200821234 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種包裝盒及包裝構造，尤其係關於用 於運送玻璃基板之包裝盒及其包褒構造。 【先前技術】 隨著數位科技的發展，液晶顯示產品已廣泛地應用在 日常生活的各個層面中。對於液晶顯示模組而言，玻璃基 板所扮演的角色好比是半導體產業中的晶圓，因此，液曰:曰 顯示器產業對玻璃基板的要求近乎完美。 _ 玻璃是-種脆性材料’當受到外力碰撞或是掉落地面 時、，很容易破裂以致於不能使用。而在製作液晶顯示面板 的過私中，彩色濾光片基板及薄膜電晶體基板的運送問題 至關重要。在上述基板的運送過程中，其易受化學污染， 且當基板與其他包裝物摩擦時，極易造成彩色濾光片基板 及薄膜電晶體基板表面電路或者元器件受損。 先前技術之玻璃基板運送主要是將玻璃基板放置在包 裝盒中以運送。如圖1所示，一種玻璃基板包裝盒係採用 發泡樹脂製成。該包裝盒10包括一盒體12〇及一蓋體 140,該盒體120與該蓋體140間相互嵌套配合，形成一收 容玻璃基板之收容空間。在該盒體120二相對侧壁122内 表面上設置有用以支撑玻璃基板之複數溝槽13〇。 再請參閱圖2，係圖1所示包裝盒10之局部放大示意 圖。該溝槽13 0係由複數長條狀突起131平行間隔設置而 成。該突起131之截面呈矩形，其包括一第一抵接面133 200821234 及-第二抵接面135，該第-抵接面133與該第二抵接面 135相對設置，且該第一抵接面133與該第二抵接面135 均垂直於該盒體120之側壁122。每二相鄰突起131之第 一抵接面133與第二抵接面135配合該側壁122圍成該 槽 130。 ' 包裝過私中，將玻璃基板安裝於該盒體12〇之溝槽 内，並藉由該突起131之第一抵接面133與該相鄰突起ΐ3ι 之第二抵接面135夾持以固定；然後相互配合嵌套該盒體 120及蓋體140;當需要把玻璃基板抽出時，使該蓋體14〇 脫離該盒體120，取出玻璃基板即可。 而以該種玻璃基板包裝盒10運送，由於該包裝盒1〇 之盒體120係由樹脂發泡材料所製成，雖然該結構具有緩 衝性能佳、重量輕之優點，但仍然具有以下缺點： 首先，該包裝盒10内表面突起131之截面呈矩形，結 構均一，緩衝能力差，當受外力衝擊時，玻璃基板容易因ϋ 應力集中造成損壞或者破裂，降低運送過程中的安全係數。 其次，採用該包裝方式，由於該第一抵接面133及第 ―，接面135均貼合與該玻璃基板邊緣表面，所以玻璃基 板合易與相鄰二突起131之抵接面133、135接觸摩擦影響 玻璃基板之潔淨度，更有甚者，破壞玻璃基板邊緣表面之 電路，如·薄膜電晶體基板表面之邊緣金屬線。 【發明内容】 _有鏗於上述内容，有必要提供一種避免應力集中，緩 衝外力扣擊對玻璃基板造成的損壞、且提高運送過程中安 200821234 全係數之玻璃基板包裝盒。 有鑑於上述内容，有必要提供一種防止玻璃基板損 壞，緩衝外力撞擊對玻璃基板造成的損壞、且提高運送過 程中安全係數之玻璃基板包裝構造。 一種用於運送玻璃基板之包裝盒，其包括一盒體，該 盒體包括至少二相對間隔設置之側壁，該側壁之二相對侧 表面設置有複數楔形柱狀突起，該突起包括一垂直於該侧 壁之抵接面及一斜面，該斜面遠離該侧壁端朝該抵接面方 向傾斜。 種玻璃基板包裝構造，其包括複數玻璃基板及一盒 體，該盒體包括至少二相對間隔設置之侧壁，其中該侧壁 之二相對側表面設置有複數楔形柱狀突起，該突起包括: 垂直於該㈣之抵接面及—斜面，該斜面遠離該側壁端朝 該抵接面方向傾斜，該玻璃基板對應收容於二相鄰突起間。 相較於先前技術，上述用於運送玻璃基板之包裝今及 其包裝構造’藉由該突起之抵接面配合該斜面夾持玻；基 板，有效緩衝外力的震動、撞擊對玻璃基板引起的損壞， 同守斜面;^離該债j壁端朝該抵接面方向傾_，減少該溝槽 2面與該玻璃基板之制面積，有效㈣玻璃基板邊^ 區域表面受摩擦而損壞。 【實施方式】 請參_ 3’係—種較佳實施方式所揭示之玻璃基板 =裝構造立體分解示意圖。該包袭構造2包括複數玻璃 基板4〇及—包裝盒20。肖包褒盒20包括-盒體21及一 200821234 * 蓋體25,該盒體21與該蓋體25相互嵌套配合形成一收容 空間（未標示），該複數玻璃基板40收容於該收容空間。 ~ 該玻璃基板40可以為液晶顯示面板、電漿顯示用玻璃 • 基板及一般玻璃基板，同時還可以用來運送背光板、彩色 濾光板、薄膜電晶體等。取該玻璃基板40為薄膜電晶體基 板為例，在該玻璃基板40的邊緣區域通常設置有薄膜電晶 體引腳、積體電路晶片及軟性電路板等重要元件，在運送 過程中，需要避免受到外力撞擊以及相互摩擦造成對上述 ί 重要元件的損壞。 該包裝盒20之盒體21包括四個内侧壁211、一底壁 212及四個外側壁214。該四個外侧壁214分別垂直於該底 壁212，該外側壁213首尾依次連接，且配合該底壁212 圍成一矩形無蓋收容空間，該内侧壁211與該外侧壁214 係一體成型，並高於該外側壁214。其中二相對内側壁211 表面設置有平行間隔設置之複數條狀突起213，每二相鄰 條狀突起213之間形成一溝槽215以收容玻璃基板40,該 複數條狀突起213與該盒體21 —體成型。 再請結合參閱圖4,係圖3所示盒體21之局部放大示 意圖。該突起213係自該内侧壁211延伸出之根部較寬頂 端較窄之楔形柱體，其包括一第一抵接面2131及一與該第 一抵接面2131相對之第二抵接面2133，且該第一抵接面 2131與該第二抵接面2133呈不對稱設置，該第一抵接面 2131垂直於該側壁211，該第二抵接面2133遠離該内侧壁 211端朝第一抵接面2131方向傾斜。該第一抵接面2131 11 200821234 與相鄰突起213之第二抵接面2133配合該内側壁211圍成 溝槽215，使得該溝槽215具有靠近有靠近内側壁211端 寬度大於遠離該内側壁211端寬度之結構，每二相鄰溝槽 215藉由該突起213間隔開來，同時該相對内側壁211表 面之溝槽215——對應。 請參閱圖5,係圖3所示盒體21之底壁212内表面平 面示意圖。在底壁212内表面亦設置有複數溝槽215及複 數凹凸圖案216。該溝槽215同樣由複數條狀突起213間 隔形成，該溝槽215之結構與位於側壁211上之溝槽215 結構一致，且位於底壁212内表面之每一溝槽215分別與 位於相對内側壁211上之二溝槽215對應，即：在組裝過 程中，每一玻璃基板40分別由位於二相對内側壁211及底 壁212内表面上之溝槽215所夾持。 該凹凸圖案216分佈於該212内表面，且該凹凸圖案 216之高度低於該底壁212之溝槽215之高度。該凹凸圖 案216係用具彈性之凸塊，其與該盒體21係一體成型。該 凹凸圖案216可以有效緩衝在外力衝擊時強力衝擊玻璃基 板40，更可以避免包裝盒20撞擊時引起的應力集中，進 一步有效保護玻璃基板40。 請再次參閱圖3，該蓋體25係一有頂蓋體，該蓋體25 具有一與該盒體21内側壁211及外侧壁214對應之階梯結 構（圖未示），以實現該盒體21與該蓋體25之嵌套配合。 請參閱圖6,在包裝過程中，採用包裝盒20包裝該玻 璃基板40包括如下步驟： 12 200821234 首先提供該盒體25 ; 然後將玻璃基板40依次***該盒體25之溝槽215 内’每一玻璃基板40分別藉由位於該二相對設置之^侧壁 211表面及該底壁212内表面之溝槽215以夾持，該玻璃 基板40係一薄膜電晶體基板，其設置有金屬線路之^面靠 近該第二抵接面2133設置，而未設置金屬線路之表面靠近 該第一抵接面2131設置； 接著蓋合該蓋體21，並使該蓋體21側壁上之台階結 構與該盒體25之内側壁211及外側壁214對應嵌套配合， 使得該玻璃基板40收容於該包裝盒2〇内獲得包裝構造2。 