TW200803994A - Syringe pump, substrate processing apparatus and substrate processing method - Google Patents

Syringe pump, substrate processing apparatus and substrate processing method Download PDF

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Publication number
TW200803994A
TW200803994A TW096103932A TW96103932A TW200803994A TW 200803994 A TW200803994 A TW 200803994A TW 096103932 A TW096103932 A TW 096103932A TW 96103932 A TW96103932 A TW 96103932A TW 200803994 A TW200803994 A TW 200803994A
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Taiwan
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liquid
piston
chamber
cylinder
hole
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TW096103932A
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Chinese (zh)
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TWI314067B (en
Inventor
Takeshi Fukuchi
Yoshinori Takagi
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Dainippon Screen Mfg
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/0403Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material
    • B05B9/0409Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material the pumps being driven by a hydraulic or a pneumatic fluid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Details Of Reciprocating Pumps (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Reciprocating Pumps (AREA)

Abstract

The invention provides a technology to remove a treatment liquid and particles attaching to the side face of a piston and to keep the lubricity between the piston and a seal member in a syringe pump and a substrate treatment apparatus using the same. The syringe pump 8 of the substrate treatment apparatus supplies a washing liquid to the side face of the piston 82 in a backward chamber 85 formed in the rear end side of a cylinder 81. Therefore, a resist liquid and particles attaching to the side face of the piston 82 are washed away by the washing liquid and removed from the side face of the piston 82. Part of the washing liquid supplied to the backward chamber 85 attaches to the surface of a first seal member, a second seal member, and the piston 82 and functions as a lubricant. Therefore, the lubricity between the first seal member, the second seal member, and the piston 82 can be maintained.

Description

200803994 九、發明說明: 【發明所屬之技術領域】 本發明係關於供送光抗蝕液等之處理液用之注射式幫 浦、及一面藉該注射式幫浦供送處理液,一面在基板表面 塗佈處理液之基板處理裝置及基板處理方法。 【先前技術】 以往’已知有在液晶顯示裝置用玻璃基板、半導體晶 圓、膜液晶用軟性基板、光罩用基板、彩色濾光片用基板 等各種基板之製造步驟中,將光抗蝕液等之處理液供應至 基板表面之基板處理裝置。此種基板處理裝置包含供送處 理液用之幫浦。作為幫浦,可使用注射式幫浦(活塞幫 浦)、風箱式幫浦、齒輪幫浦、隔板幫浦、或管幫浦等, 其中’注射式幫浦之噴出響應性及定流量性較優異,多被 使用於基板處理裝置。 有關包含注射式幫浦之以往之基板處理裝置,例如揭示 於專利文獻1中。 [專利文獻1]日本特開2005_246201號公報 [發明所欲解決之問題] 如專利文獻1所載,注射式幫浦具有缸體與活塞,藉使 活塞在缸體内進退,將缸體内之處理液供應至下游侧。 但’在此種注射式幫浦中,在活塞後退(後拉)時,附著於 /舌塞之側面之處理液會與活塞同時露出於缸體外部而有硬 化之情形。而’活塞再度前進(前推)時,因處理液之硬化 而產生之粒子有混入缸體内之處理液中之情形。而,在缸 118336.doc 200803994 體與活塞之滑接部分雖設有密封構件,但難以完全防止附 著於活塞之侧面之處理液與活塞同時露出於外部。 又,在注射式幫浦内,為圓滑地施行缸體内之活塞之進 退運動,且防止設於缸體與活塞^㈣構件之磨損劣 化,要求一直維持活塞與密封構件間之潤滑性。 、 本發明係鑑於此種情況而設計者,其目的在於提供在、、主 射式幫浦、使用注射式幫浦之基板處理裝置及基板處理方 法中’除去附著在活塞之側面之處理液及粒子,且可維持 活塞與密封構件之間之潤滑性之技術。 、、 【發明内容】 為解決上述問題’請求項!之發明之注射式幫浦之特徵 在於.其係供送處理液用者,且包含:中空之缸體,盆係 具有吸引前述處理液之吸引孔與噴出前述處理液之喷出孔 者’間隔構件’其係將前述红體之内部空間隔成為與前述 ^引孔及前述噴出孔連通之第1室、及形成於比前述第以 體之後部侧之第2室’並具有貫通於前述缸體 ::後方向之第i貫通孔者;後端構件,其係配置於前述 +、之後端部而構成前述第2室之外壁之一部分,並具有 貝通=前述飯體之前後方向之第2貫通孔者;活塞,其係 述第π述第1貝通孔及别述第2貫通孔,其前端部配置於前 靠近二之内部,且其後端部配置於比前述缸體之後端部 體之體之外側;驅動部’其係使前述活塞向前述缸 向進退者;第1密封構件,其係滑接自如地密 貝通孔之内侧面與前述活塞之侧面之間者;第2 118336.doc 200803994 二:構件’其係滑接自如地密封前述第2貫通孔之内側面 二财述活塞之側面之間者;液體供應機構,其係在前述第 卩將特定液體供應至前述活塞之側面者;及液 機構’其係由前述第2室排出前述特定液體者。 月^項2之發明之注射式幫浦之特徵係在如請求項】之注 盘=浦中’前述活塞係向前述缸體之前後方向進退而不 由、:體之内側面滑接,並藉改變前述第i室之體積, 由雨述嘴出孔噴出前述處理液者。 體積 射Sr.之發明之注射式幫浦之特徵係在如請求項2之注 於前述第2室^述液體供應機構係藉將料特定液體储存 面者。至内’而將前述特定液體供應至前述活塞之側 射:ΪΓ中之發::广伽之特徵係在如請求項2之注 之前述二之:面供應機構係向配置於前物室内 二活塞之侧面噴出前述特定液體者。 明求項5之發明之注射 之注射式幫浦中,前隸^ /之特徵係在如請求項3或4 述處理液。 …液體係前述處理液之溶媒或前 請求項6之發明之注射式 之注射式幫浦中,進一牛勺人*寺徵係在如請求項3或4 述第2宕咖 # •氣體供應機構,复孫户义 j弟2至内,將特定氣體供 ㈣、係在别 ,活塞之侧面;及氣體排 ?有前述:定液體之 出前述特定氣體者。 ,其係由前述第2室排 請求項7之發明之注射式 支 118336.doc 特敛係在如請求項3或4 I__ 200803994 之注射式幫浦中,在前 射播杜B义 基之側面中至少與前述第1宓 Γ:第2密封構件滑接之部分係平頂構造表面/ 射:= 之發明之注射式幫浦之特徵係在如請求項7之注 P規格.職4平頂構造表面之聰嶋1(對應之國 際^各.刪287)中所規定之負载長度率 W切斷㈣十為㈣—者 ^項9之發明之注射式幫浦之特徵係在如請求項7之注 ==浦中’在前述平頂構造表面之刪嶋 Γ S〇4287)中所規定之算術平均—最大心 度Rp係RaSO.08 _且Rp各〇 3叫者。 理二ST之發明之基板處理裝置之特徵在於··其係藉處 液處理基板者,且包含:喷出處理液之注射式幫浦 =:應:構,其係將由前述注射式幫浦噴出之前述處 攻一至土板之表面者;前述注射式幫浦係包含:中空 之缸體’其係具有吸引前述處理液之吸引孔與喷出前述2 理液之喷出孔者,·間隔構件,其係將前述紅體之内部空間 隔成為與前述吸引孔及前述喷出孔連通之第】室、以及形 成於比前述第】室靠近前述缸體之後部側之第2室,並呈有/ 貫通於前述域之前後方向之第丨貫通孔者;後端構:, 其係配置於前述缸體之後端部而構成前述第』室之外壁之 -部分,並具有貫通於前述缸體之前後方向之第2貫:孔 者;活塞,其係***前述第!貫通孔及前述第2貫通孔,其 爾端部配置於前述第!室之内部’且其後端部配置於比前 述缸體之後端部靠近前述缸體之外側;驅動部,直係使前 118336.doc -9- 200803994 述活塞向前述缸體之前後方向進退者;第丄密封構件,盆 係滑接自如地密封前述$1貫通孔之内側面與前述活夷二 側面之間者;第2密封構件,其係滑接自如地密封前‘第2 貫通孔之内側面與前述活塞之側面之間者;液體 構,其係在前述第2室之内部,將_ ^ 肝特疋液體供應至前述活 塞之側面者;及液體排出機構’其係由前述第2 述特定液體者。 請求項U之發明之基板處理裝置之特徵係在如請求項 之基板處理裝置中進—步包含:設定機構,其係設定前述 :體供應機構之動作之時序者;及控制機構,其係依據由 刖述設定機構所設k時序,使前述液體供應機構執行動 作者。 請求項12之發明之基板處理方法之特徵在於:〜 理液處理基板者,且包含:第1步驟,其係藉纽射^ 浦内之活塞進退,經由形成於前述注射式幫浦内之第以 供應至基板表面者;及第2步驟’其係在形成 於則述主射式幫浦内之第2室内,將特定液體供應至前述 活塞之側面者。 [發明之效果] 依據請求項!〜n所載之發明,注射式幫浦係包含:液體 供應機構,其係在形成於缸體之後部側之第2室之内部, :=定液體供應至活塞之側面者;及液體排出機才冓,其係 由第2室排出特定液體者。因此,附著在活塞之側面^處 理液及粒子可利用特定液體沖洗而加以除去。又,供應至 118336.doc 200803994 第至—之特疋液體會附著於第1密封構件、第2密封構件、 及二舌基之表面’具有作為潤滑劑之功能。因此,可維持第 1密封構件及第2密封構件與活塞之間之潤滑+生。 尤其’依據請求項2所载之發明,活塞係向缸體之前後 方向進退而不與缸體之内侧面滑接,並藉改變第ι室之體 積’由噴出孔噴出處理液。因此,無必要將缸體之内侧面 之外侧面在長距離中維持高的加卫精度。從而,可 :注射式幫浦之加工容易化,且可容易製造容量大之注射 式幫浦。 、-依據明求項3所載之發明,液體供應機構係藉將 特定液體儲存於第2室内,而將特定液體供應至活塞之侧 面因此,可將特定液體確實供應至活塞之侧面,良好地 除去附著在活塞之侧面之處理液及粒子。 尤其’依據請求項4所載之發明,液體供應機構係向配 置於第2室内之活塞之侧面噴出特定液體。㈣,特定液 體可直接供應至活塞之侧面,良好地除去附著在活塞之側 面之處理液及粒子。 、/、依據兩求項5所載之發明,特定液體係處理液之 溶媒或處理液。因此’即使特定液體混入P室之處理液 中’、對第1室之處理液也無造成不良影響之虞。 、,、依據吻求項6所载之發明,進一步包含:氣體供 應機構,JL将力楚9 a Hr» V 至’將特定氣體供應至被供應特定 液體=塞之侧面者;及氣體排出機構,其係由第2室排 出特疋《I體。因此’多餘之液體會強制地被排出至缸體之 118336.doc 200803994 外部,降低多餘之液體由第2室進入 尤其,依據請求項7所載之發明,在活塞:侧面中,至 少與第1密封構件及第2密封構件滑接之部分係平頂構造表 面。因此,可降低活塞之侧面損傷到第!密封構件彻 封構件之虞’故可防止第!密封構件及第2密封構件之磨損 劣化又’因特疋液體被良好地保持於活塞之側面,故可 =一步提高第1密封構件及第2密封構件與活塞之間之潤滑 尤其,依據請求項8所載之發明,在活塞之側面中成為 平頂構造表面之部分之刪_1(對應之國際規袼: IS04287)中所規定之負载長度率r咖⑷係在最大高度粗度 Rz之50%之切斷位準c中,為反阶⑷-π%。即,活塞之側 =更顯著地具有平頂構造之特性。㈣,可更良好地防止 第」密封構件及第2密封構件之磨損劣化,可進—步提高第 山封構件及第2密封構件與活塞之間之潤滑性。 、,尤其,依據請求項9所載之發明,在活塞之側面中成為 平頂構造表面之部分之JISB0601(對應之國際規格: S04287)中所規定之算術平均高度及最大山高度汉口係 -0·〇8 μιη且Rpg 0·3 μιη。因此,在活塞之側面中,可 使山部更士曰^Γ -- 卞一化可更良好地防止第1密封構件及第2密封 構件之磨損劣化。 甘- 人/、’依據請求項10所載之發明,基板處理裝置係包 s喷出處理液之注射式幫浦;及處理液供應機構,其係 將由左射式幫浦被噴出之處理液供應至基板之表面者;注 118336.doc •12- 200803994 射式幫浦係包含:中空之缸體,其係具有吸引處理液之吸 丨孔與噴出處理液之喷出孔者;間隔構件,其係將缸體之 内部空間隔成連通於吸引孔及噴出孔之第丨室與形成於比 室更靠近缸體之後部側之第2室,並具有貫通於缸體之 剛後方向之第1貫通孔者;後端構件,其係配置於缸體之 後端部而構成第2室之外壁之-部分,並具有貫通於缸體 之方向之第2貫通孔者;活塞,其係***第丨貫通孔及第2 貝通孔,其前端部配置於第〗室之内部,且其後端部配置 於比缸體之後端部更靠近缸體之外側者;驅動部,其係使 活塞向缸體之前後方向進退者;第1密封構件,其係滑接 自如地密封第1貫通孔之内侧面與活塞之側面之間者;第2 密封構件,其係滑接自如地密封第2貫通孔之内侧面與活 塞之側面之間者;液體供應機構,其係在第2室之内部, 將特疋液體供應至活塞之侧面I;及液體#出機構,其係 由第2室排出特定液體者。因此,在基板處理裝置之處理 液供應動作中執行極重要任務之注射式幫浦中,可防止粒 子之產生,且可維持注射式幫浦之潤滑性。 尤其,依據請求項u所載之發明,基板處理裝置係進一 步包含:設定機構’其係設定液體供應機構之動作之時點 者;控制機構,其係依據設定機構所設定之時點,使液體 供應機構執行動作者。因此,可依照基板處理狀態,將液 體供應之時點設定於最適之時點,可依據該時點,自動地 供應特定液體。 又,依據請求項12所載之發明,基板處理方法係包含: 118336.doc -13· 200803994 弟1步驟,其係藉使注射式幫浦内之活塞進退,經由形成 於,射式幫浦内之第!室而將處理液供應至基板表面者; 及弟2步驟’其係在形成於注射式幫浦内之第2室内,將特 定液體供應至活塞之側面者。因此,附著在活塞之侧面之 處理液及粒子可被特定液體沖洗而除去。χ,在第2室内 被供應之特定液體具有作為潤滑劑之功能。_,可維持 活塞之潤滑性。 【實施方式】。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 A substrate processing apparatus for surface coating a processing liquid and a substrate processing method. [Prior Art] Conventionally, in the manufacturing steps of various substrates such as a glass substrate for a liquid crystal display device, a semiconductor wafer, a flexible substrate for a film liquid crystal, a substrate for a photomask, and a substrate for a color filter, a photoresist is known. The treatment liquid such as liquid is supplied to the substrate processing apparatus on the surface of the substrate. Such a substrate processing apparatus includes a pump for supplying a processing liquid. As a pump, you can use the injection pump (piston pump), bellows pump, gear pump, diaphragm pump, or tube pump, etc., where the injection responsiveness and constant flow of the injection pump It is excellent in properties and is often used in substrate processing equipment. A conventional substrate processing apparatus including an injection type pump is disclosed, for example, in Patent Document 1. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2005-246201 [Problems to be Solved by the Invention] As disclosed in Patent Document 1, an injection type pump has a cylinder block and a piston, and if the piston advances and retreats in the cylinder body, the cylinder body is The treatment liquid is supplied to the downstream side. However, in such an injection type pump, when the piston is retracted (post-pull), the treatment liquid adhering to the side of the / tongue plug is exposed to the outside of the cylinder and hardened. On the other hand, when the piston advances again (pre-push), the particles generated by the hardening of the treatment liquid are mixed into the treatment liquid in the cylinder. Further, although the sealing member is provided in the sliding portion between the body and the piston of the cylinder 118336.doc 200803994, it is difficult to completely prevent the treatment liquid attached to the side surface of the piston from being exposed to the outside at the same time. Further, in the injection type pump, the reciprocating movement of the piston in the cylinder is smoothly performed, and the wear of the components provided in the cylinder block and the piston (4) is prevented from being deteriorated, and the lubrication between the piston and the sealing member is required to be maintained at all times. The present invention has been made in view of such circumstances, and an object of the present invention is to provide a process for removing a process liquid adhering to a side of a piston, a main injection type pump, a substrate processing apparatus using an injection pump, and a substrate processing method. A particle and a technique that maintains the lubricity between the piston and the