic electroluminescent element 300 can be effectively improved by the arrangement of the water-resistant oxygen layer 330. Second Embodiment Figs. 4A to 4F are cross-sectional views showing the manufacturing process of an organic electroluminescence device according to a second embodiment of the present invention. This embodiment is directed to the fabrication of a top emission organic electroluminescent device. Referring to FIG. 4A, a substrate 410 is first provided. The substrate 410 may be a glass substrate, a plastic substrate or other kinds of substrates. Next, referring to FIG. 4B, a first electrode 420 is formed on the substrate 410. In one embodiment, the method of forming the first electrode 42A may be a sputtering method or other suitable method, and the material of the first electrode 420 is, for example, a metal, and the invention does not limit the type of metal. Next, the organic light-emitting layer 430 is formed on the first electrode 420 with reference to FIG. 4C'. In one embodiment, the method of forming the organic light-emitting layer 430 is, for example, a coating method, a steaming method, or other suitable method, and the present invention does not impose any limitation on the kind of the organic light-emitting layer 430. Next, referring to FIG. 4D, a second electrode 440 is formed on the organic light-emitting layer 430. In one embodiment, the method of forming the second electrode 440 can be a helium ore method, a steaming method, or other suitable method. The material of the second electrode 440 includes a transparent conductive material, and the transparent conductive material is, for example, indium tin oxide (IT0), indium zinc oxide (IZ0), and nanometer thickness thin gold 15 200822357 uo I υυ^^ι rw 19660twf.doc/n genus or other suitable material. Then, a polymer substrate 450 is disposed above the second electrode 440. The polymer substrate 450 has a first surface 452 and a second surface 454. The first surface 452 is provided. The second electrode 440 is opposite, and a plurality of light-increasing structures 460 are formed on the second surface 454. In the present embodiment, the polymer substrate 450 is a member produced by a press molding method or an injection molding method. The material of the polymer substrate 450 is as described in the first embodiment and will not be repeated here. Referring to FIG. 4F, an anti-oxygen layer 470 is formed on the first surface side 452. The method for forming the moisture-resistant layer 470 is, for example, a coating method or other suitable method, and the material of the water-resistant layer 470 is, for example, a photoresist material, an epoxy resin, cerium oxide, cerium nitride, parylene, or the like. Combine one of them. In this embodiment, when the anti-aqueous oxygen layer 47 is formed on the first surface 452 side, the method for fabricating the organic electroluminescent device further includes forming between the water-resistant oxygen layer 470 and the second electrode 440. A buffer layer 48〇. The method for forming the buffer layer 480 is, for example, a coating method or other suitable method, and the material of the buffer layer 480 is selected, for example, from a photoresist material, an epoxy resin, cerium oxide, cerium nitride, parylene or the like. Similar material. Further, by coating the buffer layer 48 on the second electrode 440, the water-resistant layer 470 can be prevented from directly contacting the second electrode 440 to prevent the water-resistance 470 from causing damage to the second electrode 440.