200822268 九、發明說明： 【發明所屬之技術領域】 本發明係關於晶圓容器，且特別地，係關於將晶圓支撐於晶圓 容器中之系統。 【先前技術】 電子裝置中所用之半導體及磁性組件通常係由「晶圓」製成。 其中「晶圓」意指矽晶圓、磁性基板或類似物。在將該等晶圓加 工變成完成品裝置之過程中，必須實施諸多步驟，且通常必須在 各製造場所間以及在一製造場所内部傳送晶圓。晶圓一般對物理 震動及電子衝擊非常敏感。另外，晶圓可能非常昂貴，尤其係於 加工步驟完成之後。 為提供保護，人們已開發出用於在處理之前、處理期間以及處 理之後成批地運送和儲存晶圓之專門載具。二種常用類型之專門 晶圓容器稱為前開式晶圓盒（front opening unified pod，FOUP ) 以及前開式運輸盒（front opening shipping boxes，FOSBs )。該等 容器具有一容器部，該容器部具有内部晶圓支撐件，以用於在該 容器内部中以軸向相間之水平佈局固持一晶圓層疊。該容器具有 一容許***和取出晶圓之前門以及一密封地嚙合至該晶圓容器上 且可被閂鎖於定位上之門。舉例而言，該等盒揭示於第6,216,874 號、第6,206，196號、第6,010,008號、第5,944，194號美國專利中， 該等專利全部由本申請案之擁有者所擁有且以引用方式全文倂入 本文中。 第1圖繪示一普通之先前技術前開式載具。圖中顯示該晶圓容 5 200822268 器安放於自動處理設備25上，且 妒髀邱？0目士 體匕s Λ又體邛20以及門22 〇 Γ 具有開°之前端24 1部23、-對側面28、29、背部 32以及底部34。門框36界定一 义山 殼體部20可具有機械手臂搬運凸缘且用以接納門22。 ±产从^ 錢連凸緣42。殼體部20内部中之晶圓 支撐件*支撐複數個晶圓（未顯 曰曰圓 陣列形式在-水平方向上對齊。門之空間 52 S4 1 2具有朝外側面50、朝内側面 面二 周緣54具有位於朝外側面上之閃鎖狹槽58。外側 具=閃鎖為/Γ之主要結構面板，其覆蓋與鎖眼68相關聯且 顯不）之問鎖機構（未顯示），該等閃鎖部件自 閂鎖狹槽58伸出。 件自 ’晶圓可因容器之物理震動而移位。晶圓於晶圓支 擇件上之移位可導致自晶圓上或自承放晶圓之支撐件上磨下汽 =該等微粒，縱使其非常細小，亦可能會導致在微影製程及盆 他製好财發生缺陷。因此，在製程中期望避免微粒之形成Γ t, 先别技術中為減少微粒形成所作之嘗試一直著重於 用之塑膠材料上。與也丨二_ ^ 令如T所 牛例而吕’第5,780，127號以及第6,808,668號 專利即揭示用於製作晶圓支撐件並減少潛在微粒形成之可妒 ^各種聚合物材料及方法。該等專利以引用方式全文併入本^ 。為Ί 中之微粒形成所作之其他嘗制係針對晶圓支 撐件之物理配置以及減震。舉例而言，第6,267,245號以及第 6,644,477號美國專利即揭示此等支撐及減震系統，該等專利以引 用方式全文倂入本文中。 6 200822268 然而，該等先前技術之嘗試並未完全成功地消除晶圓容器内微 粒之形成。因此，業内仍需要一種具有能進一步限制微粒形成之 特徵之晶圓容器。 業内之另一趨勢係朝直徑不斷增大且不斷變薄之晶圓發展。儘 管150、200及300 mm之半導體晶圓係為業内普遍採用之標準， 但目前正在設想及使用更大直徑之晶圓，例如450 mm及更大直徑 之晶圓。然而’晶圓尺寸變大之缺點在於，將晶圓如同在習知晶 圓容器中一般以晶圓外周緣支撐於擱架上時，晶圓會因重力而發 生撓曲或下垂。晶圓之此種下垂可能減小各晶圓間在晶圓中心處 之間隙，且使得難以使用標準機械手臂工具在靠近晶圓中心處插 入各晶圓間拿放晶圓，以將晶圓***容器及自容器中取出。因此， 業内進一步需要一種可裝納更大直徑之晶圓且同時可減少重力下 垂之晶圓容器。 【發明内容】 本發明藉由提供更能限制晶圓容器内之微粒污染且減小較大直 徑晶圓之重力下垂之容器、晶圓支撐系統及方法，而實質上滿足 業内之上述需要。 本發明之實施例更提供具有傾斜之晶圓支撐區域之晶圓支撐表 面，從而僅於晶圓之下周緣角處提供接觸支撐區，減小被支撐晶 圓與晶圓支撐件間之接觸，並藉此使晶圓受到之損壞及污染最小。 該等晶圓支撐件可單獨形成或與該晶圓容器一體成型。若單獨 形成，可將該等晶圓支撐件卡扣至該晶圓容器中之預形成結構中 及/或可藉由連接件而牢固於其中。若與該容器分別形成，則本發 7 200822268 明之晶圓支撐件可藉由諸如靖成^等製程—體成^，或者其組 件可單獨形成。若該等組件單獨形成，㈣等㈣可加以組裝並 藉由連接件以，《形式進行緊固。若與該容器成―體成型，則可 藉由諸如包覆成型等習知製程來形成該等晶圓支撐件。200822268 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to wafer containers and, in particular, to systems for supporting wafers in wafer containers. [Prior Art] The semiconductor and magnetic components used in electronic devices are usually made of "wafer". "Wafer" means a wafer, a magnetic substrate or the like. In the process of turning these wafers into finished devices, many steps must be performed, and wafers must typically be transferred between manufacturing sites and within a manufacturing facility. Wafers are generally very sensitive to physical shocks and electronic shocks. In addition, wafers can be very expensive, especially after the processing steps are completed. To provide protection, specialized carriers have been developed for shipping and storing wafers in batches before, during, and after processing. Two common types of specialized wafer containers are called front opening unified pods (FOUPs) and front opening shipping boxes (FOSBs). The containers have a container portion having an internal wafer support for holding a wafer stack in an axially spaced horizontal arrangement within the interior of the container. The container has a door that allows insertion and removal of the wafer and a door that sealingly engages the wafer container and can be latched in position. For example, such a box is disclosed in U.S. Patent Nos. 6,216,874, 6,206,196, 6, 010, 008, 5, 944, 194, all of which are owned by the assignee of Into this article. Figure 1 illustrates a conventional