sealing member. , [Content of the invention] In order to solve the above problem, the request item! The injection type pump of the invention is characterized in that it is used for supplying a treatment liquid, and comprises: a hollow cylinder having a suction hole for sucking the treatment liquid and a discharge hole for discharging the treatment liquid. The member has a first space in which the inner space of the red body communicates with the first hole and the discharge hole, and a second chamber formed on the rear side of the first body and has a through-cylinder Body: the i-th through hole in the rear direction; the rear end member is disposed at the end portion of the second chamber after the + and rear end portions, and has a Beton = the front and rear direction of the rice body a through hole; a piston, wherein the first through hole and the second through hole are described in the first embodiment, and the front end portion is disposed in front of the second portion, and the rear end portion is disposed at a rear end of the cylinder. The driving portion is configured to move the piston forward and backward toward the cylinder; the first sealing member is slidably disposed between the inner side surface of the through hole and the side surface of the piston; 2 118336.doc 200803994 II: The component 'sliding freely a liquid supply mechanism that supplies a specific liquid to a side surface of the piston in the first side; and a liquid mechanism that is the second The chamber discharges the aforementioned specific liquid. The injection type pump of the invention of the item 2 is characterized in that, in the injection tray of the request item, the piston unit advances and retreats in the front and rear directions of the piston body, and the inner side of the body is slid and borrowed. The volume of the first chamber is changed, and the treatment liquid is ejected from the nozzle of the rain nozzle. The injection pump of the invention of the volume Sr. is characterized by the fact that the liquid supply mechanism of the second chamber described in claim 2 is for the specific liquid storage surface. Inwardly, the specific liquid is supplied to the side of the piston: the hair in the ::: The characteristics of the gamma are as described in the above-mentioned claim 2: the surface supply mechanism is disposed in the front object chamber 2 The side of the piston ejects the aforementioned specific liquid. In the injection type pump of the invention of the invention of claim 5, the former is characterized by the treatment liquid as claimed in claim 3 or 4. ... the liquid system of the aforementioned treatment liquid or the injection type of the injection pump of the invention of the above-mentioned claim 6, the entry of a shovel of the human temple is as in the case of claim 3 or 4 , Fu Sun Hu Yi, 2 brothers, to the specific gas supply (four), tied to the side of the piston; and gas discharge? There are the foregoing: the liquid is given out of the specific gas. The injection type 118336.doc of the invention of the second chamber row request 7 is specifically attached to the injection pump of claim 3 or 4 I__ 200803994, on the side of the front projection Du B. At least the portion of the first sealing member to which the second sealing member is slidably attached is a flat-top structure surface / shot: = The characteristics of the injection-type pump of the invention are as specified in claim 7 of the specification P. The load length ratio specified in the construction surface of the singularity 1 (corresponding to the international ^ s. 287) is cut off (four) ten is (four) - the feature of the injection type of the invention is as in claim 7 Note == The arithmetic mean-maximum heart rate Rp of the Puzhong 'deletion of the flat top structure surface (S〇4287) is RaSO.08 _ and Rp is 〇3. The substrate processing apparatus of the invention of the second embodiment is characterized in that it is a substrate for processing a substrate by a liquid, and includes: an injection pump for discharging a treatment liquid: a structure, which is to be ejected by the aforementioned injection type pump The above-mentioned injection type pumping system includes: a hollow cylinder having a suction hole for sucking the processing liquid and a discharge hole for discharging the second liquid, and a spacer member The first space of the red body is a first chamber that communicates with the suction hole and the discharge hole, and a second chamber that is formed closer to the rear side of the cylinder than the first chamber. a third through hole that penetrates the front and rear directions of the aforementioned domain; a rear end structure that is disposed at a rear end portion of the cylinder to constitute a portion of the outer wall of the first chamber, and has a through-hole The second direction of the front and rear direction: the hole; the piston, which is inserted into the aforementioned! The through hole and the second through hole are disposed at the end of the second through hole. The inside of the chamber is disposed, and the rear end portion thereof is disposed closer to the outer side of the cylinder than the rear end portion of the cylinder; the driving portion directly causes the piston to advance and retreat toward the front and rear of the cylinder in front of 118336.doc -9-200803994 a second sealing member, the basin is slidably sealed between the inner side surface of the $1 through hole and the side surface of the movable side; and the second sealing member is slidably sealed to the front of the second through hole a side surface and a side surface of the piston; a liquid structure which is inside the second chamber, and supplies a liquid to the side of the piston; and a liquid discharge mechanism' which is the second Specific liquids. The substrate processing apparatus of the invention of claim 7 is characterized in that, in the substrate processing apparatus of the claims, the step further comprises: a setting mechanism for setting a timing of the operation of the body supply mechanism; and a control mechanism based on The liquid supply mechanism executes the actor by the k timing set by the setting mechanism. The substrate processing method according to the invention of claim 12 is characterized in that: the liquid processing substrate is included in the first step, and the first step is to advance and retreat by means of a piston in the injection beam, and the first step is formed in the injection pump. The second step is to supply the specific liquid to the side surface of the piston in the second chamber formed in the main-ejection pump. [Effect of the invention] According to the request item! In the invention of the invention, the injection pump system includes: a liquid supply mechanism which is inside the second chamber formed on the rear side of the cylinder, := a liquid supplied to the side of the piston; and a liquid discharge machine It is the person who discharges the specific liquid from the second chamber. Therefore, the liquid and particles adhering to the side of the piston can be removed by rinsing with a specific liquid. Further, the liquid supplied to the first sealing member, the second sealing member, and the two tongue bases, which is supplied to 118336.doc 200803994, has a function as a lubricant. Therefore, the lubrication between the first sealing member and the second sealing member and the piston can be maintained. In particular, according to the invention of claim 2, the piston is advanced and retracted in the front-rear direction of the cylinder without sliding to the inner side surface of the cylinder, and the treatment liquid is ejected from the discharge hole by changing the volume of the first chamber. Therefore, it is not necessary to maintain a high degree of precision in the long side of the inner side of the cylinder. Therefore, the injection type pump can be easily processed, and the injection pump having a large capacity can be easily manufactured. According to the invention of the third aspect, the liquid supply mechanism supplies the specific liquid to the side of the piston by storing the specific liquid in the second chamber, so that the specific liquid can be surely supplied to the side of the piston, which is good The treatment liquid and particles adhering to the side of the piston are removed. In particular, according to the invention of claim 4, the liquid supply mechanism ejects a specific liquid to the side of the piston disposed in the second chamber. (4) The specific liquid can be directly supplied to the side of the piston to remove the treatment liquid and particles adhering to the side of the piston. / /, according to the invention contained in the two claims 5, the solvent or treatment liquid of the specific liquid system treatment liquid. Therefore, even if a specific liquid is mixed into the treatment liquid in the P chamber, there is no adverse effect on the treatment liquid in the first chamber. According to the invention contained in the claim 6, further comprising: a gas supply mechanism, JL will force 9 a Hr» V to 'send a specific gas to the side to which the specific liquid is supplied = plug; and the gas discharge mechanism It is discharged from the second chamber by the second chamber. Therefore, the excess liquid is forcibly discharged to the outside of the cylinder block 118336.doc 200803994, and the excess liquid is lowered by the second chamber. In particular, according to the invention contained in claim 7, in the piston: side, at least with the first The portion where the sealing member and the second sealing member are slidably is a flat top structure surface. Therefore, it is possible to reduce the damage of the side surface of the piston to the sealing member of the first sealing member, so that the first step can be prevented! The wear deterioration of the sealing member and the second sealing member is further improved because the liquid is well held on the side of the piston, so that the lubrication between the first sealing member and the second sealing member and the piston can be improved in one step, in particular, according to the request The invention contained in 8 is the part of the surface of the piston that is part of the flat-topped construction surface (corresponding to the international standard: IS04287). The load length ratio r (4) is 50 of the maximum height roughness Rz. In the cut-off level c of %, it is the inverse order (4)-π%. That is, the side of the piston = more significantly has the characteristics of a flat top configuration. (4) The wear deterioration of the first sealing member and the second sealing member can be prevented more satisfactorily, and the lubricity between the first sealing member and the second sealing member and the piston can be further improved. In particular, according to the invention contained in claim 9, the arithmetic mean height and the maximum mountain height of the JIS B0601 (corresponding to the international standard: S04287) which is a part of the flat top structure surface in the side surface of the piston are - · 〇 8 μιη and Rpg 0·3 μιη. Therefore, in the side surface of the piston, it is possible to prevent the wear of the first sealing member and the second sealing member from being deteriorated more satisfactorily.