200812750 九、發明說明： • 【發明所屬之技術領域】 本發明係關於一種化學機械研磨（CMP)製程之研磨墊及 其製造方法，詳言之，係關於一種具有中空纖維之研磨墊 及其製造方法。 【先前技術】 抛光一般係指化學機械研磨（CMP)製程中，對於初為粗 φ 糙表面的磨耗控制，其係利用含研磨粒子的研磨漿液平均 分散於一研磨墊之上表面，同時將一待拋光元件抵住該研 磨墊後以重覆規律動作搓磨。該待拋光元件係諸如半導 體、儲存媒體基材、積體電路、LCD平板玻璃、光學玻璃 與光電面板等物體。為了維持該研磨漿液之分佈與流動， 以及化學機械研磨後之平坦化及研磨效率，該研磨墊之上 表面上通常會開設有複數個溝槽或形成一表面紋路。因 此，該研磨墊對於該待拋光物件的拋光效果，易受到該等 _ 溝槽或該表面紋路的影響。 參考圖1，顯示第一種習用具有表面紋路之研磨墊之俯 視示意圖。該研磨墊1之表面紋路包括複數個井字形排列 的直線溝槽11，其中該等直線溝槽！ ！之深度、寬度及間距 係依所需而設計。該等直線溝槽丨丨對該研磨墊丨而言雖具 有較佳的均勻分佈性，可提供研磨漿液較佳的流動性，但 由於連通至該研磨墊1外圍12的通道較多，且該等溝槽u 所佔面積相對於整體的研磨面積比例相當大，將導致大量 的研磨漿液流失。 109890.doc 200812750 參考圖2，顯示第二種習用具有表面紋路之研磨墊之俯 視示意圖。該研磨墊2之表面紋路包括複數個同心之圓形 溝槽21 ’纟中該等圓形溝槽21之深度及寬度係依所需而設 計。該研磨墊2之缺點在於其局部區域的研磨面積差異過 大，幾乎無法達到溝槽面積比的均一性。此外，研磨過程 中所產生之雜質不易快速地離開該研磨墊2，因而影響研 磨精度及該研磨墊2之使用壽命。 因此，有必要提供一種創新且具進步性的具有中空纖維 之研磨墊及其製造方法，以解決上述問題。 【發明内容】 本’X月之主要目的在於提供一種具有中空纖維之研磨200812750 IX. Description of the Invention: • Technical Field of the Invention The present invention relates to a chemical mechanical polishing (CMP) process polishing pad and a method of manufacturing the same, and more particularly to a polishing pad having hollow fibers and a manufacturing method thereof method. [Prior Art] Polishing generally refers to the abrasion control of a rough φ rough surface in a chemical mechanical polishing (CMP) process, which uses an abrasive slurry containing abrasive particles to be evenly dispersed on the upper surface of a polishing pad, and simultaneously After the polishing element is pressed against the polishing pad, it is honed in a repeated regular motion. The component to be polished is an object such as a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat glass, an optical glass, and a photovoltaic panel. In order to maintain the distribution and flow of the slurry, as well as the planarization and polishing efficiency after chemical mechanical polishing, a plurality of grooves or a surface grain are usually formed on the surface of the polishing pad. Therefore, the polishing effect of the polishing pad on the object to be polished is susceptible to the groove or the surface texture. Referring to Figure 1, there is shown a top plan view of a first conventionally used polishing pad having a surface texture. The surface texture of the polishing pad 1 includes a plurality of linear grooves 11 arranged in a shape of a well, wherein the linear grooves are! ! The depth, width and spacing are designed as needed. The linear grooves 较佳 have better uniform distribution to the polishing pad, and can provide better fluidity of the slurry, but there are many channels connected to the periphery 12 of the polishing pad 1 and the The ratio of the area occupied by the grooves u to the overall polished area is quite large, resulting in a large amount of slurry lost. 109890.doc 200812750 Referring to Figure 2, a top view of a second conventionally used polishing pad having a surface texture is shown. The surface texture of the polishing pad 2 includes a plurality of concentric circular grooves 21'. The depth and width of the circular grooves 21 are designed as desired. A disadvantage of the polishing pad 2 is that the difference in the polishing area of the local area is too large, and the uniformity of the groove area ratio is hardly achieved. Further, the impurities generated during the grinding process are not easily separated from the polishing pad 2, thereby affecting the grinding precision and the service life of the polishing pad 2. Therefore, it is necessary to provide an innovative and progressive polishing pad having hollow fibers and a method of manufacturing the same to solve the above problems. SUMMARY OF THE INVENTION The main purpose of the present invention is to provide a grinding machine with hollow fibers.
制，不像習知研磨墊中研磨漿 用時間並無法預估與控制。 L研磨粒子之流通性佳，因此其 用時間較為均勻且可預估與控 卜漿液作用在待拋光元件上的作It is not like the polishing time in the conventional polishing pad. It is impossible to predict and control. The L-grinding particles have good fluidity, so the use time is relatively uniform and can be predicted and controlled to act on the component to be polished.