當需要取出玻璃基板40時，只需要打開蓋體25，直 接抽取出該玻璃基板40即可。 ^該包裝盒20係採用樹脂發泡材料構成，如作為聚烯烃 系發泡體之局密度聚乙烯、聚丙烯、低密度聚乙烯、乙烯_ ^酸乙烯酯共聚合物等。樹脂發泡材料係使含有發泡劑之 聚烯烃系小球或其一次發泡體填充於模具内，以一定溫度 加熱而製造，其發泡倍率控制在3〜3〇倍。該發泡方法可 以採用低壓發泡法，所以可以使用低成本之鋁型模具。樹 脂發泡材料所形成之各部份厚度，根據強度需求，以15〜 100mm為適當。 相較於先前技術，在該玻璃基板包裝構造2中，利用複 數突起213間隔出複數溝槽215收容並夾持該玻璃基板4〇。 該第一抵接面2131抵接該玻璃基板4〇之背面，有效緩衝外 力的震動、撞擊對玻璃基板40引起的損壞；同時因為該溝 13 200821234 槽215具有靠近内侧壁211端寬度大於遠離該内側壁211端 寬度之結構，所以該第二抵接面2133並沒有完全於該玻璃 基板40之表面完全貼合，減少該第二抵接面2133與玻璃基 板40之接觸面積，從而降低該玻璃基板40在運送過程中， 與該第二抵接面2133摩擦或者撞擊造成對玻璃基板40之損 壞之風險。如：該玻璃基板40為薄膜電晶體基板時，由於 該薄膜電晶體基板一侧表面設置有複數金屬線路等元器 件，所以該第二抵接面2133與該薄膜電晶體基板之具複數 金屬線路側之表面接觸面積減少，有效降低該薄膜電晶體 基板表面金屬線路受摩擦損壞之風險，提高其在運送過程 中之安全係數。 當然，如果該玻璃基板40為彩色濾光片基板，則在插 入該溝槽215時，將該第一抵接面2131抵接該彩色濾光片 及板之背面，表面設置有透明導電層側則靠近該第二抵接 面2133，則亦可避免該彩色濾光片基板表面之透明導電層 因摩擦而受相’有效保護該彩色遽光片基板。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施方式，舉 凡熟悉本案技藝之人士，在援依本案發明精神所作之等效 修飾或變化，皆應包含於以下之申請專利範圍内。 14 200821234 【圖式簡單說明】 圖1係一種先前技術之玻璃基板包裝盒立體示意圖。 圖2係本發明圖1所示包裝盒盒體之局部放大示意圖。 圖3係本發明一種較佳實施方式所揭示玻璃基板包裝構造 立體分解示意圖。 圖4係本發明圖3所示包裝盒盒體之局部放大示意圖。 圖5係本發明圖3所示包裝盒盒體之底壁平面示意圖。 圖6係本發明圖3所示之包裝盒之盒體與玻璃基板之立體 組裝示意圖。 【主要元件符號說明】 包裝構造 2 第二抵接面 2133 包裝盒 20 外侧壁 214 盒體 21 溝槽 215 内侧壁 211 凹凸圖案 216 底壁 212 蓋體 25 突起 213 玻璃基板 40 第一抵接面 2131 15200821234 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a package and a package structure, and more particularly to a package for transporting a glass substrate and a package structure thereof. [Prior Art] With the development of digital technology, liquid crystal display products have been widely used in various aspects of daily life. For liquid crystal display modules, the role of glass substrates is like wafers in the semiconductor industry. Therefore, liquid crystal: The display industry's requirements for glass substrates are almost perfect. _ Glass is a kind of brittle material. When it is hit by an external force or falls to the ground, it is easily broken so that it cannot be used. In the process of making a liquid crystal display panel, the problem of transporting the color filter substrate and the thin film transistor substrate is crucial. During the transportation of the above substrate, it is susceptible to chemical contamination, and when the substrate is rubbed with other packages, the surface circuit or components of the color filter substrate and the thin film transistor substrate are easily damaged. The prior art glass substrate transport is primarily by placing the glass substrate in a package for shipping. As shown in Fig. 1, a glass substrate package is made of a foamed resin. The package 10 includes a casing 12 and a cover 140. The casing 120 and the cover 140 are nested with each other to form a receiving space for receiving the glass substrate. A plurality of grooves 13 有用 for supporting the glass substrate are disposed on the inner surface of the opposite side wall 122 of the casing 120. Referring again to Figure 2, a partial enlarged view of the package 10 of Figure 1 is shown. The groove 130 is formed by connecting a plurality of elongated protrusions 131 in parallel. The protrusion 131 has a rectangular cross section, and includes a first abutting surface 133 200821234 and a second abutting surface 135. The first abutting surface 133 is opposite to the second abutting surface 135, and the first abutting The junction 133 and the second abutment surface 135 are both perpendicular