200821798 WP9511-C201-0571 22520twf.doc/n 九、發明說明： 【發明所屬之技術領域】 β本發明是有關於-種面板模組及其製造方法，且 是有關於一種觸控面板模組及其製造方法。 【先前技術】 、，在現今資訊時代中，人類對於電子產品之依賴性與曰 倶增。筆記型電腦、行動電話、個人數位助理器' (卿⑽^ 〆、山^1咖㈣价’ PDA)、數位隨身聽等電子產品均已成為 1 ，代人生活及工作中不可或缺之應用工具。上述之電子產 品均具有一人機介面，用以輸入使用者所須指令，以使電 子產品之内部系統自動執行此項指令。目前使用最廣泛之 人機介面裝置包括鍵盤（keyb〇ard)、滑鼠（m〇use)以及 觸控面板（touch panel)。 —立請參考圖1，其繪示習知之一種觸控面板模組的剖面 卞w圖名知觸控面板模組1〇〇包括一罩體（cover ) 110、 透光電容式觸控面板（transparent capacitive touch panel) I， 12〇 與一光學膠帶（optically clear adhesive，OCA) 130。 光130環繞罩體no之一透光部（tranSparentpart) 112 ’且位於罩體110之一殼體（housing) 114上。此外， 透光電容式觸控面板12〇藉由光學膠帶13〇貼合至罩體 u〇上。然而，由於透光部H2與透光電容式觸控面板12〇 之間有一充滿空氣的間隔（air gap) G，因此習知觸控面板 模組的整體透光度（transmittance)會有所損失。 為了改善以上的缺點，習知之另一種觸控面板模組 200被提出。請參考圖2,其繪示習知之另一種觸控面板模 5 200821798 WP9511-C201-0571 22520twf.doc/n 組的剖面不意圖。觸控面板模組2〇〇與觸控面板模組 的不同之處在於，透光電容式觸控面板22〇藉由一'整片光 學勝T 230貼附至罩體210上。然而，由於光學膠帶mo 與罩體210貼合後通常無法平整地與透光電容式觸控面板 220貼合而會殘留氣泡於光學膠帶23〇與透光電容式觸控 面板220之間，或者光學膠帶230與透光電容式觸控面板 220貼合後通常無法平整地與罩體21〇貼合而會殘留氣泡 於光學膠f 23()與罩體210之間，因此觸控面板模組2〇〇 的光學特性與產品外觀皆會受到影響。 【發明内容】 本發明提供一種觸控面板模組，其透光度較佳。 本發明提供一種觸控面板模組的製造方法，其所製造 的觸控面板模組的透光度較佳。 本發明提出一種觸控面板模組，其包括一罩體與一透 光觸控面板（transparent touch panel)。至少部分透光觸控 面板直接接合罩體。 J 在本發明之一實施例中，上述之透光觸控面板可配置 於罩體的一表面上。 在本發明之一實施例中，上述至少部分透光觸控面板 可直接嵌入（insert)罩體。上述之罩體包括一透光部與一 殼體。透光部配置於透光觸控面板上。殼體具有一凹孔 (hole)，且透光部與至少部分透光觸控面板直接嵌入凹 孔中。此外，上述透光部的材質包括聚碳酸樹脂 (polycarbonate，PC)、丙稀酸樹脂（acrylic resin)(俗 200821798 9511(201-0571 22520twf.d〇c/n 稱壓克力樹脂）或其他透明塑膠材質。 在本發明之另一實施例中，上述之罩體包括一透光部 與一设體。透光部具有一凹槽（tr〇Ugh)，且至少部分透 光觸控面板直接嵌入凹槽中。殼體具有一凹孔，且至少部 分透光部與至少部分透光觸控面板直接嵌入凹孔中。此 外，上述透光部的材質包括聚;ς炭酸樹脂、丙烯酸樹脂或其 他透明塑膠材質。 ^ ('] 在本發明之一實施例中，上述之透光觸控面板可為一 透光電谷式觸控面板。 本發明提出一種觸控面板模組的製造方法，其包括下 列步驟。首先，提供一透光觸控面板。接著，藉由射出成 型技術（injection molding technology)形成一罩體，使得 至少部分透光觸控面板直接接合罩體。 在本發明之一實施例中，上述之透光觸控面板可配置 於罩體的一表面上。 在本發明之一實施例中，上述至少部分透光觸控面板 ^ 可直接嵌入罩體。上述藉由射出成型技術形成罩體步驟包 括下列流程（process)。首先，藉由射出成型技術形成一 豉體，其中殼體具有一凹孔，且至少部分透光觸控面板直 接嵌入凹孔的一部分中。接著，藉由射出成型技術形成一 透光部於透光觸控面板上，使得透光部直接嵌入凹孔的另 一部分中。 在本發明之另一實施例中，上述藉由射出成型技術形 成罩體的步驟包括下列流程。首先，藉由射出成型技術形 7 200821798 WP9511-C201-0571 22520twf.doc/n 成-透光部於透光觸控面板上。接著，藉由射出成型技術 形成-殼體，其中殼體具有一凹孔，且部分透光部與至少 部分透光觸控面板直接嵌入凹孔中。 、林發明之又-實施例中，上述藉由射出成型技術形 成罩體的步驟包括下列流程。首先，藉由射出成型技術形 成透光邛，其中透光部具有一凹槽，且至少部分透光觸 控面板直接嵌入凹槽中。接著，藉由射出成型技術形成一 ( ' 九又體其中设體具有一凹孔，且至少部分透光部與至少部 分透光觸控面板直接嵌入凹孔中。 在本發明之一實施例中，可藉由模内裝飾（in_m〇ld decoration ’ IMD)射出成型技術而形成罩體。 由於本發明之觸控面板模組的透光觸控面板不用如 習知技術般藉由光學膠帶而貼附至罩體上，因此當使用者 使用電子裝置時，使用者可透過透光觸控面板清楚地辨明 電子裝置所顯示的資訊。換言之，本發明之觸控面板模組 的透光度較佳。此外，本發明之觸控面板模組的厚度較薄。 ϋ 另外，本發明之觸控面板模組的製造方法的良率較高且產 能較高。 為邊本發明之上述特徵和優點能更明顯易懂，下文特 舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 第一實施例 圖3Α繪示本發明第一實施例之一種電子裝置的立體 示意圖，圖3Β繪示圖3Α之電子裝置沿著線14,的剖面示 8 200821798 WP9511-C201-0571 22520twf.doc/n 意圖。請參考圖3A與圖3B，第一實施例之觸控面板模组 300。適用於一電子裝置30,電子裝置30例如為個人數位助 理器、行動電話、筆記型電腦或工業控制面板褒置。第一 實施例之觸控面板模組300包括一罩體31〇與一透光觸控 面板320。至少部分透光觸控面板320直接接合罩體31〇。 在第一實施例中，透光觸控面板320可直接嵌入罩體31〇。 由於透光觸控面板320不用如習知技術般藉由光學膠 ρ 帶130、230 (見圖1與圖2)而貼附至罩體31〇上，因此 當使用者使用電子裝置30時，使用者可透過透光觸控面板 320清楚地辨明電子裝置30所顯示的資訊。換言之，觸控 面板模組300的透光度較佳。 在第一實施例中，罩體310包括一透光部312與一殼 體314。透光部312配置於透光觸控面板320上。殼體314 具有一凹孔314a，且透光部312與至少部分透光觸控面板 320直接嵌入凹孔314a中。透光觸控面板320可部分嵌入 罩體310，或可完全埋入罩體310，端視設計者的需求而 〇 定。此外，透光部312的材質包括聚碳酸樹脂、丙烯酸樹 脂或其他透明塑膠材質。在此必須說明的是，透光觸控面 板320可以依照設計需求與殼體314之間維持一預留空間 (reserved space) S，使得電性連接於透光觸控面板320 與電子裝置30内部的其他電子元件（未繪示）之間的可撓 性電路板（flexible circuit board)(未繪示）可彎折於預 留空間S内。 圖3C繪示圖3B之透光觸控面板的局部放大示意圖。 9 200821798 WP9511-C201-0571 22520twf. doc/n 請參考圖3B與圖3C，第一實施例之透光觸控面板32〇可 為一透光電谷式觸控面板。舉例而言，透光電容式觸控面 板包括兩個透光電極線路層322與三個透光介電層324。 