经由 Through the steps of FIGS. 4A to 4F described above, a top-emission type organic electroluminescent element 4〇〇 can be formed as shown in FIG. 4F. The organic electroluminescent device includes a substrate 410, a first electrode 420, an organic light-emitting layer 43A, a 200822357 uoiuuh^iiW 19660twf.doc/n two electrode 440, a south molecular substrate 450, a majority of the light-increasing structure 460, and water resistance. Oxygen layer 470. The first electrode 420 is disposed on the substrate 410. The organic light emitting layer 430 is disposed on the first electrode 420. The second electrode 440 is disposed on the organic light-emitting layer 430. The polymer substrate 450 is disposed above the second electrode 440. The polymer substrate 450 has a first surface 452 and a second surface 454, and the first surface 452 is opposite to the second electrode 440. The brightness enhancement structure 460 is disposed on the second surface 454. The water vapor resistant layer 470 is disposed on the first surface side 452. In particular, in the present embodiment, when the water-resistant oxygen layer 470 is disposed on the D-surface side 452, the organic electroluminescent device 400 further includes a buffer layer 480 disposed on the water-resistant oxygen layer 470 and the second layer. Between the electrodes 440. The material of the above member is described in the above-described method of fabricating the organic electroluminescent device 400, and will not be repeated here. In addition, referring to FIG. 4F, the encapsulant 490 may be further used to coat the organic light-emitting layer 430 to further improve the waterproof performance of the organic electroluminescent element 400. In summary, the method for fabricating the organic electroluminescent device 4 of the second embodiment is to form a polymer substrate 450 having a light-increasing junction structure 46 by a compression molding method or an injection molding method. The polymer substrate 450 is produced in a large amount, and the manufacturing cost of the organic electroluminescent device 400 is further reduced. Further, the organic electroluminescent element 400 can enhance the light-increasing efficiency by the light-increasing structure 460. Further, by the arrangement of the water-resistant oxygen barrier layer 470, the waterproof performance of the organic electroluminescent element 400 can be effectively improved. In particular, the arrangement of the buffer layer 480 can prevent the water-resistant layer 470 from damaging the second electrode 4'. 17 200822357 uoiwuh^iTW 19660twf.doc/n Third Embodiment The second embodiment is similar to the first embodiment, and relates to a method for fabricating an upper-emitting organic electroluminescent element and a structure thereof. Fig. 5 is a schematic view showing an organic electroluminescent device according to a second embodiment of the present invention. Referring to FIG. 4A to FIG. 4E and FIG. 5 together, first, the third embodiment uses the steps shown in FIGS. 4A to 4D to fabricate the substrate 41, the first electrode 420, the organic light-emitting layer 430, and the second electrode 440. Electroluminescent element. Next, as shown in FIG. 4E, a polymer substrate 45A is provided. It is to be noted that the difference between the present embodiment and the second embodiment is that the second embodiment 440 does not open between the second electrode 440 and the polymer substrate 450 to form the water-resistant oxygen barrier layer 470. As shown in FIG. 5, when the water-resistant oxygen barrier layer 470 is formed on the second surface 454 side, the polymer substrate 450 is directly disposed on the second electrode 440. After the above steps, a plurality of organic electroluminescent elements 401 as shown in FIG. 5 are formed, including a substrate 410, a first electrode 420, an organic light emitting layer 430, a first electrode 440, a polymer substrate 450, a plurality of light-increasing structures 460, and Anti-hydrophobic layer 470. The first electrode 420 is disposed on the substrate 410. The organic light-emitting layer 430 is disposed on the first electrode 42A. The second electrode 44 is disposed on the organic light-emitting layer 430. The polymer substrate 45 is disposed on the second electrode 44A. The polymer substrate 450 has a first surface 452 and a second surface 454', and the first surface 452 faces the second electrode 440. The brightness enhancement structure 460 is disposed on the second surface 454. The water vapor resistant layer 470 is disposed on the second surface side 452. The material of the above member has been described above and will not be repeated