to the sidewall 122 of the casing 120. The first abutting surface 133 of each of the two adjacent protrusions 131 and the second abutting surface 135 cooperate with the side wall 122 to enclose the groove 130. In the packaging, the glass substrate is mounted in the groove of the casing 12, and is sandwiched by the first abutting surface 133 of the protrusion 131 and the second abutting surface 135 of the adjacent protrusion ΐ3ι Fixing; then nesting the casing 120 and the lid 140 with each other; when the glass substrate needs to be taken out, the lid 14 is detached from the casing 120, and the glass substrate can be taken out. In the case of the glass substrate package 10, since the case 120 of the package is made of a resin foamed material, although the structure has the advantages of good cushioning performance and light weight, it still has the following disadvantages: First, the inner surface protrusion 131 of the package 10 has a rectangular cross section, uniform structure, and poor buffering ability. When impacted by an external force, the glass substrate is liable to be damaged or broken due to stress concentration, thereby reducing the safety factor during transportation. Then, according to the packaging method, since the first abutting surface 133 and the first and second connecting surfaces 135 are bonded to the edge surface of the glass substrate, the glass substrate is easily abutted against the abutting surfaces 133 and 135 of the adjacent two protrusions 131. The contact friction affects the cleanliness of the glass substrate, and more particularly, the circuit that damages the edge surface of the glass substrate, such as the edge metal line on the surface of the thin film transistor substrate. SUMMARY OF THE INVENTION _ In view of the above, it is necessary to provide a glass substrate package that avoids stress concentration, buffers damage caused by external force to the glass substrate, and improves the transportation process. In view of the above, it is necessary to provide a glass substrate package structure that prevents damage to the glass substrate, buffers external force from colliding with the glass substrate, and improves the safety factor during transportation. A package for transporting a glass substrate, comprising a box body, the box body comprising at least two oppositely spaced side walls, wherein two opposite side surfaces of the side wall are provided with a plurality of wedge-shaped columnar protrusions, the protrusions comprising a vertical An abutting surface of the side wall and a sloped surface that is inclined away from the side wall end toward the abutting surface. A glass substrate packaging structure comprising a plurality of glass substrates and a box body, the box body comprising at least two oppositely spaced side walls, wherein the opposite side surfaces of the side walls are provided with a plurality of wedge-shaped columnar protrusions, the protrusions comprising: The abutting surface perpendicular to the (four) and the inclined surface are inclined away from the side wall end toward the abutting surface, and the glass substrate is correspondingly received between the two adjacent protrusions. Compared with the prior art, the above-mentioned package for transporting a glass substrate and its packaging