甘-人/, 'In accordance with the invention contained in claim 10, the substrate processing apparatus is a syringe pump that ejects the treatment liquid; and the treatment liquid supply mechanism is a treatment liquid to be ejected by the left-shot pump The surface supplied to the substrate; Note 118336.doc •12- 200803994 The jet pump system includes: a hollow cylinder having a suction hole for sucking the treatment liquid and a discharge hole for discharging the treatment liquid; The second chamber in which the inner space of the cylinder is spaced apart from the suction hole and the discharge hole and the second chamber formed closer to the rear side of the cylinder than the chamber, and has a direction perpendicular to the rear direction of the cylinder a through hole member; the rear end member is disposed at a rear end portion of the cylinder to constitute a portion of the outer wall of the second chamber, and has a second through hole penetrating the direction of the cylinder; the piston is inserted into the second The through hole and the second beacon hole have a front end portion disposed inside the first chamber, and a rear end portion thereof disposed closer to the outer side of the cylinder than the rear end portion of the cylinder; the driving portion is configured to move the piston toward The front and rear of the cylinder are advanced and retracted; the first sealing member is slidably connected Sealing between the inner side surface of the first through hole and the side surface of the piston; the second sealing member is slidably sealed between the inner side surface of the second through hole and the side surface of the piston; and the liquid supply mechanism Inside the second chamber, the special liquid is supplied to the side I of the piston; and the liquid #out mechanism is a person who discharges the specific liquid from the second chamber. Therefore, in the injection type pump which performs a very important task in the processing liquid supply operation of the substrate processing apparatus, generation of particles can be prevented, and the lubricity of the injection type pump can be maintained. In particular, according to the invention of claim u, the substrate processing apparatus further includes: a setting mechanism that sets the time of the operation of the liquid supply mechanism; and a control mechanism that causes the liquid supply mechanism according to the time set by the setting mechanism Execute the actor. Therefore, the liquid supply timing can be set at the optimum time according to the substrate processing state, and the specific liquid can be automatically supplied according to the timing. Further, according to the invention of claim 12, the substrate processing method comprises: 118336.doc -13· 200803994 The first step is to advance and retreat the piston in the injection pump through the formation of the jet pump. The first! The treatment liquid is supplied to the surface of the substrate; and the second step is performed in the second chamber formed in the injection pump to supply a specific liquid to the side of the piston. Therefore, the treatment liquid and particles attached to the side of the piston can be removed by washing with a specific liquid.特定, the specific liquid supplied in the second chamber has a function as a lubricant. _, can maintain the lubricity of the piston. [Embodiment]

態 、下 面參妝圖式’一面說明本發明之合適之實施型 &lt; 1·基板處理裝置之全體構成&gt; 圖1係表示本發明之一實施型態之基板處理裝置丨之構成 之立體圖。此基板處理裝置丨係以製造液晶顯示裝置之畫 面面板用之角形玻璃基板(以下僅稱「基板」)90作為被處 理基板’在選擇地蝕刻基板9〇之表面之光微影步驟中,用 來將作為處理液之光抗蝕液(以下僅稱「抗蝕液」)塗佈於 基板90之表面之裝置。如圖1所示,基板處理裝置1主要具 有主體部2與控制部6。 主體部2設置有載置基板90而加以保持用之置物台3。置 物台3係由具有直方體形狀之一體之石材所構成,在其上 面’形成有平坦且被水平加工之保持面3 0。在保持面3 〇, 分布形成有多數真空吸附口(省略圖示)。載置於保持面3〇 上之基板90係被來自真空吸附口之吸附力所吸住,藉以將 其穩定地保持於保持面3〇上。 118336.doc -14- 200803994 又’在保持面30,升降自如之複數之揚升銷Lp互相以特 定間隔被配置。在揚升銷LP連接驅動部,使驅動部起作用 時,可使揚升銷LP上下升降移動。藉此,載置於揚升銷 LP上之基板90可一直保持水平姿勢上下升降移動。又,在 保持面30上,在夾著保持基板9〇之區域之兩側部,平行且 . 水平地鋪設一對行走執條3 1。行走執條3 1與後述之交聯部 ' 4連結,發揮向行走軌條31之鋪設方向導引交聯部4之移動 之作用。 _ 在置物台3之上方,設有交聯部4。交聯部4具有喷嘴支 持部40、與支持喷嘴支持部4〇之兩端之升降機構43、44。 噴嘴支持部40係以碳纖維補強樹脂為骨材所構成,略平行 地架設在與行走軌條3 1之鋪設方向垂直之方向。在喷嘴支 持部40,安裝有狹缝噴嘴4 1與間隙感測器42。狹縫噴嘴4 i 係具有一面掃描基板90之表面,一面向下方喷出抗钱液, 藉以將抗蝕液塗佈於基板90之表面(更正確而言,為基板 φ 90之表面中,除周圍特定寬之區域以外之區域)之功能。 狹缝喷嘴41連接於後述之供應機構7(參照圖2),將供應機 構所供應之抗蝕液塗佈於基板90之表面。所塗佈之抗蚀液 - 會在基板90之表面形成抗蝕膜。又,間隙感測器42被安裝 / 於狹缝噴嘴41之附近。間隙感測器42具有計測與下方之存 在物(基板90之表面及抗蚀膜之表面)間之距離之功能。 升降機構43、44係連結於喷嘴支持部4〇之兩端部。升降 機構43、44具有AC伺服馬達43a、44a及含未圖示之滾珠螺 釘之驅動部。升降機構43、44係藉使驅動部起作用,對噴 118336.doc -15- 200803994 噶支持。卩4〇之兩端部施加升降驅動力,使喷嘴支持部4〇 — 直保持水平姿勢上下升降移動。又,左右之升降機構43、 44也可藉由分別獨立起作用,以調整狹縫噴嘴41之水平姿 勢。在升降機構43、44之下部,設有對應於上述之行走軌 條31之一對行走部。行走部沿著行走軌條31行走,使交聯 部4在基板90上方水平地移動。 又,在行走軌條3 1及交聯部4之外側,設有一對線性馬 達5〇、5 1、與一對線性編碼器52、53。線性馬達50、5 1具 有固設於置物台3之側面之定子50a、51a、與固設於交聯 部4之侧部之動子5〇b、5沁。線性馬達5〇、51係藉在定子 5〇a 5 la與動子5〇b、5 lb間產生之驅動力,使交聯部4向 化著行走軌條3 1之方向移動。另一方面,線性編碼器、 53具有沿著定子5〇a、51a固設之刻度部、與固設於動子 5〇b、5 lb之更外側之檢出片。線性編碼器52、53係藉由計 測對刻度部之檢出片之相對位置,以檢出交聯部4之位 置。 在被置物台3上之保持面3 〇之行走執條3 1所夾之區域之 一部分形成有開口 32。在開口 32下方之主體部2之内部, 設有待機筒、喷嘴洗淨機構及預塗佈機構。此等機構係在 對基板90之抗蝕液之塗佈處理之前預先執行之抗蝕液供應 處理、抽氣處理、預分散處理等預備處理中使用。 控制部6係在内部設置有依照程式處理各種資料用之運 弃部6 0、與保存程式及各種資料用之記憶部6丨。具體上, 運算部60係由CPU及MPU所構成,記憶部61係由ram、 118336.doc -16 - 200803994 ROM、磁碟I置等所構成。在記憶部61,例如儲存有關將 洗淨液及置換氣體供應至後述之注射式幫浦8内之時點之 貝訊。在控制部6之前面,設有受理來自操作者之操作輸 入用之操作部62與顯示各種資訊用之顯示部〇。具體上, 操作部62係由複數開關類(含鍵盤及滑鼠等)所構成,顯示 部63係由液晶顯示器及CRT所構成。可藉由操作者操作操 作部62,例如,任意設定儲存於記憶部“之上述時點之資 訊。又,也可由觸控面板式之顯示器構成顯示部〇,顯示 部63也可構成為兼具操作部62之功能。 圖2係上述之置物台3及狹縫喷嘴41之側剖面圖。在圖 2 ,也模式地顯示基板處理裝置丨之各部之電氣的或機構的 連接構成。控制部6電性連接於間隙感測器42、升降機構 43、44、線性馬達5〇、51、線性編碼器52、幻、及供應機 構7。控制部6係接收由間隙感測器42、及線性編碼器u、 53發送之計測值,且控制升降機構43、44、線性馬達π、 供應機構7之動作。例如,控制部6係藉由依據由間隙感測 器42接收之計測值控制升降機構43、料之動作,調節基板 90與狹缝喷嘴41之間之距離。又,控制部6係藉由根據由 線性編碼器52、53接收之計測值,控制線性馬達5〇之動 作,以施行在置物台3上之狹縫噴嘴41之掃描動作。又, 控制部6係藉由控制供應機構7之動作,由狹缝噴嘴41將抗 餘液噴出至基板90之表面。 &lt; 2·供應機構之構成&gt; 圖3係表示供應機構7之具體的構成之圖。如圖3所示, 118336.doc -17- 200803994 供應機構7係包含收集槽71、配管72a〜72h、開閉闕 73a〜73d、壓力調整部74、過濾器75及注射式幫浦8。開閉 閥73a〜73d、壓力調整部74、及注射式幫浦8之驅動機構% 係電性連接於控制部6,藉由控制部6控制此等之動作,以 實現對狹縫噴嘴41之抗蝕液之供應動作。 收集槽71係暫時地儲存由抗蝕液供應源7〇經配管7〜供 應之抗蝕液。抗蝕液被儲存於收集槽71内時,抗蝕液中之 氣泡會浮上液面,向收集槽71之上部脫離。而,積存在收 集槽71之上部之氣體成分經由配管72b被排出於外部,藉 此除去抗鍅液中之氣泡。 注射式幫浦8係吸引儲存於收集槽71之抗蝕液,向狹縫 喷嘴41噴出所吸引之抗蝕液用之噴出幫浦。注射式幫浦8 包含中空之缸體81、與在缸體81之内部施行進退運動之活 塞(柱塞)82。缸體81之内部被間隔構件83隔成前室料與後 至85,由收集槽71被吸引之抗蝕液會被填充於前室84内。 活塞82係貫通間隔構件83而***設於缸體81之前後方向。 活塞82之後端部連接於驅動機構86,藉接受自驅動機構% 之驅動力,使活塞82向缸體81之前後方向進退。 注射式幫浦8之前室84與收集槽71之間係被配管72c所連 接。而’在配管72c之路徑途中介插著開閉閥73a。又,注 射式幫浦8之前室84與狹缝喷嘴41之間係被配管72d所連 接。而,在配管72d之路徑途中介插著開閉閥731&gt;。因此, 封閉開閉閥73b同時開放開閉閥73a,使活塞82後退(後拉) 時,儲存於收集槽71内之抗蝕液可經由配管72()被吸引至 118336.doc -18· 200803994 前室84内。而,封閉開閉閥73a同時開放開閉閥73b,使活 塞82前進(前推)時,填充於前室84内之抗蝕液可經由配管 72d被供送至狹縫噴嘴41。狹縫噴嘴41將被供送之抗蝕液 塗佈於基板9 0之表面。 另一方面,在缸體81之後室85,連接配管72e。配管72e . ,之上游側分歧成配管72f與配管72g,在配管72f之上游側, • 連接供應洗淨液用之洗淨液供應源76。因此,開放設在配 管72f上之開閉閥73〇時,洗淨液會由洗淨液供應源76通過 配管72f及配管72e而供應至後室85内。又,在配管72g之 上游侧’連接供應置換氣體用之置換氣體供應源77。因 此,開放設在配管72g上之開閉閥73d時,置換氣體會由置 換氣體供應源77通過配管72g及配管72e而供應至後室85 内。開閉閥73c及開閉閥73d具有作為切換洗淨液與置換氣 體之供應用之切換機構之功能。 被供應至後室8 5内之洗淨液與置換氣體係經由配管7 2 h • 而被排出至缸體之外部。又,作為上述之洗淨液,例如使 用抗蝕液之溶媒成分且具有作為潤滑劑之功能之丙酮、 PEGMEA、PEGME等之有機溶劑。又,作為上述之置換氣 體,例如,使用氮氣等惰氣或CDA(潔淨乾空氣)。 在連結收集槽71與缸體81之配管72〇連接壓力調整部 74。壓力調整部74係將由收集槽?!向缸體81吸引之抗蝕液 之吸引壓維持於特定值以下,藉此,防止抗㈣中產生氣 泡。又’在連結注射式幫浦8與狹縫喷嘴41之配管—,介 插著過遽器75。過遽器75係除去存在於由注射式幫浦” 118336.doc •19- 200803994 出之抗#液申之雜質(粒子及氣泡等)’使抗韻液清淨化。 圖4係更詳細表示上述注射式幫浦8之構成之圖。一面參 照圖4,一面更詳細說明有關注射式幫浦8之構成。缸體81 之缸體81係由SUS等不銹鋼所構成,具有略圓筒形狀之外 形。缸體8i之内部空間被間隔構件83隔成前室科與後室 85。面臨前室84之缸體81之側面形成吸引孔8ia。在吸引 孔81a連接上述之配管72c,由收集槽71(參照圖”被吸引之 抗蚀液係由吸引孔81a被導入前室84内。又,在叙體8 i之 前端部(圖4之缸體81之上面)形成噴出孔81b。在噴出孔8ib 連接上述之配管72d,由缸體81被噴出之抗蝕液經由噴出 孔81b被送出至配管72d。即,前室84係成為填充作為處理 液之抗蝕液用之空間。 又,在缸體81之後端部(圖4之缸體81之底面),安裝封 閉缸體81之後端部用之後端構件87。後端構件87係與間隔 構件83同時構成後室85之外壁,間隔構件83、後端構件” 及红體81之側面所包圍之空間成為後室85。在間隔構件83 及後端構件87,分別形成貫通於缸體81之前後方向之貫通 孔83a、87a,在貫通孔83a、87 a插通活塞82。 活塞82之後端部連接於驅動機構86。驅動機構%具有馬 達86a、滾珠螺釘86b、螺母86c、導引部86(1、及連結構件 86e。驅動機構86係藉馬達86a產生之驅動力使滾珠螺針 86b旋轉,並使螺合於滾珠螺釘之螺母86〇沿著導引部86d 向缸體81之前後方向移動。經由連結構件86e連結於螺母 86c之活塞82係隨著螺母86c之移動而施行進退運動。 118336.doc -20- 200803994 在間隔構件83之貫通孔83a之内周面,安裝第丨密封構件 83b。第1密封構件83b係由滑動性及耐磨損性優異之樹脂 材料所構成,滑接自如地密封間隔構件83之貫通孔83&amp;之 内周面與活塞82之外周面之間。又,在後端構件87之貫通 孔87a之内周面,安裝有第2密封構件87b。第2密封構件 8 7b也由滑動性及耐磨損性優異之樹脂材料所構成,可滑 動自如地密封後端構件87之貫通孔87a之内周面與活塞82 之外周面之間。作為構成密封構件83b、87b之材料,具體 上可使用PEEK系、Ny系、POM系、UHMW-HDPE系、聚 對苯二甲酸乙二醇酯系、聚醯亞胺系等樹脂材料。 在面臨後室85之缸體81之側面形成導入孔81c。在導入 孔81c連接上述之配管72e,由洗淨液供應源76被供應之洗 淨液、及由置換氣體供應源77被供應之置換氣體係由導入 孔81c被導入後室85内。又,面臨後室85之缸體81之側面 中,在夾著導入孔81c與活塞82而低於相反側之面之導入 孔81c之位置,形成排出孔8 Id。在排出孔81d連接上述之 配管72h,後室85内之液體及氣體係由排出孔81d被排出至 配管72h。 當洗淨液被供應至後室85内時,洗淨液會儲存於後室85 内,並在配置於後室85内之活塞82附近形成液流。因此, 附著在活塞82之侧面之抗蝕液及粒子會被洗淨液沖洗,由 活塞82之側面被除去。從而,可防止附著於活塞82之側面 之抗蝕液露出於後端構件87之後方側而硬化。又,也可防 止附著在活塞82之侧面之粒子進入間隔構件83之前方側而 118336.doc -21- 200803994 混入前室84内之抗蝕液中。 供應至後室85内之洗淨液之—部分會附著於第i密封構 件83b、弟2密封構件87b、及活突# ^ 〇 夂济基S2之表面,具有作為潤 滑劑之功能。