200808504 (1) 九、發明說明 【發明所屬之技術領域】 本發明是關於板片切斷方法，更詳細上則是關於將超 過板狀構件的外周之板片張貼在板狀構件之後，可以依照 * 板狀構件的形狀來切斷該板片之板片切斷方法。 【先前技術】 Φ 過去，對半導体晶圓（以下，簡稱爲「晶圓」），進 行張貼用來保護該表面的電路面之保護板片。 張貼這種保護板片時進行切斷，係將超過晶圓的外周 之保護薄板張貼在晶圓上之後，沿著晶圓外周令切刀刀刃 移動，依照晶圓的晶圓來切斷保護板片（例如，參考日本 專利文獻1 )。 專利文獻1 :日本專利第29 1 993 8號公報。 • 【發明內容】 <發明所欲解決之課題> 然而，日本專利文獻1所揭示之板片切斷方法，僅是 調整切刀刀刃的***深度，未裝備切刀刀刃的角度調整等 之變更姿勢的機構，而導致種種的缺失。 即是會有的缺失係如第7 ( A )圖所示，對於被張貼 在工作台T上的晶圓W之板片S的面大致成垂直地*** 切刀刀刃5 0的刀刃5 0 A，沿著晶圓W的外周來進行切斷 ，該切斷後進行背面硏磨時，如第7(B)圖所示’產生 -4- (2) (2)200808504 板片S的超出部分L。即是晶圓W由於該外周端以向外側 膨脹的方式進行倒角加工，硏削必然會使直徑變小，該差 則成爲超出部分L。 於是爲了要使前述超出部分L不要產生，如第8(A )圖所示，切刀刀刃50對於板片S的面成傾斜姿勢進行 移位來將板片S切斷即可。然而，這種方法會導致的缺失 係在刀刃5 0 A***時，如該（B )圖所示，受到板片S的 厚度或剛性等的影響，刀尖容易折損。 另外’如第9圖所示，採用以垂直姿勢將刀刃50A插 入板片S之後，令該切刀刀刃5 〇傾斜的方法的情況，會 導致與該移位量相對應而在晶圓W上的板片S產生縐紋 ’又因情況有時還會劃破晶圓W的缺失。 <發明所欲解決之課題> 本發明係針對上述的缺失而提案，其目的則是提供可 以防止：依照板狀構件的形狀來切斷被張貼在晶圓等的板 狀構件之板片時，板片產生皺紋、或劃破晶圓的事態，而 且板片不會超出晶圓的外周之板片切斷方法。 <用以解決課題之手段> 爲了要達成前述目的，本發明是採用一種將超過板狀 構件的外周大小的板片張貼在前述板狀構件之後，經由切 刀刀刃’依照板狀構件的形狀，將前述板片予以切斷之板 片切斷方法，具備有： -5- (3) (3)200808504 沿著前述板狀構件的外周來令切刀刀刃相對移動，依 照前述板狀構件的形狀，將前述板片予以切斷之軌跡，作 爲正規軌跡， 比前述正規軌跡還要更向外側偏離的位置，作爲切斷 開始位置，將切刀刀刃***前述板片之第1步驟；及 以將切刀刀刃***前述板片直接朝向前述正規軌跡逐 漸接近的方式，令切刀刀刃相對移動，將前述板片予以切 斷之第2步驟；及 在前述切刀刀刃位於正規軌跡上的狀態下，令切刀刀 刃相對移動，依照前述板狀構件的形狀，將前述板片予以 切斷之第3步驟。 本發明中，從前述切斷開始位置移動到前述正規軌跡 上之間，該切刀刀刃，最好是以從切斷方向上面來看成爲 切刀刀刃的中心線對於切斷方向成傾斜之特定的進刀角的 方式，進行姿勢移位，在前述正規軌跡上切刀刀刃的刀緣 比背部還要更接近板狀構件的外周的狀態下，將前述板片 予以切斷。 另外，在切刀刀刃從前述切斷開始位置移動到前述正 規軌跡上之間，該切刀刀刃也可以採用：以從切斷方向正 面來看成爲切刀刀刃的中心線對於切斷方向成傾斜之特定 的外傾角的方式，進行姿勢移位，在維持該外傾角的狀態 下，切刀刀刃在前述正規軌跡上移動，不會超過前述板狀 構件的外周，切斷板片的方法。 進而，在切刀刀刃從前述切斷開始位置移動到前述正 -6- (4) 200808504 ' 規軌跡上之間，該切刀刀刃則以切斷方向側面來看成爲切 刀刀刃的中心線，對於切斷方向成傾斜之特定的前趨角的 方式，進行姿勢移位，在將前述板片與刀緣所形成的角度 維持在銳角的狀態下，切刀刀刃在前述正規軌跡上移動， 就可以切斷前述板片。 另外，最好是採用：前述切刀刀刃支撐在被數値控制 之多關節型的機器人上來進行姿勢控制的方法。 〔發明效果〕 依據本發明，可以在比前述正規軌跡還要更向外側偏 開的位置先***切刀刀刃，經由該切刀刀刃接近正規軌跡 的過程，漸漸地變更切刀刀刃的姿勢，不會使正規軌跡附 近的板片產生皺紋，也不會對晶圓 W的外周施加過度的 負荷，依照該晶圓W的形狀來切斷板片。 另外，在從離開晶圓外周的切斷開始位置起至切刀刀 φ 刃移動到正規軌跡上爲止之間，以成爲切斷時的進刀角、 外傾角、前趨角的方式，可調整地設定切刀刀刃的姿勢， 故不會有因位於正規軌跡之切刀刀刃的姿勢而使板片產生 鈹紋、或劃破晶圓之虞，還能夠依據板片的厚度、剛性等 ，以最適當的條件來進行板片的切斷。 進而，可以利用將切刀刀刃支撐在被數値控制之多關 節型的機器人上之切斷，可以進行對切刀刀刃的移動軌跡 施予多樣性來成爲複雜的平面形狀之板片的切斷。 (5) (5)200808504 【實施方式】 以下，參考圖面來說明本發明的實施形態。 第1圖中表示本實施形態之板片切斷裝置1 0、及裝設 在該板片切斷裝置10，並且大致水平地支撐在平面形狀爲 大致圓形之作爲板狀構件的晶圓W，將保護用黏接性的板 片S張貼在該晶圓w的上面（電路面）之工作台T之槪 略正面圖。該圖中，板片切斷裝置10係具備有多關節型 的機器人11、及被保持在該機器人11之切刀刀刃12而構 成。 前述機器人11包含有基體部14、及配置在該基體部 1 4的上面側而朝向箭頭A〜F方向可迴轉地設置之第1臂 15A〜第6臂15F、及安裝在第6臂15F的前端側，即是安 裝在機器人1 1的自由端側之工具保持夾頭1 9。第2、第3 以及第5臂15B、15C、15E係在第1圖中的Y X Z面內可 迴轉地設置，第1、第4以及第6臂15A、15D、15F係可 迴轉地設置在該軸周圍。本實施形態中的機器人1 1係以 數値控制（Numerical Control)來控制。即是各關節對於 加工物（晶圓）的移動量，利用分別對應的數値資訊來控 制，該移動量全部由程式來控制，利用與如同過去的切斷 裝置每次晶圓尺寸變更就要經由手動來變更切刀刀刃的位 置完全不同的方式。進而，過去的切斷裝置係伴隨切刀刀 刃的姿勢變更（後述的進刀角αΐ、外傾角α2、前趨角α3 )，必須每次再度調整切斷直徑，不過本實施形態的機器 人1 1，即使無論如何地變更切刀刀刃的姿勢，仍可以將切 -8- 200808504 (6) 斷直徑維持在高精度的設定値。 前述工具保持夾頭1 9係如第2圖所示，具備有大致 呈圓筒狀的切刀刀刃容納體20、及配置在該切刀刀刃容納 體2 0周方向上大致隔著1 2 0度間隔的位置，拆卸自如地 保持切刀刀刃12之三個夾頭爪21而構成。各夾頭爪21 ' 係設有內方角爲銳角的尖端形狀部2 1 A，藉由空壓，可在 直徑方向上對於切刀刀刃容納體20的中心來進行進退。 φ 前述切刀刀刃12係如第3圖所示，由形成有基部區 域之刀座1 2 A、及拆卸自如地固定在該刀座1 2 A的尖端側 12B所構成。