prior art front open carrier. The figure shows that the wafer capacity 5 200822268 is placed on the automatic processing equipment 25, and Qiu Qiu? 0 目 匕 匕 Λ Λ 邛 20 and door 22 〇 Γ has a front end 24 1 part 23, - opposite sides 28, 29, back 32 and bottom 34. The door frame 36 defines a Yishan housing portion 20 that can have a robotic arm handling flange and is configured to receive the door 22. ± Produced from ^ Money Link Flange 42. The wafer support member* in the interior of the housing portion 20 supports a plurality of wafers (the array is not aligned in the horizontal direction). The space of the door 52 S4 1 2 has an outwardly facing side 50 and an inwardly facing surface. The peripheral edge 54 has a flash lock slot 58 on the outwardly facing side. The outer side has a primary structural panel with a flash lock of /Γ, which covers the lock mechanism (not shown) associated with the keyhole 68, which The equal flash lock member extends from the latch slot 58. Pieces from the 'wafer can be displaced by the physical shock of the container. Displacement of the wafer on the wafer support can result in the grinding of vapors from the wafer or from the support of the wafer, which, even if it is very small, may also result in lithography and Pottery made a good fortune. Therefore, it is desirable to avoid the formation of particles during the process, and attempts to reduce particle formation in the prior art have been focused on plastic materials. And 丨 丨 _ 如 如 如 T ’ ’ ’ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , These patents are hereby incorporated by reference in their entirety. Other attempts made for the formation of particles in Ί are for the physical configuration of the wafer support and for shock absorption. Such support and shock absorbing systems are disclosed, for example, in U.S. Patent Nos. 6, 267, 245, and U.S. Pat. 6 200822268 However, attempts by these prior art have not completely eliminated the formation of microparticles in wafer containers. Accordingly, there is still a need in the art for a wafer container having features that further limit particle formation. Another trend in the industry is toward wafers that are growing in diameter and shrinking. Although 150, 200, and 300 mm semiconductor wafers are commonly used in the industry, larger diameter wafers, such as 450 mm and larger wafers, are currently being envisioned and used. However, the disadvantage of the larger wafer size is that when the wafer is supported on the shelf by the outer periphery of the wafer as in a conventional wafer container, the wafer may be deflected or sagging due to gravity. Such sagging of the wafer may reduce the gap between the wafers at the center of the wafer and make it difficult to insert wafers between wafers near the center of the wafer using standard robotic tools to insert wafers The container is taken out of the container. Therefore, there is a further need in the art for a wafer container that can accommodate larger diameter wafers while reducing gravity sagging. SUMMARY OF THE INVENTION The present invention substantially meets the above-described needs in the industry by providing containers, wafer support systems and methods that are more capable of limiting particulate contamination in wafer containers and reducing the gravity droop of larger diameter wafers. Embodiments of the present invention further provide a wafer support surface having a slanted wafer support region to provide contact contact