200804572 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種具有表面紋路之研磨墊，詳言之，係 關於一種具有孔洞以儲存研磨漿液之研磨墊。 ” 【先前技術】 拋光一般係指化學機械研磨（CMP)製程中，對於初為粗 " 糙表面的磨耗控制，其係利用含研磨粒子的研磨漿液平均 Φ 分散於一研磨墊之上表面，同時將一待拋光物件抵住該研 磨墊後以重覆規律動作搓磨。該待拋光物件係諸如半導 體、儲存媒體基材、積體電路、LCD平板玻璃、光學玻璃 與光電面板等物體。為了維持該研磨漿液之分佈與流動， 以及化學機械研磨後之平坦化及研磨效率，該研磨塾之上 表面上通常會開設有複數個溝槽或形成一表面紋路。因 此’該研磨墊對於該待拋光物件的拋光效果，易受到該等 溝槽或該表面紋路的影響。 瞻 參考圖1，顯示中華民國公告第5(M429號專利所揭示之 - 具有表面紋路之研磨墊之俯視示意圖。該研磨墊1之表面 • 紋路包括複數個同心之圓形溝槽11，其中該等圓形溝槽n 之深度及寬度係依所需而設計。該研磨墊1之缺點為研磨 過程中所產生之雜質不易快速地離開該研磨墊1，因而影 響研磨精度及該研磨墊1之使用壽命。 參考圖2，顯示中華民國公告第562716號專利所揭示之 具有表面紋路之研磨墊之俯視示意圖。該研磨墊2之表面 紋路包括複數個放射狀之溝槽21 ’其中該等放射狀之溝槽 10989l.doc 200804572 21係連接該研磨墊2之中心22及該研磨塾2之邊緣23。該研 磨塾2之優點為研磨過程中所產生之雜質容易快速地離開 該研磨墊2 ’但是其缺點為研磨漿液内之研磨粒子也快速 地離開該研磨墊2，因而影響研磨精度及該研磨墊2之使用 壽命。 因此，有必要提供一種創新且具進步性的具有表面紋路 之研磨墊，以解決上述問題。 【發明内容】 本發明之主要目的在於提供一種具有表面紋路之研磨 墊，其包括一表面紋路，該表面紋路係位於該研磨墊之一 拋光面上，該表面紋路包括至少一第一溝槽、至少一第二 溝槽及複數個孔洞。該第二溝槽係連接至該研磨墊邊緣， 且忒第溝槽及該第二溝槽交錯而形成複數個交錯點。該 等孔洞係位於該等交錯點上，且該等孔洞之深度係大於該 第一溝槽之深度。 藉此，該第二溝槽可使懸浮於研磨漿液之雜質快速地離 開該研磨墊，而該等孔洞則可以儲存研磨漿液以延長該研 磨水液内之研磨粒子離開該研磨塾之時間。 【實施方式】 本發明提供一種具有表面紋路之研磨墊，該研磨墊係應 用於化學機械研磨（CMP)製程中對一待拋光物件進行研磨 或拋光。該待拋光物件包括但不限於半導體、儲存媒體基 材、積體電路、LCD平板玻璃、光學玻璃與光電面板等物 體0 I09891.doc 200804572 本發明具有表面紋路之研磨墊包括一表面紋 纷’該表面 紋路係位於該研磨墊之一拋光面上，該表面紋路包括至少 一第一溝槽、至少一第二溝槽及複數個孔洞。 览一較隹實 施例中，該第一溝槽以俯視觀之係為複數圈不同半徑之圓 形溝槽且該㈣形溝槽係為同心、，然而該第—溝槽亦可以 是複數圈不同邊長之方形溝槽且該等方形溝槽係為同心， 或是該第一溝槽亦可以是一螺旋狀溝槽或是其他形狀之溝 η ° / 该第二溝槽係係由該研磨塾之一中央部延伸至該研磨塾 之-邊緣，且該第-溝槽及該第二溝槽交錯而形成複數個 交錯點。㈣i也’該第二溝槽由俯牙見觀之係為複數條放射 狀之溝槽’每-第二溝槽可以是直線狀溝槽或是弧狀溝 槽。該等孔洞係位於該等交錯點上，且該等孔洞之深度係 大於該第一溝槽及該第二溝槽之深度。藉此，該第二溝槽 可使懸浮於研磨漿液之雜質快速地離開該研磨墊，而該等 孔洞則可以儲存研磨漿液以延長該研磨漿液内之研磨粒子 離開該研磨塾之時間。 兹以下列實例予以詳細說明本發明，唯並不意味本發明 僅侷限於此等實例所揭示之内容。 實例1 : 參考圖3,顯示本發明實们之研磨塾之俯視示意圖。本 實例之研磨墊3之表面紋路包括複數個第一溝槽31、複數 個第一溝槽32及複數個孔洞33。該等第—溝槽3】係為複數 個同〜圓形溝槽’且該等第一溝槽3】以俯視觀之係為複數 109891.doc 200804572 圈不同半徑之圓形溝槽。該等第二溝槽32係為複數條放射 另之屢槽，母一弟一溝槽32係為直線狀溝槽且係由該研磨 塾3之一中央部延伸至該研磨墊3之邊緣34。1該第等一溝槽 31及該第等二溝槽32交錯而形成複數個交錯點。該等孔洞 33係位於該等交錯點上，且該等孔洞33之深度係大於該等 太 第一溝槽31及該等第二溝槽32之深度。 實例2 : # 參考圖4，顯示本發明實例2之研磨墊之俯視示意圖。本 貝例之研磨墊4之表面紋路包括複數個第一溝槽41、複數 個第二溝槽42及複數個孔洞43。該等第一溝槽“係為複數 個同心圓形溝槽。該等第二溝槽42係為複數條放射狀之溝 槽，每一第二溝槽42係為直線狀溝槽且係由該研磨墊4之 一中央部延伸至該研磨墊4之邊緣44。該第等一溝槽“及 名第等一溝槽42父錯而形成複數個交錯點。該等孔洞係 位於該等交錯點上，且該等孔洞43之深度係大於該等第一 • 溝槽41及該等第二溝槽42之深度。本實例之研磨墊4之表 ， 面紋路與該實例1之研磨墊3之表面紋路之不同處僅在於， ” 该研磨墊4最内圈之第一溝槽411並未與該等第二溝槽“交 錯。 實例3 : 該等第二溝槽 參考圖5，顯示本發明實例3之研磨墊之俯視示意圖。本 貝例之研磨墊5之表面紋路包括複數個第一溝槽$ 1、複數 個第二溝槽52、複數個第一孔洞53及複數個第二孔洞55。 該等第一溝槽51係為複數個同心圓形溝槽。 109891.doc 200804572 52係為複數條放射狀之溝槽，每一第二溝槽52係為直線狀 溝槽且係由該研磨墊5之一中央部延伸至該研磨塾5之邊緣 54。該第等-溝槽51及該料二溝槽52交錯而形成複數個 交錯點。該等第-孔洞53係位於該等交錯點上，且該等第 孔洞53之深度係大於該等第一溝槽41及該等第二溝槽c 之沬度。該等第二孔洞55係位於該等第二溝槽52上但是不 在該等交錯點之位置，且該等第二孔洞55之深度係與該等 第一孔洞53之深度相同。 實例4 : 參考圖6，顯示本發明實例4之研磨墊之俯視示意圖。本 貝例之研磨墊6之表面紋路包括複數個第一溝槽6 i、複數 個第二溝槽62及複數個孔洞63。該等第一溝槽61以俯視觀 之係為複數個同心之方形溝槽，且等該第一溝槽61係為複 數圈不同邊長之方形溝槽。該等第二溝槽62係為複數條放 射狀之溝槽，每一第二溝槽62係為直線狀溝槽且係由該研 磨墊6之一中央部延伸至該研磨墊6之邊緣64。該第等一溝 槽61及該第等二溝槽62交錯而形成複數個交錯點。該等孔 洞63係位於該等交錯點上，且該等孔洞〇之深度係大於該 等第一溝槽61及該等第二溝槽62之深度。 實例5 : 參考圖7，顯示本發明實例5之研磨墊之俯視示意圖。本 貫例之研磨墊7之表面紋路包括一第一溝槽71、複數個第 二溝槽72及複數個孔洞73。該第一溝槽71以俯視觀之係為 一螺旋狀溝槽。該等第二溝槽72係為複數條放射狀之溝 109891.doc •10- 200804572 槽’母一弟一溝槽72係為直線狀溝槽且係由該研磨墊7之 一中央部延伸至該研磨墊7之邊緣74。該第等一溝槽71及 該第等二溝槽72交錯而形成複數個交錯點。該等孔洞乃係 位於該等交錯點上，且該等孔洞73之深度係大於該第一溝 槽71及該等第二溝槽72之深度。 實例6 : 參考圖8，顯示本發明實例6之研磨墊之俯視示意圖。本 實例之研磨墊8之表面紋路包括複數個第一溝槽81、複數 個第二溝槽82及複數個孔洞83。該等第一溝槽81係為複數 個同心圓形溝槽。該等第二溝槽82係為複數條放射狀之溝 槽，母一弟二溝槽82係為弧狀溝槽且係由該研磨墊8之一 中央部延伸至該研磨墊8之邊緣84。該第等一溝槽81及該 第等二溝槽82交錯而形成複數個交錯點。該等孔洞83係位 於该等父錯點上，且該等孔洞83之深度係大於該等第一溝 槽81及戎荨弟二溝槽82之深度。 惟上述實施例僅為說明本發明之原理及其功效，而非用 以限制本發明。