TW200808533A - Reactive foil assembly - Google Patents

Reactive foil assembly Download PDF

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Publication number
TW200808533A
TW200808533A TW96110374A TW96110374A TW200808533A TW 200808533 A TW200808533 A TW 200808533A TW 96110374 A TW96110374 A TW 96110374A TW 96110374 A TW96110374 A TW 96110374A TW 200808533 A TW200808533 A TW 200808533A
Authority
TW
Taiwan
Prior art keywords
reactive
film
reactive foil
foil
assembly
Prior art date
Application number
TW96110374A
Other languages
English (en)
Inventor
Michael H Bunyan
Original Assignee
Parker Hannifin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Parker Hannifin Corp filed Critical Parker Hannifin Corp
Publication of TW200808533A publication Critical patent/TW200808533A/zh

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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0006—Exothermic brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/286—Al as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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  • Engineering & Computer Science (AREA)
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  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

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200808533 九、發明說明： 【發明所屬之技術領域】 本發明係關於反應性ϋ。更特定而言，本發明係關於一 經封裝之反應性箔組件。 【先前技術】 反應性箔可用於接合各種材料，例如，金屬、半導體、 陶竟、塑膠、聚合物複合物及類似材料。反應性荡甚為有 效地用於接合類似類型之材料或不同類型之材料。非窮舉 性列舉反應性箔之應用，其中包括··將一散熱座安裝於一 晶片組上；將射頻（RF)連接器安裝於印刷電路板上；將陶 瓷裝甲附著於坦克上；安裝濺鍍靶；密封光電池、電容 器、感測器、電子器件，及類似應用。 習慣上，為接合兩種材料，將一反應性箔置於該兩種材 料之間。然後點火該反應性箔，從而引發該反應性箔内存 在之多個奈米層之一放熱反應。此反應於幾分之一秒内每 單位體積產生極大量之能量，從而熔化該反應性箔。所釋 放之能量亦可熔化該等材料之一部分表面，從而形成一堅 固可靠之金屬化接合。更具體而言，反應性箔係多層化結 構且可用於形成兩個或多個表面之間之堅固且永久之黏 曰° 5亥專反應性洎包含由兩種或多種元素或化合物組成之 奈米層堆疊（具有奈米級之厚度），該等層被以交替組態定 位。该等反應性箔係藉由沈積數以千計之由至少兩種元素 或化合物組成之交替奈米層來製造。 一反應性荡之實例係一包括多個由鋁及鎳組成之奈米層 119720.doc 200808533 之多層結構。數以千計之由鋁及鎳組成之奈米層經交替地 沈積以形成該反應性箔。當藉由一能量脈衝點火該反應性 殆時’遠專链及鎳之奈米層開始經受一放熱反應。