因此,可維持第1密封構件83b及第2密封構 件87b與活塞82之間之潤滑性,圓滑地施行活塞82之進退 動作。 洗淨液供應至後室85後,封閉開閉閥7Μ參照圖3)同時 開放開閉閥73d(參照圖3)時,停止洗淨液之供應,而將置 換氣體供應至後室85内。置換氣體被供應至後室85内時, 置換氣體會將後室85内之多餘之液體向排出孔川側強制 地擠出而排出。㈣’可防止多餘之洗淨液進人間隔構件 83之前方側而混入前室84内之抗蝕液中。置換氣體供應後 之活塞82之侧面呈現僅薄薄地附著適當量之洗淨液做為潤 滑劑之狀態。 圖5係將活塞82之侧面附近之剖面形狀單純化所示之 圖。如圖5所示,活塞82之側面係呈現加工成將高的山部 削成平坦部82a,並留下深的谷部82b之所謂「平頂構造表 面」。因此,可降低活塞82之侧面損傷到第!密封構件8讣 及第2密封構件87b之虞,故可防止第1密封構件83b及第2 密封構件87b之磨損劣化。又,可藉使洗淨液流入谷部8几 而將洗淨液良好地保持於活塞82之侧面。因此,可良好地 維持第1密封構件83b及第2密封構件87b與活塞82之間之潤 滑性。 具體上,最好活塞82之側面係將JISB0601(對應之國際 118336.doc -22- 200803994 規格:IS04287)中所規定之負載長度率Rmr(c)加工成最大 高度粗度Rz之50%之切斷位準c中,為Rmr(c)-70%者。此 種活塞82之側面可更顯著地具有平頂構造之特性。因此, 可更良好地防止第1密封構件83b及第2密封構件87b之磨損 劣化’可更良好地維持第1密封構件83b及第2密封構件87b 與活塞82之間之潤滑性。 又’活塞82之侧面係將jisb〇601(對應之國際規格: IS04287)中所規定之算術平均高度Ra及最大山高度^^若加 工成RaSO.〇8 μηι且Rp^O.3 μπι時,更為理想。此種活塞 82之側面變成將高的山部削成更平坦之平頂構造表面。從 而’可更良好地防止第1密封構件83b及第2密封構件87b之 磨損劣化。又,若利用JISB0601(對應之國際規格: IS0428 7)中所規定之最大高度粗度rz及最大谷深度Rv更進 一步限定活塞之侧面性狀,則活塞82之侧面最好加工成rz $ 1·3 μιη、Rv$ ι·〇 μιη 0 回到圖4,活塞82並非與缸體81之内側面直接滑接,而 係一面與形成在間隔構件83之貫通孔83a及形成在後端構 件8 7之貝通孔8 7 a之内侧面滑接,一面進退。而,藉改變 月至84之體積,由喷出孔81b喷出抗蝕液。因此,無必要 將缸體81之内侧面與活塞82之侧面在長距離中維持高的加 工精度。從而,可使注射式幫浦8之加工容易化,且可容 易製造容量大之注射式幫浦8。 &lt;3·基板處理裝置之動作&gt; 接著,一面參照上述各圖及圖6之流程圖,一面說明有 118336.doc -23- 200803994 關在上述基板處理裝置1中施行基板90之處理時之動作。 又’在以下說明之處理動作係藉控制部6控制上述之揚升 銷LP之驅動部、間隙感測器42、升降機構43、44、線性馬 達50、51、線性編碼器52、53、開閉閥73a〜73d、壓力調 整部74、驅動機構86等所進行。 在基板處理裝置1中施行基板90之處理時,首先,封閉 開閉閥73d同時開放開閉閥73c,將洗淨液供應至注射式幫 浦8之後室85内(步驟S1)。洗淨液係在後室85内於活塞82 附近形成液流,以沖洗附著在活塞82之側面之抗蝕液及粒 子。由活基8 2之側面被除去之抗钱液及粒子係與洗淨液同 時由排出孔81d被排出。洗淨液之供應係持續預先設定於 記憶部61之特定時間。 接著,封閉開閉閥73c同時開放開閉閥73d,將置換氣體 供應至注射式幫浦8之後室85内(步驟S2)。置換氣體會將 後室85内之液體向排出孔81d侧強制地擠出而由後室85排 出多餘之洗淨液。因此,可防止洗淨液進入間隔構件83之 前方側而混入前室84内之抗蝕液中。活塞82之侧面呈現僅 附著適當量之洗淨液做為潤滑劑之狀態。置換氣體之供應 係持續預先設定於記憶部61之特定時間。 其後’藉操作者或特定之搬送機構搬送基板90,將基板 90載置於突出於置物台3之保持面30上而待機之複數揚升 銷LP上。而,藉複數揚升銷lp之下降,將基板90載置於 保持面30上(步驟S3)。基板9Ό係藉真空吸附口之吸附力被 保持面30所吸附而穩定地被保持於保持面3〇上。 118336.doc -24- 200803994 將基板90載置於保持面30上時,升降機構43、44依據間 隙感測器42之計測值調整狹縫喷嘴41之姿勢及高度(步驟 S4)。另一方面,在供應機構7中,封閉開閉闊73b同時開 放開閉閥73a。而,注射式幫浦8藉使驅動機構86起作用而 使活塞82後退,以吸引收集槽71内之抗蝕液而填充於前室 84内(步驟S5)。此時,活塞82之後部被拉出至後端構件87 之後方側,露出於缸體81之外部。但,在活塞82之側面 中’露出外部之部分已在後室85内被洗淨,並未附著抗蝕 液。因此,抗蝕液不會露出於缸體8 1之外部而被硬化。 其後,線性馬達50、5 1依據線性編碼器52、53之計測值 使父聯部4移動。又,在供應機構7中,封閉開閉閥73 a同 時開放開閉閥73b,注射式幫浦8藉使驅動機構86起作用而 使活塞82前進。因此,狹縫喷嘴41一面在基板9〇之上方掃 描’將抗蝕液塗佈於基板90之表面(步驟S6)。此時,活塞 82之前部被推入至間隔構件83之前方側,進入前室科内。 但,在活塞82之側面中,進入前室84内之部分已在後室85 内被洗淨,並未附著粒子。因此,粒子不會混入前室84内 之抗钱液中。 對基板90之抗蝕液之塗佈完畢時,線性馬達5〇、5丨會使 交聯部4回到待機位置。而,藉複數之揚升銷Lp2上升, 使基板90脫離保持面30。其後,藉操作者或特定之搬送機 構從揚升銷LP上移除基板90,搬出至基板處理裝置丨之外 部(步驟S7)。利用以上之動作,完成在基板處理裝置以 基板90之處理。 118336.doc -25- 200803994 如上所述如圖所示,此基板處理裝置1之注射式幫浦8係 在形成於缸體81之後部側之後室85内,將洗淨液供應至活 塞82之侧面。因此,附著在活塞82之側面之抗蝕液及粒可 猎洗淨液沖洗而由活塞8 2之侧面加以除去。因此,可防止 附著在活塞82之側面之抗蝕液露出後端構件87之後方側露 出而硬化。又,也可防止附著在活塞82之側面之粒子進入 間隔構件83之前方側而混入前室84内之抗蝕液中。 又,供應至後室85内之洗淨液之一部分會附著於第j密 封構件83b、第2密封構件87b、及活塞82之表面,具有作 為潤滑劑之功能。因此,可維持第i密封構件83b及第2密 封構件87b與活塞82之間之潤滑性,圓滑地施行活塞82之 進退動作。 又,注射式幫浦8係一面與形成在缸體81内之間隔構件 83之貫通孔83a及形成在後端構件87之貫通孔87a之内側面 滑接,一面進退,藉改變前室84之體積,由噴出孔81b喷 出抗蝕液。因此,缸體81之内側面與活塞82不直接滑接, 缸體8 1之内側面與活塞82之侧面無必要長距離維持高的加 工精度。從而,可使注射式幫浦8之加工容易化,且可容 易製造容量大之注射式幫浦8。 又,注射式幫浦8係一面將洗淨液儲存於後室85内,一 面在配置於後室85内之活塞82附近形成液流。因此,可將 洗淨液確實供應至活塞82之側面,良好地除去附著在活塞 82之側面之抗蝕液及粒子。 又/主射式幫浦8係使用抗蝕液之溶媒成分之液體作為 118336.doc -26- 200803994 洗淨液。因此,洗淨液即使混入前室8 4内之抗餘液中,對 前室84内之抗蝕液也無造成不良影響之虞。 又,在注射式幫浦8之後室85内,被供應洗淨液後,再 被供應置換氣體。因此,多餘之洗淨液會強制地被排出至 缸體81之外部,可降低洗多餘之淨液進入間隔構件83之前 方之虞。 又’活塞8 2之側面係被加工成平頂構造表面。因此,可 降低活塞82之侧面損傷到第1密封構件83b及第2密封構件 87b之虞,故可防止第}密封構件83b及第2密封構件87b之 磨損劣化。又,因洗淨液被良好地保持於活塞82之側面, 故可良好地維持第1密封構件83b及第2密封構件87b與活塞 82之間之潤滑性。 &lt; 4 ·變形例&gt; 以上’雖說明有關本發明之一實施型態,但本發明並不 限定於以上之例。例如,注射式幫浦8也可採用如圖7所示 之構成。圖7之注射式幫浦8係在將洗淨液導入後室85用之 導入孔81c安裝噴霧部88。喷霧部88係朝向後室85内之活 塞82之側面。因此,洗淨液供應源76所供應之洗淨液係以 霧狀向後室85内之活塞82之側面被喷出。藉此,洗淨液會 直接被供應至活塞82之側面,可良好地除去附著在活塞82 之侧面之抗蝕液及粒子。 又’在上述之例中,使用抗蝕液之溶媒成分之液體作為 洗淨液,但也可使用抗蝕液本身作為洗淨液。如此,即使 將洗淨液混入前室84内之抗蝕液中,前室84内之抗蝕液之 118336.doc -27- 200803994 成分構成比率也不會變化。 又’在上述之例中’開始1塊基板9G之處理時,施行洗 淨液之供應(步驟Sl)與置換氣體之供應(步驟Μ),作此等 之供應時點可依各種條件加以變更。例如,也可在每當處 理1批或特定塊數之基板9叫施行洗淨液之供應與置換氣 體之供應。如此,以限定的時點施行洗淨液及置換氣體之 供應’即可節省洗淨液及置《氣體之消耗量。The present invention is a configuration of a substrate processing apparatus according to an embodiment of the present invention. FIG. 1 is a perspective view showing a configuration of a substrate processing apparatus according to an embodiment of the present invention. This substrate processing apparatus is used to manufacture a glass substrate for a screen panel of a liquid crystal display device (hereinafter simply referred to as "substrate") 90 as a substrate to be processed, in the step of selectively etching the surface of the substrate 9? A device for applying a photoresist liquid (hereinafter simply referred to as "resist solution") as a treatment liquid to the surface of the substrate 90 is used. As shown in Fig. 1, the substrate processing apparatus 1 mainly has a main body portion 2 and a control portion 6. The main body portion 2 is provided with a mounting table 3 on which the substrate 90 is placed and held. The stage 3 is composed of a stone having a rectangular parallelepiped shape, and a flat and horizontally processed holding surface 30 is formed on the upper surface. On the holding surface 3 〇, a plurality of vacuum suction ports (not shown) are formed in the distribution. The substrate 90 placed on the holding surface 3A is sucked by the suction force from the vacuum suction port, thereby stably holding it on the holding surface 3〇. 118336.doc -14- 200803994 Further, in the holding surface 30, the rising and falling pins Lp of the plurality of lifting and lowering are arranged at a specific interval. When the lift pin LP is connected to the drive unit and the drive unit is activated, the lift pin LP can be moved up and down. Thereby, the substrate 90 placed on the lift pins LP can be moved up and down in a horizontal posture at all times. Further, on the holding surface 30, a pair of walking bars 31 are laid horizontally in parallel on both side portions of the region sandwiching the holding substrate 9''. The walking bar 3 1 is coupled to the cross-linking portion '4, which will be described later, and functions to guide the movement of the cross-linking portion 4 in the laying direction of the traveling rail 31. _ Above the stage 3, a cross-linking portion 4 is provided. The cross-linking portion 4 has a nozzle supporting portion 40 and lifting mechanisms 43 and 44 that support both ends of the nozzle supporting portion 4''. The nozzle support portion 40 is made of a carbon fiber reinforced resin as an aggregate, and is disposed in a direction slightly perpendicular to the direction in which the traveling rails 31 are laid. A slit nozzle 41 and a gap sensor 42 are attached to the nozzle support portion 40. The slit nozzle 4 i has a surface on one side of the scanning substrate 90, and a resist liquid is sprayed downward to face the surface of the substrate 90 (more correctly, in the surface of the substrate φ 90, except The function of the area outside the specific wide area). The slit nozzle 41 is connected to a supply mechanism 7 (see Fig. 2) to be described later, and the resist liquid supplied from the supply mechanism is applied to the surface of the substrate 90. The applied resist liquid - a resist film is formed on the surface of the substrate 90. Further, the gap sensor 42 is mounted in the vicinity of the slit nozzle 41. The gap sensor 42 has a function of measuring the distance from the underlying object (the surface of the substrate 90 and the surface of the resist film). The elevating mechanisms 43 and 44 are connected to both end portions of the nozzle support portion 4A. The elevating mechanisms 43 and 44 include AC servo motors 43a and 44a and drive units including ball screws (not shown). The lifting mechanisms 43, 44 are supported by the spray 118336.doc -15-200803994. The lifting/lowering force is applied to both ends of the crucible 4〇, so that the nozzle supporting portion 4〇 is vertically moved up and down in a horizontal posture. Further, the left and right lifting mechanisms 43 and 44 can also independently act to adjust the horizontal posture of the slit nozzle 41. Below the elevating mechanisms 43, 44, there is provided a pair of running portions corresponding to the above-described traveling rails 31. The traveling portion travels along the traveling rail 31 to horizontally move the cross-linking portion 4 above the substrate 90. Further, on the outer side of the traveling rail 3 1 and the cross-linking portion 4, a pair of linear motors 5, 51 and a pair of linear encoders 52, 53 are provided. The linear motors 50 and 51 have stators 50a and 51a fixed to the side faces of the stage 3, and movers 5〇b and 5沁 fixed to the side portions of the cross-linking unit 4. The linear motors 5A and 51 are driven by the driving force generated between the stator 5〇a 5 la and the movers 5〇b and 5 lb to move the cross-linking unit 4 in the direction in which the traveling rails 3 1 are moved. On the other hand, the linear encoder, 53 has a scale portion fixed along the stators 5A, 51a, and a detection piece fixed to the outside of the movers 5〇b, 5 lb. The linear encoders 52, 53 detect the position of the cross-linking portion 4 by measuring the relative position of the detected piece to the scale portion. An opening 32 is formed in a portion of the region sandwiched by the walking strips 3 1 of the holding surface 3 on the stage 3. Inside the main body portion 2 below the opening 32, a standby cylinder, a nozzle cleaning mechanism, and a precoating mechanism are provided. These mechanisms are used in preparatory processing such as a resist liquid supply process, a pumping process, and a pre-dispersion process which are performed before the coating process of the resist liquid of the substrate 90. The control unit 6 is internally provided with a memory unit 6 for storing the various data in accordance with the program, and a storage unit for storing the program and various materials. Specifically, the computing unit 60 is composed of a CPU and an MPU, and the storage unit 61 is configured by ram, 118336.doc -16 - 200803994 ROM, and