因此，習於此技術之人士可在不違背本發 明之精神對上述實施例進行修改及變化。本發明之權利範 圍應如後述之申請專利範圍所列。 【圖式簡單說明】 圖1顯示中華民國公告第504429號專利所揭示之具有表 面紋路之研磨墊之俯視示意圖； 圖2顯示中華民國公告第562716號專利所揭示之具有表 面紋路之研磨墊之俯視示意圖； 109891.doc 11 200804572 圖3顯示本發明實例1之研磨墊之俯視示意圖； 圖4顯示本發明實例2之研磨墊之俯視示意圖； 圖5顯示本發明實例3之研磨墊之俯視示意圖； 圖6顯示本發明實例4之研磨墊之俯視示意圖； 圖7顯示本發明實例5之研磨墊之俯視示意圖；及 圖8顯示本發明實例6之研磨墊之俯視示意圖。 【主要元件符號說明】200804572 IX. Description of the Invention: [Technical Field] The present invention relates to a polishing pad having a surface texture, and more particularly to a polishing pad having a hole for storing an abrasive slurry. [Prior Art] Polishing generally refers to the abrasion control of a rough "rough surface in a chemical mechanical polishing (CMP) process, which uses an average slurry of abrasive slurry containing abrasive particles dispersed on the surface of a polishing pad. At the same time, a workpiece to be polished is rubbed against the polishing pad to repeat the regular motion. The object to be polished is an object such as a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat glass, an optical glass and a photoelectric panel. Maintaining the distribution and flow of the slurry, as well as the planarization and polishing efficiency after chemical mechanical polishing, the surface of the polishing crucible is usually provided with a plurality of grooves or a surface texture. Therefore, the polishing pad is The polishing effect of the polished object is susceptible to the grooves or the surface texture. Referring to Figure 1, there is shown a top view of the polishing pad with surface texture disclosed in the Republic of China Announcement No. 5 (M429 patent). The surface of the mat 1 • The texture includes a plurality of concentric circular grooves 11 wherein the depth and width of the circular grooves n are as desired The disadvantage of the polishing pad 1 is that the impurities generated during the grinding process are not easy to leave the polishing pad 1 quickly, thus affecting the polishing precision and the service life of the polishing pad 1. Referring to FIG. 2, the Patent No. 562716 of the Republic of China is shown. A top view of a polishing pad having a surface texture. The surface texture of the polishing pad 2 includes a plurality of radial grooves 21 ′ wherein the radial grooves 109891.doc 200804572 21 are connected to the polishing pad 2 The center 22 and the edge 23 of the grinding crucible 2. The advantage of the grinding crucible 2 is that the impurities generated during the grinding process are easily and quickly leave the polishing pad 2' but the disadvantage is that the abrasive particles in the abrasive slurry also leave the grinding rapidly. The pad 2 thus affects the grinding precision and the service life of the polishing pad 2. Therefore, it is necessary to provide an innovative and progressive surface-patterned polishing pad to solve the above problems. [The present invention] Providing a polishing pad having a surface texture, comprising a surface texture on a polishing surface of the polishing pad The surface grain includes at least one first trench, at least one second trench, and a plurality of holes. The second trench is connected to the edge of the polishing pad, and the first trench and the second trench are staggered to form a plurality An interlacing point. The holes are located at the staggered points, and the depth of the holes is