200821352 九、發明說明： 【發明所屬之技術領域】 本發明係關於黏著薄膜，特別的是可應用於半導體的封裝 過程之黏著薄膜。 【先前技術】 近年來將黏著薄膜應用於半導體製造與封裝的技術愈來 愈受人注意。舉例來說，黏著薄膜可作為切割薄膜（dicing 的 4为’该切割薄膜在半導體晶片（semiconductor chip)製作 過程中固疋半導體晶圓（semic〇n(juct〇r wafer)以利切割。將黏 著薄膜應用在半導體封裝最典型的過程為，將切割薄膜輾壓於 半導體晶圓上，接著進入晶圓切割。晶圓切割過程是將半導體 曰曰圓切成單獨的半導體元件（semicon(juct〇r devices)，也就是晶 片（chip)。切割過程之後接著進行擴展過程（expanding process)、挑選過程(pick Up process)與黏晶（die attaching)等過 程。 黏著薄膜於半導體製造上的應用可延伸作為切割黏著晶 粒薄膜（dicing die bonding film)的一部份，該切割黏著晶粒薄 膜為一種包含切副與晶粒黏者功能（也就是黏晶（die attach))的 結合薄膜（integrated film)。然而，這樣的過程，必須確保輾壓 於黏著層的晶粒能完全被取出，像是從感壓黏著層（pressure sensitive adhesive layer )上移除。因此，為了將晶粒從感壓黏 著層移除，晶粒與黏著層必須非常緊密。進一步而言，用於黏 著晶粒薄膜的黏著薄膜必須更為可靠，例如：增加黏著薄膜之 6 200821352 Ί几張強度（tensile strength)。 【發明内容】 本發明係相關於半導體封裝過程中黏著薄膜之成份，其與 用於半導體封裝所用之切割黏著晶粒薄膜相關，並可克服目前 相關技術中的限制與缺點。 本發明的特點在於半導體封裝過程中，可提供一黏著薄 膜，其可應用於黏著晶粒薄膜，使其展現較強的抗張強度。 本發明的另一特點在於半導體封裝過程中，提供一黏著薄 膜，其可應用於黏著晶粒薄膜，其對半導體晶粒具良好黏著 性，並且可從緊鄰的黏著層中有效分離。 上述之特點可藉由以下所述所組成的黏著薄膜來達成，該 黏著薄膜之成分包含具一個以上之羥基、羧基或環氧基的彈性 树脂、具攝氏負十度到正兩百度玻璃轉移溫度的薄膜形成樹 脂、環氧樹脂、酚類固化劑、固態催化劑、固化前添加劑、石夕 烧偶合劑和填充物。 此黏著薄膜也需要一些有機溶劑。彈性樹脂佔整個組成份 總重量的重量百分比5到75、薄膜形成樹脂佔1〇到6〇、環氧 樹脂佔10到60、酚類固化劑佔5到3〇、固態催化劑佔〇 〇1 到5、固化前添加劑佔〇 〇1到3〇、矽烷偶合劑佔〇 〇1到ι〇、 以及填充物佔0.1到60。 彈性樹脂的平均分子量約莫500到5,000,000道爾吞 (m〇lecular)。薄膜形成樹脂可包含一個以上的酚類樹脂（phenol resin)或苯氧基樹脂（pheneoxy resin)，也可具有一個以上的經 7 200821352 基、環氧基、一個苯氧基(phenoxy group)或一個烧基（alkyl group)，其平均分子量約莫200到3〇〇,〇〇〇道爾吞。環氧樹脂 (epoxy resin)可包含一個以上的雙酚環氧樹脂（bisphen〇1 epoxy resin)、紛駿環氧樹脂(phenol novolac epoxy resin)、鄰甲紛· 環氧樹脂（ortho-cresol novolac epoxy resin)、多功能環氧樹脂（a mult卜functional epoxy resin)、胺環氧樹脂（amine epoxy resin)、雜J哀環氧樹脂（heterocyclic epoxy resin)、被替代的環 氧樹脂（substituted epoxy resin)或者萘酚環氧樹脂（naphthol epoxy resin)。酚類固化劑包含一個以上的酚醛樹脂（phenol novolac resin)、酚醚樹脂（xylok resin)、丙二酚醛樹脂（bisphenol A novolac resin)、甲紛酸樹脂（cresol novolac resin)。固態催化 劑包含一個以上的三聚氰胺類型催化劑（melamine-type catalyst)，味嗤類型催化劑（imidazole-type catalyst)或者三苯 膦類型催化劑（triphenylphosphine-type catalyst) 〇 固化前添加劑包含一異氰酸酯（isocyanate)。該固化前添加 劑包含一或多個下面所述之異氰酸酯：4, 4’-二苯基曱烷二異 氫酸酯（4 A-diphenylmethane diisocyanate)、三氯乙烯二異氫酸 酯（trilene diisocyanate)、二甲苯二異氫酸酯（xylene diisocyanate)、4，4’-二苯醚二異氫酸醋（4,4’-diphenylether diisocyanate)、4,4’-[2,2-雙（4-苯氧基苯基丙酮）二異氫酸 酉旨]{4,4f-[2,2-bis(4-phenoxyphenylpiOpane)] diisocyanate}、六 亞甲基二異氰酸酯（hexamethylene diisocyanate)、4,4’-二環己 基甲：):完二異氰酸醋（4,4’-dicyclohexylmethane diisocyanate)、 2,4’-二環己基曱烧二異氰酸酯aUicyclohexylmethane 8 200821352 diisocyanate)、2,2,4-三甲基六亞曱基二異氰酸酯 (2,2,4-trimethyl-hexamethylene diisocyanate)、二異氰酸異佛爾 酮（isophorone diisocyanate)、離胺酸二異氰酸酯（lysine diisocyanate)、環己基甲烧二異氰酸酯（cyclohexylmethane diisocyanate)、1，6-六亞曱基二異氰酸酯（1,6-hexamethylene diisocyanate)、由二異氰酸酯或三異氰酸酯與多元醇（p〇ly〇l) 反應後的產物。200821352 IX. Description of the Invention: [Technical Field] The present invention relates to an adhesive film, particularly an adhesive film which can be applied to a semiconductor packaging process. [Prior Art] In recent years, the technique of applying an adhesive film to semiconductor manufacturing and packaging has been attracting more and more attention. For example, the adhesive film can be used as a dicing film (the dicing 4 is 'the dicing film is solidified on a semiconductor wafer (sect〇r wafer) during the fabrication process of the semiconductor chip to facilitate cutting. The most typical process for film packaging in semiconductor packaging is to roll the dicing film onto the semiconductor wafer and then into the wafer. The wafer dicing process is to diced the semiconductor dies into individual semiconductor components (semicon(juct〇r Devices), which is a chip. The cutting process is followed by an expansion process, a pick up process, and a die attaching process. The application of the adhesive film to semiconductor fabrication can be extended as Cutting a portion of a dicing die bonding film which is an integrated film comprising a die-cutting and die-bonding function (ie, die attach) However, such a process must ensure that the grains that are pressed against the adhesive layer can be completely removed, as from the pressure sens The itive adhesive layer is removed. Therefore, in order to remove the die from the pressure-sensitive adhesive layer, the die and the adhesive layer must be very tight. Further, the adhesive film for adhering the die film must be more reliable, for example, Adding adhesive film 6 200821352 tens several tensile strength. [Invention] The present invention relates to a component of an adhesive film in a semiconductor packaging process, which is related to a die-bonded grain film used for semiconductor packaging, and The limitations and disadvantages of the related art can be overcome. The invention is characterized in that an adhesive film can be provided in the semiconductor packaging process, which can be applied to the adhesive grain film to exhibit strong tensile strength. One feature is that in the semiconductor packaging process, an adhesive film is provided, which can be applied to an adhesive grain film, which has good adhesion to semiconductor grains and can be effectively separated from the adjacent adhesive layer. The above characteristics can be obtained by the following The adhesive film is composed, and the component of the adhesive film comprises more than one hydroxyl group, carboxyl group or An epoxy resin, an epoxy resin, a film forming resin having a Celsius minus ten degrees to a positive two Baidu glass transfer temperature, an epoxy resin, a phenolic curing agent, a solid catalyst, a pre-curing additive, a Shixi burning coupler, and a filler. The adhesive film also requires some organic solvent. The elastic resin accounts for 5 to 75% by weight of the total composition, the film-forming resin accounts for 1 to 6 inches, the epoxy resin accounts for 10 to 60, and the phenolic curing agent accounts for 5 to 3 inches. The solid catalyst accounts for 〇〇1 to 5, the additive accounts for 到1 to 3 固化 before curing, the decane coupling agent accounts for 〇〇1 to ι〇, and the filler accounts for 0.1 to 60. The elastic resin has an average molecular weight of about 500 to 5,000,000 dox. The film-forming resin may comprise more than one phenol resin or pheneoxy resin, or may have more than one of the 7200821352 groups, an epoxy group, a phenoxy group or a An alkyl group having an average molecular weight of about 200 to 3 angstroms. Epoxy resin may contain more than one bisphen 〇 1 epoxy resin, phenol novolac epoxy resin, ortho-cresol novolac epoxy Resin, a mult functional epoxy resin, amine epoxy resin, heterocyclic epoxy resin, substituted epoxy resin Or naphthol epoxy resin. The phenolic curing agent contains one or more phenol novolac resins, phenol ether resins, bisphenol A novolac resins, and cresol novolac resins. The solid catalyst comprises more than one melamine-type catalyst, an imidazole-type catalyst or a triphenylphosphine-type catalyst. The pre-curing additive comprises an isocyanate. The pre-curing additive comprises one or more of the isocyanates described below: 4,4'-diphenylmethane diisocyanate, trilene diisocyanate , xylene diisocyanate, 4,4'-diphenylether diisocyanate, 4,4'-[2,2-bis(4- Phenoxyphenylacetone)dihydroxo acid]{4,4f-[2,2-bis(4-phenoxyphenylpiOpane)]diisocyanate}, hexamethylene diisocyanate, 4,4'- Dicyclohexylcarbamate:): 4,4'-dicyclohexylmethane diisocyanate, 2,4'-dicyclohexylsulfonium diisocyanate aUicyclohexylmethane 8 200821352 diisocyanate), 2,2,4-trimethyl Cyclosyl dimethicone Diisocyanate), 1,6-hexamethylene diisocyanate (1,6-hexamethy Lene diisocyanate), a product obtained by reacting a diisocyanate or a triisocyanate with a polyol (p〇ly〇l).