刀座12A爲大致圓柱狀，在該外周面周方向 上大致隔著1 20度間隔的位置之基端側，沿著軸方向形成 有溝槽22，在這些溝槽22中卡合前述夾頭21的尖端形狀 部2 1 A，使切刀刀刃1 2對於工具保持夾頭1 9的位置保持 一定。 另外，刀刃12B包含有支撐在前述前述刀座12A之基 # 部12C、及沿著刀座12A的軸線之背部12D、及從該背部 12D的尖端部12E朝向銳角方向面對之刃緣12F。因此， 刃緣12F變成尖端部12E側的寬度小於基部12C側的寬度 〇 前述工作台T係如第1圖所示，由平面來看大致方形 的外側工作台4 1、及平面大致圓形的內側工作台42所構 成。外側工作台4 1被設置成在與內側工作台42的外緣之 間形成間隙的狀態下可容納該內側工作台42的凹狀’並 且被設置成經由單軸機器人44可對於基台來進行升降。 -9- 200808504 (7) 一方面，內側工作台42被設置成經由單軸機器人46可對 於外側工作台41來進行升降。因此’外側工作台41與內 側工作台42可一體地升降，並且可相互獨立地升降，藉 由此方式，可以依照板片S的厚度、晶圓W的厚度來調 ' 整到特定的高度位置。 在前述工作台T的上部側，配置將板片S捲出至晶圓 W上之板片捲出單元，從該板片捲出單元捲出至晶圓W φ 上之板片S係一面使貼合滾筒（未圖示）在板片S上旋轉 ，一面朝向板片捲出方向移動，將該板片S張貼在晶圓W 的上面。 其次，參考第4〜6圖來說明本實施形態之板片S的切 斷方法。此外，板片 S則依照日本專利特願 2005 — 1 98 8 06號所揭示的要領來張貼至晶圓W上。 如第4圖所示，切斷方向上面來看切刀刀刃12的中 心線對於沿著晶圓W的外周之切斷方向成傾斜之進刀角 φ αΐ、如第5圖所示，切斷方向正面來看切刀刀刃12的中 心線傾斜之外傾角α2、如第6圖所示，切斷方向側面來看 切刀刀刃12的中心線向切斷方向傾斜之前趨角α3，作爲 初始設定，分別輸入至控制器。設定這種進刀角αΐ、外傾 角α2以及前趨角α3的理由，係因要能夠依照板片S的厚 度、或剛性等，在最適當的條件下，進行切斷之故。 另外’刀刃12Β維持前述各角度αΐ、α2、α3來切斷 板片S時，用來依照晶圓W的形狀不會超出地切斷板片s 之移動軌跡，作爲正規軌跡，輸入至控制器。該正規軌跡 -10 - 200808504 (8) 可以藉由晶圓W的直徑來設定。另外，離開前述正規軌 跡之特定的位置（參考第4圖中的點狀虛線位置），作爲 切斷開始位置P來輸入。 接著，將晶圓W載置在工作台τ上，在該晶圓W的 * 上面側張貼板片S。進行張貼時，保持在機器人1 1上的 = 切刀刀刃12，以位置上不會干涉到板片S的方式，在特 定位置待機。 Φ 板片S結束張貼，刀刃12B就會經由機器人11移動 到切斷開始位置P，以刀座1 2 A的軸線變成大致垂直方向 的姿勢，刀刃12B***到板片S的面一定深度。 以此方式，在刀刃12B***到板片S的面的狀態下， 切刀刀刃1 2如第4圖中的點狀虛線所示，上面來看沿著 大致圓弧狀的軌跡，一面接近前述正規軌跡，一面進行板 片S的切斷，並且逐漸進行姿勢移位來成爲前述設定的刀 角αΐ、外傾角α2、前趨角α3，刃緣12F移動到大致接觸 # 到晶圓W的外周的位置，即是移動到正規軌跡上時（參 考第4圖中的實線位置），各角度α 1、α2、α3則變成設 定角度。 然後，維持這些角度，刀刃12Β直經由過機器人在正 規軌跡上，移動，大致經過一迴轉，板片S依照晶圓W 的形狀來進行切斷。 切斷板片S結束之後，切刀刀刃12回歸到特定的待 機位置，一方面，晶圓W藉由搬運裝置（未圖示）進行 搬運之後’經過前述切斷所產生之外側的板片不要部分， -11 - 200808504 Ο) 捲到捲取裝置（未圖示）’下一個晶圓W載置在工作台T 上，之後，依照同樣的要領，進行切斷動作。 因此，依據這樣的實施形態’切刀刀刃12之刀刃 1 2 Β的姿勢，由於是在一面逐漸移位一面移動到與晶圓W 的外周接觸之正規軌跡上之構成’故獲得：板片s產生皺 ' 紋、或劃破晶圓W外周部的缺失可以有效地避免，而且 即使進行晶圓W的背面硏磨’板片S超出該晶圓w外周 Φ 的缺失仍可以解決之效果。 以上，用來實施本發明之最理想的構成、方法等，在 前述文中有所記載，不過本發明並不侷限於此。 即是本發明主要是針對特定的實施形態，予以圖示並 進行說明，不過只要不要脫離本發明之技術上的精神和目 的的範圍，對於以上說明過的實施形態，業者可以針對形 狀、位置或配置等，因應於需求來施予各種的變更。 例如，前述實施形態中，將半導體晶元作爲板狀構件 • 來予以圖示並進行說明過，不過本發明並不侷限於此，玻 璃、鋼板、或是樹脂板、以及其他的板狀構件都可以作爲 對象來應用，半導體晶圓也可以是矽晶圓或化合物半導體 晶圓。另外，板狀構件的平面形狀並不侷限於大致圓形， 也可以是橢圓形、多角形等，具備有各種的平面形狀之形 狀。 【圖式簡單說明】 第1圖爲本實施形態的板片切斷裝置和工作台之槪略 -12- 200808504 (10) 正面圖。 第2圖爲表示機器人的前端側區域之擴大立體圖。 第3圖爲切刀刀刃之擴大立體圖。 第4圖爲保持進刀角來切斷板片之動作說明圖。 ' 第5圖爲保持外傾角來切斷板片之動作說明圖。 ' 第6圖爲保持前趨角來切斷板片之動作說明圖。 第7 ( A )圖爲表示沿著晶圓外周來切斷板片的過去 φ 例之剖面圖。 第7 ( B )圖爲表示因切斷板片後的晶圓背面硏削而 產生超出部分的狀態之部分擴大剖面圖。 第8(A)圖爲表示保持傾斜姿勢來將刀刃***板片 的狀態之剖面圖。 第8 ( B )圖爲表示用來說明在保持傾斜姿勢的狀態 下將刀刃***板片時刀刃受損的情況之剖面圖。 第9圖爲用來說明呈垂直姿勢將刀刃***板片後予以 φ 傾斜的情況的缺失之剖面圖。 【主要元件符號說明】 1 0 :板片切斷裝置 1 1 :機器人 12 :切刀刀刃 12B :刀刃 1 2 D :背部 12F :刃緣 -13- 200808504 (11) 位置 圓（板狀構件） P :切斷開始 S :板片 W :半導体i αΐ :進刀角 α2 :外傾角 α3 :前趨角200808504 (1) IX. OBJECT OF THE INVENTION [Technical Field] The present invention relates to a sheet cutting method, and more particularly to a sheet which is pasted beyond the outer periphery of the sheet member, after being applied to the sheet member, * The shape of the plate member to cut the sheet cutting method of the sheet. [Prior Art] Φ In the past, a semiconductor wafer (hereinafter simply referred to as "wafer") was