greater than the depth of the first groove. Thereby, the second groove can quickly leave impurities suspended in the slurry. The polishing pad, wherein the holes can store the polishing slurry to extend the time that the abrasive particles in the polishing water liquid leave the polishing crucible. [Embodiment] The present invention provides a polishing pad having a surface texture, which is applied to the polishing pad. Grinding or polishing a workpiece to be polished in a chemical mechanical polishing (CMP) process, including but not limited to a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat glass, an optical glass, and an optoelectronic panel. I09891.doc 200804572 The polishing pad with surface texture of the present invention comprises a surface pattern which is located on a polishing surface of the polishing pad, the surface texture package At least one first trench, at least one second trench, and a plurality of holes are included. In a preferred embodiment, the first trench is a circular trench having a plurality of different radii in a plan view, and the (four)-shaped trench is concentric, but the first trench may also be a plurality of circles. Square grooves of different side lengths and the square grooves are concentric, or the first groove may also be a spiral groove or other shaped groove η ° / the second groove system is A central portion of the polishing pad extends to the edge of the polishing pad, and the first groove and the second groove are staggered to form a plurality of staggered points. (d) i also 'the second groove is viewed from the view of the plurality of radial grooves'. Each of the second grooves may be a linear groove or an arcuate groove. The holes are located at the staggered points, and the depth of the holes is greater than the depth of the first groove and the second groove. Thereby, the second groove allows impurities suspended in the slurry to quickly exit the polishing pad, and the holes can store the slurry to extend the time during which the abrasive particles in the slurry exit the polishing crucible. The invention is illustrated by the following examples, which are not intended to be construed as limiting the invention. Example 1: Referring to Figure 3, a top plan view of the abrasive crucible of the present invention is shown. The surface texture of the polishing pad 3 of the present example includes a plurality of first grooves 31, a plurality of first grooves 32, and a plurality of holes 33. The first groove 3 is a plurality of the same-circular groove' and the first groove 3 is a circular groove having a different radius in a plan view. The second grooves 32 are a plurality of radiating grooves, and the grooves 32 are linear grooves and extend from a central portion of the polishing pad 3 to the edge 34 of the polishing pad 3. 1. The first groove 31 and the second groove 32 are staggered to form a plurality of interlaced points. The holes 33 are located at the intersections, and the depths of the holes 33 are greater than the depths of the first grooves 31 and the second grooves 32. Example 2: # Referring to Figure 4, a top plan view of the polishing pad of Example 2 of the present invention is shown. The surface texture of the polishing pad 4 of the present embodiment includes a plurality of first grooves 41, a plurality of second grooves 42, and a