固化前添加劑可含胺（amine)。該固化前添加劑包含一個 以上下面所述之胺類：二乙稀三胺（diethylene triamine)、三乙 稀四胺（triethylene tetramine)、二乙基胺基丙基胺 (diethylaminopropylamme)、孟浠二胺（menthane diamine)、N-胺乙基對二氮己環(N-aminoethyl piperazine)、間二甲苯二胺 (m-xylene diamine)、或異佛爾酮雙胺（isophorone diamine)。 石夕烧偶合劑包含一個以上的含胺石圭烧（amine-containing silane)、含環氧基石圭烧(epoxy-containing silane)或含硫醇基石查 烷(mercapto-containing silane)。而填充物為球狀或非固定形狀 之無機填充物質，成分為金屬或無金屬物質，大小約莫5奈米 (nm)到 20 微米（μηι)。 黏著層可進一步包含離子淨化劑（ion scavenger)，而此離 子淨化劑包含一個以上的三嗪硫醇化合物（triazine-thiol compound)、錯化合物（zirconium compound)、録麵化合物 (antimony-bismuth compound)或鎮銘化合物（magnesium-aluminum compound) 。 離子淨 化劑佔 總成份 的重量 百分比 〇· 1 到5 〇 9 200821352 本發明之特點與優點可藉提供一切割黏著晶粒薄膜而實 ^見此切副黏著晶粒薄膜包含基膜(base film)、第一層感壓黏 ，，黏著薄膜，第一層感壓黏著層位於基層與黏著層間。黏 二厚：其成份為包含一個以上之祕、絲或環氧基的彈性樹 月攝氏負十度到正兩百度玻璃轉移溫度的薄膜形成樹脂， 衩乳樹脂’酚類固化劑，固化催化劑，固化前添加劑，矽烷偶 合劑和填充物。The pre-curing additive may contain an amine. The pre-curing additive comprises more than one of the amines described below: diethylene triamine, triethylene tetramine, diethylaminopropylamme, montmorillonide (menthane diamine), N-aminoethyl piperazine, m-xylene diamine, or isophorone diamine. The Shixia coupling agent contains more than one amine-containing silane, epoxy-containing silane or mercapto-containing silane. The filler is a spherical or non-fixed shape inorganic filler, and the composition is metal or metal-free, and the size is about 5 nanometers (nm) to 20 micrometers (μηι). The adhesive layer may further comprise an ion scavenger comprising more than one triazine-thiol compound, zirconium compound, and antimony-bismuth compound. Or a magnesium-aluminum compound. The weight percentage of the ion scavenger to the total composition 〇·1 to 5 〇9 200821352 The features and advantages of the present invention can be achieved by providing a cut adhesive grain film and seeing that the cut adhesive film comprises a base film. The first layer is pressure-sensitive, and the film is adhered. The first layer of pressure-sensitive adhesive layer is located between the base layer and the adhesive layer. Viscous two-thickness: its composition is a film-forming resin containing more than one secret, silk or epoxy-based elastic tree, a tenth degree Celsius to a positive two-dimensional glass transfer temperature, a bismuth resin, a phenolic curing agent, a curing catalyst, Pre-curing additives, decane coupling agents and fillers.
本發明之特點與優點可運用於半導體封裝，包含半導體元 件、黏著薄膜、基板，黏著薄膜位於半導體it件與基板之間。 黏㈣膜其成份為包含—個以上之經基、㈣或環氧基的彈性 =月曰具攝氏負十度到正兩百度玻璃轉移溫度的薄膜形成樹 脂，環氧樹脂，紛類固化劑，固化催化劑，固化前添加劑，石夕 烧偶合劑和填充物。 …本考X月之特點與優點可提供一半導體元件包裝之方法，包 各將㈣黏者晶粒薄膜黏附至半導體晶圓上，當半導體晶圓黏 附切:j黏，晶粒薄膜黏時，切割半導體晶圓而分開半導體元 件，當黏著_從切割黏著晶粒薄膜分開時，則半導體元件即 ”切剔黏者0日粒薄膜分開。此時黏著薄膜仍與半導體元件接 觸而半‘體7L件接觸基板，則黏著薄膜位於半導體元件與基 片I 著薄膜其成份為包含-個以上之經基、魏基或環 氧基的彈11¼¾、具攝氏負十度到正兩百度玻璃轉移溫度的薄 膜形成樹脂、環氧樹脂、_固化劑、固化催化劑、固化前添 加劑、矽烷偶合劑和填充物。 【實施方式】 200821352 實施例可藉由之後的簡圖詳細敘述，然而它們可經由不同 的形式展現且不侷限於此。經這些實施例可完全充分地表達本 务明，並可k供相關技術完整的發明範圍。 圖中’關於薄膜層的尺寸與範圍，在圖解中為了清楚地解 釋而有些誇大。但可因此瞭解薄膜層與原料如何在另一薄膜層 或基板上，是在薄膜層、基板上或是賴層之間n; 瞭解其中—個薄膜層在另-薄膜層之下，是直接的或是衫個 薄膜層之間.。此外，也可解釋薄膜層如何存在兩個薄膜層之 =是膜一元層素或是多層在其間，從頭到尾利用數字相對應㈣用 於此所表示之「至少_」、「一個以上」、 者」開放的做為連接和分— /r ^ 和。」、「至少-個A:二表 C」、「一個以上的、或c」」、、「一個以MAW和 包含以下的涵義：單獨A、單獨B:單獨c、：亚且’或者。」 跟C、含B跟C、ABC三個都—:A跟二含A 無限制，除非這些組合明確地以 7而吕，這些表示並 以「至少-個和c」作為:括」一，限制。例如： 分，且η大於3。而「人…不’其意思為具有η個成 則完全不同。 。ABC中至少挑選一個」的意義 在此所用的「或」（〇 3「 何-個」(either)這個連接詞做的或」’除非用「任 含單獨Λ、單獨3、單 列如·「A或β或c」包The features and advantages of the present invention can be applied to a semiconductor package comprising a semiconductor component, an adhesive film, a substrate, and an adhesive film between the semiconductor member and the substrate. The composition of the adhesive (four) film is a film-forming resin containing a plurality of warp groups, (four) or epoxy groups, and a film forming resin, epoxy resin, and a plurality of curing agents. Curing catalyst, pre-curing additive, Shixi burning coupler and filler. ...The characteristics and advantages of this test X month can provide a method of packaging semiconductor components, each of which will adhere the (4) adhesive film to the semiconductor wafer. When the semiconductor wafer is adhered and cut, the die is sticky. The semiconductor wafer is diced to separate the semiconductor components. When the adhesion _ is separated from the dicing die film, the semiconductor component is separated from the dicing film. At this time, the adhesive film is still in contact with the semiconductor component and the half body 7L When the substrate is in contact with the substrate, the adhesive film is located on the semiconductor element and the substrate I. The film has a composition of more than one warp group, Wei-based or epoxy-based bomb 111⁄43⁄4, with a Celsius minus ten degrees to a positive two Baidu glass transition temperature. Film forming resin, epoxy resin, curing agent, curing catalyst, pre-curing additive, decane coupling agent and filler. [Embodiment] 200821352 Embodiments can be described in detail by the following schematic, however they can be in different forms. The present invention is fully and fully described by these embodiments, and can be used for the complete scope of the related art. The size and scope are somewhat exaggerated in the illustration for clarity of explanation, but it is therefore understood how the film layer and the material are on another film layer or substrate, either on the film layer, on the substrate or between the layers; One of the film layers is under the other film layer, either directly or between the film layers. In addition, it can also explain how the film layer exists in two film layers = is a film monolayer or a multilayer In the meantime, the numbers are used from beginning to end (4) for the "at least _", "one or more", and "open" as the connection and the sub-/r ^ and . "At least - A: two tables C", "one or more, or c", "one with MAW and the following meanings: separate A, individual B: separate c,: sub and 'or." With C, including B and C, ABC three -: A and two with A without restrictions, unless these combinations are clearly 7, these are expressed as "at least - and c" as: . For example: minute, and η is greater than 3. And "people...no" means that there are η rules that are completely different. The meaning of at least one in ABC is used here as "or" (〇3 "何-" (either) or the connection word is made or "Unless "use a separate package, separate 3, single column such as "A or β or c" package