隶上層的透光介電層324與最下層的透光介電層324可為 厚度較薄的二氧化矽層，且中間的透光介電層324可為厚 度較厚的透光基板。當然，依照不同的設計需求，最上層 與最下層的透光介電層324可為厚度較厚的透光基板，且 (、' 中間的透光介電層324可為厚度較薄的介電材料或光學膠 (optical adhesive)，但是並未以圖面繪示。這些透光電 極線路層322與這些透光介電層324交替配置，且這些透 光電極線路層322的線路排列方向彼此垂直。當使用者按 觸罩體310之透光部312時，透光觸控面板320受按觸處 的電容產生變化，進而輸出一電性訊號。 在此必須說明的是，上述透光電容式觸控面板的構件 與外型可依照設計需求而有所改變，上述透光電容式觸控 面板是用以舉例而非限定本發明。此外，第一實施例之透 li 光觸控面板320亦非侷限於透光電容式觸控面板，第_實 施例之透光觸控面板320可依照設計需求而為其他型式的 透光觸控面板。 以下將對於第一實施例之觸控面板模組300的製造過 私作说明。圖4A至圖4C繪示本發明第一實施例之觸控面 板模組的製造方法的過程示意圖。首先，請參考圖4A，提 供一透光觸控面板320。接著，請參考圖4B至圖4C，藉 由射出成型技術形成一罩體310，使得至少部分透光觸控 10 200821798 WP9511-C201-0571 22520twf.doc/n 面板320直接接合罩體310。在弟一實施例中，至少部分 透光觸控面板320可直接嵌入罩體310。 詳言之，第一實施例中，上述藉由射出成型技術形成 罩體310的步驟包括以下流程。首先，請參考圖，透光 觸控面板320可置放於一模具]VII内，並可藉由模内裝飾 射出成型技術，注入塑料於模具Ml内而形成一殼體314。 殼體314具有一凹孔314a (見圖3B)，且至少部分透光 觸控面板320直接嵌入凹孔314a(見圖3B)的一部分中。 接著，請參考圖4C，上述透光觸控面板32〇與殼體314 的半成品可置入另一模具M2内，並可藉由模内裝飾射出 成型技術形成一透光部312於透光觸控面板320上，使得 透光部312直接嵌入凹孔314a (見圖3B)的另一部分中。 此外’第一實施例之觸控面板模組3〇〇可有另一種選 擇性的製造過程。圖5A至圖5C繪示本發明第一實施例之 觸控面板模組的另一製造方法的過程示意圖。首先，請參 考圖5A，提供一透光觸控面板32〇。接著，請參考圖5B 至圖5C，藉由射出成型技術形成一罩體，使得至少部分透 光觸控面板320可直接嵌入罩體31〇。 詳言之，第一實施例中，上述藉由射出成型技術形成 罩體310的步驟包括以下流程。首先，請參考圖5B，透光 觸控面板320可置放於一模具M1，内，並可藉由模内裝飾 射出成型技術形成一透光部312於透光觸控面板320上。 接著，請參考圖5C，上述透光觸控面板32〇與透光部312 的半成品可置人另-模具M2，内，並藉由模内裝飾射出成 11 200821798 WP9511-C201-0571 22520twf.doc/n 型技術，注入塑料於模具M2,内而形成一殼體314。殼體 314具有一凹孔31如（見圖3B)，且透光部312與至少部 分透光觸控面板320直接嵌入凹孔314a (見圖3B)中。 弟二實施例 請參考圖6，其緣示本發明第二實施例之一種觸控面 板模組的剖面示意圖。第二實施例之觸控面板模組4〇〇的 外型與第一實施例之觸控面板模組30〇的外型有所不同。 在第二實施例中，罩體410之透光部412具有一凹槽 412a’且至少部分透光觸控面板420直接喪入凹槽412a 中。此外，罩體410之殼體414具有一凹孔414a，且至少 部分透光部412與至少部分透光觸控面板420直接嵌入凹 孔414a中。 以下將對於第二實施例之觸控面板模組4〇〇的製造過 ( 程作說明。圖7A至圖7C繪示本發明第二實施例之觸控面 板模組的製造方法的過程示意圖。首先，請參考圖，提 供一透光觸控面板420。接著，請參考圖7B至圖7C，藉 (J 由射出成型技術形成一罩體410，使得至少部分透光觸控 面板420可直接嵌入罩體410。 詳言之，第二實施例中，上述藉由射出成型技術形成 罩體410的步驟包括以下流程。首先，請參考圖，可先 將透光觸控面板420置入一模具M3中，且可藉由模内裝 飾射出成型技術形成一透光部412，使得至少部分透光觸 控面板420直接嵌入透光部412之凹槽412a中。接著，請 參考圖7C’可將上述透光觸控面板420與透光部412的半 12 200821798 WP9511-C201-0571 22520twf.doc/n 成品置入另一模具M4中，並可藉由模内裝飾射出成型技 術形成一殼體414，使得至少部分透光部412與至少部分 透光觸控面板420直接嵌入殼體414的凹孔414a中。 弟二實施例 請參考圖8，其繪示本發明第三實施例之一種觸控面 板模組的剖面示意圖。第三實施例與上述實施例的主要不 同之處在於，第三實施例的觸控面板模組5〇〇的透光觸控 、 面板520可配置於罩體510的一表面516上。 必須強調的是，上述實施例的罩體31〇、410與510 的外型可依照設計需求而有所改變（例如為平板狀），據 此上述實施例只是用以舉例而非限定本發明。 綜上所述，本發明之觸控面板模組及其製造方法至少 具有以下的優點： 一、 由於本發明之觸控面板模組的透光觸控面板不用 如習知技術般藉由光學膠帶而貼附至罩體上，因此當使用 j 者使用電子裝置時，使用者可透過透光觸控面板清楚地辨 y 明電子裴置所顯示的資訊。換言之，本發明之觸控面板模 組的透光度較佳。 二、 由於本發明之觸控面板模組的透光觸控面板不用 如習知技術般藉由光學膠帶而貼附至罩體上，因此本發明 之觸控面板模組的厚度較薄。 二、由於本發明之觸控面板模組的透光觸控面板不用 如習知技術般藉由光學膠帶而貼附至罩體上，而可藉由模 内裝飾射出成型技術直接嵌入罩體，因此本發明之觸控面 13 200821798 WP9511-C201-0571 22520twf.doc/n 板模組的製造方法的良率較高且產能較高。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何所屬技術領域中具有通常知識者，在不 脫離本發明之精神和範圍内，當可作些許之更動與潤飾， 因此本發明之保護範圍當視後附之申請專利範圍所界定者 為準。 【圖式簡單說明】 (、 圖1繪示習知之一種觸控面板模組的剖面示意圖。 圖2繪示習知之另一種觸控面板模組的剖面示意圖。 圖3A緣示本發明第一實施例之一種電子裝置的立體 示意圖。 圖3B繪不圖3A之電子裝置沿著線，的剖面示意圖。 圖3C繪示圖3B之透光觸控面板的局部放大示意圖。 圖4A至圖4C繪示本發明第一實施例之觸控面板模組 的製造方法的過程示意圖。 圖5A至圖5C繪示本發明第一實施例之觸控面板模組 ϋ 的另〆製造方法的過程示意圖。 圖6繪示本發明第二實施例之一種觸控面板模組的剖 面示意圖。 圖7Α至圖7C繪示本發明第二實施例之觸控面板模組 的製造方法的過程示意圖。 圖8繪不本發明第三實施例之一種觸控面板模組的剖 面示意圖。 