here. In particular, in the present embodiment, when the water-resistant oxygen barrier layer 47 is disposed on the second surface of the second surface of the surface of the surface of the surface of the surface of the second surface of the second surface of the second surface on. Thus, the fabrication of the buffer layer 48A can be omitted to simplify the structure of the organic electroluminescent element 401. Further, the polymer substrate 450 itself can serve as a protective layer to protect the organic electroluminescent element 401. Furthermore, the water-repellent layer 470 directly covering the surface 454 of the polymer substrate 45A can improve the waterproof performance of the polymer substrate 450 to prevent the moisture from damaging the organic light-emitting layer 43. In addition, referring to FIG. 5, the encapsulant 490 may be further used to encapsulate the organic electroluminescent element 4〇1 with the organic light-emitting layer 430, thereby improving the waterproof performance of the organic electroluminescent element 401. Fourth Embodiment The fourth embodiment is similar to the third embodiment. The difference between the two is as follows. In the step of the third embodiment, the polymer substrate 450 having the light-increasing structure 460 is separately fabricated by a compression molding method or an injection molding method. 4E, however, in the fourth embodiment, the step of providing the polymer substrate 45A is performed directly on the organic electroluminescent element. FIGS. 6A to 6B are diagrams showing a fourth embodiment of the present invention. A schematic diagram of a step of providing a polymer substrate. Please refer to FIG. 4A to FIG. 4), FIG. 6A to FIG. 6 and FIG. 5, firstly, this embodiment also uses the steps shown in FIGS. 4α to 4D to fabricate a substrate 410. An electrode 420, an organic light-emitting layer 430, and an organic electroluminescence element of the second electrode 440. Thereafter, a polymer substrate 450 having a light-increasing structure 460 is directly formed on the organic electroluminescence device by the steps shown in Figs. 6 to 6Β. 200822357 uoiuu4yifW 19660twf.doc/n Referring first to FIG. 6A, a polymer layer 2 5〇a is first formed on the substrate 410. The method of forming the polymer material layer may be a coating method, an evaporation method, or other suitable method, and the material of the polymer material layer 450a is, for example, a moldable polymer material. In more detail, the material of the polymer material layer 450a may be selected from the group consisting of polymethyl methacrylate methyl acetonate, poly fluorinated oxysulfonate, poly nitrite, polycarbonate, polystyrene, poly Alkene terephthalate or other suitable material. It is worth noting that this south molecular material layer 450a is formed on the organic electroluminescent element and covers the second electrode 440. Thereafter, as shown in Fig. 6B, the polymer material layer 45A is subjected to a stamping operation using a mold 5 to form a light-increasing junction 460 on the second surface. The stamping action of the mold 40 is performed in the pressing direction a. Therefore, this step can directly form the polymer substrate 45G having the light-increasing structure 460 on the organic electroluminescent element, and during the pressing operation. Air gaps (not shown) between the individual film layers can be eliminated. Therefore, the light emitted from the organic light-emitting layer 4 3 is not affected by the presence of the air gap, and the light-increasing efficiency of the organic electroluminescent element can be improved. In particular, the water-oxygen-resistant layer 470 may be further formed on the polymer substrate 450, and the sealant 490 may be formed to coat the organic light-emitting layer 430 to form an organic electroluminescent device similar to that shown in FIG. . Further, the structure of the organic electroluminescent element produced by the above steps is the same as that of the f electroluminescent element of the third embodiment (as shown in Fig. 5), and the components and materials thereof will not be repeated here. 20 200822357 uoiuuwifW 19660twf.doc/n Fifth Embodiment The fifth embodiment is similar to the second embodiment and is also related to the fabrication of a top emission organic electroluminescent element. also