attached with a protective sheet for protecting a circuit surface of the surface. When the protective sheet is pasted, the protective sheet which is over the outer periphery of the wafer is pasted on the wafer, and then the cutter edge is moved along the outer circumference of the wafer, and the protective sheet is cut according to the wafer wafer. Sheet (for example, refer to Japanese Patent Document 1). Patent Document 1: Japanese Patent No. 29 1 993 8A. [Explanation] <Problems to be Solved by the Invention> However, the sheet cutting method disclosed in Japanese Patent Laid-Open No. 1 is merely to adjust the insertion depth of the cutter blade, and the angle adjustment of the cutter blade is not provided. Changing the posture of the body, resulting in a variety of missing. That is, there is a missing line as shown in Fig. 7(A), in which the face of the sheet S of the wafer W which is posted on the table T is inserted substantially perpendicularly into the edge of the cutter blade 50. The cutting is performed along the outer circumference of the wafer W. When the back surface is honed after the cutting, as shown in Fig. 7(B), 'produces -4- (2) (2) 200808504 the excess portion L of the sheet S . That is, the wafer W is chamfered so that the outer peripheral end expands outward, and the boring inevitably causes the diameter to become small, and the difference becomes the excess portion L. Therefore, in order to prevent the excess portion L from being generated, as shown in Fig. 8(A), the cutter blade 50 is displaced in an inclined posture with respect to the surface of the sheet S to cut the sheet S. However, the loss caused by this method is caused by the insertion of the blade 50 A, and as shown in the figure (B), the blade tip is easily damaged by the thickness or rigidity of the blade S. Further, as shown in Fig. 9, in the case where the blade edge 50A is inserted into the sheet S in a vertical posture, the method of tilting the cutter blade 5 会 is caused to occur on the wafer W corresponding to the shift amount. The plate S produces a crepe pattern, and sometimes the wafer W is broken due to the situation. <Problems to be Solved by the Invention> The present invention has been made in view of the above-described deficiencies, and an object of the invention is to provide a sheet which can prevent a sheet member which is attached to a wafer or the like from being cut according to the shape of a plate member. At the time, the sheet is wrinkled or scratched, and the sheet does not exceed the outer sheet of the wafer. <Means for Solving the Problem> In order to achieve the above object, the present invention employs a sheet in which the outer circumference of the plate-like member is affixed to the sheet-like member, and follows the blade-shaped member according to the blade-shaped member. The shape cutting method for cutting the sheet piece includes: -5-(3) (3)200808504. The cutter blade is relatively moved along the outer