【主要元件符號說明】 14 200821798 WP9511-C201-0571 22520twf.doc/n 30 :電子裝置 100、200、300、400、500 :觸控面板模組 110、210、310、410、510 :罩體 112、312、412 :透光部 114、314、414 :殼體 120、220 :透光電容式觸控面板 130、230 :光學膠帶 314a、414a :凹孔 P 320、420、520 :透光觸控面板 322 :透光電極線路層 324 :透光介電層 412a :凹槽 516 :表面 G :間隔 ΜΙ、ΜΓ、M2、M2’、M3、M4 :模具 S :預留空間200821798 WP9511-C201-0571 22520twf.doc/n Nine, the invention description: [Technical field of the invention] β The present invention relates to a panel module and a manufacturing method thereof, and relates to a touch panel module and Its manufacturing method. [Prior Art] In the current information age, human dependence on electronic products has increased. Notebook computers, mobile phones, personal digital assistants (Qing (10) ^ 〆, Shan ^ 1 coffee (four) price 'PDA), digital Walkman and other electronic products have become 1, indispensable applications in life and work tool. Each of the above electronic products has a human machine interface for inputting instructions required by the user so that the internal system of the electronic product automatically executes the command. The most widely used human interface devices include keyboards, keyboards, and touch panels. Please refer to FIG. 1 , which illustrates a cross section of a conventional touch panel module. The touch panel module 1 includes a cover 110 and a transparent capacitive touch panel ( Transparent capacitive touch panel) I, 12 inch and an optically clear adhesive (OCA) 130. The light 130 surrounds one of the trasparent parts 112' and is located on a housing 114 of the housing 110. In addition, the light-transmitting capacitive touch panel 12 is attached to the cover u 〇 by an optical tape 13 。. However, since there is an air gap G between the light transmitting portion H2 and the transparent capacitive touch panel 12A, the overall transmittance of the conventional touch panel module may be lost. . In order to improve the above disadvantages, another touch panel module 200 of the prior art has been proposed. Please refer to FIG. 2 , which illustrates a cross-sectional view of another conventional touch panel module 5 200821798 WP9511-C201-0571 22520twf.doc/n group. The touch panel module 2 is different from the touch panel module in that the light-transmissive capacitive touch panel 22 is attached to the cover 210 by a 'one-piece optical win T 230. However, since the optical tape mo is generally not bonded to the transparent capacitive touch panel 220 after being attached to the cover 210, air bubbles may remain between the optical tape 23A and the transparent capacitive touch panel 220, or After the optical tape 230 is bonded to the transparent capacitive touch panel 220, it is generally not able to fit smoothly with the cover 21 而 and residual air bubbles between the optical adhesive f 23 ( ) and the cover 210 , so the touch panel module Both the optical properties of the 2 与 and the appearance of the product are affected. SUMMARY OF THE INVENTION The present invention provides a touch panel module that has better light transmittance. The invention provides a method for manufacturing a touch panel module, which has better transmittance of the touch panel module. The present invention provides a touch panel module including a cover and a transparent touch panel. At least a portion of the light transmissive touch panel directly engages the cover. In an embodiment of the invention, the transparent touch panel may be disposed on a surface of the cover. In an embodiment of the invention, the at least partially transparent touch panel can be directly inserted into the cover. The cover body includes a light transmitting portion and a casing. The light transmitting portion is disposed on the light transmissive touch panel. The