銘及錄 之放熱反應於幾分之一秒内每單位體積釋放大量熱能。此 外，一旦點火了該反應性箔，則該放熱反應係自蔓延及自 持。該反應性箔釋放足夠熱能，該熱能足以於幾分之_秒 内熔化整個反應性箱。在該放熱反應期間，該反應區域之 溫度可達到一上至1500°C之溫度。當引發該反應時，熱能 以一可預知且可控制之方式流動。藉由變化該反應性箱之 組成、奈米層之厚度及數量，可在該放熱期間控制該溫 度、所釋放之總能量及能流之速度。 自該反應性箔產生之受控且被定位之熱可經组態以在合 意方向上且於任一環境内之合意位置處釋放寬廣範圍之溫 度、熱能及能流。總之，反應性箔係一有前景之精確投遞 熱能之技術。然而，此技術受到如下文所述之各種缺點困 擾。 舉例而言，當接合兩種材料時，將該反應性箔置於兩種 材料之表面之間。將該反應性箔接近地置於該等表面之間 之接合形成部之合意位置處。施加壓力至該等表面以防止 该反應性箔自該接合形成部之合意位置之任一不合意移 動。然而，在該等習用方法中，該反應性箔可能被自該原 始位置移置，因此形成一製作不良或甚至一有缺陷之接 一 因此’需要提供一種系統及一種方法來防止該反應性 邊之不合意移置。 H9720.doc 200808533 此外，藉由使用諸如壓縮該兩個表面之間之反應性箱、 一電脈衝、一火花、一熱細絲及一雷射光束之構件提供一 月b i脈衝來引發該放熱反應。然而，該等所列出之構件中 沒有一者係簡單、可靠、易於使用、廉價且易學易用。因 此，需要一種系統及一種方法來提供一簡單、可靠、易於 • 使用、廉價且易學易用之點火該反應性箔之構件。 ' 此外’在一些情形中當該反應性箔熔化時，熔融材料可 , 飛濺至毗鄰區域上。熔融材料飛濺至毗鄰區域導致毗鄰電 子組件（例如，電容器、電晶體、電阻器、二極體、積體 電路及類似組件）之損壞。因此，需要提供一種系統及一 種方法來保護毗鄰電子組件免於熔融材料之飛濺。 此外，一反應性箔可用於接合兩個表面，其中該接合之 位置係難於接近且該接合區域係甚小。由於該接合之區域 係]、且難於接近更小反應性猪之使用在將該反應性猪 精確操縱放置於該接合形成部之合意位置處方面造成一問 、 題因此，萬要一種系統及一種方法來使小且難於接近之 區域之接合容易。 因此，合意之情形係提供一種系統及一種方法來解決如 •了問題·反應性ϋ之不合意移置、反應性猪之點火、溶化 ， #料自反應㈣之_、及反應性於一甚小絲於接近 之位置處之操縱及安置。 【發明内容】 在^樣中，11明提供一種用於接合兩個物體之反應 性箱組件。該反應性落組件包括一反應性镇及一膜，以使 119720.doc 200808533 該反應性箔定位於該膜上。 在另一態樣中，一用於點火該反應性落之反應性荡點火 組件包含一反應性簿及一個或多個撓性電路。該等挽性電 路中之每-者可包含一個或多個可操作地搞連至該反應性 箔之反應端。 此外在各種悲樣中，本發明提供一種反應性箔點火組 件來提供-用於點火一反應性箱之系統及一方法，該反應 r 性箱點火組件係簡單、可靠、易於使用、廉價、易學易^ 且防止該反應性猪自接合形成部之原始位置之不合意移 置。 ’ 此外，在各種態樣中，本發明提供一種反應性箔組件， 其保護鄰近電子組件免於來自該等經點火之反應性箔之熔 融材料之飛濺。 再者，在各種態樣中，本發明提供一種用於接合兩個表 面之反應性箔組件，其為可再加工性提供光潔斷面特徵。 再者，在各種態樣中，本發明提供一種用於以增強之容 易性接合兩個表面之反應性箔組件，其中接合形成之合意 位置並不難於接近、易於製造且對使用者友好。 【實施方式】 如本文所使用’除非以其他方式提及，”一 ”係指至少一 個。如本發明所使用，術語，，在…之上"（ab〇ve)及，，在…之下，， (below)僅用於描述如該等圖式中所示之組態，且除非以其 他方式提及，皆已被可交替地使用。熟習此項技術者將明 瞭顯而易見之變化（例如，交換”在…之上"斑"在之下"之 119720.doc 200808533 組態），且該等變化涵蓋於由隨附申請專利範圍記錄之本 發明之範嘴内。如本文所使用’關於任何兩個層之術語 ’’定位於…之上"（positioned above)及，，定位於 ， w ·. ·之下” (positioned below)未必需要該等層係直接地彼此贼鄰。換 言之’例如，#-第-層被定位於一第二層之下，此可包 括具有存在於該第一與該第二層之間之其他材料/層之組 態。因此，各種中間材料或層可存在於該等定位於a.上或 下之層之間。