plurality of holes 43. The first trenches are "a plurality of concentric circular trenches. The second trenches 42 are a plurality of radial trenches, and each of the second trenches 42 is a linear trench and is One of the central portions of the polishing pad 4 extends to the edge 44 of the polishing pad 4. The first groove "and the first groove 42 are the father's fault and form a plurality of interlacing points. The holes are located at the staggered points, and the depth of the holes 43 is greater than the depth of the first grooves 41 and the second grooves 42. The surface of the polishing pad 4 of the present example differs from the surface texture of the polishing pad 3 of the example 1 only in that, the first groove 411 of the innermost ring of the polishing pad 4 does not overlap with the second groove. The slots are "interlaced. Example 3: These Second Grooves Referring to Figure 5, a top plan view of the polishing pad of Example 3 of the present invention is shown. The surface texture of the polishing pad 5 of the present embodiment includes a plurality of first grooves $1, a plurality of second grooves 52, a plurality of first holes 53, and a plurality of second holes 55. The first grooves 51 are a plurality of concentric circular grooves. 109891.doc 200804572 52 is a plurality of radial grooves, each of which is a linear groove and extends from a central portion of the polishing pad 5 to an edge 54 of the polishing pad 5. The first-groove 51 and the second trench 52 are staggered to form a plurality of staggered points. The first holes 53 are located at the staggered points, and the depths of the first holes 53 are greater than the first grooves 41 and the second grooves c. The second holes 55 are located on the second grooves 52 but not at the staggered points, and the depths of the second holes 55 are the same as the depth of the first holes 53. Example 4: Referring to Figure 6, a top plan view of a polishing pad of Example 4 of the present invention is shown. The surface texture of the polishing pad 6 of the present embodiment includes a plurality of first trenches 6 i , a plurality of second trenches 62 , and a plurality of holes 63 . The first trenches 61 are a plurality of concentric square trenches in a plan view, and the first trenches 61 are square trenches having a plurality of different side lengths. The second grooves 62 are a plurality of radial grooves, each of the second grooves 62 is a linear groove and extends from a central portion of the polishing pad 6 to an edge 64 of the polishing pad 6. . The first groove 61 and the second groove 62 are staggered to form a plurality of intersecting points. The holes 63 are located at the staggered points, and the depths of the holes are greater than the depths of the first grooves 61 and the second grooves 62. Example 5: Referring to Figure 7, a top plan view of a polishing pad of Example 5 of the present invention is shown. The surface texture of the polishing pad 7 of the present embodiment includes a first groove 71, a plurality of second grooves 72, and a plurality of holes 73. The first groove 71 is a spiral groove in a plan view. The second grooves 72 are a plurality of radial grooves 109891.doc •10- 200804572 The groove 'mother one groove-72 is a linear groove and extends from a central portion of the polishing pad 7 to The edge 