housing has a hole, and the light transmitting portion and the at least partially transparent touch panel are directly embedded in the recess. In addition, the material of the light transmitting portion includes polycarbonate (PC), acrylic resin (customer 200821798 9511 (201-0571 22520twf.d〇c/n called acrylic resin) or other transparent In another embodiment of the present invention, the cover body includes a light transmitting portion and a body. The light transmitting portion has a groove (tr〇Ugh), and at least a portion of the light transmissive touch panel is directly embedded. In the recess, the housing has a recessed hole, and at least a portion of the light transmissive portion and the at least partially transparent touch panel are directly embedded in the recessed hole. Further, the material of the transparent portion includes poly; carbonic acid resin, acrylic resin or the like. The transparent plastic material is provided. ^ ('] In one embodiment of the present invention, the transparent touch panel can be a light-transmitting electric valley touch panel. The present invention provides a method for manufacturing a touch panel module, which includes The following steps are provided. Firstly, a transparent touch panel is provided. Then, a cover is formed by injection molding technology, so that at least partially transparent touch panel directly engages the cover. The transparent touch panel can be disposed on a surface of the cover. In an embodiment of the invention, the at least partially transparent touch panel can be directly embedded in the cover. The above is formed by injection molding technology. The cover step includes the following process. First, a body is formed by injection molding technology, wherein the housing has a recessed hole, and at least a portion of the transparent touch panel is directly embedded in a portion of the recessed hole. The injection molding technique forms a light transmitting portion on the light transmissive touch panel such that the light transmitting portion directly fits into another portion of the recessed hole. In another embodiment of the present invention, the step of forming the cover by the injection molding technique The following process is included. First, a light-transmissive portion is formed on the light-transmitting touch panel by injection molding technology. Then, a housing is formed by injection molding technology, wherein The housing has a recessed hole, and the partially transparent portion and the at least partially transparent touch panel are directly embedded in the recessed hole. In the embodiment of the invention, in the embodiment, the cover is formed by the injection molding technique. The steps include the following processes: First, a light-transmissive crucible is formed by an injection molding technique, wherein the light-transmitting portion has a groove, and at least a portion of the light-transmitting touch panel is directly embedded in the groove. Then, an injection molding technique is used to form a ( ' The nine-body body has a recessed hole, and at least a portion of the light transmitting portion and the at least partially transparent touch panel are directly embedded in the recessed hole. In an embodiment of the present invention, the in-mold decoration (in_m) 〇ld decoration ' IMD) injection molding technology to form a cover. Since the