此外，如本文所使用，術語—表面内之"開 口 "並不限定於一表面内的由該表面完全地環繞之一開口 或間隔，而其亦意欲包括沿此一表面之邊界之壓痕或凹 陷。該開口可具有包括圓形、半圓形、矩形、三角形、多 邊形、拋物線形、不規則形狀或各種其他形狀中之一組合 之形狀。如本文所使用，術語"附著構件"包括附著兩個^ 體或表面之構件’且其中包括各種構件，例如機械、化 學、熱及類似構件，及（例如）緊固件、黏著劑及鲜料。某 些該等附著構件包括可釋放附著構件，即例如黏性黏著 劑’其提供兩個表面之間的黏合，但經組態以在需要時係 可分離。該附著構件用於根據所預期之目的提供兩個物體 或表面之間之__操㈣連。此外’熟f此項技術者將容易 地瞭解1合㈣著構件可被根據所預期之目的使用，且 全部该等組合皆包括於由隨附於本文之申請專利範圍所界 定之本發明内。 圖1A及1B分別以其俯視圖及侧視圖圖解說明—根據本 固只施例之反應性箔組件1〇〇。反應性箔組件工⑻包 119720.doc 200808533 含一反應性箔1 〇2及一定位於反應性箔1 〇2之下之膜1 〇4。 膜104經定位以使反應性箔102之至少一部分不與膜1〇4重 疊。舉例而言，在圖1A及1B中所圖解說明之組態中，膜 104包含一開口 106(虛線），於該開口上方反應性箔1〇2不與 膜104重疊。在此組態中，反應性箔1〇2完全地覆蓋開口 106，然而在其他可預見組態中，反應性箔ι〇2可僅部分地 覆蓋開口 106。 如於此項技術中所瞭解，反應性箔1〇2係一多層結構且 包含一由兩種或多種元素組成之交替奈米層堆疊。於此應 注意，反應性箔102之多個層（例如，圖⑺及其他圖中所圖 解說明之彼等層）僅係說明性且不代表奈米層之厚度比例 或數量，該等奈米層中之每一者皆具有一大約奈米級之厚 度。藉由沈積數以千計之由兩種或多種元素組成之交替奈 米層製造反應性箔102，且相應地，反應性箔1〇2可具有一 數微米之厚度。 在用於接合兩個物體（未顯示）之使用中，組件1〇〇可被 定位於該兩個物體之乾面之間。可藉由一能量脈衝點火反 應性fl 102, I當點火時，該等奈米層開始經受一放熱反 應。该放熱反應於-短持續時間内每單位體積釋放大量能 篁。一旦反應性箔102被點火，該放熱反應係自蔓延及自 持反應性4 1〇2足以於幾分之一秒内完全地溶化反應性 V白102之熱能。該反應（且因此，所產生之能量）以一可預知 且可控制之方式流動。藉由變化該反應性箱之組成、該等 奈米層之厚度及數量，可控制該溫度、所釋放之能量，及 119720.doc 200808533 月匕流之速度。膜104係一熱穩定及一電絕緣膜，且可自各 種材料構建例如，金屬、非金屬、塑膠、纖維、紗、聚 合物複合物及類似材料。 根據某些其他實施例，使用各種附著構件(包括，機械 構件、化學構件、熱接合或其__組合）將反應㈣⑽於第 -表面108處附著至膜1G4。該等附著構件（未於該等圖式 顯示）（其中）包括：緊固件及黏㈣。反應性箱1〇2與膜1〇4 之此附著允許保持反應性㈣2相對於開口 1()6之定位。此 卜膜104之第一表面Π0亦包含與供第一表面1〇8使用之 ，著構件類似或不同之附著構件。用於第二表面ιι〇之附 著構件允許將膜1〇4附著於一欲接合之表面上。以此方 式，膜104被以一大致穩定之組態定位於欲接合之表面 上，藉此有利地允許大致精確地將反應性箔1〇2定位於欲 接&表面之相關區域上。因此，反應性箔組件1 〇〇之此封 裝有利地消除習用反應性箱解決方案之各種缺點，尤其例 如，欲固定部分之移動、未對準及類似缺點。此外，本發 明藉由僅允許將所需量之反應性箱定位於膜⑽上而提^ 反應性箔102之經濟使用，藉此最小化該反應性箔之浪 費。此特徵潛在地允許大量成本節約。 在由圖1A及1B所圖解說明之實施例中，例如，反應性 其包括數以千計之由鋁（A1)及鎳（Ni) 箔102係一多層結構 組成之之奈;^ ’該等奈米層經交替地沈積以形成反應性 箔102。每一由鋁及鎳組成之奈米層之厚度係約174奈米， 同時反應性箔102之總厚度係約175微米。 119720.doc -11 - 200808533 使用一黏著劑（未顯示）（且較佳地，一可釋放黏著劑）將 反應性搭102附著至箔1〇4。在圖丨八及⑺所圖解說明之實 Μ 例中膜 1 〇4 係一可自 Ε·Ι· du Pont de Nemours and Company構得之Kapt〇n⑧膜。熟習此項技術者應瞭解， Kapton®膜不意謂係限制性，且另一情形係可在不背離本 發明之fe ’之情形下使用具有類似品質之膜，本發明之範 疇由隨附申請專利範圍概述。 在本發明之某些態樣中，反應性箔1〇2可包含呈若干層 形式或其他形式之添加材料。