74 of the polishing pad 7. The first groove 71 and the second groove 72 are staggered to form a plurality of interlaced points. The holes are located at the staggered points, and the depth of the holes 73 is greater than the depth of the first groove 71 and the second grooves 72. Example 6: Referring to Figure 8, a top plan view of a polishing pad of Example 6 of the present invention is shown. The surface texture of the polishing pad 8 of the present example includes a plurality of first grooves 81, a plurality of second grooves 82, and a plurality of holes 83. The first trenches 81 are a plurality of concentric circular trenches. The second grooves 82 are a plurality of radial grooves, and the two grooves 82 are arcuate grooves and extend from a central portion of the polishing pad 8 to the edge 84 of the polishing pad 8. . The first groove 81 and the second groove 82 are staggered to form a plurality of interlaced points. The holes 83 are located at the point of the parent error, and the depth of the holes 83 is greater than the depth of the first groove 81 and the second groove 82. However, the above-described embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Therefore, those skilled in the art can make modifications and changes to the above embodiments without departing from the spirit of the invention. The scope of the invention should be as set forth in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top plan view of a polishing pad having a surface grain disclosed in the Patent No. 504429 of the Republic of China; FIG. 2 is a plan view of a polishing pad having a surface grain disclosed in the Republic of China Publication No. 562716. Figure 3 shows a top plan view of the polishing pad of Example 1 of the present invention; Figure 4 shows a top view of the polishing pad of Example 2 of the present invention; Figure 5 shows a top view of the polishing pad of Example 3 of the present invention; 6 is a top plan view showing the polishing pad of Example 4 of the present invention; FIG. 7 is a top plan view showing the polishing pad of Example 5 of the present invention; and FIG. 8 is a top plan view showing the polishing pad of Example 6 of the present invention. [Main component symbol description]
1 研磨墊 2 研磨墊 3 本發明實例1之研磨墊 4 本發明實例2之研磨墊 5 本發明實例3之研磨墊 6 本發明實例4之研磨墊 7 本發明實例5之研磨墊 8 本發明實例6之研磨墊 11 圓形溝槽 21 放射狀之溝槽 22 研磨墊之中心 23 研磨墊之邊緣 31 第一溝槽 32 第二溝槽 33 孔洞 34 邊緣 41 第一溝槽 109891.doc -12· 2008045721 polishing pad 2 polishing pad 3 polishing pad 4 of the inventive example 1 polishing pad 5 of the invention example 2 polishing pad 6 of the inventive example 3 polishing pad 7 of the inventive example 4 polishing pad 8 of the inventive example 5 6 polishing pad 11 circular groove 21 radial groove 22 center of polishing pad 23 edge of polishing pad 31 first groove 32 second groove 33 hole 34 edge 41 first groove 109891.doc -12· 200804572
42 第二溝槽 43 孔洞 44 邊緣 51 第一溝槽 52 第二溝槽 53 第一孔洞 54 邊緣 55 第二孔洞 61 第一溝槽 62 第二溝槽 63 孔洞 64 邊緣 71 第一溝槽 72 第二溝槽 73 孔洞 74 邊緣 81 第一溝槽 82 第二溝槽 83 孔洞 84 邊緣 411 最内圈之第一溝槽 109891.doc -13-42 second groove 43 hole 44 edge 51 first groove 52 second groove 53 first hole 54 edge 55 second hole 61 first groove 62 second groove 63 hole 64 edge 71 first groove 72 Two grooves 73 holes 74 edges 81 first grooves 82 second grooves 83 holes 84 edges 411 the first groove of the innermost ring 109891.doc -13-