transparent touch panel of the touch panel module of the present invention is not attached to the cover by optical tape as in the prior art, when used When an electronic device is used, the user can clearly distinguish the information displayed by the electronic device through the transparent touch panel. In other words, the touch panel module of the present invention has better light transmittance. In addition, the touch panel module of the present invention has a thin thickness. Further, the manufacturing method of the touch panel module of the present invention has a high yield and a high productivity. The above described features and advantages of the present invention will become more apparent from the following description. [Embodiment] FIG. 3 is a perspective view showing an electronic device according to a first embodiment of the present invention, and FIG. 3 is a cross-sectional view showing the electronic device of FIG. 3 along line 14. 8 200821798 WP9511-C201-0571 22520twf.doc/n Intent. Referring to FIG. 3A and FIG. 3B, the touch panel module 300 of the first embodiment. Applicable to an electronic device 30, such as a personal digital assistant, a mobile phone, a notebook computer, or an industrial control panel device. The touch panel module 300 of the first embodiment includes a cover 31 and a transparent touch panel 320. At least a portion of the light transmissive touch panel 320 directly engages the cover 31〇. In the first embodiment, the transparent touch panel 320 can be directly embedded in the cover 31 〇. Since the transparent touch panel 320 is not attached to the cover 31 by the optical adhesive tapes 130, 230 (see FIGS. 1 and 2) as in the prior art, when the user uses the electronic device 30, The information displayed by the electronic device 30 can be clearly identified by the user through the transparent touch panel 320. In other words, the transmittance of the touch panel module 300 is better. In the first embodiment, the cover 310 includes a light transmitting portion 312 and a casing 314. The light transmitting portion 312 is disposed on the transparent touch panel 320 . The housing 314 has a recessed hole 314a, and the light transmitting portion 312 and the at least partially transparent touch panel 320 are directly embedded in the recessed hole 314a. The transparent touch panel 320 can be partially embedded in the cover 310, or can be completely embedded in the cover 310, depending on the designer's needs. In addition, the material of the light transmitting portion 312 includes polycarbonate resin, acrylic resin or other transparent plastic material. It should be noted that the transparent touch panel 320 can maintain a reserved space S between the housing 314 and the housing 314 so as to be electrically connected to the transparent touch panel 320 and the electronic device 30. A flexible circuit board (not shown) between other electronic components (not shown) can be bent into the reserved space S. FIG. 3C is a partially enlarged schematic view of the transparent touch panel of FIG. 3B. 9200821798 WP9511-C201-0571 22520twf. doc/n Referring to FIG. 3B and FIG. 3C, the transparent touch panel 32A of the first embodiment may be a light-transmitting electric valley touch panel. For example, the light transmissive capacitive touch panel includes two light transmissive electrode line layers 322 and three