circumference of the plate-shaped member, according to the plate-shaped member. a shape in which the trajectory of the sheet is cut as a normal trajectory, which is further displaced outward than the normal trajectory, and a first step of inserting the cutter blade into the sheet as a cutting start position; a second step of cutting the blade to relatively move the cutting blade directly toward the regular trajectory so as to gradually approach the regular trajectory, and the cutting blade is located on a regular trajectory Next, the cutter blade is relatively moved, and the third step of cutting the sheet according to the shape of the plate member is performed. In the present invention, between the cutting start position and the normal trajectory, the cutter blade preferably has a center line of the cutter blade which is inclined with respect to the cutting direction as viewed from the cutting direction. In the manner of the feed angle, the posture is shifted, and the blade is cut in a state where the edge of the cutter blade is closer to the outer circumference of the plate member than the back. Further, the cutter blade may be moved between the cutting start position and the regular trajectory, and the cutter blade may be inclined to the cutting direction as the center line of the cutter blade viewed from the front side in the cutting direction. In the manner of the specific camber angle, the posture is shifted, and the cutter blade is moved on the regular trajectory while maintaining the camber angle, and the method of cutting the sheet does not exceed the outer circumference of the plate-shaped member. Further, when the cutter blade moves from the cutting start position to the positive -6-(4) 200808504' trajectory, the cutter blade becomes the center line of the cutter blade in the cutting direction side surface. The posture shift is performed in such a manner that the cutting direction is inclined to a specific rake angle, and the cutter blade moves on the regular trajectory while maintaining the angle formed by the sheet and the blade edge at an acute angle. The aforementioned sheets can be cut. Further, it is preferable to adopt a method in which the cutter blade is supported by a multi-joint type robot controlled by a number of jaws to perform posture control. [Effect of the Invention] According to the present invention, the cutter blade can be inserted at a position further outward than the normal trajectory, and the posture of the cutter blade can be gradually changed by the process in which the cutter blade approaches the normal trajectory. The sheet in the vicinity of the regular track is wrinkled, and an excessive load is not applied to the outer circumference of the wafer W, and the sheet is cut in accordance with the shape of the wafer W. In addition, between the cutting start position from the outer periphery of the wafer and the time when the cutter φ edge moves to the normal trajectory, the angle of the feed angle, the