r _ 7A 〜7B 繪示為本發明第五實施例之有機電致發光元件的部分製作 流程剖面不意圖。請共同參照圖4A〜4D、圖@ 7A 〜7B,首先,第五實施例也是利用如圖4a〜4d緣示"之步 驟製作具有基板410、第一電極420、有機發光層^ 第二電極440的有機電致發光元件。 胃 ” 在經過圖4A〜4D的步驟之後,請參照圖7八,在第二 電極440上依序製作緩衝層480與抗水氧層47〇,其中, 緩衝層480位於第二電極440與抗水氧層470之間。 此緩衝層480之材質例如是聚對二曱苯,由於其具有 較為堅硬的特性,而不易直接利用其製作增光結構^6〇'。 因此,請參照圖7B,在抗水氧層470上形成一高分 子材料層450a,並利用一模具500沿著下壓方向A而對此 高分子材料層450a進行壓模動作,使得該高分子材料層 450a形成具有增光結構460之高分子基板450。另外,也 可再製作封膠490,由此,形成結構如圖4F所繪示之有機 電致發光元件400。 值得注意的是,本實施例是在有機電致發光元件上直 接形成高分子材料層450a,並將其下壓而形成具有增光結 構460的高分子基板45〇。所以,各膜層之間可以緊密地 結合,以防止空氣間隙的產生,進而提昇有機電致發光元 件400的出光效率。並且,由於抗水氧層47〇的設置,而 21 200822357 υο ιυυ^^ι TW 19660twf.doc/n 可以提昇有機電致發光元件400的防水性能。 第六實施例 第六實施例與第五實施例類似,也是關於上發光式 (top emission)有機電致發光元件的製作。本實施例與第 五實施例的差異在於··在本實施例中,抗水氧層470是形 成於高分子基板450的第二表面454侧。r _ 7A to 7B are schematic cross-sectional views showing a part of the production process of the organic electroluminescence device of the fifth embodiment of the present invention. Referring to FIG. 4A to FIG. 4D and FIG. 7A to 7B in common, first, the fifth embodiment is also fabricated with the substrate 410, the first electrode 420, the organic light-emitting layer, and the second electrode by using the steps shown in FIGS. 4a to 4d. An organic electroluminescent element of 440. After the steps of FIGS. 4A to 4D, referring to FIG. 7 , a buffer layer 480 and an anti-oxygen layer 47 are sequentially formed on the second electrode 440 , wherein the buffer layer 480 is located at the second electrode 440 The material of the buffer layer 480 is, for example, poly(p-nonylbenzene), and because of its relatively hard characteristics, it is not easy to directly use the light-increasing structure thereof. Therefore, please refer to FIG. 7B. A polymer material layer 450a is formed on the water-resistant oxygen layer 470, and the polymer material layer 450a is subjected to a molding operation in a pressing direction A by a mold 500, so that the polymer material layer 450a is formed with the light-increasing structure 460. The polymer substrate 450. Alternatively, the encapsulant 490 may be further formed, thereby forming an organic electroluminescent device 400 having a structure as shown in Fig. 4F. It is noted that the present embodiment is an organic electroluminescent device. The polymer material layer 450a is directly formed thereon, and is pressed down to form a polymer substrate 45A having the light-increasing structure 460. Therefore, the film layers can be tightly bonded to prevent the generation of an air gap, thereby enhancing the organic electricity. Cause The light-emitting efficiency of the light-emitting element 400. And, due to the arrangement of the water- and moisture-resistant layer 47, 21 200822357 υο ιυυ^^ TW 19660 twf.doc/n can improve the waterproof performance of the organic electroluminescent element 400. The sixth embodiment is similar to the fifth embodiment and is also related to the fabrication of a top emission organic electroluminescent device. The difference between this embodiment and the fifth embodiment lies in that, in this embodiment, the water and oxygen resistant layer 470 is formed on the second surface 454 side of the polymer substrate 450.
圖8A〜8B繪示為第六實施例之有機電致發光元件的 ^ 1 部分製作流程剖面示意圖。請共同參照圖4A〜4D與圖8A 〜8B,首先,第六實施例也是利用如圖4A〜4D繪示之步 驟製作具有基板410、第一電極420、有機發光層430、與 第二電極440的有機電致發光元件。 接著,請參照圖8A,在第二電極上440依序形成緩 衝層482與高分子材料層450a。再來,利用模具5〇〇沿著 下壓方向A對於高分子材料層450a進行下壓,而形成如 圖8B所繪示之具有增光結構46〇的高分子基板45〇。 U 之後,請參照圖8B,於高分子基板450上形成抗水8A to 8B are schematic cross-sectional views showing the fabrication process of the ^1 portion of the organic electroluminescent device of the sixth embodiment. Referring to FIGS. 4A to 4D and FIGS. 8A to 8B together, first, the sixth embodiment is also fabricated with the substrate 410, the first electrode 420, the organic light-emitting layer 430, and the second electrode 440 by using the steps as shown in FIGS. 4A to 4D. Organic electroluminescent element. Next, referring to Fig. 8A, a buffer layer 482 and a polymer material layer 450a are sequentially formed on the second electrode 440. Then, the polymer material layer 450a is pressed down in the pressing direction A by the mold 5, and the polymer substrate 45A having the light-increasing structure 46A as shown in Fig. 8B is formed. After U, please refer to FIG. 8B to form water resistant on the polymer substrate 450.