light transmissive dielectric layers 324. The transparent dielectric layer 324 and the lowermost transparent dielectric layer 324 of the upper layer may be a thin layer of germanium dioxide, and the transparent dielectric layer 324 may be a thick transparent substrate. Of course, according to different design requirements, the uppermost and lowermost transparent dielectric layers 324 may be thicker transparent substrates, and (the intermediate transparent dielectric layer 324 may be a thinner dielectric) A material or an optical adhesive, but not shown in the drawings. These transparent electrode wiring layers 322 are alternately arranged with the transparent dielectric layers 324, and the lines of the transparent electrode wiring layers 322 are arranged perpendicular to each other. When the user presses the light transmitting portion 312 of the touch cover 310, the transparent touch panel 320 is changed by the capacitance of the touch, thereby outputting an electrical signal. The components and the appearance of the touch panel may be changed according to the design requirements. The transparent capacitive touch panel is used to exemplify the invention, but the transparent touch panel 320 of the first embodiment is also used. The light-transmissive touch panel 320 of the first embodiment can be other types of transparent touch panels according to design requirements. The touch panel module of the first embodiment will be described below. 300 manufacturing has been said to be private 4A to 4C are schematic diagrams showing the process of manufacturing the touch panel module according to the first embodiment of the present invention. First, referring to FIG. 4A, a transparent touch panel 320 is provided. Next, please refer to FIG. 4B. 4C, a cover 310 is formed by injection molding technology, so that at least a portion of the transparent touch 10 200821798 WP9511-C201-0571 22520twf.doc/n panel 320 directly engages the cover 310. In an embodiment, at least The light-transmissive touch panel 320 can be directly embedded in the cover 310. In detail, in the first embodiment, the step of forming the cover 310 by the injection molding technique includes the following process. First, please refer to the figure, the transparent touch The panel 320 can be placed in a mold VII, and can be injected into the mold M1 by an in-mold decorative injection molding technique to form a casing 314. The casing 314 has a recessed hole 314a (see Fig. 3B). The at least partially transparent touch panel 320 is directly embedded in a portion of the recess 314a (see FIG. 3B). Next, referring to FIG. 4C, the semi-finished product of the transparent touch panel 32 and the housing 314 can be placed in another mold. Inside M2, it can be shot by in-mold decoration The technology forms a light transmitting portion 312 on the transparent touch panel 320 such that the light transmitting portion 312 is directly embedded in another portion of the recessed hole 314a (see FIG. 3B). Further, the touch panel module 3 of the first embodiment There is another alternative manufacturing process. Fig. 5A to Fig. 5C are schematic diagrams showing the process of another manufacturing method of the touch panel module according to the first embodiment of the present invention. First, please refer to Fig. 5A to provide a light transmission. The touch panel 32. Next, referring