structure 'clamp the glass by the abutting surface of the protrusion; the substrate effectively buffers the shock of the external force and the damage caused by the impact on the glass substrate , the same as the inclined surface; ^ from the wall side of the debt j toward the abutting surface direction _, reducing the area of the groove 2 and the glass substrate, effectively (four) the surface of the glass substrate is damaged by friction. [Embodiment] A glass substrate according to a preferred embodiment of the preferred embodiment is schematically exploded. The enveloping structure 2 includes a plurality of glass substrates 4 and a package 20. The casket 20 includes a box body 21 and a 200821234 * cover body 25. The box body 21 and the cover body 25 are nested with each other to form a receiving space (not shown). The plurality of glass substrates 40 are received in the accommodating space. . ~ The glass substrate 40 can be a liquid crystal display panel, a glass for plasma display, a substrate, and a general glass substrate, and can also be used for transporting a backlight, a color filter, a thin film transistor, and the like. Taking the glass substrate 40 as an example of a thin film transistor substrate, important elements such as a thin film transistor pin, an integrated circuit chip, and a flexible circuit board are usually provided in the edge region of the glass substrate 40, and it is necessary to avoid being subjected to transportation during transportation. External force impact and mutual friction cause damage to the above important components. The casing 21 of the package 20 includes four inner side walls 211, a bottom wall 212 and four outer side walls 214. The four outer side walls 214 are respectively perpendicular to the bottom wall 212. The outer side walls 213 are connected end to end, and are combined with the bottom wall 212 to form a rectangular coverless receiving space. The inner side wall 211 is integrally formed with the outer side wall 214, and Higher than the outer sidewall 214. A plurality of strip-shaped protrusions 213 are disposed on the surface of the two opposite inner sidewalls 211, and a groove 215 is formed between each two adjacent strip-shaped protrusions 213 to receive the glass substrate 40. The plurality of strip-shaped protrusions 213 and the box body 21 - Body molding. Referring again to Fig. 4, a partial enlarged view of the casing 21 shown in Fig. 3 is shown. The protrusion 213 is a wedge-shaped cylinder having a narrower top end than the root portion 211. The protrusion 213 includes a first abutting surface 2131 and a second abutting surface 2133 opposite to the first abutting surface 2131. The first abutting surface 2131 is disposed asymmetrically with the second abutting surface 2131. The first abutting surface 2131 is perpendicular to the sidewall 211, and the second abutting surface 2133 is away from the inner sidewall 211. The abutting surface 2131 is inclined. The first abutting surface 2131 11 200821234 and the second abutting surface 2133 of the adjacent protrusion 213 cooperate with the inner side wall 211 to form a groove 215, so that the groove 215 has a width close to the end of the inner side wall 211 and is farther away from the inner side. The structure of the width of the end of the