三個都有，若表達成「任何_個^、Α跟C、Β跟C、ABC 或B或C」則包含單獨A、 11 200821352 單獨B、單獨C但不包括A跟B、A跟C、B跟C、ABC三個 都有。 圖1A與IB利用一個實施例解釋半導體元件封裝範例方 法的各個階段，在此半導體晶圓會被切割，而單獨的半導體元 件，即晶粒，則利用切割黏著晶粒薄膜黏著在基板上。 參照圖1A與1B，半導體晶圓100上可封裝數層元件， 像是記憶體裝置（memory devices)、微處理器（microprocessors) 等。爲了封裝這些元件，將半導體晶圓100沿著所劃之線分割 成數個晶粒100a。而此切割過程包含將切割黏著晶粒薄膜101 輾壓至整個未切割的晶圓100上，此切割黏著晶粒薄膜包含切 割薄膜125與介質黏著層（11^〇1[^(^16 3(11168卜6 1&}^)105。切 割黏著晶粒薄膜101上的黏著層105可利用說明書中有關黏著 薄膜的成份製成。 切割薄膜125包含了感壓黏著層（PSA layer)115和基膜 120。感壓黏著層115可以是一非固化薄膜（n〇n_curing fiim)或 紫外線固化薄膜(UV-curing film)。基膜120可以是氯乙烯薄膜 (vmylchloride film)像是聚氯乙烯（pvc)或聚烯烴 (polyolefin)。在實作上，切割薄膜ι25可藉由輾壓感壓黏著層 115與基膜120而製成。 切割黏著薄膜101可藉由黏著薄膜1〇5與半導體晶圓1〇〇 接觸’而感壓黏著層115與黏著薄膜1 〇5接合。 以上所述’晶圓封裝需藉由尚未切割的晶圓1〇〇結合切割 黏著晶粒薄膜101而完成，而切割黏著晶粒薄膜1〇1中所包含 的黏著薄膜105成份則依照此說明書所製。 12 200821352 切割的過程中會將晶圓100分離成數個晶粒100a，而黏 著層105分離成數個相對應於100a的105a，在此將切割後的 切割黏著晶粒薄膜101’上的黏著層標示為105a。同樣的，切 割薄膜125被分割成數個125’，而其所包含的感壓黏著層115 與基膜120分割成數個115a與120a，切割的過程結束後，晶 圓100/晶粒100a分別附著在切割黏著晶粒薄膜101/101’上。 根據圖1B，單獨的晶粒100a要從切割黏著晶粒薄膜101’ 移除。此過程可暴露於紫外光的照射，紫外光可將感壓黏著層 115a固化成115a’而降低其黏著性。特別的是，固化後的感壓 黏著層115a’相較於非固化的感壓黏著層115a，其黏附力顯著 的下降，這樣，在挑選單獨晶粒l〇〇a的過程中，晶粒黏著層 105a仍附著於晶粒上100a，而與固化的感壓黏著層115a’分 離。因此分離出的晶粒100a具有晶粒黏者層105a以利接下來 固定在基板130上，也因為晶粒黏著層105a使得分離出的晶 粒100a可單獨附著在基板130。使接下來架線(wiring)、與封 膠(encapsulation)等過程能更為順利。 黏著層105可藉由此說明書中所述之黏著薄膜製成，詳細 成份如下。 根據此說明書，此黏著薄膜包含彈性樹脂、薄膜形成樹 脂、環氧樹脂、酚類固化劑、固化催化劑、固化前添加劑、矽 烧偶合劑、填充物和有機溶劑。 彈性樹脂（elastomer resin)可為薄膜形成橡膠 (film-forming rubber)。此彈性樹脂可包含一個以上之羥基、緩 基、或環氧基，其平均分子量大約500到5,000,000道爾呑。 13 200821352 此彈性樹脂可包含一個以上的丙烯腈彈性體（acrylonitrile elastomer)、丁 鄰二烯彈性體(butadiene elastomer)、苯乙稀彈 性體（styrene elastomer)、丙烯酸彈性體（acryl elast〇mer)、異戌 二烯彈性體（isoprene elastomer)、乙烯彈性體（ethylene elastomer)、丙稀彈性體(propylene elastomer)、聚氨酯彈性體 (polyurethane elastomer)或者硅樹月旨彈性體（siiicone elastomer)。彈性樹脂佔整個黏著薄膜總組成份總重量的重量 百分比5到75。 薄膜形成樹脂可促進黏著薄膜的形成。薄膜形成樹脂具有 玻璃轉移溫度約攝氏負十度到正兩百度。薄膜形成樹脂可包含 一個以上之酚樹脂或含苯氧基的樹脂。薄膜形成樹脂可包含一 個以上的羥基、環氧基、苯氧基或烷基。薄膜形成樹脂平均分 子量大約200到300,000道爾吞。黏著薄膜成分佔整個薄膜形 成樹脂總重量的重量百分比10到60，根據彈性樹脂的重量， 亦即每100份重量的彈性樹脂，黏著薄膜成分包含約10到6〇 份重量的膜形成樹脂。 薄膜形成樹脂可包含對苯二紛(hydroquinone)的骨架、2_ 漠氫藏（2-bromohydroquinone)、苯二紛（resorcinol)、兒茶紛 (catechol)、雙齡 A(bisphenol A)、雙紛 F(bisphenol F)、雙. AD(bisphenol AD)、雙酚 S(bisphenol S)、4.4，-二羥基聯笨 (4.4f-dihydroxybiphenyl)、雙（4-羥基苯）乙 _ (bis(4-hydroxyphenyl)ether)、一 個紛基(phenol group)、一個甲 驗（cresol group)、一個甲紛酸（cresol novolac group)，且/或_ 個florene group，而在florene group的骨架中，可被取代為一 14 200821352 個烷基(alkyo gorup)、一個芳香族羥基(aryl group)、一個輕甲 基(methyloy group)、一個烯丙基(allyl gr〇up)、一個環脂肪族 (cyclic aliphatic group)、鹵素(halogen)，並且/或者一個硝基 (nitro group)。在實作上，雙酚中央的碳原子可被取代為—個 • 直鏈烧基（straight-chained alkyl group)、一個分支垸基 (branched alkyl group)、一個烯丙基、一個被替代的烯丙基、 一個$衣脂肪族、或一個烧氧碳基(alkosy carbonyl group)。 • 環氧樹脂具有固化與黏著的能力。根據黏著薄膜的形狀， 環氧樹脂可以是固態的或是帶有一個以上官能基的似固態樹 脂。環氧樹脂可包含一個以上的雙酚環氧樹脂、酚駿環氧樹 脂、鄰甲酚醛環氧樹脂、多功能環氧樹脂、胺環氧樹脂、雜環 環氧樹脂、被替代的環氧樹脂或者萘紛環氧樹脂，以上可單獨 使用或是合併一個以上其他環氧樹脂使用。根據彈性樹脂的重 ΐ ’壞氧樹脂佔整個黏著薄膜總組成份總重量的重量百分比 10 到 60 〇 φ 紛類固化劑具有一個以上之雙 Α樹脂、雙紛F樹脂、 • 雙齡S樹脂、紛酸樹脂、紛樹脂、丙二齡酸樹脂、甲齡酸樹 脂或一多功能盼樹脂（multi-functional phenol resin)，像是曰本 Meiwa Plastic Industries 公司的產品 MEH-7500 即是。以上可 單獨使用或是合併一個以上的其他紛類固化劑使用。齡類固化 劑可以是一個分子包含兩個以上酚羥基（phen〇iic hydroxyl group)的化合物，並且暴露在溼氣中具有較高的抗電解腐蝕性 (electrolytic corrosion resistance)。根據彈性樹脂的重量，酚類 固化劑佔整個黏著薄膜總組成份總重量的重量百分比5到3〇。 15 200821352 固化催化劑的功能在於縮短固化時間以便在半導體製程 中環氧樹脂能完全固化。固化催化劑包含-個以上的三聚氰胺 類型催化劑、__型催化劑、或者三苯賴型催化劑，以上 可單獨使用或是合併—個以上其他@化催化劑使用。根據彈性 樹脂的重量，固化催化劑佔整個黏著薄膜總組成份總重量的重 量百分比0.01到5。 固化前添加劑可在製造黏著薄膜125時做固化前處理。固 化岫添加劑可增加黏著薄膜125的張力與硬度，在薄膜製造過 程中黏著薄膜的成分可透過固化前處理使得薄膜的伸長率 (elongatum)減少。固化前添加劑可包含異氰酸樹脂，異氰酸樹 脂包含一個以上官能基，可在前處理過程中增加黏著薄膜125 的硬度與降低其伸長率。目化前添加劑可包含胺基樹脂，其相 較於環氧樹脂與酚樹脂而言固化地較快。根據彈性樹脂的重 ϊ，固化前添加劑佔整個黏著薄膜總組成份總重量的重量百分 〇1到30右不打异憑藉著一般結合的理論，黏著薄膜成 知中的备基會與異氰酸酯類的固化前添加物或胺基類的固化 則添加物反應，而使得黏著薄膜125具有出色的材料特性。 異氰酸酯類（iS0cyanate_type)的固化前添加物可包含芳香 私二異氰酸酯（aromatic isocyanates)，像是4, 4，-二苯基曱烷二 異氫酸酯、三氯乙烯二異氫酸酯、二曱苯二異氫酸酯、4, 4，_ 二苯醚二異氫酸酯、4,4，-[2,2-雙(4-苯氧基苯基丙酮）二異氫酸 酯];或非芳香族二異氰酸酯，像是六亞甲基二異氰酸酯、4,4，_ 一％己基甲烷二異氰酸酯、2,4，_二環己基甲烷二異氰酸酯、 2,2，‘三曱基六亞甲基二異氰酸酯、二異氰酸異佛爾酮、離胺 16 200821352 酸^一異氣酸s旨，或是其他非芳香族二異乳酸s曰’像是ί展己基甲 烷二異氰酸酯、1，6-六亞曱基二異氰酸酯。進一步可使用固化 前添加劑將二異氰酸酯或三異氰酸酯與多元醇進行反應以產 生修飾的異氰酸g旨化合物。此固化前添加劑可單獨使用或是合 併一個以上其他的固化前添加劑使用。 胺基類固化前添加劑可包含一個以上的二乙稀三胺、三乙 烯四胺、二乙基胺基丙基胺、孟烯二胺、N-胺乙基對二氮己環、 間二甲苯二胺或異佛爾酮雙胺，此固化前添加劑可單獨使用或 是合併一個以上其他的固化前添加劑使用。 矽烷偶合劑可藉由無機有機的化學結合進而增加無機材 料（像是二氧化石夕）與有機材料的黏著性。根據彈性樹脂的重 量，矽烧偶合劑佔整個黏著薄膜總組成份總重量的重量百分比 0·01 到 10。 矽烷偶合劑可以具有含環氧的化合物，像是 (3,4-epoxycyclohexyl)_ethyltrimethoxy silane、3-glycidoxytrimethoxy silane 和 3-glycidoxypropyltriethoxy silane。石夕烧偶合劑可以具 有含 胺基的 化合物 ， 像是 N-(2-aminoethyl)-3-aminopropylmethyldimethoxy silane 、 N-(2- aminoethyl)-3-aminopropyltrimethoxy silane 、 N-(2-aminoethyl)-3-aminopropyltriethoxy silane 、 3-aminopropyl- trimethoxy silane 、 3-aminopropyltriethoxy silane 、 3-triethoxy-N-(l?3-dimethylbutylidene)propylamine 和 N-phenyl-3-aminopropyl_ trimethoxy silane。石夕院偶合劑可以具有含硫醇基的化合物，像 是 3-mercaptopropylmethyldimethoxy silane 或 17 200821352 3-mercaptopropyltriethoxy silane。烧偶合劑也同樣是可以具有 含異氰酸S旨的化合物，像是 3-isocyanatepropyltriethoxy silane。此矽烷偶合劑可單獨使用或是合併一個以上其他的矽 烧偶合劑使用。 填充物可包含無機或是有機的填充物。無機的填充物包含 一些金屬物質像是金粉、銀粉、銅粉或鎳粉，和一些非金屬物 質像是氧化铭(slumina)跟其他的氧化铭、氫氧化I呂（aluminum hydroxide)、氳氧化鎭（magnesium hydroxide)、碳酸妈（calcium carbonate)、碳酸鎮（magnesium carbonate)、，石夕酸約（calcium silicate)、石夕酸鎮（magnesium silicate)、氧化約(calcium oxide)、 氧化鎮（magnesium oxide)、氮化铭（aluminum nitride)、二氧化 石夕（silica)、氮化石朋（boron nitride)、二氧化鈦（titanium dioxide)、 玻璃、氧化鐵(iron oxide)或陶瓷。有機的填充物包含碳、橡膠 或聚合物。在實作中，球狀的或非固定形狀之無機填充物，其 大小約為5奈米（nm)到20微米。根據彈性樹脂的重量，填充 物佔整個黏著薄膜總組成份總重量的重量百分比〇. 1到60。 有機溶劑可在製造黏著薄膜125時降低黏著薄膜125的黏 性。有機溶劑包含甲苯(toluene)、二甲苯(xyiene)、丙二醇甲 醚醋酸酯（propylene glycol monomethyl ether acetate)、苯 (benzene)、丙酉同（acetone)、曱基乙基綱（methylethylketone)、 四鼠0夫喃（tetrahydrofuran)、一甲基曱酸胺（dimethylformamide) 或環己酮（cyclohexanon)。 黏著薄膜中添加有機溶劑可做為平衡，並非黏著薄膜成分 中剩餘的部份。根據彈性樹脂的重量，有機溶劑佔整個黏著薄 18 200821352 膜總組成份總重量的重量百分比100到1〇〇〇。 黏著薄膜可進一步包含離子淨化劑，可用來吸附離子雜 質，進而可降低或消除因為黏著薄膜125暴露在溼氣中所產生 降解電子絶緣材料特性的離子。此離子淨化劑包含無機的吸附 劑像是三嗪硫醇化合物、錘化合物、銻鉍化合物或鎂鋁化合 物。根據彈性樹脂的重量，離子淨化劑佔總成份的重量百分比 0.01 到 5 ° 實施範例中特別的實作將會藉由下述的例子敘述。這些例 子除了作為解釋之外，並不對當前之發明有所限制。 【實施例】 所列成份放入一公升圓柱型燒瓶，帶有一根高速攪拌棒， 姐在每分鐘4000轉的速度下快速攪拌均勻，藉此形成一化合 物。接著使用球磨機將此化合物磨成粉狀進行兩次以上。接著 使用50微米的過濾膜（capsule filter)過濾，接著製成20微米 厚的的黏著薄膜。此黏著薄膜於攝氏90度乾燥20分鐘，接著 放於攝氏40度3天。在以下的實施例中，環氧樹脂/固化劑的 比例約為1.0。 !施例1:建構一黏著薄膜 (a) 400公克含一個羧基和羥基的彈性樹脂。 (b) 60公克具有一個雙盼A和雙紛F的薄膜形成樹脂。 (c) 60公克的曱酚醛環氧樹脂。 (d) 33公克的紛酸固化劑(phenol novolac curing agent)。 (e) 0.6公克的咪嗤固化催化劑(imidazole curing catalyst)。 (f) 7公克的含有修飾的二異氰酸甲苯的固化前添加劑。 19 200821352 0.5公克的硫醇基石夕烧偶合劑和〇·5公克的環氧基石夕烧偶合劑 20公克非晶態之二氧化矽。 f施例2 ·建構一黏者薄膜 (a) 400公克含一個羧基和羥基的彈性樹脂。 (b) 60公克含一個魏基和經基的薄膜形成樹脂。 (c) 60公克的甲齡酸環氧樹脂。 40公克的紛謎固化劑。 (e) 0·1公克的12米π坐固化催化劑。 (f) 3公克含修飾之烷基異氰酸酯三亞曱基丙酸(modified alkylisocyanate trimethylolpropane)的固化前添加劑。 (g) 1 公克由 $衣氧氣丙 k(ePichlorohydrin)和 methyloxylenediamine 反應完的的環氧基添加劑，並可對含羧基的彈性體做固化前 處理。 (h) 〇·5公克的硫醇基矽烷偶合劑和0·5公克的環氧基矽烷偶合劑 (i) 20公克非晶態之二氧化矽。 U氣例3 :建構一黏著薄膜 (a) 400公克含一個羧基和羥基的彈性樹脂。 (b) 60公克含一個羧基和羥基的彈性樹脂。 (c) 60公克的甲酚醛環氧樹脂。 (d) 40公克的紛固化劑。 (e) 0· 1公克的咪唑固化催化劑。 (f) 3 公克二㈣二賴 ______ bisphend cyanate偷)’其具有转麵料麵喊嫌麵化前添 加劑。 