在某些實施例中，該添加材 料係至少一銦銲料層（未顯示）。該等銦銲料層中之每一者 可被沈積於反應性箔1 〇2之一侧或多側上。塗佈有銦層之 反應性箔102可用於（例如）一電子組件至一母板之銲接。一 般而㊁’該添加材枓提供額外功能性或性能至使用如所論 述之反應性箔組件所形成之接合之性質。 反應性箔組件100可被形成為一捲並經封裝以供消耗。 或者，反應性箔組件100可被封裝為一多個反應性箔組件 之堆疊（類似、於箔組件100)。熟習此項技術者將明瞭各種封 裝組態，且該等組態皆包括於隨附至本文之申請專利範圍 内所記錄之本發明之範疇内。 在某些實施例中，反應性箔組件i 00額外地包括一定位 於反應性箔1 02之上之封裝保護膜（未顯示）。該封裝保護膜 可用於使反應性箔組件100呈一經封裝之形式，以及通常 用於保護反應性箔102。該封裝保護膜經組態以被可釋放 地附著至膜104，且經組態以保護反應性箔1〇2免於在封 119720.doc -12- 200808533 裝、運輸或其他在最終消耗之前之中間移動 JLo 日]之無意的 貝之。反應性箔組件1 00可易於被捲起或堆疊以被封穿 該封裝保護膜可類似於膜104或包括其他塑膠膜。 义。 在各個實施例中，該反應性箔組件可被封裝於—囊内， 该囊可係撓性、非撓性或其一組合。該囊可包含_於該囊 . 内部之聚矽氧塗層。可撕破該囊且可（例如）將如上文二封 • 裝之反應性箔組件100自該囊取出以供消耗。 , 圖2 A及2 B以其俯視圖及側視圖圖解說明一根據本發明 之各種其他實施例之反應性箱組件2〇〇。反應性箱組件 包含反應性箔102、膜1〇4及一撓性電路23〇。使用適當附 著構件將撓性電路230附著至膜104(或置於其上）。撓性電 路230包含一反應端232及一電源端234。反應端232被可操 作地與反應性箔102耦連且供應能量脈衝以點火反應性箔 102。電源端234被可操作地與一提供該能量脈衝之電源 (未顯示）耦連，且該電源端可延伸出膜1〇4。撓性電路23〇 被附著至膜104以使反應端232被可操作地耦連至反應性箔 102。在某些實施例中，撓性電路23〇亦可被構建於膜1〇4 之内，亦即，撓性電路230可被置於第一表面1〇8與第二表 面11 0之間。在某些其他實施例中，膜1 〇4可具有在内部構 建之電路（未顯示），該等電路經組態以自該電源供應電力 至反應性箱102。如本文所使用，在撓性電路23〇及膜i 〇4 之背景下’術語’’耦連’’意欲涵蓋包括但不限定於撓性電路 230被附著至膜104、被置於其上或被構建於其中之全部組 態。 119720.doc -13- 200808533 在作業中，當使用該電源供電電源端234時點火反應性 羯102且引發箔1〇4之一放熱反應。該電源可係一交流或一 直流電源，或可僅提供一足以引發該反應之電流脈衝。該 電源包括（例如）電化電池、電燃料電池、太陽電池、發電 機、電力發生器及類似電源。在某些實施例中，該電源係 一 9.0V電池。此外，在另一實施例中，反應性箔組件2〇〇 可具有多個反應性箔。在該等實施例中，反應性箔組件 200經組態以包括多個對應於該多個反應性箔之撓性電 路，或一具有多個對應於該多個反應性箔之反應端之單一 挽性電路230。該等實施例之具體圖式未獨立地包括於該 等圖式中，但熟習此項技術者將易於明瞭。該多個反應性 落中之每一者皆可被定位於第一表面1〇8上之膜1〇4之上， 以使該多個反應性箔中之每一者之至少一部分不與該膜重 璺。反應性箔組件200可被形成為一捲並經封裝以供消 耗。或者，反應性箔組件2〇〇可被封裝為一多個反應性箔 組件之堆疊’類似於經封裝之箔組件2〇〇。熟習此項技術 者將明瞭各種封裝組態，該等組態皆包括於隨附至本文之 申請專利範圍内所記錄之本發明之範缚内。 圖3圖解說明一根據本發明某些實施例之反應性箔組件 3〇〇。反應性箔組件3〇〇包含反應性箔1〇2、膜1〇4及一基膜 340。基膜340被定位於膜104之下且使用適合的附著構件 附著至第二表面11〇。基膜34〇係一熱穩定且電絕緣膜，且 可使用各種材料（例如，金屬、非金屬、塑膠、纖維、 紗、聚合物複合物及類似材料）構建基膜34()。 119720.doc -14 - 200808533 在某些實施例中’基膜340係一 Kapton膜，且用於將膜 1〇4附著至基膜340之附著構件係一黏著劑。該黏著劑（未 於該等圖式中顯示）被置於膜104之介面（亦即，第二表面 110上）與基膜340之間。該黏著劑係一可釋放黏著劑且經 組態以允許剝離基膜340以使該黏著劑被保留於第二表面 110 上。 