a disk I. The memory unit 61 stores, for example, the time at which the cleaning liquid and the replacement gas are supplied to the injection pump 8 to be described later. In front of the control unit 6, an operation unit 62 for accepting an operation input from an operator and a display unit for displaying various kinds of information are provided. Specifically, the operation unit 62 is composed of a plurality of switches (including a keyboard and a mouse), and the display unit 63 is composed of a liquid crystal display and a CRT. The operator can operate the operation unit 62 to arbitrarily set the information stored in the memory unit at the above-mentioned point in time. Alternatively, the display unit can be configured by a touch panel type display, and the display unit 63 can be configured to operate simultaneously. Fig. 2 is a side cross-sectional view of the above-described stage 3 and slit nozzle 41. Fig. 2 also schematically shows the electrical or mechanical connection configuration of each part of the substrate processing apparatus 。. It is connected to the gap sensor 42, the lifting mechanism 43, 44, the linear motor 5〇, 51, the linear encoder 52, the magic, and the supply mechanism 7. The control unit 6 receives the gap sensor 42 and the linear encoder. u, 53 transmits the measured value, and controls the movement of the elevating mechanism 43, 44, the linear motor π, and the supply mechanism 7. For example, the control unit 6 controls the elevating mechanism 43 according to the measured value received by the gap sensor 42, The operation of the material adjusts the distance between the substrate 90 and the slit nozzle 41. Further, the control unit 6 controls the operation of the linear motor 5 by the measurement values received by the linear encoders 52, 53 to perform the loading. Slot spray on stage 3 Further, the control unit 6 discharges the residual liquid to the surface of the substrate 90 by the slit nozzle 41 by controlling the operation of the supply mechanism 7. <2. Configuration of Supply Mechanism> Fig. 3 shows A diagram showing the specific configuration of the supply mechanism 7. As shown in Fig. 3, 118336.doc -17-200803994 The supply mechanism 7 includes a collecting tank 71, pipes 72a to 72h, opening and closing ports 73a to 73d, a pressure adjusting portion 74, and a filter. 75 and the injection pump 8. The opening and closing valves 73a to 73d, the pressure adjusting unit 74, and the driving mechanism % of the injection pump 8 are electrically connected to the control unit 6, and the control unit 6 controls these operations to The supply operation of the resist liquid to the slit nozzle 41 is performed. The collecting tank 71 temporarily stores the resist liquid supplied from the resist liquid supply source 7 through the piping 7 to. When the resist liquid is stored in the collecting tank 71 The bubbles in the resist liquid float on the liquid surface and are separated from the upper portion of the collecting tank 71. The gas components accumulated in the upper portion of the collecting tank 71 are discharged to the outside through the pipe 72b, thereby removing the bubbles in the anti-caries liquid. The injection pump 8 system attracts the resist liquid stored in the collecting tank 71, and is narrow The slit nozzle 41 ejects the discharge pump for the sucked liquid to be sucked. The injection pump 8 includes a hollow cylinder 81 and a piston (plunger) 82 that moves in and out of the cylinder 81. The cylinder 81 The inside of the partition member 83 is partitioned into a front chamber material and a rear portion 85, and the resist liquid sucked by the collecting tank 71 is filled in the front chamber 84. The piston 82 is inserted through the partition member 83 and inserted into the cylinder block 81. The front end of the piston 82 is connected to the driving mechanism 86, and receives the driving force from the driving mechanism %, so that the piston 82 advances and retreats in the front-rear direction of the cylinder 81. Before the injection pump 8 is between the chamber 84 and the collecting tank 71 It is connected by piping 72c. On the other hand, the opening and closing valve 73a is interposed in the path of the pipe 72c. Further, the front chamber 84 of the injection pump 8 and the slit nozzle 41 are connected by a pipe 72d. On the other hand, the opening and closing valve 731 &gt; is interposed in the path of the pipe 72d. Therefore, when the opening and closing valve 73b is closed and the opening and closing valve 73a is opened at the same time, when the piston 82 is retracted (post-pull), the resist liquid stored in the collecting tank 71 can be attracted to the front chamber of the pipe through the pipe 72 (). 84 inside. When the opening and closing valve 73a is closed and the opening and closing valve 73b is opened, and the piston 82 is advanced (forward), the resist liquid filled in the front chamber 84 can be supplied to the slit nozzle 41 via the pipe 72d. The slit nozzle 41 applies the supplied resist liquid to the surface of the substrate 90. On the other hand, in the chamber 85 after the cylinder 81, the pipe 72e is connected. The upstream side of the pipe 72e. is divided into a pipe 72f and a pipe 72g, and on the upstream side of the pipe 72f, a cleaning liquid supply source 76 for supplying the cleaning liquid is connected. Therefore, when the opening and closing valve 73 is provided in the pipe 72f, the cleaning liquid is supplied from the cleaning liquid supply source 76 to the rear chamber 85 through the pipe 72f and the pipe 72e. Further, a replacement gas supply source 77 for supplying a replacement gas is connected to the upstream side of the pipe 72g. Therefore, when the opening and closing valve 73d provided in the pipe 72g is opened, the replacement gas is supplied from the replacement gas supply source 77 to the rear chamber 85 through the pipe 72g and the pipe 72e. The opening and closing valve 73c and the opening and closing valve 73d have a function as a switching mechanism for switching the supply of the cleaning liquid and the replacement gas. The cleaning liquid and the replacement gas system supplied to the rear chamber 85 are discharged to the outside of the cylinder through the piping 7 2 h •. Further, as the above-mentioned cleaning liquid, for example, an organic solvent such as acetone, PEGMEA or PEGME which functions as a lubricant is used as a solvent component of the resist liquid. Further, as the above-mentioned replacement gas, for example, inert gas such as nitrogen or CDA (clean dry air) is used. The pressure adjusting portion 74 is connected to the pipe 72 of the cylinder 81 connected to the collecting tank 71. The pressure adjusting unit 74 maintains the suction pressure of the resist liquid sucked by the collecting tank? to the cylinder 81 at a specific value or less, thereby preventing generation of bubbles in the anti-(4). Further, in the pipe connecting the injection pump 8 and the slit nozzle 41, the filter 75 is inserted. The filter 75 is used to remove the impurities (particles and bubbles, etc.) which are present in the injection pump "118336.doc •19-200803994" to make the anti-speech liquid clear. Figure 4 shows the above in more detail. A configuration of the injection pump 8. The configuration of the injection pump 8 will be described in more detail with reference to Fig. 4. The cylinder 81 of the cylinder 81 is made of stainless steel such as SUS and has a slightly cylindrical shape. The internal space of the cylinder 8i is partitioned into a front chamber and a rear chamber 85 by a partition member 83. A suction hole 8ia is formed on a side surface of the cylinder 81 facing the front chamber 84. The above-mentioned piping 72c is connected to the suction hole 81a by the collecting tank 71. The resist liquid to be sucked (see Fig.) is introduced into the front chamber 84 by the suction hole 81a. Further, a discharge hole 81b is formed at the end portion of the front portion (the upper surface of the cylinder 81 of Fig. 4). 8ib is connected to the above-described pipe 72d, and the resist liquid discharged from the cylinder 81 is sent to the pipe 72d via the discharge hole 81b. That is, the front chamber 84 is a space for filling the resist liquid as the treatment liquid. The rear end of the body 81 (the bottom surface of the cylinder 81 of Fig. 4), after the closed cylinder 81 is installed The rear end member 87 is used for the end portion. The rear end member 87 and the partition member 83 constitute the outer wall of the rear chamber 85 at the same time, and the space surrounded by the side surfaces of the partition member 83, the rear end member" and the red body 81 becomes the rear chamber 85. The member 83 and the rear end member 87 respectively form through holes 83a and 87a penetrating the front and rear directions of the cylinder 81, and the pistons 82 are inserted through the through holes 83a and 87a. The rear end of the piston 82 is connected to the drive mechanism 86. % has a motor 86a, a ball screw 86b, a nut 86c, a guide portion 86 (1, and a coupling member 86e. The drive mechanism 86 rotates the ball screw 86b by the driving force generated by the motor 86a, and is screwed to the ball screw. The nut 86〇 moves in the front-rear direction of the cylinder 81 along the guide portion 86d. The piston 82 coupled to the nut 86c via the coupling member 86e moves forward and backward as the nut 86c moves. 