20 200821352 (g) 1公克由魏氯峨和methylGxylenediamine反就的環氧基 添加劑，並可對含羧基的彈性體做固化前處理。 (h) 0.5公克的硫醇基魏偶合劑和μ公克的環氧基魏偶合劑 (i) 20公克非晶態之二氧化石夕。 复與例4 :建構一龜荖薄瞪 (a) 300公克含有環氧基的彈性樹脂。 (b) 應公克含雙紛A與雙紛F的薄膜形成樹脂。 (c) 80公克的甲龄終％氧樹脂和1〇公克的萘紛環氧樹脂。 (d) 36公克的多功能的固化劑。 (e) 0·6公克的咪唑固化催化劑。 (f) 2公克的胺顓固化前添加劑。 (g) 〇·5公克的硫醇基石夕烧偶合劑和〇·5公克的環氧基石夕烧偶合劑 (h) 20公克非晶態矽之二氧化矽 例5 :建構一黏著薄膜 ⑻ 1〇〇公克含一個羧基和羥基的丙烯酸彈性樹脂和3〇〇公克的 含環氧基的丙烯酸彈性體 (b) 60公克含雙酴a與雙盼F的薄膜形成樹脂。 (c) 80公克的曱酚醛環氧樹脂。 (d) 65公克的紛醚固化劑。 (e) 0·6公克的咪唑固化催化劑。 (f) 3公克的烷胺顓固化前添加劑。 (g) 0.5公克的硫醇基石夕院偶合劑和0·5公克的環氧基石夕烧偶合劑 (h) 20公克非晶態之二氧化矽。 實施例6 ·建構一黏者薄膜 21 200821352 ⑻100公克含環氧基的丙烯酸彈性樹脂和3〇〇公克的含環氧基 的丙烯酸彈性體。 ⑼60公克含雙齡與雙赃的薄膜形成樹脂。 (c) 80公克的曱酚醛環氧樹脂和1〇公克的萘酚環氧樹脂。 (d) 65公克的酚醚固化劑。 (e) 〇·6公克的咪唑固化催化劑。 (f) 3公克的烷胺顓固化前添加劑。 (g) 〇·5公克的硫醇基矽烷偶合劑和0.5公克的環氧基矽烷偶合劑 (h) 20公克非晶態之二氧化矽。 【比較實施例】 在比較實施例中，除了不包括固化前添加劑，黏著薄膜的 製程依實施例1到6。 比較實施例1 :建構一黏著簿膜m (a) 400公克含一個羧基和羥基的彈性樹脂。 (b) 60公克具有一個雙酚A和雙酚F的薄膜形成樹脂。 (c) 60公克的甲酚醛環氧樹脂。 (d) 33公克的酚醛固化劑(phenol novolac curing agent)。 (e) 〇·6公克的咪唑固化催化劑(imidazole curing catalyst)。 (f) 〇·5公克的硫醇基矽烷偶合劑和〇·5公克的環氧基矽烷偶合 劑。 (g) 20公克非晶態之二氧化矽。 土齡實施例2 :建構一黏著薄膜（2Λ (a) 400公克含一個魏基和經基的彈性樹脂。 (b) 60公克含一個羧基和羥基的薄膜形成樹脂。 22 200821352 (c) 60公克的甲酚醛環氧樹脂。 (d) 40公克的紛醚固化劑。 (e) 0·1公克的咪唑固化催化劑。 (ί) 1公克由環氧氯丙烷和methyloxylenediamine反應完的的環氧 基添加劑，並可對含羧基的彈性體做固化前處理。 (g) 〇·5公克的硫醇基矽烷偶合劑和0.5公克的環氧基矽烷偶合 劑。 (h) 20公克非晶態之二氧化秒。 比鲛實施例3 :建構一黏荖薄膜π、 ⑻ 400公克含一個羧基和羥基的彈性樹脂。 (b) 60公克含一個羧基和羥基的彈性樹脂。 (c) 60公克的曱酚醛環氧樹脂。 (d) 40公克的酚醚固化劑。 (e) 〇· 1公克的咪唑固化催化劑。 (f) 1公克由環氧氣丙烧和methyloxylenediamine反應完的環氧基 添加劑，並可對含羧基的彈性體做固化前處理。 (g) 0·5公克的硫醇基石夕烧偶合劑和〇·5公克的環氧基石夕烧偶合 劑。 (h) 20公克非晶態之二氧化矽。 比較實施: 一建構一黏著薄膜(勾 (a) 300公克含有環氧基的彈性樹脂。 (b) 公克含雙齡A與雙紛F的薄膜形成樹脂。 (c) 80公克的曱酚醛環氧樹脂和10公克的萘酚環氧樹脂。 (d) 36公克的多功能的固化劑。 (e) 〇·6公克的咪唑固化催化劑。 23 200821352 (f) ο.5公克的硫醇基魏偶合劑和0.5公克的環氧基石夕烧偶合 劑。 (g) 20公克非晶態之二氧化石夕。 比較實施例5 :建構一點蔓_薄膜 ⑻100公$含-個麟和經基的丙稀酸彈性樹脂和公克的 含環氧基的丙烯酸彈性體。 (b) 60公克含雙酚A與雙酚F的薄膜形成樹脂。 (c) 80公克的甲酚醛環氧樹脂和10公克的萘酚環氧樹脂。 (d) 65公克的酚醚固化劑。 (e) 0.6公克的咪嗤固化催化劑。 (f) 〇·5公克的硫醇基石夕烧偶合劑和0·5公克的環氧基石夕烧偶合 劑。 (g) 20公克非晶態之二氧化矽。 比較實施例6 :建構一黏荖薄暄m ⑻1〇0公克含環氧基的丙烯酸彈性樹脂和3〇〇公克的含環氧基 的丙烯酸彈性體。 (b) 60公克含雙齡A與雙酚F的薄膜形成樹脂。 (c) 80公克的曱酚醛環氧樹脂和10公克的萘酚環氧樹脂。 (d) 65公克的酚醚固化劑。 (e) 〇·6公克的咪唑固化催化劑。 (f) 〇·5公克的硫醇基矽烷偶合劑和0.5公克的環氧基矽烷偶合 劑。 (g) 20公克非晶態之二氧化矽。 24 200821352 提升材料的柹能. 在實施例1到6與比較實施例1到6中，半導體封裝過程 中製成黏著薄膜之材料其性能可依下面所述而有所提升，結果 列於表1。為了近一步測定晶片挑選的成功率，須計算紫外光 照射前後’黏著層和感壓黏著層之間丨8〇度時的剝落值，與黏 著層和晶圓之間180度時的剝落值的不同。而此測定的結果列 於表2。 (1) 抗張強度：每層薄膜會放在室溫(25。〇—個小時，接 著將樣本製成20公釐（mm)x50公釐（mm)大小，厚20微米狗 骨頭（dog bone)的形狀進行抗張強度試驗。 (2) 計算180度時的剝落值(黏著層和感壓黏著層之間）：為 了測量黏著層和感壓黏著層之間的黏著力，每個薄膜會輾壓上 切割薄膜，放置一小時，接著薄膜製成15公釐义7〇公釐大小 的矩形進行180度剝落值的測試。 切割薄膜可藉由於1〇〇微米厚的聚烯烴薄膜（poly〇lefin film)上塗覆紫外光固化之感壓黏著層而製成。在紫外光固化 前，切割薄膜的附著力為130荷重（gf)，固化後為60荷重。另 外，使用含有不銹鋼成份的樣本（SUS304)，在固化前180度時 的剝落值為0·0055 N/mm，固化後為〇 〇〇1〇 N/mm。 (3) 計算180度剝落值(黏著層和晶圓之間）：為了測量黏 著層和晶圓之間的黏著力，每個薄膜會輾壓上切割薄膜，放置 一小時’接著在攝氏60度、0.2 MPa、每秒20公尺的速度， 將25公釐χ70公釐大，720微米厚的晶圓碾壓上去，接著測 量180度剝落值。 25 200821352 切割薄膜可藉由於100微米厚的聚浠烴薄膜（polyolefin film)上塗覆紫外光固化之感壓黏著層而製成。在紫外光固化 前，切割薄膜的附著力為130荷重（gf)，固化後為60荷重。另 外，使用含有不銹鋼成份的樣本（SUS304)，在固化前180度時 的剝落值為0.0055 N/mm ’固化後為0.0010 N/mm。All three, if expressed as "any _ ^, Α with C, Β with C, ABC or B or C" then contain a separate A, 11 200821352 alone B, alone C but not including A and B, A and C B, C, ABC have three. 1A and IB illustrate various stages of an exemplary method of semiconductor device packaging using an embodiment in which a semiconductor wafer is diced and a separate semiconductor component, i.e., a die, is bonded to the substrate by a dicing die film. Referring to FIGS. 1A and 1B, a plurality of layers of components, such as memory devices, microprocessors, etc., may be packaged on the semiconductor wafer 100. In order to package these components, the semiconductor wafer 100 is divided into a plurality of crystal grains 100a along the line drawn. The cutting process comprises rolling the cut adhesion die film 101 onto the entire uncut wafer 100. The cut adhesion die film comprises a dicing film 125 and a dielectric adhesion layer (11^〇1[^(^16 3(( 11168b 6 1&}^) 105. The adhesive layer 105 on the diced adhesive grain film 101 can be made by using the composition of the adhesive film in the specification. The dicing film 125 comprises a pressure sensitive adhesive layer (PSA layer) 115 and a base film. 120. The pressure sensitive adhesive layer 115 may be a non-curing film or a UV-curing film. The base film 120 may be a vinyl chloride film such as polyvinyl chloride (PVC). Or a polyolefin. In practice, the dicing film ι25 can be formed by pressing the pressure-sensitive adhesive layer 115 and the base film 120. The dicing adhesive film 101 can be adhered to the semiconductor wafer 1 by bonding the film 1 〇 5 〇〇 contact' and the pressure-sensitive adhesive layer 115 is bonded to the adhesive film 1 〇 5. The above-mentioned 'wafer package needs to be completed by bonding the bonded die film 101 by the uncut wafer 1 ,, and cutting the adhesive crystal The adhesive film 105 contained in the granular film 1〇1 is formed into The parts are made according to this specification. 12 200821352 During the cutting process, the wafer 100 is separated into a plurality of crystal grains 100a, and the adhesive layer 105 is separated into a plurality of 105a corresponding to 100a, where the cut after cutting is adhered to the crystal grains. The adhesive layer on the film 101' is denoted as 105a. Similarly, the dicing film 125 is divided into a plurality of 125', and the pressure-sensitive adhesive layer 115 and the base film 120 are divided into a plurality of 115a and 120a, and the cutting process is completed. The wafer 100/die 100a is attached to the dicing die film 101/101', respectively. According to Fig. 1B, the individual dies 100a are removed from the dicing die film 101'. This process can be exposed to ultraviolet light. Irradiation, ultraviolet light can cure the pressure-sensitive adhesive layer 115a to 115a' to reduce its adhesion. In particular, the adhesion of the cured pressure-sensitive adhesive layer 115a' compared to the non-cured pressure-sensitive adhesive layer 115a Significantly, so that in the process of selecting the individual crystal grains l〇〇a, the die attach layer 105a remains attached to the crystal grains 100a and is separated from the cured pressure-sensitive adhesive layer 115a'. 