圖4圖解說明根據本發明之某些態樣之反應性箔組件 3〇〇。基膜340被自膜104半剝離，從而將該可釋放黏著劑 (未顯不）留下於第二表面110上。膜1〇4可被完全地自基膜 340剝離，且膜104同該反應性箱組件一起可被置於兩個欲 被接合之物體中之一者上，以使第二表面丨丨〇被附著至欲 被接合目標中之一者之靶面。反應性箔組件3〇〇可被形成 為捲並經封裝以供消耗。或者，反應性箔組件3〇〇可被 封裝為一多個反應性箔組件（類似於經封裝之箔組件3〇㈨之 堆疊。 圖5圖解說明一根據本發明之各個實施例之組件，其 包括反應性箔組件200(圖2)、一第一物體55〇、一第二物體 5 52、及一緊固系統554。反應性箔組件2〇〇用於將第一物 體550接合至第二物體552。第一物體55〇包含一第—物體 表面556，且第二物體552包含一第二物體表面。反應 性箔組件200被置於第一物體55〇之上以使膜1〇4之第二表 面110被定位於第一物體表面556之上。一附著構件（例 如，一黏著劑）可被應用至第二表面11〇以使第二表面U0 黏著至第—物體表面556。以此方式，反應性ϋ組件200被 119720.doc -15- 200808533 定位於第一物體550之上以使反應性箔1〇2被定位於該第一 物體之目標面。接著將第二物體552放置以附著至第一物 體5 50。第二物體552被定位於反應性箔組件2〇〇之上。因 此，反應性箔組件200被夾於第一物體55〇與第二物體552 之間。使用附著構件，例如該圖中所例示之緊固系統 554，將第一物體55〇與第二物體552固持在一起。緊固系 、、先554被繃緊以避免第一物體55〇與第二物體552之間不欲 之相對移動。撓性電路230之電源端234伸出反應性箔組件 20〇。電源端234可被可操作地耦連至一電源（未於該圖式 中，、、、員示）。g點火该反應性箔時，引發一放熱反應。反應 ^生v| 102之至少一部分在甚短持續時間内（且較佳地，在幾 分之一秒内）熔化。第一物體55〇或第二物體552之至少一 邛刀溶化且同炼融反應性箔（未顯示）一起賦能第一物體5 $ 〇 與第二物體552之間於第一物體表面556及第二物體表面 558處之一金屬化接合。該金屬化接合在點火該反應性箔 之數秒内形成。在該金屬化接合已形成之後，可藉由鬆開 緊固系統554將剩餘反應性箔組件2〇〇(亦即，膜1〇4及撓性 電路230)自第一物體550移除。舉例而言，可使用諸如微 控制器控制之切割器件等精確工具，或熟習此項技術者將 易於想到的且包括於本申請專利範圍之範疇内的其他此類 適當移除方法拉開或適當地切除膜1〇4及撓性電路23〇。 圖6圖解說明根據本發明之某些態樣之組件6〇〇。組件 600包含一反應性箔組件61〇、一散熱座66〇及一晶片組 662。反應性箔組件61〇保護一反應性箔1〇2、一膜1〇4、一 119720.doc -16 - 200808533 撓性電路230及-發泡體框664。發泡體框被置於膜心 之上以使反應性箱102之至少-部分被發泡體框664之至少 一部分環繞。而且，反應性㈣2由發泡體框環繞。使 用各種構件(例如’機械構件、化學構件、熱構件、黏著 劑及類似構件）將發泡體框664附著至膜1()4。此外，散孰 座660被附著至晶片組662以使反應性箱組件_被定㈣ 接合形成部之一合意位置。 發泡體框664形成一壩結構。該壩結構經組態以阻擋由 反應性羯H)2之反應導致之炫融材料之飛滅。因而，發泡 體框664保護晶片組662之外部或延伸區域或其他鄰近電子 組件（例如，.露電容器及類似物）免於由溶融材料之飛減 導致之任一損壞。反應性箱組件61〇可被形成為一捲並經 封裝以供消耗。或者，反應性箔組件61〇可被封裝為一多 個反應性荡組件（類似於經封裝之箱組件61〇)之堆疊。熟習 此項技術者將明瞭各種封I组態，且該等㈣皆涵蓋於如 隨附至本文之中請專利範圍内所記錄之本發明之範嘴。 圖7圖解說明-根據本發明之各個實施例之組件鳩。組 件700包含一反應性箱組件71〇、一散熱座66〇及一晶片組 762。反應性箔組件71〇包含一反應性箔1〇2、一膜1〇4、— 撓性電路230及一保護膜77〇。保護膜77〇被定位於第—表 面飢之膜1〇4之上，以使膜1〇4之至少一部分與保護膜 770重璺且反應性箔} 〇2不與保護膜77〇重疊。而且，保镬 膜770被定位於膜1G4之上錢反應性⑽被保護膜環 繞。使用各種附著構件（例如’機械構件、化學構件、熱 119720.doc -17- 200808533 構件、一黏著劑及類似構件）將保護膜770附著至膜104。 