109890.doc 200812750 體’以覆蓋該等中空纖維；及⑷移除該基板。 【實施方式】 本發明提供-種具有维之研磨塾，該研磨墊係應 用於化學機械研磨（瞻）製程巾對—待拋光元件進行研磨 或拋光。該待拋光7〇件包括但不限於半導體、儲存媒體基 材、積體電路、LCD平板玻璃、光學玻璃與光電面板等物 體。109890.doc 200812750 to cover the hollow fibers; and (4) to remove the substrate. [Embodiment] The present invention provides a polishing pad having a dimension which is applied to a chemical mechanical polishing process to polish or polish a component to be polished. The 7-piece to be polished includes, but is not limited to, a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat glass, an optical glass, and an optoelectronic panel.
參考圖3 ’顯示本發明具有中空纖維之研磨墊之剖面示 思圖’ 4研磨墊3包括-本體31及複數條中空纖維32。該 本體31具有—研磨表面33。在本實施例中該本體31之材質 係為高固成分（High Solid)的PU，其内部具有複數個連續 式或非連續式之孔洞34。然而可以理解的是，該本體31之 材質也可以是壓克力樹脂或是其他樹脂。 參考圖4，顯不本發明所使用之中空纖維之sem照片 圖。本發韻使用之中空纖維係為習知之中空纖維。請同 時參考圖3，該中空纖維32位於該本體31内且開口於該研 磨表面33，且該等中空纖維32之開〇係均勻分散排列。在 本實施例中，該等中空纖維32之材質係選自由聚丙烯 (PP)、聚酯（PET)及尼龍（Nylon)所組成之群。每一該等中 空纖維32之截面之中空面積與其總截面積之比值（中空率） 為10至30%。 在本發明中，每一中空纖維32之截面之中空面積大於一 研磨漿液之研磨粒子（圖中未示）之截面積，俾利研磨漿液 及研磨粒子在該等中空纖維32内流動。藉此，研磨漿液及 109890.doc 200812750 =磨粒子可經由該等巾空纖維32在該研磨墊3上達到全面 ^通’而不像f知研磨塾1，2(圖1及圖2)中研磨漿液的傳輪 《限於溝槽所佔研磨面積比。此外，在本發明中，由於研 磨漿液及研磨粒子之流通性佳，因此其作用在待抛光元件 上的作用時間較為均勻且可預估與控制，不像習知研磨墊 ^圖1及圖2)中研磨漿液作用在待拋光元件上的作用時間 並無法預估與控制。 • 纟本實施例中，該等中空纖維32之開口係均勻分散排 '亦即該等中空纖維32均勻分散於該研磨表面Μ，而且 f等中工纖維32係與該研磨表面33垂直。然而可以理解的 是，該等中空纖維32之開口亦可以排列出特定圖案，例如 排列成複數個同心圓，或是排列成井字形。 車乂佳地在其他貝施態樣中，該等中空纖維Μ更突出於 該研磨表面33之外，如圖5所示，此種實施態樣可利用該 #中工纖維32本身所具有的_性特徵，可達到掃除研磨後 • 之殘屑之效果。 較佳地，該研磨墊3更包括複數條溝槽（圖中未示），位 於該研磨表面33。以俯視觀之，該等溝槽可以是複數個井 字形排列的直線溝槽，或是複數個同心之圓形溝槽。 I發明更包括該研磨墊3之製造方法，其包括以下步 驟首先’提供複數條如圖4之中空纖維32。接著，參考 . 目6，將該等中空纖維32垂直排列於一基板4〇上。在本實 ㈣j中係制靜電吸附之方式使該科空纖㈣排列於該 基板4 0上。在本實施例中，兮@ & K 1 J T該專中空纖維32係均勻分散地 109890.doc 200812750 垂直排列於該基板4〇上，然而可以理解的是，該等中空纖 維32亦可以排列出特定圖案，例如排列成複數個同心圓， 或是排列成井字形。 接著，參考圖7，形成一本體31，以覆蓋該等中空纖維 32 °在本實施例中該本體31之材質係為高固成分（High Solid)的PU ’其内部具有複數個連續式或非連續式之孔洞 34。然而可以理解的是，該本體31之材質也可以是壓克力 樹脂或是其他樹脂。 最後’移除該基板4〇，再翻轉180度即形成圖3所示之研 磨塾3。 惟上述實施例僅為說明本發明之原理及其功效，而非用 以限制本發明。因此，習於此技術之人士可在不違背本發 明之精神對上述實施例進行修改及變化。本發明之權利範 圍應如後述之申請專利範圍所列。 【圖式簡單說明】 圖1顯示第一種習用具有表面紋路之研磨墊之俯視示意 圖， 圖2顯示第二種習用具有表面紋路之研磨墊之俯視示意 圖； 圖3顯示本發明具有中空纖維之研磨墊之剖面示意圖； 圖4顯示本發明所使用之中空纖維之SEM照片圖； 圖5顯示本發明具有申空纖維之研磨墊之另一種實施態 樣之剖面示意圖；及 圖6至7顯示本發明具有中空纖維之研磨墊之製程步驟示 109890.doc -10 - 200812750 意圖。 【主要元件符號說明】 1 第一種習用研磨墊 2 第二種習用研磨墊 3 本發明研磨墊 11 直線溝槽 12 研磨墊外圍Referring to Fig. 3', there is shown a cross-sectional view of a polishing pad having hollow fibers of the present invention. The 4 polishing pad 3 includes a body 31 and a plurality of hollow fibers 32. The body 31 has an abrasive surface 33. In the present embodiment, the body 31 is made of a high solid PU having a plurality of continuous or discontinuous holes 34 therein. However, it can be understood that the material of the body 31 can also be acrylic resin or other resin. Referring to Figure 4, a sem photograph of a hollow fiber used in the present invention is shown. The hollow fiber used in the present invention is a conventional hollow fiber. Referring to FIG. 3 at the same time, the hollow fiber 32 is located in the body 31 and is open to the grinding surface 33, and the openings of the hollow fibers 32 are uniformly dispersed. In the present embodiment, the materials of the hollow fibers 32 are selected from the group consisting of polypropylene (PP), polyester (PET), and nylon (Nylon). The ratio of the hollow area of the section of each of the hollow fibers 32 to the total cross-sectional area (hollow ratio) is 10 to 30%. In the present invention, the hollow area of the cross section of each of the hollow fibers 32 is larger than the cross-sectional area of the abrasive particles (not shown) of the polishing slurry, and the sharpening slurry and the abrasive particles flow in the hollow fibers 32. Thereby, the slurry and the 109890.doc 200812750=the abrasive particles can be fully integrated on the polishing pad 3 via the hollow fibers 32 without being like the grinding 塾1, 2 (Figs. 1 and 2). The transfer wheel