regions only at a lower peripheral corner of the wafer, reducing contact between the supported wafer and the wafer support, This minimizes damage and contamination of the wafer. The wafer supports can be formed separately or integrally formed with the wafer container. If formed separately, the wafer supports can be snapped into the preformed structure in the wafer container and/or can be secured therein by the connectors. If formed separately from the container, the wafer support of the present invention can be formed by a process such as Jing Cheng, or the components thereof can be formed separately. If the components are formed separately, (4), etc. (4) can be assembled and fastened by means of the connector. If formed integrally with the container, the wafer supports can be formed by conventional processes such as overmolding.
根據-實施例’-種晶圓容器包含—殼體部，具有一頂部、一 底部、相對之側面、-背部以及由_門框所界定之—開口前端。 一門可選擇性地接納於該門框中，以㈣地封_開口前端。於 該殼體中提供-晶圓支撐⑽，料接納及支撐至少—晶圓，該 晶圓支撐系統包含-對相間之懸臂式晶圓搁架，各該晶圓掷架包 含-對相對之闕斜㈣，料斜㈣協料似配置，以使得 當將該晶圓接納於該#_上時，該日日日圓在該日日日圓之—下周緣角 處支撐於該料面上’該晶圓之所有其他部分則不躺該晶圓支 撐系統。該等斜面可相對於水平面傾斜丨度至9度、3度至7度、 或者約5度。各該晶圓擱架可具有_大致凹陷之上表面，且於某 ⑼例中，邊等斜面之斜坡係與該等晶圓搁架之該等凹陷上表 面接^。 於本發明之實施例中，該晶圓支撐系統包含一對晶圓支撐結 i ’、中各4日日1]支撐結構包含_柱，該對晶圓搁架其中之一 自雜延伸出。該等晶圓支禮結構可藉由複數個緊固件而牢固於 Z體部中’或者可使用—包覆成型製程而與該殼體部成一體地 行：穿成1^柱及該等晶圓搁架係一體成型或各別模製成形後再 ;實化例中，一種用於以一水平定向、相間且轴向對齊之佈 8 200822268 局支撐複數個晶圓之晶圓容器包含：一殼體部，具有一頂部、一 底部、相對之側面、一背部以及由一門框所界定之一開口前端。 一門可選擇性地接納於該Η框中，以密封地封閉該開口前端。於 該殼體中提供—晶圓支㈣統，用於接納及支撐料晶圓，該晶 圓支撐系統包含一對相間之相對晶圓支撐結構，各該晶圓支撐結 構包含一柱，複數個相間之懸臂式晶圓搁架自該柱延伸出。該等 晶圓支撐結構中-第—者之各該晶圓_係與另—晶圓支稽結構 〇 之該等晶圓_其中之—水平對齊’以界定複數個水平定向之狹 槽’分別用於接納該複數個晶圓其中之_。各該晶圓擱架包含一 對相對之傾斜斜面部，㈣以於接觸該晶圓，料斜面部協同定 位及配置’以使得切該晶圓接納於該狹槽巾時，該晶圓在該晶 □之下周緣角處支稽於§亥等斜面上，該晶圓之戶斤有其他部分則 不接觸該晶圓支撑系統。 根據一實施例，一種晶圓容器包含：一殼體部，具有一頂部、 一底部、相對之側面、—背部以及由—門框所界定之_開口前端。 I， Μ可選擇性地接納於該門框中，以密封地封閉該開Π前端。該 谷器更包3用於將至少一晶圓支撐於該殼體中之裝置，其中該裝 置沿該晶圓之下周緣角在複數個相間之位置處支標該晶圓，該晶 圓之所有其他部分則不接觸該容器。 藉由結合附圖閱讀下文說明，本發明之該等及其他目的、特徵 及優點將變得顯而易見。 【實施方式】 此項技術中之-般技術者將易於瞭解，本發明各實施例中所顯 9 200822268 示之各個組件於不違背本發明之精神及範圍内可以互換，且可添 加於其他實施例中或在其他實施例中互換。半導體晶圓容器之一 般細節以及適用於本發明之各種組件闡述於第6,951，284號、第 6,955,382 號、第 6,880,718 號、第 6,811，〇29 號、第 6,758,339 號、 第6,736,268號'第RE 38,221號以及第6,464,081號美國專利中， 該等專利全部由本發明之擁有者所擁有，且以引用方式全文倂入 本文中。According to an embodiment, a wafer container includes a housing portion having a top portion, a bottom portion, an opposite side surface, a back portion, and an open front end defined by the _ door frame. A door is selectively receivable in the door frame to (4) seal the front end of the opening. Providing a wafer support (10) in the housing, receiving and supporting at least a wafer, the wafer support system comprising - pair of cantilever wafer shelves, each of the wafer throwing frames comprising - facing the opposite Oblique (four), material oblique (four) material-like configuration, such that when the wafer is received on the #_, the day-day yen is supported on the material surface at the lower-circle angle of the day-day All other parts of the circle do not lie on the wafer support system. The ramps may be inclined to a height of 9 degrees, 3 degrees to 7 degrees, or about 5 degrees with respect to the horizontal plane. Each of the wafer shelves may have a substantially concave upper surface, and in a (9) example, the slopes of the equal slopes are connected to the concave upper surfaces of the wafer shelves. In an embodiment of the invention, the wafer support system includes a pair of wafer support nodes i', each of which has a support structure comprising a column, and one of the pair of wafer