camber angle, and the front angle at the time of cutting can be adjusted. Since the posture of the cutter blade is set to the ground, there is no possibility that the sheet is creased or the wafer is broken due to the posture of the cutter blade located in the normal trajectory, and the thickness and rigidity of the sheet can be used. The most appropriate conditions are used to cut the sheets. Further, by cutting the cutter blade to the multi-joint type robot controlled by the number of knives, it is possible to perform the cutting of the trajectory of the cutter blade and to make the cutting of the complicated flat shape. . (5) (5) 200408504 [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 shows a sheet cutting device 10 of the present embodiment, and a wafer W which is mounted on the sheet cutting device 10 and which is substantially horizontally supported as a plate-like member having a substantially circular planar shape. A schematic front view of the table T for protecting the adhesive sheet S on the upper surface (circuit surface) of the wafer w. In the figure, the sheet cutting device 10 is configured to include a multi-joint type robot 11 and a cutter blade 12 held by the robot 11. The robot 11 includes a base portion 14 and first and second arms 15A to 15F which are disposed on the upper surface side of the base portion 14 and are rotatable in directions of arrows A to F, and are attached to the sixth arm 15F. The front end side, that is, the tool holding chuck 19 mounted on the free end side of the robot 1 1. The second, third, and fifth arms 15B, 15C, and 15E are rotatably provided in the YXZ plane in Fig. 1, and the first, fourth, and sixth arms 15A, 15D, and 15F are rotatably provided. Around the shaft. The robot 11 in the present embodiment is controlled by a numerical control (Numerical Control). That is, the amount of movement of each joint to the workpiece (wafer) is controlled by the corresponding number of pieces of information, and the amount of movement is controlled by the program, and the wafer size is changed every time with the cutting device as in the past. It is a completely different way to change the position of the cutter blade manually. Further, in the conventional cutting device, the posture of the cutter blade is changed (the feed angle αΐ, the camber angle α2, and the front angle α3 to be described later), and the cut diameter must be adjusted again every time. However, the robot 1 of the present embodiment is used. Even if the posture of the cutter blade is changed anyway, the cut diameter of the cut-8-200808504 (6) can be maintained at a high precision setting. As shown in Fig. 2, the tool holding chuck 19 includes a cutter blade holder 20 having a substantially cylindrical shape, and a cutter holder 20 disposed in the circumferential direction of the cutter blade holder. The position of the interval is configured to detachably hold the three collet claws 21 of the cutter blade 12. Each