靠近反應性箔102之保護膜770之一部分呈一彎曲組態，亦 即如圖7中所示被升高以形成一壩結構。該壩結構經組態 以阻擋因反應性箔102之反應所導致之熔融材料之飛錢。 此外，散熱座660被附著至晶片組762以使反應性箱組件 710被定位於接合形成部之一合意位置。因而，保護膜77〇 保遵晶片組7 6 2之外部或延伸部分或鄰近電子組件。晶片 組7 6 2可係一電阻器、一積體電路、一處理器、微處理器 及任一可能需要一散熱座之電子器件。晶片組762亦可包 含針柵格陣列（PGA)或球柵格陣列（BGA)。該PGA或BGA 中之任一者被固定至晶片組762以易於將晶片組762接合至 一目標。反應性組件710可被形成為一捲並經封裝以供 消耗。或者，反應性箔組件710可被封裝為一多個反應性 箔組件（類似於經封之箔組件710)之堆疊。熟習此項技術者 將明瞭各種封裝組態，且該等組態皆包括於隨附至本文之 申請專利範圍内所記錄之本發明之範疇内。 圖8A及8B分別圖解說明一根據本發明之各個實施例之 反應性點火組件8 0 0之一俯視圖及一側視圖。反庳性箱點 火組件800包含一反應性箔1 〇2及一撓性電路23〇。撓性電 路230包含一反應端232及一電源端234。撓性電路23〇被附 著至反應性箔230以使反應端232被可操作地耦連至反應性 箔102。撓性電路230被可操作地耦連至反應性箔1〇2。電 源端234被耦連至一電源（未顯示）。撓性電路23〇具有足夠 長度且在將電源端234連接至該電源方面提供一容易性。 119720.doc -18· 200808533 在作業中，該電源供應一能量脈衝，該能量脈衝藉由反 應端232供應至反應性箔1 〇2。此能量脈衝點火反應性羯 102且引發反應性箔1 〇2之一放熱反應。在其他實施例中， 反應點火組件800包含具有多個反應端（類似於反應端232) 之撓性電路230。該多個反應端（未顯示）中之每一者被可操 作地與反應性箔102耦連，且經組態以提供反應性箱1 〇2之 一合意熔化圖案。 如上文藉由各個實施例所揭示，本發明提供數個超過此 項技術之習知狀態之優點。藉由提供一切割成形之膜，該
反應性洎組件可有利地用於接合兩個表面，其中接合形成 部之區域係甚小且通常難於接近。此外，該反應性箔組件 可用於以一有效方式使用經濟數量之該反應性箔將該反應 性箔定位至該相關區域（欲接合該等材料之靶區域）上。由 於該膜與該反應性箔相比為大之大小，該反應性箔於靶位 置之操縱及安置係顯著地方便，於以其他方式較小且難於 接近之區域。此外，如參照各個實施例所論述之反應性箔 組件可經封裝並作為一習用即剝即黏部件提供給最終用 戶。此外，該反應性箔組件可經組態以供"取置and Place)製造。此有利地提供該反應性猪等於其消耗之便利 運輸、操縱及安置，否則此需要極其精密之操縱。 將一第一物體接合至一第二物體之各種實例在各種其他 實例之中包括·接合類似材料之物體；接合不同材料之物 體’將-散熱座安裝於一晶片組上；將射頻連接器安裝於 印刷電路板上，·將”裝甲附著至坦克；安裝賤鍍乾；密 119720.doc -19· 200808533 封光電池、電容器、感測器、電子器件，修 :’溶融反應性^用作—散熱座與—晶m之= :=枓二:外，該反應性箱組件亦具有在諸如軍事煙火 ^★、熔線、結構能量學、火藥點火及類似方面之能量 :方面之應用。根據本發明之各個實施例，本發明亦揭： -種提供—如上文所論述之反應性t组件之方法。而且， 本發明亦可用作一種如上文所論述將一第一表面接合至一
第-表面之方法。此外’本發明亦可用作一種提供—如上 文所論述之反應性箔點火組件之方法。 、雖然本發明容許有各種修改及替代形式，但具體實施例 以實例形式顯不於該等圖式中並詳細闡述於本文中。然 而，應瞭解，本發明並不意欲受限於所揭示之特定形式。 相反，本發明意欲涵蓋歸屬於隨附申請專利範圍所界定之 本發明範疇内的所有修改形式、同等形式及替代形式。 【圖式簡單說明】 閱讀上文詳細闡述並參考該等附圖後，本發明之前述及 其他優點及特徵將變得顯而易見，其中： 圖1A及1B圖解說明一根據本發明各個實施例之反應性 箔組件之俯視圖及側視圖； 圖2A及2B圖解說明一根據本發明各種其他實施例之反 應性箔組件之俯視圖及側視圖； 圖3圖解說明一根據本發明各種其他實施例之反應性箱 組件之一前側視圖； 圖4圖解說明圖3之反應性箱組件之一縱向侧視圖； 119720.doc -20- 200808533 ^圖5圖解說明一包括一根據本發明各個實施例之反應性 、冶組件之組件； 圖6圖解說明一包括一根據本發明各個實施例之反應性 、治組件之組件； 圖7圖解說明一包括一根據本發明各個實施例之反應性 箔組件之組件；且 圖8 A及8B圖解說明一根據本發明各個實施例之反應性 箱點火組件之俯視圖及侧視圖。 