shelves extends from the miscellaneous. The wafer support structure can be solidified in the Z body by a plurality of fasteners or can be used in an overmolding process to be integrated with the casing portion: the 1 column and the crystal The round shelf is integrally formed or separately molded; in the embodiment, a wafer container for supporting a plurality of wafers in a horizontally oriented, phase-to-phase, and axially aligned manner comprises: The housing portion has a top portion, a bottom portion, an opposite side surface, a back portion, and an open front end defined by a door frame. A door is selectively received in the frame to sealingly close the open front end. Providing a wafer support (four) system for receiving and supporting a material wafer, the wafer support system comprising a pair of opposite wafer support structures, each of the wafer support structures comprising a column, a plurality of A cantilevered wafer shelf extends from the column. Each of the wafer support structures - the wafers and the other wafers - are horizontally aligned to define a plurality of horizontally oriented slots - respectively Used to receive the _ of the plurality of wafers. Each of the wafer shelves includes a pair of opposite inclined bevels, (4) for contacting the wafer, the bevel is cooperatively positioned and configured to enable the wafer to be received when the wafer is received in the slot At the corner of the periphery of the crystal, it is placed on the slope of §Hai, and other parts of the wafer are not in contact with the wafer support system. In accordance with an embodiment, a wafer container includes a housing portion having a top portion, a bottom portion, opposing sides, a back portion, and an opening front end defined by the door frame. I, a crucible is selectively received in the door frame to sealingly close the opening end of the opening. The device further comprises means for supporting at least one wafer in the housing, wherein the device supports the wafer at a plurality of interphase positions along a lower peripheral edge of the wafer, the wafer All other parts are not in contact with the container. The above and other objects, features and advantages of the present invention will become apparent from the <RTIgt; [Embodiment] It will be readily understood by those skilled in the art that the various components shown in the various embodiments of the present invention can be interchanged without departing from the spirit and scope of the present invention, and can be added to other implementations. In the examples or in other embodiments interchanged. General details of semiconductor wafer containers and various components suitable for use in the present invention are described in Nos. 6,951,284, 6,955,382, 6,880,718, 6,811, 29, 6,758,339, 6,736,268, No. RE 38,221 And U.S. Patent No. 6,464,081, the entire disclosure of which is incorporated herein by reference in its entirety in its entirety herein in