氧層470。也就是說,當上述之抗水氧層47〇形成於第二 表面454側時,此有機電致發光元件的製作方法更包括: 高分子基板彻與第二電極44〇之間形成—緩衝芦似。、 形成此緩衝層482之方法例如是塗佈法,而緩衝^ 48 材質例如是選自於光阻材料、環氧樹脂、氧 I 聚對二甲苯或其他適當的材質。 乳石 請繼續參照圖8B,經由上述步驟製作之有機電致發 22 200822357 uoiuu^yifW 19660twf.doc/n 光元件402包括基板410、第一電極420、有機發光層430、 第二電極440、高分子基板450、多數增光結構460以及抗 水氧層470。第一電極420設置於基板410上。有機發光 層430設置於第一電極420上。第二電極440設置於有機 發光層430上。高分子基板450設置於第二電極440之上 方,此高分子基板450具有一第一表面452與一第二表面 454,而第一表面452對向於第二電極440。增光結構460 設置於第二表面454上。抗水氧層470設置於第二表面454 侧0 特別是,在本實施例中,當抗水氧層470設置於第二 表面454侧且覆蓋增光結構460時,有機電致發光元件402 更包括一緩衝層482,設置於高分子基板450與第二電極 440之間。同樣地,如圖8B所示,可再利用封膠49〇以包 覆有機發光層430,以提昇有機電致發光元件402的防水 特性。 上述各個實施例中,提供高分子基板450的方法可以 tj 是另行製作具有增光結構460的高分子基板450,在將此 问分子基板450與其他膜層進行黏合;或者是,先以圖4a :4D的步驟製作有機電致發光元件,之後再於有機電致發 光元件上塗佈高分子材料層450a,並以模具500下壓此高 分子材料層450a而形成具有增光結構460的高分子基柄 450。 叹 此外,藉由抗水氧層470與緩衝層480、緩衝層482 的設置,也能夠使有機電致發光元件的製作具有較佳的防 23 200822357 uoiuu^iiW 19660twf.doc/n 能 水性能以及更好的元件性 、、’示上所述,本發明之有機電致發光元件及直造 包括下列優點: Μ ⑴此有機電致發光元件因採用具有增光結構的高 分子基板,而能夠提昇其光線利用效率。 ⑺此有機電致發光元件具有抗水氧層,進而能約 提昇有機電致發光元件的防水性能。 (3)在此有機電致發光元件的製作方法中,藉由壓模 法或射出成型法以製作具有增光結構的高分子基板。因 此,能夠大量地進行製造以降低製作成本。 ,(4)在有機電致發光元件的製作方法的製作過程中, 可消除存在於膜層之間的空氣_,以提昇有機電 元件的增光效果。 o 雖然本發明已以較佳實施例揭露如上,然其並非用以 限,本發明,任何熟習此技藝者,在不麟本發明之精神 =範圍内,當可作些許之更動與潤飾,因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1繪示為習知一種有機電致發光元件的示意圖。 圖2繪示為習知另一種有機電致發光元件的示意圖。 圖3Α〜3F繪示為本發明第一實施例之一種有^電致 發光元件的製作流程剖面示意圖。 圖4Α〜4F繪示為本發明第二實施例之有機電致發光 元件的製作流程剖面示意圖。 24 200822357 uoiuu^yiiW 19660twf.doc/n 圖5繪示為本發明第三實施例之有機電致發光元件的 不意圖。 圖6A〜6B繪示為本發明第四實施例之提供高分子基 板的步驟的不意圖。 圖7A〜7B繪示為本發明第五實施例之有機電致發光 元件的部分製作流程剖面示意圖。 圖8A〜8B繪示為第六實施例之有機電致發光元件的 部分製作流程剖面示意圖。 ◎ 【主要元件符號說明】 100、200 :有機電致發光元件 110、210 :玻璃基板 120、220 :陽極 130' 230 ' 350、430:有機發光層 132 :光線 140、240 :陰極 150、250 :蓋板 (J 160 :增光層 170 :空氣間隙 212 ·微透鏡陣列 300、400、撕、402 :有機電致發光元件 310、450 ·南分子基板 312、452 :第一表面 314、454 :第二表面 320、460 :增光結構 25 200822357 υο iuu^yi TW 19660twf.doc/n 330、470 :抗水氧層 340、420 :第一電極 360、440 :第二電極 370 :保護層 380、490 :封膠 410 :基板 450a :高分子材料層 480、482 :緩衝層 500 :模具 A :下壓方向 26Oxygen layer 470. That is, when the anti-aqueous oxygen layer 47 is formed on the second surface 454 side, the method for fabricating the organic electroluminescent device further includes: forming a buffer between the polymer substrate and the second electrode 44? like. The method of forming the buffer layer 482 is, for example, a coating method, and the buffer material is, for example, selected from a photoresist material, an epoxy resin, an oxy-p-xylene or other suitable material. Please continue to refer to FIG. 8B. The organic electroluminescence produced by the above steps 22 200822357 uoiuu^yifW 19660 twf.doc/n optical element 402 includes a substrate 410, a first electrode 420, an organic light-emitting layer 430, a second electrode 440, and a high The molecular substrate 450, the plurality of light-increasing structures 460, and the water-resistant oxygen layer 470. The first electrode 420 is disposed on the substrate 410. The organic light emitting layer 430 is disposed on the first electrode 420. The second electrode 440 is disposed on the organic light emitting layer 430. The polymer substrate 450 is disposed above the second electrode 440. The polymer substrate 450 has a first surface 452 and a second surface 454, and the first surface 452 is opposite to the second electrode 440. The brightness enhancement structure 460 is disposed on the second surface 454. The water-resistant layer 470 is disposed on the side of the second surface 454. In particular, in the embodiment, when the water-resistant oxygen layer 470 is disposed on the second surface 454 side and covers the light-increasing structure 460, the organic electroluminescent element 402 further includes A buffer layer 482 is disposed between the polymer substrate 450 and the second