wall 211 is such that each of the two adjacent grooves 215 is spaced apart by the protrusion 213, and the groove 215 corresponding to the surface of the inner side wall 211 is corresponding. Referring to Fig. 5, there is shown a plan view of the inner surface of the bottom wall 212 of the casing 21 shown in Fig. 3. A plurality of grooves 215 and a plurality of concave and convex patterns 216 are also disposed on the inner surface of the bottom wall 212. The trench 215 is also formed by a plurality of strip-shaped protrusions 213. The structure of the trench 215 is identical to the structure of the trench 215 on the sidewall 211, and each trench 215 on the inner surface of the bottom wall 212 is located opposite to the inner side. The two grooves 215 on the wall 211 correspond to each other, that is, each of the glass substrates 40 is sandwiched by the grooves 215 on the inner surfaces of the two opposite inner side walls 211 and the bottom wall 212, respectively. The concave-convex pattern 216 is distributed on the inner surface of the 212, and the height of the concave-convex pattern 216 is lower than the height of the groove 215 of the bottom wall 212. The concave-convex pattern 216 is an elastic bump which is integrally formed with the casing 21. The concave-convex pattern 216 can effectively cushion the glass substrate 40 when it is impacted by an external force, and can further avoid stress concentration caused when the package 20 is hit, thereby further effectively protecting the glass substrate 40. Referring to FIG. 3 again, the cover body 25 has a top cover body. The cover body 25 has a stepped structure (not shown) corresponding to the inner side wall 211 and the outer side wall 214 of the case body 21 to realize the cover body. 21 mates with the nest of the cover 25. Referring to FIG. 6, during the packaging process, packaging the glass substrate 40 with the package 20 includes the following steps: 12 200821234 First, the case 25 is provided; then the glass substrate 40 is sequentially inserted into the groove 215 of the case 25. A glass substrate 40 is respectively sandwiched by a groove 215 located on the surface of the oppositely disposed side wall 211 and the inner surface of the bottom wall 212. The glass substrate 40 is a thin film transistor substrate provided with a metal line. The surface is disposed adjacent to the second abutting surface 2133, and the surface of the metal line is not disposed adjacent to the first abutting surface 2131; then the cover 21 is covered, and the step structure on the side wall of the cover 21 is The inner side wall 211 and the outer side wall 214 of the casing 25 are nested and mated so that the glass substrate 40 is received in the package 2 to obtain the package structure 2. When it is necessary to take out the glass substrate 40, it is only necessary to open the lid body 25 and directly extract the glass substrate 40. The package 20 is made of a resin foamed material such as a local density polyethylene, a polypropylene, a low density polyethylene, an ethylene vinyl acetate copolymer or the like as a polyolefin foam. In the resin foaming material, a polyolefin-based pellet containing a foaming agent or a primary foam thereof is filled in a mold and heated at a constant temperature, and the expansion