C. 第2-10圖中繪示根據本發明實施例之晶圓容器7〇。晶圓容器 7〇大體包含殼體72及門74。殼體72大體包含整體式外殼76，該 外殼76具有頂壁78、相對之底壁8〇、側壁82、84、後壁86以及 由門框90所界定之開口前端88。運動耦合件％可接納於底壁肋 上’以將容器70定位於處理設備（未顯示）±，而機械手臂搬運 凸緣94可接納於頂壁78上，以達成對容器70之自動化搬運。 門74可接納於門框9〇中，以密封地封閉容器％，且大體包含 外壁96及内壁98 ’從而為用於將門74關於定位上之問鎖機構 (未顯示）界I封閉空間。可經由界定於外壁％中之鎖眼剛 操作該等閂鎖機構。 晶圓支撐系統102設置於殼體72中，用於以一水平、相間且轴 向對準之佈局來接納複數個晶圓刚。晶圓支撐系統⑽大體包含 、^位置相互#近但與各該側壁82、84相間之晶圓支撐件1⑽。 於第3、3a、4、9以及10圖所繪示之一實施例中，晶圓支撐件ι〇6 ^體包含後部柱108，後部柱108具有整體式固定樑110、H2, 魏個懸臂式搁架114相間地位於其間。每一懸臂式搁架與 200822268 下部固定樑112皆界定-對相對之晶圓支撑斜面ιΐ6 ιΐ8。此外， 如第3a®中所示’懸臂式擱架114之上表面12〇及下部固定樑ιι2 稍，凹陷，自低點m朝斜φ116、118之每_方向上向上傾斜。 如第3圖中所示，該對晶圓支樓件1〇6之懸臂式搁架…水平對 齊而界定複數個水平狹槽123,以分別用於接納一晶圓刚。應瞭 解’殼體72以及晶圓支撐件1〇6可用以提供自〗個至3〇個或更 多之任何所需數量之狹槽123。C. Figures 2-10 illustrate a wafer container 7A in accordance with an embodiment of the present invention. The wafer container 7A generally includes a housing 72 and a door 74. The housing 72 generally includes a unitary housing 76 having a top wall 78, opposing bottom walls 8〇, side walls 82, 84, a rear wall 86, and an open front end 88 defined by the door frame 90. The kinematic coupling member % can be received on the bottom wall rib ' to position the container 70 to a processing device (not shown) ± and the robot arm handling flange 94 can be received on the top wall 78 for automated handling of the container 70. The door 74 can be received in the door frame 9 to sealingly enclose the container % and generally includes an outer wall 96 and an inner wall 98' to provide a closed space for the door 74 to be positioned relative to the lock mechanism (not shown). The latching mechanisms can be operated via the keyhole defined in the outer wall %. A wafer support system 102 is disposed in the housing 72 for receiving a plurality of wafers in a horizontal, interphase, and axially aligned configuration. The wafer support system (10) generally includes a wafer support 1 (10) that is adjacent to each other but spaced apart from each of the sidewalls 82, 84. In one embodiment illustrated in Figures 3, 3a, 4, 9 and 10, the wafer support member 包含6^ body comprises a rear pillar 108, and the rear pillar 108 has integral fixed beams 110, H2, and a cantilever The shelves 114 are located between them. Each cantilevered shelf is defined with the 200822268 lower fixed beam 112 - the opposite wafer support bevel ΐ6 ιΐ8. Further, as shown in the 3a®, the upper surface 12 of the cantilevered shelf 114 and the lower fixed beam ιι are slightly recessed, inclined upward from the low point m in each of the oblique directions φ 116, 118. As shown in Fig. 3, the pair of cantilevered shelves of the wafer substrate 1〇6 are horizontally aligned to define a plurality of horizontal slots 123 for receiving a wafer. It should be understood that the housing 72 and the wafer support 1〇6 can be used to provide any desired number of slots 123 from one to three or more.
於所示實施例中’斜面116、118相對於水平面傾斜約5度。然 而’斜S 116、118之其他傾斜角度也可能適合於其他實施例，且 仍歸屬於本發明之範圍内。舉例而言，於某些實施例中，斜面Μ、 118可相對於水平面傾斜約3度至7度，而於其他實施射，則可 相對於水平面傾斜約1度至9度。 疋樑110 I〗2可包含用於將晶圓支撐件ι〇6牢固於殼體 :之一心13〇。於一實施例中，各凸起126、:“ο 皆:定—孔132，以用於接納貫穿外殼76之-緊固件（未顯示）。 為提供能使晶® 104進行靜電耗散之導電性，該等緊固件可具有 導:性且可自凸起128、130延伸至運動I馬合件92内或貫穿運動 92 °如此項技術中之—般技術者所習知，運軸合件92 可部分地或完全由導電性或靜電耗散性材料製成， 地路徑。 ^电_ 根據本發明之實施例，如第9及1〇圖中所示，晶圓104之下周 =角124倚靠於斜面116、118上，以便僅於四個非常小的接觸區 8 (實貝上係為由晶圓1〇4之下周緣角124所界定之一條線）處 11 200822268 ^按母-晶圓1〇4。此種支撑模式使容器7〇中所儲存晶圓刚與 晶圓支撐系統102間之接觸最小化。使接觸最小化可消除或大幅 也減丄原本因更廣泛之接觸而造成之晶圓損壞及微粒污染。 3在2 3a目中亦可看出，懸臂式擱架114之凹陷上表面12〇與下 口P固二樑112,於二接觸區138外之晶圓1〇4與上表面⑽間，形 成1隙或間隙126。間隙126使晶圓1〇4中能夠存在輕微的由重 、丨I之下垂，但在晶圓104與上表面120間並不發生接觸。當 Ί 然，應瞭解，在本發明之其他實施例中，可增大上表面12〇之凹 私度，以使上表面12〇之凹陷界定出斜面ιΐ6、丨Μ。如第I〗圖 中所不上表面120之傾坡可係為連續的，以將該等斜面倂為一 體，同時仍能達成晶圓104與懸臂式摘架114以及下部固定襟ιΐ2 間在下周緣角124處之線接觸。 曰曰圓支撐件106可由熟習此項技術者所習知之數種方法形成。 舉例而言’可由聚合物材料以注射成型、包覆成型或類似製程來 形成。任何具有適當耐磨性以及化學性質之材料皆係適合之材 丨 料。特定而言，可使用聚醚醚酮（PEEK)或聚醚醯亞胺（PEI) 聚合物，且可將其與其他，例如碳纖維，等材料組合，以使晶圓 支撐件106具有導電性或靜電耗散性。 於本發明之另一實施例中，如第5圖中所示，可藉由包覆成型 而使晶圓支撐部件106與殼體72 —體成型。於此等實施例中，可 藉由使晶圓支撐件106之一部分從殼體72之底壁8〇延伸或藉由 上文所述之導電緊固件，達成晶圓支撐件1〇6經由運動耦合件92 接地之導電性。 12 200822268 於本發明之再一實施例中，可如第6-8圖中所示將晶圓支樓件 106形成為若干單獨部件。