electrode 440. Similarly, as shown in Fig. 8B, the encapsulant 49 can be reused to coat the organic light-emitting layer 430 to enhance the waterproof property of the organic electroluminescent element 402. In the above embodiments, the method of providing the polymer substrate 450 may be to separately fabricate the polymer substrate 450 having the light-increasing structure 460, and bond the molecular substrate 450 to other film layers; or, first, as shown in FIG. 4a: The step of 4D is to fabricate an organic electroluminescent device, and then the polymer material layer 450a is coated on the organic electroluminescent device, and the polymer material layer 450a is pressed down by the mold 500 to form a polymer stalk having a light-increasing structure 460. 450. In addition, by the arrangement of the anti-aqueous oxygen layer 470, the buffer layer 480, and the buffer layer 482, the fabrication of the organic electroluminescent device can also be improved to have a water-proof property and Further, the organic electroluminescent device and the direct manufacturing of the present invention include the following advantages: (1) The organic electroluminescent device can be improved by using a polymer substrate having a light-increasing structure. Light utilization efficiency. (7) The organic electroluminescence element has an anti-aqueous oxygen layer, which in turn can improve the waterproof performance of the organic electroluminescence element. (3) In the method for producing an organic electroluminescence device, a polymer substrate having a light-increasing structure is produced by a compression molding method or an injection molding method. Therefore, it is possible to manufacture in a large amount to reduce the manufacturing cost. (4) In the production process of the method for fabricating the organic electroluminescence device, the air _ existing between the film layers can be eliminated to enhance the light-increasing effect of the organic electric device. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the scope of the invention, and the skilled person may make some modifications and refinements within the scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a conventional organic electroluminescent device. 2 is a schematic view of another conventional organic electroluminescent device. 3A to 3F are cross-sectional views showing a manufacturing process of an electroluminescent device according to a first embodiment of the present invention. 4A to 4F are schematic cross-sectional views showing a manufacturing process of an organic electroluminescence device according to a second embodiment of the present invention. 24 200822357 uoiuu^yiiW 19660twf.doc/n FIG. 5 is a schematic view showing an organic electroluminescence element according to a third embodiment of the present invention. 6A to 6B are views showing a step of providing a polymer substrate in accordance with a fourth embodiment of the present invention. 7A to 7B are schematic cross-sectional views showing a part of the manufacturing process of the organic electroluminescence device according to the fifth embodiment of the present invention. 8A to 8B are schematic cross-sectional views showing a part of the manufacturing process of the organic electroluminescent device of the sixth embodiment. ◎ [Description of main component symbols] 100, 200: Organic electroluminescent elements 110, 210: Glass substrates 120, 220: Anode 130' 230' 350, 430: Organic light-emitting layer 132: Light rays 140, 240: Cathodes 150, 250: Cover plate (J 160: brightness enhancement layer 170: air gap 212) microlens array 300, 400, tear, 402: organic electroluminescent element 310, 450 · south molecular substrate 312, 452: first surface 314, 454: second Surface 320, 460: light-increasing structure 25 200822357 υο iuu^yi TW 19660twf.doc/n 330, 470: water-resistant oxygen layer 340, 420: first electrode 360, 440: second electrode 370: protective layer 380, 490: Glue 410: substrate 450a: polymer material layer 480, 482: buffer layer 500: mold A: pressing direction 26
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