to FIG. 5B to FIG. 5C, a cover is formed by the injection molding technique, so that at least a portion of the transparent touch panel 320 can be directly embedded in the cover 31. In detail, in the first embodiment, the above-described step of forming the cover 310 by the injection molding technique includes the following flow. First, referring to FIG. 5B, the transparent touch panel 320 can be placed in a mold M1, and a light transmitting portion 312 can be formed on the transparent touch panel 320 by in-mold decoration molding technology. Next, referring to FIG. 5C, the semi-finished product of the transparent touch panel 32 and the transparent portion 312 can be placed in the mold M2, and is injected into the mold by the in-mold decoration. 11 200821798 WP9511-C201-0571 22520twf.doc The /n type technique injects plastic into the mold M2 to form a casing 314. The housing 314 has a recess 31 (see Fig. 3B), and the light transmitting portion 312 and the at least partially transparent touch panel 320 are directly embedded in the recess 314a (see Fig. 3B). Second Embodiment Referring to Figure 6, there is shown a cross-sectional view of a touch panel module according to a second embodiment of the present invention. The appearance of the touch panel module 4A of the second embodiment is different from that of the touch panel module 30A of the first embodiment. In the second embodiment, the light transmitting portion 412 of the cover 410 has a recess 412a' and the at least partially transparent touch panel 420 directly enters the recess 412a. In addition, the housing 414 of the cover 410 has a recess 414a, and at least a portion of the light transmitting portion 412 and the at least partially transparent touch panel 420 are directly embedded in the recess 414a. The following is a description of the manufacturing process of the touch panel module 4 of the second embodiment. FIG. 7A to FIG. 7C are schematic diagrams showing the process of manufacturing the touch panel module according to the second embodiment of the present invention. First, please refer to the figure to provide a transparent touch panel 420. Next, please refer to FIG. 7B to FIG. 7C, by forming a cover 410 by injection molding technology, so that at least partially transparent touch panel 420 can be directly embedded. The cover 410. In detail, in the second embodiment, the step of forming the cover 410 by the injection molding technique includes the following process. First, referring to the figure, the transparent touch panel 420 can be first placed into a mold M3. The light transmitting portion 412 can be formed by the in-mold decorative injection molding technology, so that at least the partially transparent touch panel 420 is directly embedded in the recess 412a of the light transmitting portion 412. Next, please refer to FIG. 7C' The light transmissive touch panel 420 and the half of the light transmitting portion 412 are inserted into another mold M4, and a casing 414 can be formed by in-mold decorative injection molding technology. Making at least part of the light transmitting portion 412 and at least a portion The light-transmissive touch panel 420 is directly embedded in the recessed hole 414a of the housing 414. Second Embodiment Referring to Figure 8, a cross-sectional view of a touch panel module according to a third embodiment of the present