於此等實施例中，晶圓支撐件1〇6大體 包含柱140,其界定相間凹口 142以及複數個單獨之懸臂式搁架 144。各該懸臂式擱架144界定一接片結構146，該接片結構⑽ 。、中個凹口 142中，以將懸臂式搁架144附裝至柱14〇 上。各柱140依序於其頂部及其底部處界定複數孔148’以接納用 於將晶圓支撐件106牢固於殼體72中之緊固件15〇。或者，可藉 由例如包覆成型'黏合劑或與之類似之任何其他適合之手段， 將柱140 $固於殼體72巾。如前面所述，懸臂式擱架144可且有 y稍微凹陷之上表面152，且可界定斜面116、118，以達成與晶 圓刚之線接觸。出於減少材料以及輕量之目的，如第8圖中所 示，搁架144可模製有凹槽153或中心部份15仏。 較佳地，晶圓支樓件106自側面82、84向内定位，以使晶圓ι〇4 之-部们54向外延伸超出晶圓支撐件1〇6之外邊緣156。此使各 接觸區138間之距離變大’藉此減小晶圓刚之重力下垂程度。 料’外邊緣156與側面82、84間之空間使—機械手臂拾二具 能夠***該空間，以藉由提升部154***晶圓1〇4以及將晶圓⑽ 自殼體72中取出。 以上各實施例旨在作為例示性而非限定性實施例。其他實施例 亦囊括於”專利範圍之料内。儘管上文係參照特定實施例說 明本發明，然而熟習此項技術者將知，亦可在形式及細節上作出 各種改動，此並不背離本發明之精神及範圍。為便於解釋本發明 之申請專利，明確打算不援引35 usc.第ιΐ2條第六項之條 13 200822268 款，除非在一請求項中述及特定用語「 戒「用於···之步驟（step for)」。 用於…之裝置 (means for) jIn the illustrated embodiment, the ramps 116, 118 are inclined about 5 degrees with respect to the horizontal. However, other tilt angles of 'slopes S 116, 118 may also be suitable for other embodiments and still fall within the scope of the present invention. For example, in some embodiments, the ramps 118 may be inclined by about 3 to 7 degrees with respect to the horizontal, while in other embodiments, they may be inclined by about 1 to 9 degrees with respect to the horizontal. The truss 110 I can include a means for securing the wafer support ι 6 to the housing: one of the cores 13 〇. In one embodiment, each of the projections 126, "o": a bore 132 for receiving a fastener (not shown) extending through the outer casing 76. To provide electrical conductivity that enables static dissipation of the crystal® 104 The fasteners may be conductive and may extend from the projections 128, 130 into the movement I or the movement 92. The technique is known to those skilled in the art. 92 may be partially or completely made of a conductive or static dissipative material, the ground path. ^Electrical_ According to an embodiment of the present invention, as shown in Figures 9 and 1 below, wafer 104 has a lower circumference = angle 124 rests on the ramps 116, 118 so that only four very small contact areas 8 (on the shell are defined by a line defined by the peripheral edge 124 of the wafer 1〇4) 11 200822268 ^ by mother - Wafer 1〇4. This support mode minimizes contact between the wafers stored in the container 7〇 and the wafer support system 102. Minimizing contact eliminates or substantially reduces the overall exposure. Caused by wafer damage and particulate contamination. 3 It can also be seen in 2 3a that the cantilevered shelf 114 has a concave upper surface 12〇 and The P-fixed beam 112 forms a gap or gap 126 between the wafer 1〇4 and the upper surface (10) outside the two contact regions 138. The gap 126 enables a slight weight and 丨I in the wafer 1〇4. Sagging, but no contact occurs between the wafer 104 and the upper surface 120. It should be understood that, in other embodiments of the invention, the concaveness of the upper surface 12 can be increased to allow the upper surface 12 to be 12 The depression of the crucible defines the bevels ΐ6, 丨Μ. As shown in the figure I, the slope of the surface 120 may be continuous, so that the bevels are integrated, and the wafer 104 and the cantilever can still be achieved. The wire 114 is contacted between the pick-up 114 and the lower fixed ΐι 2 at the lower peripheral corner 124. The round support 106 can be formed by several methods known to those skilled in the art. For example, 'polymer material can be injection molded, Formed by overmolding or similar processes. Any material