【主要元件符號說明】 100 反應性猪組件 102 反應性箔 104 膜 106 開口 108 第一表面 110 第二表面 200 反應性猪組件 230 撓性電路 232 反應端 234 電源端 300 反應性箔組件 340 基膜 500 組件 550 第一物體 552 第二物體 119720.doc •21 - 200808533 554 緊固系統 556 第一物體表面 558 第二物體表面 600 組件 610 反應性箔組件 660 散熱座 662 晶片組 664 發泡體框 700 組件 710 反應性箔組件 762 晶片組 770 保護膜 800 反應性箔點火組件 119720.doc -22-

Claims (1)

  1. 200808533 十、申請專利範圍： 1 · 一種反應性箔組件，其包括： 少一個反應 至少一反應性箔；及 一膜，其定位於該反應性落下， 性箱之至少一部分不與該膜重疊。 2.如請求項1之反應性猪組件，其中該反應性箱組件係存 於一封裝，其中該封裝包括一封裝保護膜。
    3· $請求項2之反應性箱組件，其中該封裝包含呈一捲虹 怨之反應性箔組件。 4.如請求項2之反應性荡組件，纟中該封裝包含呈一堆最 組態之反應性箱組件。 $ 如叫求項1之反應性箔組件， 一 、、办碰Λ /、疋 乂巴栝至少一個發 /體框，其中該至少一個表 1U^ /包體框中之母一者環繞該至 ^'一個反應性箔之至少一部分。 6·如睛求項1之反應性箔組件 ,. 卞具中5亥至少一個反應性箔 至少兩種交替堆疊之材料之奈米層。 7·如請求項6之反應性箔組件， 及鎳。 ，、中5亥至少兩種材料係鋁 其中該至少兩種材料之該 約174奈米。 其中该至少一個反應性箱 其中該至少一個反應性羯 8·如請求項6之反應性箱組件， 等奈米層中之每一者之厚度係 9.如请求項1之反應性箔組件， 之厚度係約175微米。 包含至少一個添加; 119720.doc 200808533 ιι·如請求項ίο之反應性箱組件，其中該至少一個添加材料 被塗佈於該至少一個反應性箔之至少一個表面上。 12.如請求項11之反應性箱組件，其中該至少一個添加材料 係一銦銲料薄膜。 13·如請求項丨之反應性箔組件，其中該膜包含至少一個構 建於該膜内之電路，該至少一個電路包括至少一個反應 端，該反應端經組態以可操作地耦連至該至少一個反應 性箔。 14·如請求項丨之反應性箱組件，其進一步包括至少一個撓 性電路，該至少一個撓性電路被耦連至該膜，該至少一 個撓性電路包括至少一個經組態以耦連至該至少一個反 應性箱之反應端。 15.如請求項丨之反應性箔組件’其中該膜包含一開口，使 得該至少一個反應性箔中之每一者覆蓋該開口之至少一 部分。 1 6_如明求項丨之反應性箔組件，其中該開口具有可選擇之 形狀。 17.如請求項16之反應性箱組件，其中該等形狀係選自由如 下形狀組成之群組：圓形、正方形、矩形、三角形、多 邊形、不規則形狀或其組合。 :求項1之反應性箔組件，其中該膜係由選自由如下 材料組成之群組之材料構建：金屬、非金屬、塑膠、纖 維、紗線及聚合物複合物。 19.如請求们之反應性箱組件，其中該膜係一鍾。 119720.doc -2- 200808533 20·如請求項1之反應性箔組件，其進一步包括一安置於該 膜上之附著構件’以便可使用該附著構件附著該膜之至 少一部分。 21 ·如請求項20之反應性箔組件，其中該附著構件係一黏著 劑。 22.如請求項21之反應性箔組件，其中該黏著劑係一可釋放 黏著劑。 23 ·如凊求項1之反應性箔組件，其進一步包括一定位於該 膜下之基膜，其中該至少一個反應性箔與該基膜重疊， 且其中該膜與該基膜重疊。 24. 如請求項23之反應性箔組件，其中該基膜係由選自由如 下材料組成之群組之材料構建：金屬、非金屬、塑膠、 纖維、紗線及聚合物複合物。 25. 如請求項23之反應性箔組件，其中該基膜係一 Kapt〇n⑧ 膜。 26·如請求項丨之反應性箔組件，其進一步包括一定位於該 膜上之保護膜’其中該膜之至少一部分與該保護膜重 疊，且其中該至少一個反應性箔之至少一部分不與該保 護膜重疊。 27·如請求項26之反應性箔組件，其進一步包括一安置於該 保護膜與該膜之介面上之附著構件。 28·如請求項26之反應性箔組件，其中該附著構件係一黏著 劑。 