of the chuck claws 21' is provided with a tip end portion 2 1 A having an acute inner corner, and the air pressure can advance and retreat in the diameter direction with respect to the center of the cutter blade holder 20. φ The cutter blade 12 is constituted by a holder 1 2 A in which a base portion is formed and a tip end side 12B which is detachably fixed to the holder 1 2 A as shown in Fig. 3 . The blade holder 12A has a substantially columnar shape, and a groove 22 is formed along the axial direction at a proximal end side of a position at a distance of substantially 20 degrees from each other in the circumferential direction of the outer circumferential surface, and the collet is engaged in the groove 22 The tip end portion 2 1 A of 21 keeps the position of the cutter blade 1 2 constant with respect to the tool holding chuck 19. Further, the blade 12B includes a base portion 12C supported by the above-described holder 12A, a back portion 12D along the axis of the holder 12A, and a blade edge 12F facing from the tip end portion 12E of the back portion 12D toward the acute angle direction. Therefore, the blade edge 12F has a width on the side of the tip end portion 12E that is smaller than the width on the side of the base portion 12C. The table T is a substantially square outer table 4 and a substantially circular plane as shown in Fig. 1 . The inner table 42 is formed. The outer table 41 is disposed to accommodate the concave shape of the inner table 42 in a state where a gap is formed between the outer edge of the inner table 42 and is set to be possible for the base via the single-axis robot 44. Lifting. -9- 200808504 (7) In one aspect, the inner table 42 is disposed to be lifted and lowered to the outer table 41 via the single-axis robot 46. Therefore, the outer working table 41 and the inner working table 42 can be integrally raised and lowered, and can be raised and lowered independently of each other. In this way, the thickness can be adjusted to a specific height position according to the thickness of the sheet S and the thickness of the wafer W. . On the upper side of the stage T, a sheet unwinding unit that winds the sheet S onto the wafer W is disposed, and the sheet S is unwound from the sheet winding unit to the wafer W φ. The bonding roller (not shown) rotates on the sheet S and moves toward the sheet winding direction, and the sheet S is attached to the upper surface of the wafer W. Next, the cutting method of the sheet S of the present embodiment will be described with reference to Figs. 4 to 6. Further, the sheet S is attached to the wafer W in accordance with the teachings disclosed in Japanese Patent Application No. 2005-1 98 8 06. As shown in Fig. 4, the center line of the cutter blade 12 is inclined at an infeed angle φ α 沿着 along the cutting direction of the outer circumference of the wafer W as shown in Fig. 5, as shown in Fig. 5 The direction of the front side of the cutter blade 12 is inclined by the