100a has a grain stick 105a is subsequently fixed on the substrate 130, and also because the die attach layer 105a allows the separated die 100a to be attached to the substrate 130 alone, so that subsequent wiring, encapsulation, and the like can be performed. For the sake of smoothness, the adhesive layer 105 can be formed by the adhesive film described in the specification, and the detailed composition is as follows. According to this specification, the adhesive film comprises an elastic resin, a film-forming resin, an epoxy resin, a phenolic curing agent, a curing catalyst, a pre-curing additive, a smoldering coupler, a filler, and an organic solvent. The elastomer resin may be a film-forming rubber. The elastomeric resin may contain more than one hydroxyl group, a buffer group, or an epoxy group having an average molecular weight of about 500 to 5,000,000 Torr. 13 200821352 The elastic resin may comprise more than one acrylonitrile elastomer, butadiene elastomer, styrene elastomer, acryl elast mer, An isoprene elastomer, an ethylene elastomer, a propylene elastomer, a polyurethane elastomer, or a siiicone elastomer. The elastic resin accounts for 5 to 75% by weight of the total weight of the total adhesive film. The film-forming resin promotes the formation of an adhesive film. The film-forming resin has a glass transition temperature of about minus ten degrees Celsius to two hundred degrees. The film-forming resin may contain one or more phenol resins or phenoxy-containing resins. The film-forming resin may contain one or more hydroxyl groups, epoxy groups, phenoxy groups or alkyl groups. The film-forming resin has an average molecular weight of about 200 to 300,000 Torr. The adhesive film component accounts for 10 to 60% by weight of the total weight of the film-forming resin, and the adhesive film component contains about 10 to 6 parts by weight of the film-forming resin per 100 parts by weight of the elastic resin, based on the weight of the elastic resin. The film-forming resin may comprise a hydroquinone skeleton, a 2-bromohydroquinone, a resorcinol, a catechol, a bisphenol A, and a double F (bisphenol F), double. AD (bisphenol AD), bisphenol S, 4.4, dihydroxylphenyl, bis(4-hydroxyphenyl), bis (4-hydroxyphenyl) )ether), a phenol group, a cresol group, a cresol novolac group, and/or _ florene group, and in the skeleton of the florene group, can be replaced by a 14 200821352 alkyl (alkyo gorup), an aromatic aryl group, a methyloy group, an allyl gr〇up, a cyclic aliphatic group, Halogen and/or a nitro group. In practice, the carbon atoms in the center of the bisphenol can be replaced by a straight-chained alkyl group, a branched alkyl group, an allyl group, and an substituted alkene. A propyl group, a $fat aliphatic, or an alkosyl carbonyl group. • Epoxy resin has the ability to cure and adhere. Depending on the shape of the adhesive film, the epoxy resin may be solid or a solid-like resin with more than one functional group. Epoxy resin may contain more than one bisphenol epoxy resin, phenol epoxy resin, o-cresol novolac epoxy resin, multifunctional epoxy resin, amine epoxy resin, heterocyclic epoxy resin, epoxy resin replaced Or naphthalene epoxy resin, the above may be used alone or in combination with more than one other epoxy resin. According to the weight of the elastic resin, the amount of the bad oxygen resin is 10 to 60 〇 φ of the total weight of the total adhesive film. The curing agent has more than one double bismuth resin, double F resin, • double age S resin, Acidic resin, resin, propionate resin, formic acid resin or a multi-functional phenol resin, such as MEH-7500 from Meiwa Plastic Industries. The above may be used alone or in combination with more than one other type of curing agent. The age-based curing agent may be a compound containing two or more phen〇iic hydroxyl groups, and has high electrolytic corrosion resistance when exposed to moisture. The phenolic curing agent is 5 to 3 parts by weight based on the total weight of the total composition of the adhesive film, based on the weight of the elastic resin. 15 200821352 The function of the curing catalyst is to shorten the curing time so that the epoxy resin can be completely cured in the semiconductor process. The curing catalyst contains more than one melamine type catalyst, a __ type catalyst, or a triphenyl lysate type catalyst, and the above may be used alone or in combination of one or more other @化催化剂s. The curing catalyst accounts for 0.01 to 5 by weight based on the total weight of the total composition of the adhesive film, based on the weight of the elastic resin. The pre-curing additive can be pre-cured during the manufacture of the adhesive film 125. The solidification enthalpy additive can increase the tension and hardness of the adhesive film 125. During the film manufacturing process, the composition of the adhesive film can be pre-cured to reduce the elongation of the film (elongatum). The pre-curing additive may comprise an isocyanate resin, and the isocyanate resin contains more than one functional group which increases the hardness and lowers the elongation of the adhesive film 125 during the pretreatment. The pre-mesh additive may comprise an amine-based resin which cures faster than the epoxy resin and the phenol resin. According to the weight of the elastic resin, the pre-curing additive accounts for 1% to 30% of the total weight of the total weight of the adhesive film. By virtue of the general theory of bonding, the adhesive film is known to be prepared and isocyanate. The curing of the pre-curing additive or the amine-based compound reacts with the additive, so that the adhesive film 125 has excellent material properties. The pre-curing additive of the isocyanate (iS0cyanate_type) may comprise an aromatic isocyanates such as 4,4,-diphenylnonane diisocyanate, trichloroethylene dihydrogenate, diterpenes. Benzene dihydrogenate, 4, 4, _ diphenyl ether diisohydro acid ester, 4,4,-[2,2-bis(4-phenoxyphenylacetone) diisohydro acid ester]; or Non-aromatic diisocyanates, such as hexamethylene diisocyanate, 4,4,_% hexyl methane diisocyanate, 2,4,2-dicyclohexylmethane diisocyanate, 2,2, 'trimethyl hexamethylene Diisocyanate, isophorone diisocyanate, iso-amine 16 200821352 acid, or other non-aromatic diiso-lactic acid s 曰 'like ί hexyl methane diisocyanate, 1,6 - Hexamethylene diisocyanate. Further, a diisocyanate or a triisocyanate may be reacted with a polyol using a pre-curing additive to produce a modified isocyanate. The pre-curing additive may be used alone or in combination with one or more other pre-curing additives. The amine-based pre-curing additive may comprise more than one of diethylenetriamine, triethylenetetramine, diethylaminopropylamine, montene diamine, N-amine ethyl p-dinitrocyclohexane, m-xylene Diamine or isophorone bisamine, this pre-curing additive can be used alone or in combination with more than one other pre-curing additive. The decane coupling agent can increase the adhesion of inorganic materials (such as silica dioxide) to