118336.doc -20- 200803994 At intervals The inner circumferential surface of the through hole 83a of the member 83 is attached with the second sealing member 83b. The first sealing member 83b is made of a resin material excellent in slidability and wear resistance, and the through hole of the spacer member 83 is slidably sealed. Within 83&amp; The surface of the second sealing member 87b is attached to the inner circumferential surface of the through hole 87a of the rear end member 87. The second sealing member 87b is also excellent in slidability and wear resistance. The resin material is configured to slidably seal between the inner circumferential surface of the through hole 87a of the rear end member 87 and the outer circumferential surface of the piston 82. As the material constituting the sealing members 83b and 87b, PEEK can be specifically used, and Ny can be used. Resin materials such as PME, POM, UHMW-HDPE, polyethylene terephthalate, and polyamidene. An introduction hole 81c is formed on a side surface of the cylinder 81 facing the rear chamber 85. The piping 72e is connected to the introduction hole 81c, and the cleaning liquid supplied from the cleaning liquid supply source 76 and the replacement gas system supplied from the replacement gas supply source 77 are introduced into the rear chamber 85 through the introduction hole 81c. Further, in the side surface of the cylinder 81 facing the rear chamber 85, the discharge hole 8 Id is formed at a position where the introduction hole 81c and the piston 82 are opposed to the opposite side of the introduction hole 81c. The piping 72h is connected to the discharge port 81d, and the liquid and gas system in the rear chamber 85 is discharged to the piping 72h by the discharge hole 81d. When the cleaning liquid is supplied into the rear chamber 85, the cleaning liquid is stored in the rear chamber 85, and a liquid flow is formed in the vicinity of the piston 82 disposed in the rear chamber 85. Therefore, the resist liquid and particles adhering to the side surface of the piston 82 are washed by the washing liquid and removed by the side surface of the piston 82. Therefore, it is possible to prevent the resist liquid adhering to the side surface of the piston 82 from being exposed to the rear side of the rear end member 87 and being hardened. Further, it is also possible to prevent particles adhering to the side surface of the piston 82 from entering the front side of the spacer member 83 and 118336.doc -21 - 200803994 being mixed into the resist liquid in the front chamber 84. The portion of the cleaning liquid supplied to the rear chamber 85 adheres to the surfaces of the i-th sealing member 83b, the second sealing member 87b, and the living protrusion #^ 夂 夂 基 S S2, and functions as a lubricant. Therefore, the lubricity between the first sealing member 83b and the second sealing member 87b and the piston 82 can be maintained, and the forward and backward movement of the piston 82 can be smoothly performed. When the cleaning liquid is supplied to the rear chamber 85, the closing and closing valve 7 is closed (see Fig. 3) while the opening and closing valve 73d (see Fig. 3) is opened, and the supply of the cleaning liquid is stopped, and the switching gas is supplied into the rear chamber 85. When the replacement gas is supplied into the rear chamber 85, the replacement gas forcibly extrudes and discharges the excess liquid in the rear chamber 85 toward the discharge port side. (4) 'The excess cleaning liquid can be prevented from entering the front side of the spacer member 83 and mixed into the resist liquid in the front chamber 84. The side surface of the piston 82 after the replacement gas supply is in a state in which only a proper amount of the cleaning liquid is adhered as a lubricant. Fig. 5 is a view showing a simplified cross-sectional shape of the vicinity of the side surface of the piston 82. As shown in Fig. 5, the side surface of the piston 82 is a so-called "flat-top structure surface" which is formed by cutting a high mountain portion into a flat portion 82a and leaving a deep valley portion 82b. Therefore, the side damage of the piston 82 can be reduced to the first! Since the sealing member 8A and the second sealing member 87b are in contact with each other, abrasion deterioration of the first sealing member 83b and the second sealing member 87b can be prevented. Further, the cleaning liquid can be satisfactorily held on the side surface of the piston 82 by flowing the cleaning liquid into the valley portion 8. Therefore, the lubricity between the first sealing member 83b and the second sealing member 87b and the piston 82 can be satisfactorily maintained. Specifically, it is preferable that the side surface of the piston 82 is processed to a load length ratio Rmr(c) specified in JIS B0601 (corresponding to International No. 118336.doc -22-200803994 specification: IS04287) to be 50% of the maximum height roughness Rz. In the quasi-c, it is Rmr(c)-70%. The side of such a piston 82 can more significantly have the characteristics of a flat top configuration. Therefore, the deterioration of the wear of the first sealing member 83b and the second sealing member 87b can be more satisfactorily prevented. The lubricity between the first sealing member 83b and the second sealing member 87b and the piston 82 can be more satisfactorily maintained. In addition, the side of the piston 82 is the arithmetic mean height Ra and the maximum mountain height specified in jisb〇601 (corresponding to the international standard: IS04287). If processed into RaSO.〇8 μηι and Rp^O.3 μπι, More ideal. The side of the piston 82 becomes a flattened construction surface that cuts the high mountain into a flatter. Therefore, the wear of the first sealing member 83b and the second sealing member 87b can be prevented from being deteriorated more satisfactorily. Further, if the side surface property of the piston is further defined by the maximum height roughness rz and the maximum valley depth Rv defined in JIS B0601 (corresponding to the international standard: IS0428 7), the side surface of the piston 82 is preferably processed into rz $1·3. Ιιη, Rv$ ι·〇μιη 0 Returning to Fig. 4, the piston 82 is not directly slidably coupled to the inner side surface of the cylinder block 81, but is formed on one side and the through hole 83a formed in the partition member 83 and formed in the rear end member 87. Beton hole 8 7 a inside the side sliding, one side advance and retreat. On the other hand, by changing the volume of the month to 84, the resist liquid is ejected from the ejection holes 81b. Therefore, it is not necessary to maintain a high processing precision in the long distance between the inner side surface of the cylinder 81 and the side surface of the piston 82. Thereby, the processing of the injection pump 8 can be facilitated, and the injection pump 8 having a large capacity can be easily manufactured. &lt;3. Operation of Substrate Processing Apparatus&gt; Next, while referring to the above-described respective drawings and the flowchart of Fig. 6, it is explained that 118336.doc -23-200803994 is applied to the substrate processing apparatus 1 to perform the processing of the substrate 90. action. Further, in the processing operation described below, the drive unit, the gap sensor 42, the elevating mechanism 43, 44, the linear motors 50, 51, the linear encoders 52, 53, and the opening and closing of the lift pins LP are controlled by the control unit 6. The valves 73a to 73d, the pressure adjusting unit 74, the drive mechanism 86, and the like are performed. When the substrate processing apparatus 1 performs the processing of the substrate 90, first, the opening and closing valve 73d is closed and the opening and closing valve 73c is opened, and the cleaning liquid is supplied to the chamber 85 after the injection pump 8 (step S1). The cleaning liquid forms a liquid flow in the rear chamber 85 near the piston 82 to rinse the resist liquid and the particles attached to the side of the piston 82. The anti-money liquid and the particle system removed from the side surface of the living group 8 2 are discharged from the discharge hole 81d at the same time as the cleaning liquid. The supply of the cleaning liquid is continuously set in advance at the specific time of the memory unit 61. Then, the opening and closing valve 73c is closed and the opening and closing valve 73d is opened, and the replacement gas is supplied to the chamber 85 after the injection pump 8 (step S2). The replacement gas forcibly extrudes the liquid in the rear chamber 85 toward the discharge hole 81d side, and discharges the excess cleaning liquid from the rear chamber 85. Therefore, the cleaning liquid can be prevented from entering the front side of the partition member 83 and being mixed into the resist liquid in the front chamber 84. The side of the piston 82 is in a state in which only a proper amount of the washing liquid is attached as a lubricant. The supply of the replacement gas is continuously set in advance at a specific time in the memory unit 61. Thereafter, the substrate 90 is transported by the operator or the specific transport mechanism, and the substrate 90 is placed on the plurality of lift pins LP that stand on the holding surface 30 of the stage 3 and stand by. On the other hand, the substrate 90 is placed on the holding surface 30 by the fall of the plurality of rising pins lp (step S3). The substrate 9 is stably held by the holding surface 30 by the adsorption force of the vacuum suction port and is held by the holding surface 30. 