inclination angle α2. As shown in Fig. 6, the center line of the cutter blade 12 is inclined toward the cutting direction before the inclination of the side angle α3 as the initial setting. , input to the controller separately. The reason why the feed angle αΐ, the camber angle α2, and the front angle α3 are set is to be cut under the most appropriate conditions in accordance with the thickness or rigidity of the sheet S. Further, when the blade 12 is held at the respective angles αΐ, α2, and α3 to cut the sheet S, the movement trajectory for cutting the sheet s according to the shape of the wafer W is not exceeded, and is input as a normal trajectory to the controller. . The normal track -10 - 200808504 (8) can be set by the diameter of the wafer W. Further, a specific position (refer to the dotted dotted line position in Fig. 4) leaving the normal track is input as the cutting start position P. Next, the wafer W is placed on the stage τ, and the sheet S is attached to the upper side of the wafer W. When the post is applied, the cutter blade 12 held on the robot 1 1 stands by at a specific position so as not to interfere with the sheet S in position. Φ When the sheet S is finished, the blade 12B is moved to the cutting start position P via the robot 11, and the axis of the holder 1 2A becomes a substantially vertical direction, and the blade 12B is inserted into the surface of the sheet S to a certain depth. In this manner, in a state where the blade edge 12B is inserted into the surface of the sheet S, the cutter blade 1 2 is indicated by a dotted dotted line in FIG. 4, and the upper side is viewed along a substantially arc-shaped trajectory, and one side approaches the foregoing The normal trajectory is cut off while the sheet S is being cut, and the posture is gradually shifted to become the set angle αΐ, the camber angle α2, the front angle α3, and the edge 12F is moved to the periphery of the wafer W. The position, that is, when moving to the normal trajectory (refer to the solid line position in FIG. 4), the angles α 1 , α 2 , and α 3 become the set angles. Then, while maintaining these angles, the blade 12 is moved straight on the normal trajectory by the robot, and the plate S is cut according to the shape of the wafer W substantially after a revolution. After the cutting of the sheet S, the cutter blade 12 returns to the specific standby position. On the other hand, after the wafer W is transported by the transport device (not shown), the sheet on the outer side is not generated by the cutting. Part, -11 - 200808504 Ο) Roll-to-winding device (not shown) 'The next wafer W is placed on the table T, and then the cutting operation is performed in the same way. Therefore, according to the above-described embodiment, the posture of the blade edge 12 of the cutter blade 12 is formed by moving to a regular trajectory which is in contact with the outer periphery of the wafer W while being gradually displaced, so that the plate s is