organic materials by chemical combination of inorganic and organic. Depending on the weight of the elastomeric resin, the smouldering coupler is from 0.01 to 10% by weight based on the total weight of the total adhesive film. The decane coupling agent may have an epoxy-containing compound such as (3,4-epoxycyclohexyl)_ethyltrimethoxy silane, 3-glycidoxytrimethoxy silane and 3-glycidoxypropyltriethoxy silane. The Shixia coupling agent may have an amine group-containing compound such as N-(2-aminoethyl)-3-aminopropylmethyldimethoxy silane, N-(2-aminoethyl)-3-aminopropyltrimethoxy silane, N-(2-aminoethyl)-3 -aminopropyltriethoxy silane, 3-aminopropyl-trimethoxy silane, 3-aminopropyltriethoxy silane, 3-triethoxy-N-(l?3-dimethylbutylidene)propylamine and N-phenyl-3-aminopropyl_ trimethoxy silane. The Shixiyuan coupling agent may have a thiol group-containing compound such as 3-mercaptopropylmethyldimethoxy silane or 17 200821352 3-mercaptopropyltriethoxy silane. The octogenating agent can also have a compound containing isocyanate S, such as 3-isocyanate propyltriethoxy silane. The decane coupling agent may be used singly or in combination with one or more other oximation coupling agents. The filler may comprise an inorganic or organic filler. Inorganic fillers contain some metallic substances such as gold powder, silver powder, copper powder or nickel powder, and some non-metallic substances such as slumina and other oxidations, aluminum hydroxide, antimony oxide (magnesium hydroxide), calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide ), aluminum nitride, silica, boron nitride, titanium dioxide, glass, iron oxide or ceramic. The organic filler contains carbon, rubber or a polymer. In practice, a spherical or non-fixed shape inorganic filler having a size of from about 5 nanometers (nm) to about 20 microns. Depending on the weight of the elastomeric resin, the filler is present in an amount of from 1 to 60% by weight based on the total weight of the total composition of the adhesive film. The organic solvent can reduce the viscosity of the adhesive film 125 when the adhesive film 125 is produced. The organic solvent includes toluene, xyiene, propylene glycol monomethyl ether acetate, benzene, acetone, methylethylketone, and four mice. Tetrahydrofuran, dimethylformamide or cyclohexanon. The addition of an organic solvent to the adhesive film serves as a balance and does not adhere to the remaining portion of the film composition. Depending on the weight of the elastomeric resin, the organic solvent accounts for 100% to 1% by weight of the total weight of the total composition of the film. The adhesive film may further comprise an ion scavenger for adsorbing the ionic impurities, thereby reducing or eliminating ions which degrade the properties of the electronic insulating material due to exposure of the adhesive film 125 to moisture. The ion scavenger contains an inorganic adsorbent such as a triazine thiol compound, a hammer compound, a hydrazine compound or a magnesium aluminum compound. The ion scavenger is 0.01 to 5 ° by weight based on the weight of the elastomeric resin. The specific practice in the examples will be described by the following examples. These examples are not intended to limit the invention in addition to the explanation. [Examples] The listed ingredients were placed in a one liter cylindrical flask with a high-speed stirring bar, and the sister was rapidly stirred at a speed of 4000 rpm to form a compound. This compound was then pulverized in a ball mill for two or more times. This was followed by filtration using a 50 micron capsule filter followed by a 20 micron thick adhesive film. The adhesive film was dried at 90 degrees Celsius for 20 minutes and then placed at 40 degrees Celsius for 3 days. In the following examples, the ratio of the epoxy resin/curing agent was about 1.0. Example 1: Construction of an adhesive film (a) 400 g of an elastic resin containing a carboxyl group and a hydroxyl group. (b) 60 g of a film-forming resin having a double-looking A and a double F. (c) 60 grams of non-phenolic epoxy resin. (d) 33 grams of phenol novolac curing agent. (e) 0.6 g of imidazole curing catalyst. (f) 7 g of pre-curing additive containing modified toluene diisocyanate. 19 200821352 0.5 g of thiol sulphur coupling agent and 〇·5 g of epoxy-based coupling agent 20 g of amorphous cerium oxide. f Example 2 • Construction of a sticky film (a) 400 g of an elastic resin containing a carboxyl group and a hydroxyl group. (b) 60 g of a film-forming resin containing a Wei group and a warp group. (c) 60 grams of formic acid epoxy resin. 40 grams of puzzle hardener. (e) 0. 1 gram of 12 m π sitting curing catalyst. (f) 3 grams of pre-curing additive with modified alkylisocyanate trimethylolpropane. (g) 1 gram of epoxy-based additive reacted with ePichlorohydrin and methyloxylenediamine, and pre-cured for carboxyl-containing elastomers. (h) 5·5 g of a thiol decane coupling agent and 0.5 g of an epoxy decane coupling agent (i) 20 g of an amorphous cerium oxide. U gas example 3: construction of an adhesive film (a) 400 g of an elastic resin containing a carboxyl group and a hydroxyl group. (b) 60 g of an elastic resin containing a carboxyl group and a hydroxyl group. (c) 60 grams of cresol novolac epoxy resin. (d) 40 grams of curing agent. (e) 0·1 g of an imidazole curing catalyst. (f) 3 grams of two (four) two ______ bisphend cyanate steals] 'It has a twisted fabric face to face the pre-faceted additives. 20 200821352 (g) 1 gram of epoxy-based additive from chlorinated oxime and methylGxylenediamine, and can be pre-cured for carboxyl-containing elastomers. (h) 0.5 g of thiol-based Wei coupler and μg of epoxy-based coupler (i) 20 g of amorphous silica dioxide. Recombination Example 4: Construction of a turtle crucible (a) 300 g of an epoxy resin-containing elastic resin. (b) Resin-containing resin containing double A and double F. (c) 80 grams of the age-old 5% oxygen resin and 1 gram of naphthalene epoxy resin. (d) 36 grams of multifunctional curing agent. (e) 0·6 g of an imidazole curing catalyst. (f) 2 g of amine hydrazine pre-curing additive. (g) 5·5 gram of thiol sulphur coupling agent and 〇·5 gram of epoxy cation coupling agent (h) 20 gram of amorphous cerium oxide Example 5: construction of an adhesive film (8) 1 An acrylic elastomer containing one carboxyl group and a hydroxyl group and 3 gram of an epoxy group-containing acrylic elastomer (b) 60 g of a film-forming resin containing a biguanide and a double-pregine F. (c) 80 grams of non-phenolic epoxy resin. (d) 65 