with appropriate abrasion resistance and chemical properties is suitable for the material. In particular, polyetheretherketone (PEEK) or polyetherimide (PEI) can be used. a polymer, and can be combined with other materials such as carbon fiber, The wafer support member 106 is made electrically conductive or statically dissipative. In another embodiment of the present invention, as shown in FIG. 5, the wafer support member 106 and the housing 72 can be formed by overmolding. Body Forming. In these embodiments, the wafer support 1 can be achieved by extending a portion of the wafer support 106 from the bottom wall 8 of the housing 72 or by the conductive fasteners described above. The electrical conductivity of the crucible 6 is grounded via the kinematic coupling 92. 12 200822268 In yet another embodiment of the present invention, the wafer subassembly 106 can be formed as a number of separate components as shown in Figures 6-8. In an embodiment, the wafer support 1 6 generally includes a post 140 that defines an interphase recess 142 and a plurality of individual cantilevered shelves 144. Each of the cantilevered shelves 144 defines a tab structure 146, the tab structure (10). In the middle notch 142, the cantilevered shelf 144 is attached to the column 14A. Each post 140 defines a plurality of holes 148' at its top and at its bottom to receive fasteners 15 for securing the wafer support 106 to the housing 72. Alternatively, the post 140$ can be secured to the housing 72 by, for example, overmolding a 'adhesive or any other suitable means. As previously described, the cantilevered shelf 144 can have a slightly recessed upper surface 152 and can define ramps 116, 118 to achieve line contact with the wafer. For the purpose of reducing material and light weight, as shown in Fig. 8, the shelf 144 may be molded with a recess 153 or a central portion 15A. Preferably, the wafer fulcrum member 106 is positioned inwardly from the sides 82, 84 such that the portions 54 of the wafer iv 4 extend outward beyond the outer edge 156 of the wafer support 1 〇 6. This increases the distance between the contact regions 138, thereby reducing the degree of gravity sagging of the wafer. The space between the outer edge 156 and the sides 82, 84 allows the robotic arm to be inserted into the space to insert the wafer 1〇4 through the lift 154 and to remove the wafer (10) from the housing 72. The above embodiments are intended to be illustrative rather than limiting. Other embodiments are also included in the scope of the patent. Although the invention has been described above with reference to specific embodiments, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the invention. The spirit and scope of the invention. For ease of explanation of the patent application of the present invention, it is expressly intended not to invoke 35 usc. Article ΐ2, paragraph 6 of Article 13 200822268, unless a specific term "" or "for" is recited in a request. · Step (step for). Means for... j