118336.doc -24- 200803994 When the substrate 90 is placed on the holding surface 30, the elevating mechanisms 43 and 44 adjust the posture and height of the slit nozzle 41 in accordance with the measured value of the gap sensor 42 (step S4). On the other hand, in the supply mechanism 7, the opening and closing valve 73a is opened and closed 73b. On the other hand, the injection pump 8 retracts the piston 82 by the action of the drive mechanism 86 to suck the resist liquid in the collecting tank 71 and fill it in the front chamber 84 (step S5). At this time, the rear portion of the piston 82 is pulled out to the rear side of the rear end member 87, and is exposed to the outside of the cylinder 81. However, the portion exposed to the outside in the side surface of the piston 82 has been cleaned in the rear chamber 85, and the resist liquid is not attached. Therefore, the resist liquid is not exposed to the outside of the cylinder block 81 and is hardened. Thereafter, the linear motors 50, 51 move the parent joint 4 in accordance with the measured values of the linear encoders 52, 53. Further, in the supply mechanism 7, the opening and closing valve 73a is closed and the opening and closing valve 73b is opened at the same time, and the injection pump 8 causes the driving mechanism 86 to act to advance the piston 82. Therefore, the slit nozzle 41 scans the upper surface of the substrate 9 to apply the resist liquid to the surface of the substrate 90 (step S6). At this time, the front portion of the piston 82 is pushed to the front side of the spacer member 83 to enter the front chamber. However, in the side of the piston 82, the portion that has entered the front chamber 84 has been cleaned in the rear chamber 85, and no particles are attached. Therefore, the particles do not mix into the anti-money solution in the front chamber 84. When the application of the resist liquid on the substrate 90 is completed, the linear motors 5 〇 and 5 丨 return the cross-linking portion 4 to the standby position. On the other hand, the substrate L90 is separated from the holding surface 30 by the rise of the rising number Lp2. Thereafter, the substrate 90 is removed from the lift pins LP by an operator or a specific transport mechanism, and is carried out to the outside of the substrate processing apparatus (step S7). By the above operation, the processing on the substrate 90 in the substrate processing apparatus is completed. 118336.doc -25- 200803994 As shown in the figure, the injection pump 8 of the substrate processing apparatus 1 is formed in the chamber 85 after the rear side of the cylinder 81, and supplies the cleaning liquid to the piston 82. side. Therefore, the resist liquid and the particles attached to the side of the piston 82 can be washed by the cleaning liquid and removed by the side of the piston 82. Therefore, it is possible to prevent the resist liquid adhering to the side surface of the piston 82 from being exposed to the side after the rear end member 87 is exposed and hardened. Further, it is also possible to prevent particles adhering to the side surface of the piston 82 from entering the front side of the spacer member 83 and being mixed into the resist liquid in the front chamber 84. Further, a part of the cleaning liquid supplied into the rear chamber 85 adheres to the surfaces of the j-th sealing member 83b, the second sealing member 87b, and the piston 82, and functions as a lubricant. Therefore, the lubricity between the i-th seal member 83b and the second seal member 87b and the piston 82 can be maintained, and the advancement and retreat operation of the piston 82 can be smoothly performed. Further, the injection type pump 8 is slidably engaged with the through hole 83a of the partition member 83 formed in the cylinder 81 and the inner side surface of the through hole 87a formed in the rear end member 87, and the front chamber 84 is changed. The volume is discharged from the ejection hole 81b. Therefore, the inner side surface of the cylinder block 81 is not directly slidably coupled to the piston 82, and the inner side surface of the cylinder block 81 and the side surface of the piston 82 do not have to be long distances to maintain high processing precision. Thereby, the processing of the injection pump 8 can be facilitated, and the injection pump 8 having a large capacity can be easily manufactured. Further, the injection pump 8 system stores the cleaning liquid in the rear chamber 85, and forms a liquid flow in the vicinity of the piston 82 disposed in the rear chamber 85. Therefore, the cleaning liquid can be surely supplied to the side surface of the piston 82, and the resist liquid and particles adhering to the side surface of the piston 82 can be favorably removed. Further, the main-ejection pump 8 system uses a liquid of a solvent component of the resist liquid as a washing liquid of 118336.doc -26-200803994. Therefore, even if the cleaning liquid is mixed into the residual liquid in the front chamber 84, the cleaning liquid in the front chamber 84 is not adversely affected. Further, after the cleaning liquid is supplied to the chamber 85 after the injection pump 8, the replacement gas is supplied. Therefore, the excess washing liquid is forcibly discharged to the outside of the cylinder block 81, and the excess of the washing liquid before entering the partition member 83 can be reduced. Further, the side of the piston 8 2 is machined into a flat top construction surface. Therefore, the side surface of the piston 82 can be prevented from being damaged by the first sealing member 83b and the second sealing member 87b, so that the wear of the first sealing member 83b and the second sealing member 87b can be prevented from deteriorating. Further, since the cleaning liquid is favorably held on the side surface of the piston 82, the lubricity between the first sealing member 83b and the second sealing member 87b and the piston 82 can be favorably maintained. &lt;4. Modifications&gt; The above description relates to an embodiment of the present invention, but the present invention is not limited to the above examples. For example, the injection pump 8 can also be constructed as shown in Fig. 7. In the injection type pumping system 8 of Fig. 7, the spray portion 88 is attached to the introduction hole 81c for introducing the cleaning liquid into the rear chamber 85. The spray portion 88 is directed to the side of the piston 82 in the rear chamber 85. Therefore, the cleaning liquid supplied from the cleaning liquid supply source 76 is sprayed to the side surface of the piston 82 in the rear chamber 85 in a mist form. Thereby, the cleaning liquid is directly supplied to the side surface of the piston 82, and the resist liquid and particles adhering to the side surface of the piston 82 can be favorably removed. Further, in the above example, a liquid of a solvent component of the resist liquid is used as the cleaning liquid, but the resist liquid itself may be used as the cleaning liquid. Thus, even if the cleaning liquid is mixed into the resist liquid in the front chamber 84, the composition ratio of the resist liquid 118836.doc -27-200803994 in the front chamber 84 does not change. Further, when the processing of one substrate 9G is started in the above-described example, the supply of the cleaning liquid (step S1) and the supply of the replacement gas (step Μ) are performed, and the supply timing can be changed according to various conditions. For example, it is also possible to perform the supply of the cleaning liquid and the supply of the replacement gas every time a batch or a specific number of substrates 9 are processed. In this way, the supply of the cleaning liquid and the replacement gas can be performed at a limited time to save the cleaning liquid and the gas consumption.

又,在上述之例中’雖將活塞82之側面全體加工成平頂 構造表面’但’活塞82之側面只要將至少與幻密封構件 請及第2密封構件87b滑接之部分加工成平頂構造表 可0 【圖式簡單說明】 圖1係表示本發明之一實施型態之基板處理裝置之構成 圖2係置物台及狹縫喷嘴之側剖面圖。 圖3係表示供應機構之構成之圖。 圖4係詳細表示注射式幫浦之構成之圖。 圖5係將活塞之側面附近之剖面形狀單純化所示之圖 圖6係表示基板處理裝置1之基板處理流程之流程圖。 圖7係表示變形例之注射式幫浦之構成之圖。 【主要元件符號說明】 1 2 基板處理裝置 主體部 置物台 118336.doc -28- 3 200803994Further, in the above-described example, "the entire side surface of the piston 82 is processed into a flat top structure surface", but the side surface of the piston 82 is formed into a flat top structure table by at least a portion which is slidably connected to the magic seal member and the second seal member 87b. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side cross-sectional view showing a structure of a substrate processing apparatus according to an embodiment of the present invention. Fig. 3 is a view showing the configuration of a supply mechanism. Fig. 4 is a view showing in detail the configuration of the injection pump. Fig. 5 is a view showing a simplification of a cross-sectional shape in the vicinity of a side surface of a piston. Fig. 6 is a flow chart showing a substrate processing flow of the substrate processing apparatus 1. Fig. 7 is a view showing the configuration of an injection type pump of a modification. [Description of main component symbols] 1 2 Substrate processing unit Main body stage 118336.doc -28- 3 200803994

4 交聯部 6 控制部 7 供應機構 8 注射式幫浦 30 保持面 41 狹缝喷嘴 61 記憶部 62 操作部 71 收集槽 73a〜73d 開閉閥 76 洗淨液供應源 77 置換氣體供應源 81 缸體 81a 吸引孔 81b 喷出孔 81c 導入孔 81d 排出孔 82 活塞 83 間隔構件 83a、87a 貫通孔 83b 、 87b 密封構件 84 前室 85 後室 86 驅動機構 118336.doc -29- 200803994 87 88 90 後端構件 喷霧部 基板4 Cross-linking unit 6 Control unit 7 Supply mechanism 8 Injection pump 30 Holding surface 41 Slit nozzle 61 Memory unit 62 Operating unit 71 Collection tanks 73a to 73d Opening and closing valve 76 Cleaning liquid supply source 77 Displacement gas supply source 81 Cylinder block 81a suction hole 81b discharge hole 81c introduction hole 81d discharge hole 82 piston 83 spacer member 83a, 87a through hole 83b, 87b sealing member 84 front chamber 85 rear chamber 86 drive mechanism 118336.doc -29- 200803994 87 88 90 rear end member Spray substrate

118336.doc118336.doc

Claims (1)