obtained. The occurrence of wrinkles or scratching of the outer peripheral portion of the wafer W can be effectively avoided, and the effect can be solved even if the back surface honing of the wafer W exceeds the outer circumference Φ of the wafer w. The above-described optimum configuration, method, and the like for carrying out the present invention have been described above, but the present invention is not limited thereto. The present invention has been illustrated and described with respect to the specific embodiments. However, as long as the spirit and the scope of the present invention are not deviated from the scope of the present invention, the embodiments may be Configuration, etc., to apply various changes in response to demand. For example, in the above embodiment, the semiconductor wafer is illustrated as a plate member. However, the present invention is not limited thereto, and the glass, the steel plate, the resin plate, and other plate members are all used. It can be applied as an object, and the semiconductor wafer can also be a germanium wafer or a compound semiconductor wafer. Further, the planar shape of the plate-like member is not limited to a substantially circular shape, and may be an elliptical shape, a polygonal shape or the like, and has various planar shapes. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a sheet cutting device and a table of the present embodiment -12- 200808504 (10). Fig. 2 is an enlarged perspective view showing a front end side region of the robot. Figure 3 is an enlarged perspective view of the cutter blade. Fig. 4 is an explanatory view of the operation of cutting the sheet by maintaining the feed angle. 'Fig. 5 is an explanatory view of the operation of cutting the plate by maintaining the camber angle. ' Fig. 6 is an explanatory view of the operation of cutting the plate by maintaining the front angle. Fig. 7(A) is a cross-sectional view showing a conventional example of cutting the sheet along the outer circumference of the wafer. Fig. 7(B) is a partially enlarged cross-sectional view showing a state in which an excess portion is generated by boring the back surface of the wafer after cutting the sheet. Fig. 8(A) is a cross-sectional view showing a state in which the blade is inserted into the sheet in an inclined posture. Fig. 8(B) is a cross-sectional view showing a state in which the blade is damaged when the blade is inserted into the sheet in a state where the tilt posture is maintained. Fig. 9 is a cross-sectional view for explaining the absence of the case where the blade is inserted into the sheet in a vertical posture and tilted by φ. [Description of main component symbols] 1 0 : Plate cutting device 1 1 : Robot 12 : Cutter blade 12B : Blade 1 2 D : Back 12F : Edge 13 - 200808504 (11) Position circle (plate member) P : cutting start S: plate W: semiconductor i αΐ : feed angle α2 : camber angle α3 : front angle
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