ratio is controlled to be 3 to 3 times. The foaming method can employ a low pressure foaming method, so that a low cost aluminum mold can be used. The thickness of each part formed by the resin foaming material is suitably 15 to 100 mm depending on the strength requirement. In the glass substrate package structure 2, the plurality of grooves 215 are accommodated by the plurality of grooves 215 to sandwich and hold the glass substrate 4''. The first abutting surface 2131 abuts against the back surface of the glass substrate 4, effectively buffering the shock of the external force and causing damage to the glass substrate 40; and because the groove 13200821234 has a width closer to the end of the inner side wall 211 than the distance The width of the end of the inner side wall 211 is such that the second abutting surface 2133 does not completely adhere to the surface of the glass substrate 40, reducing the contact area between the second abutting surface 2133 and the glass substrate 40, thereby reducing the glass. The substrate 40 rubs or collides with the second abutting surface 2133 during transportation to cause damage to the glass substrate 40. For example, when the glass substrate 40 is a thin film transistor substrate, since the surface of the thin film transistor substrate is provided with a plurality of components such as a metal line, the second abutting surface 2133 and the thin film transistor substrate have a plurality of metal lines. The surface contact area of the side is reduced, which effectively reduces the risk of friction of the metal circuit on the surface of the thin film transistor substrate and improves the safety factor during transportation. Of course, if the glass substrate 40 is a color filter substrate, when the trench 215 is inserted, the first abutting surface 2131 abuts the back surface of the color filter and the plate, and the surface is provided with a transparent conductive layer side. When the second abutting surface 2133 is adjacent to the second abutting surface 2133, the transparent conductive layer on the surface of the color filter substrate can be prevented from being effectively protected by the phase of the color filter substrate. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. 14 200821234 [Simple description of the drawings] Fig. 1 is a perspective view of a prior art glass substrate package. Fig. 2 is a partially enlarged schematic view showing the package case of Fig. 1 of the present invention. Fig. 3 is a perspective exploded view showing the packaging structure of a glass substrate according to a preferred embodiment of the present invention. Fig. 4 is a partially enlarged schematic view showing the package case of Fig. 3 of the present invention. Figure 5 is a plan view showing the bottom wall of the package case shown in Figure 3 of the present invention. Fig. 6 is a perspective view showing the three-dimensional assembly of the casing and the glass substrate of the package shown in Fig. 3 of the present invention. [Description of main component symbols] Packaging structure 2 Second abutting surface 2133 Package 20 External side wall 214 Case 21 Groove 215 Inner side wall 211 Concavo-convex pattern 216 Bottom wall 212 Cover body 25 Protrusion 213 Glass substrate 40 First abutting surface 2131 15