29·如請求項26之反應性箔組件，其中該保護膜係選自由如 119720.doc 200808533 下材料組成之群組··金屬、非金屬、塑膠、纖維、紗線 及聚合物複合物。 3 0·如請求項26之反應性箔組件，其中該保護膜係一 Kapton® 膜。 31·如請求項26之反應性箔組件，其中該保護膜之至少一部 - 分呈一彎曲組態。 32· —種用於點火反應性箔之反應性箔點火組件，該反應性 箔點火組件包括： / - 1 一反應性箔；及 至少一個撓性電路，其包括至少一個反應端，該至少 一個反應端中之每一者可操作地耦連至該反應性箔。 33·如請求項32之反應性落組件，其中該反應性猪包含至少 一個錮銲料薄膜，該至少一個錮銲料薄膜被塗佈於該至 少一個反應性箔之至少一個表面上。 34· —種用於提供反應性箔組件之方法，該方法包括·· 提供一膜； ' * 提供至少一個反應性箔；及 將忒至少一個反應性箔附著於該膜上，使得該至少一 • 個反應性箔之至少一部分不與該膜重疊。 3 5·如明求項34之方法，其進一步包括將該反應性箔組件捲 成一捲。 36.如:求項34之方法，其進一步包含將至少一個發泡體框 附著至该膜，其中該至少_個發泡體框中之每一者環繞 該至少一個反應性箱之一之至少一部分。 119720.doc 200808533 3 7·如請求項34之方法，其中提供至少一個反應性箔包含將 至少一個銦銲料薄膜沈積於該至少一個反應性箔之至少 一個表面上。 3 8·如請求項34之方法，其進一步包括在該膜之至少一部分 上提供一黏著劑。 39·如明求項34之方法，其進一步包括提供一定位於該膜下 之基膜，使得該至少一個反應性箔與該基膜重疊，且其 中該膜與該基膜重疊。 40·如睛求項39之方法，其進一步包括將一黏著劑安置於該 基膜與该膜之介面上。 41·如請求項34之方法，其進一步包括提供一定位於該膜上 之保護膜，其中該膜之至少一部分與該保護膜重疊，且 该至少一個反應性箔不與該保護膜重疊。 42. 如凊求項4 1之方法，其進一步包含將一黏著劑安置於該 保護膜與該膜之介面上。 43. 如請求項34之方法，其進一步包含提供一定位於該膜上 之保護膜，其中該膜之至少一部分與該保護膜重疊，且 該至少一個反應性箔至少部分地與該保護膜重疊。 44·如β月求項43之方法，其進一步包括將一黏著劑安置於該 保護膜與該膜之介面上。 45·如明求項43之方法，其進一步包括將該保護膜之至少一 部分彎曲離開該膜。 46.如請求項34$ 士、χ ^ , 項34之方法，其進一步包括提供至少一個撓性電 路’該至少、一個撓性電路包括至少一個反應端，該至少 119720.doc 200808533 一個反應端可操 一個撓性電路耦連至該膜，其中該至少 作地耦連至該至少一個反應性箔。 47.如請求項26之方法’其包含將至少—個撓性電路構建於 該膜内’該至少一個撓性電路包括至少一個可操作地耦 連至該至少一個反應性箔之反應端。 48· -種用於提供反應性荡點火組件之方法，財法包括： 提供一反應性箔；
    提供至少一個撓性電路，該撓性電路包括至少一個可 操作地耦連至該反應性箱之反應端。 49·如請求項48之方法，其進一 件形成為一捲。 步包括將該反應性箔點火組 50·如請求項48之方法，其進一步包括將至少一個銦銲料之 薄膜沈積於該至少一個反應性箔之至少一個表面上。 51· —種將第一表面接合至第二表面之方法，該方法包括： 提供一膜； 提供至少一個反應性箔； 將該至少一個反應性箔附著於該膜上，使得該至少一 個反應性箔之至少一部分不與該膜重疊； 將該膜與該至少一個反應性箔之組件放置於該第一表 面與該第二表面之間；且 點火該至少一個反應性箔。 52·如請求項51之方法，其進一步包括提供一包括至少一個 反應端及一電源端之撓性電路，該撓性電路耦連至該 膜，使得該至少一個反應端可操作地耦連至該至少一個 119720.doc 200808533 :^ ’且其中點火該反應性箔包含經由該撓性電路 將能量脈衝輸送至該反應性箔。 53. 54. 如明求項51之方法，其進—步包括提供—包括至少一個 反應端及一電源端之撓性電路，該撓性電路構建於該膜 内，使得該至少一個反應端可操作地耦連至該至少一個 反應丨生v|，且其中點火該反應性箔包含經由該撓性電路 輸送能量脈衝至該反應性箔。 如明求項5 1之方法，其中該提供至少一個反應性箔之步 驟包含將至少一個銦銲料薄膜沈積於該至少一個反應性 箔之至少一個表面上。 119720.doc
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