grams of ether hardener. (e) 0·6 g of an imidazole curing catalyst. (f) 3 grams of alkylamine oxime pre-curing additive. (g) 0.5 g of a thiol base stone coupling agent and 0.5 g of an epoxy group coupling agent (h) 20 g of an amorphous ceria. Example 6 - Construction of an adhesive film 21 200821352 (8) 100 g of an epoxy-containing acrylic elastomer and 3 g of an epoxy-containing acrylic elastomer. (9) 60 g of a film-forming resin containing double age and double bismuth. (c) 80 grams of phenolic phenolic epoxy resin and 1 gram of naphthol epoxy resin. (d) 65 grams of phenol ether curing agent. (e) 6·6 g of imidazole curing catalyst. (f) 3 grams of alkylamine oxime pre-curing additive. (g) 5 g of a thiol decane coupling agent and 0.5 g of an epoxy decane coupling agent (h) 20 g of an amorphous cerium oxide. [Comparative Example] In the comparative examples, the process of the adhesive film was carried out according to Examples 1 to 6 except that the pre-curing additive was not included. Comparative Example 1: Construction of an adhesive film m (a) 400 g of an elastic resin containing a carboxyl group and a hydroxyl group. (b) 60 g of a film-forming resin having a bisphenol A and bisphenol F. (c) 60 grams of cresol novolac epoxy resin. (d) 33 grams of phenol novolac curing agent. (e) 6·6 g of imidazole curing catalyst. (f) 5 g of a thiol decane coupling agent and 5 g of an epoxy decane coupling agent. (g) 20 grams of amorphous cerium oxide. Soil age example 2: Construction of an adhesive film (2 Λ (a) 400 g of an elastomer containing a Wei group and a warp group. (b) 60 g of a film containing a carboxyl group and a hydroxyl group to form a resin. 22 200821352 (c) 60 g (1) 40 g of an ether hardening agent. (e) 0·1 g of an imidazole curing catalyst. (ί) 1 g of epoxy-based additive reacted with epichlorohydrin and methyloxylenediamine The carboxyl group-containing elastomer can be pre-cured. (g) 5·5 gram of thiol decane coupling agent and 0.5 gram of epoxy decane coupling agent. (h) 20 gram of amorphous dioxide Example 3: Construction of an adhesive film π, (8) 400 g of an elastic resin containing a carboxyl group and a hydroxyl group (b) 60 g of an elastic resin containing a carboxyl group and a hydroxyl group. (c) 60 g of a phenolic phenol ring Oxygen resin (d) 40 g of phenol ether curing agent (e) 〇·1 g of imidazole curing catalyst. (f) 1 g of epoxy-based additive reacted with epoxicone and methyloxylenediamine, and may contain The elastomer of the carboxyl group is pre-cured. (g) 0·5 g of thiol group Shi Xi Burning Coupling Agent and 公·5 g of epoxy-based sulphur coupling agent (h) 20 g of amorphous cerium oxide. Comparative implementation: One construction of an adhesive film (hook (a) 300 g containing epoxy (a) gram of film forming resin containing double age A and double F. (c) 80 g of phenolic phenolic epoxy resin and 10 g of naphthol epoxy resin. (d) 36 g more Functional curing agent (e) 6 g of imidazole curing catalyst. 23 200821352 (f) ο. 5 g of thiol-based Wei coupling agent and 0.5 g of epoxy-based sulphur coupling coupling agent (g) 20 g Amorphous sulphur dioxide eve. Comparative Example 5: Construction of a little vine film (8) 100 Å of a propylene-containing and trans-based acrylic elastomer and a gram of an epoxy-containing acrylic elastomer. 60 g of a film containing bisphenol A and bisphenol F to form a resin (c) 80 g of cresol novolac epoxy resin and 10 g of naphthol epoxy resin. (d) 65 g of phenol ether curing agent. 0.6 g of a hydrazine curing catalyst (f) 5·5 g of a thiol sulphur coupling coupler and 0.5 g of an epoxy epoxime coupler. (g) 20 An amorphous cerium oxide. Comparative Example 6: Construction of a viscous thin 暄m (8) 1 〇 0 g of an epoxy-containing acrylic elastomer and 3 gram of an epoxy-containing acrylic elastomer. 60 g of film forming resin containing double age A and bisphenol F. (c) 80 g of phenolic phenolic epoxy resin and 10 g of naphthol epoxy resin. (d) 65 g of phenol ether curing agent. (e) 6·6 g of imidazole curing catalyst. (f) 5 g of a thiol decane coupling agent and 0.5 g of an epoxy decane coupling agent. (g) 20 grams of amorphous cerium oxide. 24 200821352 Improving the energy of the material. In Examples 1 to 6 and Comparative Examples 1 to 6, the properties of the material for forming the adhesive film in the semiconductor packaging process can be improved as described below, and the results are shown in Table 1. . In order to further measure the success rate of wafer selection, it is necessary to calculate the peeling value at the 丨8 丨 degree between the adhesive layer and the pressure-sensitive adhesive layer before and after the ultraviolet light irradiation, and the peeling value at 180 degrees between the adhesive layer and the wafer. different. The results of this measurement are shown in Table 2. (1) Tensile strength: Each layer of film will be placed at room temperature (25. 〇 - hour, then the sample is made into 20 mm (mm) x 50 mm (mm) size, 20 μm thick dog bone (dog bone The shape is tested for tensile strength. (2) Calculating the peeling value at 180 degrees (between the adhesive layer and the pressure-sensitive adhesive layer): In order to measure the adhesion between the adhesive layer and the pressure-sensitive adhesive layer, each film will The film was cut and pressed for one hour, and then the film was made into a rectangular shape of 15 mm in size and subjected to a 180-degree peeling value test. The cut film can be obtained by a 1 μm thick polyolefin film (poly〇) The lefin film is coated with a UV-curable pressure-sensitive adhesive layer. The adhesion of the cut film is 130 load (gf) and 60 load after curing. In addition, a sample containing stainless steel is used. SUS304), the peeling value is 0.0055 N/mm at 180 degrees before curing, and 〇〇〇1〇N/mm after curing. (3) Calculating the 180-degree peeling value (between the adhesive layer and the wafer): In order to measure the adhesion between the adhesive layer and the wafer, each film will be pressed onto the cut film. After one hour', then at 25 degrees Celsius, 0.2 MPa, 20 meters per second, 25 mm χ 70 mm large, 720 μm thick wafer was rolled up, and then the 180 degree peel value was measured. 25 200821352 Cutting The film can be made by coating a 100 μm thick polyolefin film with a UV-curable pressure-sensitive adhesive layer. Before UV curing, the adhesion of the film is 130 load (gf), after curing. The load was 60. In addition, using a sample containing stainless steel (SUS304), the peeling value at 180 degrees before curing was 0.0055 N/mm '0.0010 N/mm after curing.