【圖式簡單說明】 第1圖係為定位於處理設備上之一先前技術晶圓容器之-立體 圖； η圖係為根據本發明-實施例之—晶圓容器之—立體圖； =3圖係為根據本發明—實施例之—晶圓容器之—正視圖； 第33圏係為第3圖之晶圓容器及晶圓支撐系統沿第3圖之截面 3A-3A戴取之一剖面側視圖； 以圖係為根據本發明—實施例之—晶圓支撐部件之—立體圖； 第5圖係為藉由包覆成型而形成之本發明晶圓容器之另施 例之一立體圖； 、 第6圖係為本發明晶圓容器之另一實施例之一立體圖，立中該 等晶圓切部件係由單獨形成之部件組裝而成； 〃 第7圖係為第6圖之實施例之晶圓支撐件之一立體圖； 第8圖係為第7圖之晶圓支撐件之—部分之部分立體圖； 第9圖係為根據本發明一實施例之一晶圓支撐斜面之八立 艚圖； 〇刀 弟⑺圖係為第9圖之晶圓支#斜面沿第9圖之截面1(μ〇截取 之一剖視圖；以及 第11圖係為根據本發明一實施例之一晶圓支撐斜面之部分剖視 圖，其中該斜面係與該晶圓支撐部件之一凹陷上表面接續。 I s本發明適合具有各種修改及替代形式，然而在附圖中係以 14 200822268 舉例方式顯示且在下文中將詳細說明本發明之具體細節。然而， 應瞭解，並非意欲將本發明限定為所述之特定實施例。相反，本 發明意欲涵蓋仍歸屬於由隨附申請專利範圍所界定之本發明精神 及範疇内之所有修改、等效及替代形式。 【主要元件符號說明】 20 :殼體部 22 ··門 23 :頂部 24 :開口前端 25 :自動處理設備 28 :側面 29 :側面 32 :背部 34 :底部 36 :門框 42 :機械手臂搬運凸緣 46 :晶圓支撐件 50 :朝外侧面 52 :朝内側面 54 ··周緣 58 :閂鎖狹槽 62 :外側面板 68 :鎖眼 7 0 ·晶圓容為 72 :殼體 74 ： Η 76 :外殼 78 :頂壁 80 :底壁 82 :側壁 84 :側壁 86 :後壁 88 :開口前端 90 ··門框 92 :運動耦合件 94 :機械手臂搬運凸緣 96 :外壁 98 :内壁 100 :鎖眼 102 :晶圓支撐系統 104 :晶圓 15 200822268 106 :晶圓支撐件 108 :後部柱 110 :固定樑 112 :固定樑 114 :懸臂式搁架 116 :晶圓支撐斜面 118 :晶圓支撐斜面 120 :上表面 122 :低點 123 :狹槽 124 :下周緣角 126 :凸起/間隙 128 :凸起 130 :凸起 132 :孔 138 :接觸區 140 :柱 142 :凹口 144 :懸臂式搁架 146 :接片結構 148 :孔 150 ··緊固件 152 :上表面 153 :凹槽 153a :中心部份 154 :提升部 156 :外邊緣 16BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a prior art wafer container positioned on a processing device; FIG. 1 is a perspective view of a wafer container according to the present invention - an embodiment; A front view of the wafer container according to the present invention - the third embodiment is a cross-sectional view of the wafer container and the wafer support system of FIG. 3 taken along section 3A-3A of FIG. 1 is a perspective view of a wafer support member according to the present invention - an embodiment; FIG. 5 is a perspective view of another embodiment of the wafer container of the present invention formed by overmolding; The figure is a perspective view of another embodiment of the wafer container of the present invention, wherein the wafer cutting components are assembled from separately formed components; 〃 FIG. 7 is a wafer of the embodiment of FIG. a perspective view of a support member; FIG. 8 is a partial perspective view of a portion of the wafer support member of FIG. 7; and FIG. 9 is an eight-dimensional diagram of a wafer support slope according to an embodiment of the present invention; The knife brother (7) is the wafer branch of the 9th figure. The slope is along the section 1 of the figure 9 (μ〇 1 is a cross-sectional view of a wafer support bevel according to an embodiment of the present invention, wherein the bevel is contiguous with a recessed upper surface of the wafer support member. Various modifications and alternative forms, however, are shown in the accompanying drawings in the accompanying drawings. The present invention is intended to cover all modifications, equivalents, and alternatives, which are still in the spirit and scope of the invention as defined by the appended claims. Top 24: Open front end 25: Automatic handling equipment 28: Side 29: Side 32: Back 34: Bottom 36: Door frame 42: Robotic arm handling flange 46: Wafer support 50: Outward side 52: Inward side 54 • Peripheral 58: Latch slot 62: Outer panel 68: Keyhole 7 0 • Wafer capacity 72: Housing 74: Η 76: Housing 78: Top wall 80: Bottom wall 82: Side wall 84: Side 86: rear wall 88: open front end 90 · · door frame 92 : motion coupling 94 : mechanical arm handling flange 96 : outer wall 98 : inner wall 100 : keyhole 102 : wafer support system 104 : wafer 15 200822268 106 : wafer Support member 108: rear pillar 110: fixed beam 112: fixed beam 114: cantilevered shelf 116: wafer support bevel 118: wafer support bevel 120: upper surface 122: low point 123: slot 124: lower peripheral angle 126 : bulge / gap 128 : protrusion 130 : protrusion 132 : hole 138 : contact area 140 : column 142 : notch 144 : cantilever type shelf 146 : tab structure 148 : hole 150 · · fastener 152 : upper surface 153: groove 153a: center portion 154: lifting portion 156: outer edge 16