invention is shown. The main difference between the embodiment and the embodiment is that the transparent touch panel of the touch panel module 5 of the third embodiment can be disposed on a surface 516 of the cover 510. It must be emphasized that The shapes of the covers 31, 410 and 510 of the above embodiments may be changed according to design requirements (for example, in the form of a flat plate), and the above embodiments are merely by way of example and not limitation of the invention. The touch panel module and the manufacturing method thereof have at least the following advantages: 1. The transparent touch panel of the touch panel module of the present invention is not attached to the cover by optical tape as in the prior art. In fact, when using the electronic device, the user can clearly distinguish the information displayed by the electronic device through the transparent touch panel. In other words, the transmittance of the touch panel module of the present invention is relatively better. Good. Second, because of this The transparent touch panel of the touch panel module of the present invention is not attached to the cover by optical tape as in the prior art, so the thickness of the touch panel module of the present invention is thin. The transparent touch panel of the touch panel module is not attached to the cover by optical tape as in the prior art, and can be directly embedded into the cover by the in-mold decorative injection molding technique, so the touch of the present invention Surface 13 200821798 WP9511-C201-0571 22520twf.doc/n The manufacturing method of the board module has a high yield and a high productivity. Although the invention has been disclosed above in the preferred embodiments, it is not intended to limit the invention. The scope of the present invention is defined by the scope of the appended claims, unless otherwise claimed. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a conventional touch panel module. FIG. 2 is a cross-sectional view showing another touch panel module of the prior art. FIG. 3A shows a first embodiment of the present invention. 3B is a schematic cross-sectional view of the electronic device along the line of FIG. 3B. FIG. 3C is a partially enlarged schematic view of the transparent touch panel of FIG. 3B. FIG. 4A to FIG. FIG. 5A to FIG. 5C are schematic diagrams showing the process of another method for manufacturing the touch panel module of the first embodiment of the present invention. FIG. FIG. 7 is a schematic cross-sectional view showing a method of manufacturing a touch panel module according to a second embodiment of the present invention. FIG. A schematic cross-sectional view of a touch panel module according to a third embodiment of the invention. [Description of main components] 14 200821798 WP9511-C201-0571 22520twf.doc/n 30: electronic devices 100, 200, 300, 400, 500: touch Panel module 110 210, 310, 410, 510: cover 112, 312, 412: light transmitting portions 114, 314, 414: housings 120, 220: light-transmitting capacitive touch panels 130, 230: optical tapes 314a, 414a: concave Holes P 320, 420, 520: light-transmitting touch panel 322: light-transmitting electrode wiring layer 324: light-transmitting dielectric layer 412a: groove 516: surface G: spacing ΜΙ, ΜΓ, M2, M2', M3, M4: Mold S: reserved space
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