(4)測量晶片剪力強度（shear strength) : 720微米厚的晶圓 依圖2所示切割成3公釐x3公釐大小，於攝氏60度輾壓至黏 著薄膜上，除了單獨黏著薄膜的部份，切割所有輾壓到黏著薄 膜的晶圓。接著，將另一 720微米厚、10公釐xlO公釐大小 的晶圓放至攝氏120度的加熱板上，而沾了黏著薄膜的晶片則 黏著其上，接著以Ikgf的力量壓20秒，接著在攝氏125度、 2小時和攝氏175度、2小時的條件下進行完全的固化。晶片 剪力於攝氏250度、每秒鐘100微米的速度測試，結果如表2 所示。 表1 抗張強 度 (kgf/m m2) 紫外光照射 前180度剝 離強度⑻ (N/mm) 紫外光照射 後180度剝 離強度(b) (N/mm) 180度剝離 強度(c) (N/mm) 晶片身 力強度 (kgf) 實施例1 1.6 0.00313 0.00158 0.00460 15.4 —' 實施例2 1.8 0.00252 0.00192 0.00416 11.1 實施例3 2.0 0.00287 0.00213 0.00394 10.5 實施例4 1.5 0.00314 0.00188 0.00461 17.6 ~ 實施例5 1.8 0.00367 0.00222 0.00520 14.1 實施例6 2.3 0.00274 0.00277 0.00384 15.8 比較實施例 0.9 0.00412 0.00264 0.00470 15.2 ~ 比較實施例2 1.0 0.00397 0.00278 0.00440 10.8 比較實施例3 1.3 0.00410 0.00310 0.00410 10.1 ~ 26 200821352 比較實施例4 0.9 0.00512 0.00298 0.00481 17.2 比較實施例5 1.1 0.00500 0.00312 0.00530 19.9 比較實施例6 ^----- 1.3 0.00367 0.00333 0.00400 15.2 表1所附注：（a)紫外光照射前黏著層與感壓黏著層之間 的180度剝離強度；（1))紫外光照射後黏著層與感壓黏著層之 間的180度剝離強度；（C)晶圓與黏著層之間的丨8〇度剝離強 度。(4) Measuring the shear strength of the wafer: The 720-micron-thick wafer is cut into 3 mm x 3 mm as shown in Fig. 2, and pressed onto the adhesive film at 60 ° C, except that the film is adhered alone. Partly, cut all the wafers that are pressed onto the adhesive film. Next, another 720 micron thick, 10 mm x 10 mm wafer was placed on a hot plate at 120 degrees Celsius, and the wafer with the adhesive film adhered to it, followed by a force of 1 kgf for 20 seconds. Complete curing was then carried out at 125 ° C, 2 hours and 175 ° C for 2 hours. The wafer shear force was tested at a speed of 250 degrees Celsius and 100 micrometers per second. The results are shown in Table 2. Table 1 Tensile strength (kgf/m m2) 180 degree peel strength before ultraviolet light irradiation (8) (N/mm) 180 degree peel strength after ultraviolet light irradiation (b) (N/mm) 180 degree peel strength (c) (N /mm) Wafer strength (kgf) Example 1 1.6 0.00313 0.00158 0.00460 15.4 - 'Example 2 1.8 0.00252 0.00192 0.00416 11.1 Example 3 2.0 0.00287 0.00213 0.00394 10.5 Example 4 1.5 0.00314 0.00188 0.00461 17.6 ~ Example 5 1.8 0.00367 0.00222 0.00520 14.1 Example 6 2.3 0.00274 0.00277 0.00384 15.8 Comparative Example 0.9 0.00412 0.00264 0.00470 15.2 ~ Comparative Example 2 1.0 0.00397 0.00278 0.00440 10.8 Comparative Example 3 1.3 0.00410 0.00310 0.00410 10.1 ~ 26 200821352 Comparative Example 4 0.9 0.00512 0.00298 0.00481 17.2 Comparative Example 5 1.1 0.00500 0.00312 0.00530 19.9 Comparative Example 6 ^----- 1.3 0.00367 0.00333 0.00400 15.2 Note to Table 1: (a) 180-degree peel strength between the adhesive layer and the pressure-sensitive adhesive layer before ultraviolet light irradiation (1)) 180 degree peel strength between the adhesive layer and the pressure-sensitive adhesive layer after ultraviolet light irradiation; (C) between the wafer and the adhesive layer丨8 degree peel strength.
參考表1，在沒有加入固化前添加劑之實施例1到6中黏 著薄膜的抗張強度，比有加入固化前添加劑之比較實施例j 到6中的抗張強度’增加百分之6〇。再來，實施例1到6之 黏著薄膜180度剝離強度相較於比較實施例1到6降低約百分 之30。而此可知，實施例丨到6因為添加了固化前添加劑而 造成抗張強度的增加。近一步觀察，因為剪力強度並沒有因固 化韵添加劑而有明顯的改變，顯示實施例〗到6具有良好的加 工性。 為了使晶片挑選的過程更為完整，於紫外光照射後，晶圓 與黏著層之間的黏著力應該要大於黏著層與感壓黏著層之間 的黏著力。在實施例1到6中可看到，經由紫外光照射後，晶 圓和黏著層之^ 180度剝離強度的制與麟層和感壓黏著 層的差別來的大’由此可看出實施例i到6具有良好的挑選成 功率。Referring to Table 1, the tensile strength of the adhesive film in Examples 1 to 6 in which no pre-curing additive was added was increased by 6 Å compared with the tensile strength ' in Comparative Examples j to 6 to which the pre-curing additive was added. Further, the 180 degree peel strength of the adhesive films of Examples 1 to 6 was reduced by about 30% compared with Comparative Examples 1 to 6. From this, it can be seen that Examples 丨 to 6 caused an increase in tensile strength due to the addition of a pre-curing additive. As a further observation, since the shear strength was not significantly changed by the solidification additive, the examples 1-6 to 6 were shown to have good workability. In order to make the process of wafer selection more complete, after UV irradiation, the adhesion between the wafer and the adhesive layer should be greater than the adhesion between the adhesive layer and the pressure-sensitive adhesive layer. It can be seen in Examples 1 to 6 that the difference between the 180-degree peel strength of the wafer and the adhesive layer and the difference between the lining layer and the pressure-sensitive adhesive layer after irradiation with ultraviolet light can be seen as an implementation. Examples i to 6 have a good selection success rate.
27 200821352 實施例2 0.00184 0.00244 實施例3 0.00127 0.00201 實施例4 0.00147 0.00273 實施例5 0.00153 0.00298 實施例6 0.00110 0.00107 比較實施例1 0.00058 0.00206 比較實施例2 0.00043 0.00162 比較實施例3 0 0.00100 比較實施例4 0.00006 0.00220 比較實施例5 0.00030 0.00218 比較實施例6 0.00033 0.0006727 200821352 Example 2 0.00184 0.00244 Example 3 0.00127 0.00201 Example 4 0.00147 0.00273 Example 5 0.00153 0.00298 Example 6 0.00110 0.00107 Comparative Example 1 0.00058 0.00206 Comparative Example 2 0.00043 0.00162 Comparative Example 3 0 0.00100 Comparative Example 4 0.00006 0.00220 Comparative Example 5 0.00030 0.00218 Comparative Example 6 0.00033 0.00067
表2所附注：（a)紫外光照射前黏著層/感壓黏著層的180 度剝離強度；（b)紫外光照射後黏著層/感壓黏著層的180度剝 離強度；（c)晶圓/黏著層的180度剝離強度。 如表1所示，實施例1到6之180度剝離強度較比較實施 例1到6之180度剝離強度來的小，可看出晶圓與黏著層之間 的黏著力稍微減少。然而於表2所示，在紫外光照射後，晶圓 與黏著層間180度剝離強度跟黏著層與感壓黏著層間180度剝 離強度的差別（c-b)，可用來作為挑選成功率的評估，實施例1 到6的平均差別為0.00238,相較於比較實施例1到6的0.00162 高出約百分之70。這些結果顯示，若依此專利所製成的黏著 層，在半導體的製造過程中，可增加挑選的成功率。 以上所述，在半導體封裝的過程中，依本發明於黏著薄膜 添加固化前添加劑，可增加黏著薄膜的抗張強度。再者，於半 導體製造的過程中可增加其挑選成功率，可瞭解到此黏著薄膜 可提供半導體封裝良好的可靠性與加工性。用來組成黏著薄膜 之成分相較於一般的產品具有較高的抗張強度。依此專利所製 成的黏著薄膜非常適合用來做為半導體封裝電子零件。 28 200821352 在此所示範的專利，雖然使用了特別的術語，但已使用較 一般的描述做解釋且不影響原意。故此，可依此領域中一般的 技術而瞭解以下所述之各種形式的專利而不離其意。 以上所述僅為本發明之較佳實施例，凡依本發明申請專利 . 範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 【圖式簡單說明】 • 圖1A與1B係為依本發明提供一半導體元件封裝方法之 詳細過程。 圖2係為測量晶粒剪力強度技術之簡圖說明。 【主要元件符號說明】 100 半導體晶圓 100a、105a、115a、120a 晶粒 101 晶粒薄膜 125 切割薄膜 105 介質黏著層 115 感壓黏著層 120 基膜 130 基板 29Note to Table 2: (a) 180 degree peel strength of the adhesive layer/pressure-sensitive adhesive layer before ultraviolet light irradiation; (b) 180-degree peel strength of the adhesive layer/pressure-sensitive adhesive layer after ultraviolet light irradiation; (c) Wafer / 180 degree peel strength of the adhesive layer. As shown in Table 1, the 180-degree peel strength of Examples 1 to 6 was smaller than the 180-degree peel strength of Comparative Examples 1 to 6, and it was found that the adhesion between the wafer and the adhesive layer was slightly reduced. However, as shown in Table 2, after the ultraviolet light irradiation, the difference between the 180-degree peel strength between the wafer and the adhesive layer and the 180-degree peel strength between the adhesive layer and the pressure-sensitive adhesive layer (cb) can be used as an evaluation of the success rate of the selection. The average difference of Examples 1 to 6 was 0.00238, which was about 70% higher than 0.00162 of Comparative Examples 1 to 6. These results show that, if the adhesive layer is made according to this patent, the success rate of the selection can be increased in the manufacturing process of the semiconductor. As described above, in the process of semiconductor packaging, according to the present invention, the pre-curing additive is added to the adhesive film to increase the tensile strength of the adhesive film. Furthermore, the success rate of the selection process can be increased during the manufacture of the semiconductor, and it is understood that the adhesive film can provide good reliability and processability of the semiconductor package. The components used to form the adhesive film have higher tensile strength than the general products. Adhesive films made in accordance with this patent are well suited for use as semiconductor packaged electronic components. 28 200821352 The patents set forth herein, although using specific terminology, have been explained using a more general description and do not affect the original meaning. Therefore, the various forms of patents described below can be understood from the general techniques in this field without departing from the meaning. The above is only the preferred embodiment of the present invention, and all changes and modifications made to the scope of the present invention are intended to be within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A and Fig. 1B are diagrams showing a detailed process of a semiconductor device packaging method according to the present invention. Figure 2 is a simplified illustration of the technique for measuring grain shear strength. [Main component symbol description] 100 Semiconductor wafer 100a, 105a, 115a, 120a Grain 101 Grain film 125 Cutting film 105 Dielectric adhesive layer 115 Pressure-sensitive adhesive layer 120 Base film 130 Substrate 29