200803994 十、申請專利範圍: 1 · 一種注射式幫浦,其特徵在於:其係供送處理液用者, 且包含: 中空之缸體(cylinder),其係具有吸引前述處理液之吸 引孔與噴出前述處理液之噴出孔者;200803994 X. Patent application scope: 1 . An injection type pump, which is characterized in that it is used for supplying a treatment liquid, and comprises: a hollow cylinder having a suction hole for attracting the treatment liquid and Spraying out the discharge hole of the treatment liquid; 間隔構件,其係將前述缸體之内部空間隔成為與前述 吸引孔土及前述喷出孔連通之第丨室、以及形成於比前述 第1至罪近前述缸體之後部側之第2室,並具有貫通於前 述缸體之前後方向之第1貫通孔者; 後端構件,其係配置於前述缸體之後端 第2室之外壁之-部分,並具有貫通於前述缸2 = 方向之第2貫通孔者; 活塞,其係***前述第丨貫通孔及前 :端部配置於前述第1之内部,且其後端二 則述缸體之後端部靠近前述缸體之外側者; 驅動部’其係使前述活塞於前述缸體之前後方向進退 者; 第1密封構件,其係滑接自如地密封前述第 内側面與前述活塞之側面之間者; 、 第2密封構件’其係滑接自*地㈣前述第^通孔之 内側面與前述活塞之側面之間者; 液體供應機構,盆择在俞成蜜9^ 再〃係在則边弟2至之内部,將特定液 體供應至前述活塞之侧面者;及 号疋狀 液體排出機構, 其係由前述第2室排出 前述特定液體 118336.doc 200803994 者。 2_如請求項1之注射式幫浦,其中 鈿述活塞係不與前诚名辦 則述缸體之内侧面滑接,而於前述缸 體之前後方向進退’改變前述第1室之體積,藉此由前 述噴出孔噴出前述處理液者。 3·如請求項2之注射式幫浦,其中 述液體供應機構係藉將前述特定液體儲存於前述第 2室内’而將前述特定液體供應至前述活塞之侧面。 4.如請求項2之注射式幫浦,其中 前述液體供應機構係向配置於前述第2室内之前述活 基之側面噴出前述特定液體。 5·如請求項3或4之注射式幫浦,其中 前述特定液體係前述處理液之溶媒或前述處理液。 6.如請求項3或4之注射式幫浦,其中進—步包含: 氣體供應機構,1传, z、係在則述弟2至内,將特定氣體 應結供應前述特定液體之前述活塞之側面;&amp; 供 體。^出機構’其係由前述第2室排出前述特定氣 7·如明求項3或4之注射式幫浦,其巾 第=述活塞之側面中至少與前述第1密封構件及前过 it構件滑接之部分係平卿叫構造 Μ 8·如Μ ^項7之注射式幫浦,其中 别述平頂構造表面之膽0601(對應之國 IS04287)中所插金+么 闼際規袼·· 疋之負載長度率Rmr⑷係在最大高度粗 118336.doc 200803994 度Rz之50%之切斷位準e中,為Rmr(c)^7〇%者。 9·如請求項7之注射式幫浦,其中 在刖述平頂構造表面之JISB〇6〇1(對應之國際 —)中所規定之算術平均高度㈣最大山高度_ RaS0.08 μηι且 RpS〇 3 者。 1-種基板處理裝置’其特徵在於:其係藉處理液處理基 板者,且包含: 喷出處理液之注射式幫浦;及 處理液供應機構,其係將由前述注射式幫浦噴出之前 述處理液供應至基板之表面者; 前述注射式幫浦係包含: 中空之缸體,其係具有吸引前述處理液之吸引孔與喷 出前述處理液之噴出孔者; 間隔構件,其係將前述缸體之内部空間隔成為與前述 吸引孔及前述喷出孔連通之第1$、以及形成於比前述 第1室靠近前述缸體之後部側之第2室,並具有貫通於前 述缸體之前後方向之第!貫通孔者; 斤後端構件,其係配置於前述缸體之後端部而構成前述 第2室之外壁之-部分,並具有貫通於前述缸體之前後 方向之第2貫通孔者; 活塞,其係***前述第!貫通孔及前述第2貫通孔,其 前端部配置於前述第丨室之㈣,且其㈣部配置於^ 前述缸體之後端部靠近前述缸體之外側者; 驅動部,其係使前述活塞於前述缸體之前後方向進退 118336.doc 200803994 者 十 子構件,其係滑接自如地密封 内側㈣前述活塞之側面之間者;以1貝通孔之 &quot;山封構件,其係滑接自如地密封前 内侧面與前述活塞之側面之間者; 貝通孔之 、-供應機構,其係在前述第2室之内部,將特定液 體供應至前述活塞之側面者;及 、_排出機構,其係由前述第2室排出前述特定液體 者。 11·如請求項10之基板處理裝置,其中進一步包含: a疋機構’其係設定前述液體供應機構之動作之時序 者;及 拴制機構,其係依據由前述設定機構所設定之時序, 使前述液體供應機構執行動作者。 12. —種基板處理方法,其特徵在於:其係藉處理液處理基 板者,且包含: 第1步驟,其係藉使注射式幫浦内之活塞進退,而經 由形成於前述注射式幫浦内之第1室,將處理液供應至 基板表面;及 第2步驟,其係在形成於前述注射式幫浦内之第2室 内,將特疋液體供應至前述活塞之側面。 118336.docThe partition member is a second chamber in which the internal space of the cylinder is connected to the suction hole and the discharge hole, and a second chamber formed on the rear side of the cylinder from the first to the sin And having a first through hole penetrating in a front-rear direction of the cylinder block; and a rear end member disposed at a portion of the outer wall of the second chamber at the rear end of the cylinder block and having a direction passing through the cylinder 2 = a second through hole; the piston is inserted into the first through hole and the front end; the end portion is disposed inside the first inner portion, and the rear end portion of the rear end portion of the cylinder is closer to the outer side of the cylinder; a portion that causes the piston to advance and retreat in a front-rear direction of the cylinder; a first sealing member that slidably seals between the inner side surface and a side surface of the piston; and a second sealing member Sliding from the ground (4) between the inner side of the aforementioned through hole and the side of the piston; the liquid supply mechanism, the pot is selected in Yu Chengmi 9^ and then tied inside the brother 2 to the specific liquid Supply to the side of the aforementioned piston; No. Cloth-like liquid discharge mechanism based 118336.doc 200803994 by the particular liquid by said second discharge chamber. 2_Injective pump of claim 1, wherein the piston system is not slid to the inner side of the cylinder, and the front and rear of the cylinder are moved forward and backward to change the volume of the first chamber. Thereby, the treatment liquid is ejected from the ejection orifice. 3. The injection pump of claim 2, wherein the liquid supply mechanism supplies the specific liquid to the side of the piston by storing the specific liquid in the second chamber. 4. The injection pump according to claim 2, wherein the liquid supply means ejects the specific liquid to a side surface of the living body disposed in the second chamber. 5. The injection pump of claim 3 or 4, wherein the solvent of the treatment liquid of the specific liquid system or the treatment liquid is aforesaid. 6. The injection pump of claim 3 or 4, wherein the step further comprises: a gas supply mechanism, a transmission, a z, a system in which the specific gas is supplied to the piston of the specific liquid Side; &amp; donor. The outlet mechanism is configured to discharge the specific gas from the second chamber. The injection pump of the third or fourth embodiment is the same as the first sealing member and the front portion of the piston. The part of the sliding part of the component is called the construction of the Μ 8·如Μ ^ Item 7 injection pump, which is described in the flat top structure of the surface of the bile 0601 (corresponding country IS04287) inserted in the gold + 闼 闼 袼· The load length ratio Rmr(4) is the Rmr(c)^7〇% of the cut-off level e of the maximum height of 118336.doc 200803994 Rz. 9. The injection type pump of claim 7, wherein the arithmetic mean height (4) maximum mountain height _ RaS0.08 μηι and RpS specified in JISB〇6〇1 (corresponding to international-) of the surface of the flat top structure 〇3. a 1-type substrate processing apparatus characterized in that it processes a substrate by a processing liquid, and includes: an injection pump that ejects a processing liquid; and a processing liquid supply mechanism that is ejected by the injection pump The injection pump is supplied to the surface of the substrate; the injection pump system includes: a hollow cylinder having a suction hole for sucking the treatment liquid and a discharge hole for discharging the treatment liquid; and a spacer member which is the aforementioned The inner space of the cylinder is a first $ that communicates with the suction hole and the discharge hole, and a second chamber that is formed closer to the rear side of the cylinder than the first chamber, and has a through-hole The front and rear direction! a through hole, a rear end member disposed at a rear end portion of the cylinder to constitute a portion of the outer wall of the second chamber, and having a second through hole penetrating the front and rear direction of the cylinder; The first through hole and the second through hole are inserted into the first through hole, and the front end portion is disposed in the fourth chamber (four), and the fourth portion is disposed on the outer side of the cylinder after the end portion of the cylinder; The piston is advanced and retracted in the front and rear direction of the cylinder block 118336.doc 200803994. The ten sub-members are slidably sealed between the inner side (four) between the sides of the piston; the one-pass hole-to-mountain seal a member that slidably seals between the front inner side surface and the side surface of the piston; a beton hole-supply mechanism that is inside the second chamber to supply a specific liquid to the side of the piston And a discharge mechanism that discharges the specific liquid from the second chamber. 11. The substrate processing apparatus of claim 10, further comprising: a 疋 mechanism that sets a timing of an operation of the liquid supply mechanism; and a tweezing mechanism that is based on a timing set by the setting mechanism The aforementioned liquid supply mechanism executes the actor. 12. A method of processing a substrate, comprising: treating a substrate by a processing liquid, and comprising: a first step of forming a syringe in the injection pump by advancing and retreating In the first chamber, the processing liquid is supplied to the surface of the substrate; and in the second step, the special liquid is supplied to the side surface of the piston in the second chamber formed in the injection pump. 118336.doc
TW096103932A 2006-04-14 2007-02-02 Syringe pump, substrate processing apparatus and substrate processing method TWI314067B (en)

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KR100912407B1 (en) * 2007-12-18 2009-08-14 주식회사 나래나노텍 An Improved Driving Device For A Pumping Device for Pumping Coating Liquid, and A Pumping Device, A Nozzle Device and A Coating Device Having the Same
KR100948123B1 (en) 2008-07-10 2010-03-18 주식회사 나래나노텍 A Pumping Device for Pumping Coating Liquid and A Slit Die and A Coating Device Having the Same
CN102463198B (en) * 2010-11-19 2013-07-31 大连德新机电技术工程有限公司 Air pressure jet-marking device for screw machine
KR101259611B1 (en) * 2011-04-13 2013-05-13 주식회사 코디엠 Up-Down Device of Oven Chamber for Fabricating the LCD Substrate
KR101365609B1 (en) * 2011-11-09 2014-02-20 나노에프에이 주식회사 dispense apparatus of adhesive liquid and method thereof
KR101512560B1 (en) * 2012-08-31 2015-04-15 가부시키가이샤 스크린 홀딩스 Substrate processing apparatus
CN103331276B (en) * 2013-07-12 2016-05-18 深圳市华星光电技术有限公司 Ultrasonic cleaning equipment and the coating machine with this ultrasonic cleaning equipment
CN103480523B (en) * 2013-10-03 2016-01-20 尤潘垦 A kind of benzene plate vasopressing injection fire-resistant fluid device
CN105499080B (en) * 2015-12-31 2020-09-01 昆山龙腾光电股份有限公司 Glue supply system and glue supply method
JP6736989B2 (en) * 2016-06-07 2020-08-05 東京エレクトロン株式会社 Treatment liquid supply device, equipment unit, treatment liquid supply method and storage medium
JP2018204482A (en) * 2017-06-01 2018-12-27 国立研究開発法人日本原子力研究開発機構 Solution transfer device
CN107387389A (en) * 2017-08-23 2017-11-24 四川达灿石油设备有限公司 A kind of fluid end of fracturing pump
JP6919607B2 (en) * 2018-03-15 2021-08-18 オムロン株式会社 Robot system and robot control method
JP7183088B2 (en) 2019-03-20 2022-12-05 株式会社東芝 pump
JP7313782B2 (en) * 2020-02-28 2023-07-25 株式会社吉野工業所 Plunger pump and liquid blow molding device
KR102362969B1 (en) * 2020-05-07 2022-02-18 (주)우원티씨에스 Syringe pump for quantitative dispensing, coating solution supply method and syringe pump cleaning method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1105773A (en) 1979-11-26 1981-07-28 Derek V. Mancini Combination autoclave pump and nozzle
JPS5862539A (en) 1981-10-11 1983-04-14 Shinko Seiki Kk Liquid viscosity measuring apparatus with automatic recovery system
JPH1192938A (en) * 1997-09-19 1999-04-06 Shimadzu Corp Liquid material vaporizing device
JP2000189872A (en) 1998-12-25 2000-07-11 Toray Ind Inc Method and apparatus for coating and method and apparatus for producing member for plasma display
JP4366757B2 (en) * 1999-05-27 2009-11-18 東レ株式会社 Coating apparatus, coating method, and method for manufacturing plasma display or display member
JP4494829B2 (en) * 2004-03-03 2010-06-30 東レエンジニアリング株式会社 Coating liquid supply apparatus and coating liquid supply method

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