of the slurry is limited to the ratio of the grinding area occupied by the groove. In addition, in the present invention, since the slurry and the abrasive particles have good fluidity, the action time on the member to be polished is relatively uniform and predictable and controllable, unlike the conventional polishing pad ^Fig. 1 and Fig. 2 The action time of the abrasive slurry on the component to be polished is not predictable and controllable. • In the present embodiment, the openings of the hollow fibers 32 are uniformly dispersed. That is, the hollow fibers 32 are uniformly dispersed on the polishing surface, and the intermediate fibers 32 such as f are perpendicular to the polishing surface 33. It will be understood, however, that the openings of the hollow fibers 32 may also be arranged in a particular pattern, such as in a plurality of concentric circles or in a well-shaped shape. In other embodiments, the hollow fiber bundles protrude beyond the grinding surface 33. As shown in FIG. 5, such an embodiment can utilize the #中工纤维32 itself. _ Sexual characteristics, the effect of sweeping debris after grinding. Preferably, the polishing pad 3 further includes a plurality of grooves (not shown) on the polishing surface 33. In a plan view, the grooves may be a plurality of linear grooves arranged in a zigzag pattern or a plurality of concentric circular grooves. The invention further includes a method of manufacturing the polishing pad 3, which comprises the steps of first providing a plurality of hollow fibers 32 as shown in Fig. 4. Next, referring to Fig. 6, the hollow fibers 32 are vertically arranged on a substrate 4A. In the embodiment (4), a method of electrostatic adsorption is applied to arrange the hollow fiber (four) on the substrate 40. In the present embodiment, 兮@ & K 1 JT, the hollow fiber 32 is uniformly dispersed, 109890.doc 200812750 is vertically arranged on the substrate 4, however, it can be understood that the hollow fibers 32 can also be arranged. Specific patterns, for example, arranged in a plurality of concentric circles, or arranged in a shape of a well. Next, referring to FIG. 7, a body 31 is formed to cover the hollow fibers 32°. In this embodiment, the material of the body 31 is a high solid PU' having a plurality of continuous or non-internal portions. Continuous hole 34. However, it can be understood that the material of the body 31 can also be acrylic resin or other resin. Finally, the substrate 4 is removed and then rotated 180 degrees to form the abrasive crucible 3 shown in FIG. However, the above-described embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Therefore, those skilled in the art can make modifications and changes to the above embodiments without departing from the spirit of the invention. The scope of the invention should be as set forth in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top plan view showing a first type of polishing pad having a surface texture, and FIG. 2 is a top plan view showing a second polishing pad having a surface grain; FIG. 3 is a view showing the grinding of the hollow fiber of the present invention. Figure 4 is a SEM photograph of a hollow fiber used in the present invention; Figure 5 is a schematic cross-sectional view showing another embodiment of the polishing pad having a hollow fiber of the present invention; and Figures 6 to 7 show the present invention. The process steps of the polishing pad with hollow fibers are shown in the figure 109890.doc -10 - 200812750. [Main component symbol description] 1 The first type of conventional polishing pad 2 The second type of conventional polishing pad 3 The polishing pad of the invention 11 Straight groove 12 Peripheral pad periphery
21 圓形溝槽 31 本體 32 中空纖維 33 研磨表面 34 孔洞 40 基板21 Circular groove 31 Body 32 Hollow fiber 33 Abrasive surface 34 Hole 40 Substrate
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