TW200801832A - Laser processing device and its processing method - Google Patents

Laser processing device and its processing method

Info

Publication number
TW200801832A
TW200801832A TW096105794A TW96105794A TW200801832A TW 200801832 A TW200801832 A TW 200801832A TW 096105794 A TW096105794 A TW 096105794A TW 96105794 A TW96105794 A TW 96105794A TW 200801832 A TW200801832 A TW 200801832A
Authority
TW
Taiwan
Prior art keywords
workpiece
ultra
fine pattern
laser
evaluating
Prior art date
Application number
TW096105794A
Other languages
Chinese (zh)
Other versions
TWI416267B (en
Inventor
Kazuma Kurihara
Takashi Nakano
Yuzo Yamakawa
Junji Tominaga
Osamu Nagumo
Masahiko Ujiie
Hirobumi Ikeya
Takayuki Hayashi
Original Assignee
Nat Inst Of Advanced Ind Scien
Pulstec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Inst Of Advanced Ind Scien, Pulstec Ind Co Ltd filed Critical Nat Inst Of Advanced Ind Scien
Publication of TW200801832A publication Critical patent/TW200801832A/en
Application granted granted Critical
Publication of TWI416267B publication Critical patent/TWI416267B/en

Links

Landscapes

  • Laser Beam Processing (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

To provide a laser beam machining device and a machining method therefor for forming a nano structure having a predetermined ultra-fine pattern on a workpiece, and evaluating the machined shape of the nano structure in a short period of time. The laser beam machining device includes a rotating mechanism 101 for placing and rotating the workpiece 102, and a moving mechanism movable straight in the radial direction of the workpiece 102, and a beam spot formed on the surface of the workpiece 102 by laser beams is moved while depicting the locus. By adjusting the intensity distribution of the laser beams of the beam spot, the ultra-fine pattern to be formed on the workpiece 102 is adjusted so as to be an intended shape. In order to set parameter values during the adjustment, the formed ultra-fine pattern is evaluated by evaluating the reflected light from the ultra-fine pattern.
TW096105794A 2006-02-16 2007-02-15 Laser processing device and processing method thereof TWI416267B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006039850A JP5034015B2 (en) 2006-02-16 2006-02-16 Laser processing apparatus and processing method thereof

Publications (2)

Publication Number Publication Date
TW200801832A true TW200801832A (en) 2008-01-01
TWI416267B TWI416267B (en) 2013-11-21

Family

ID=38494064

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105794A TWI416267B (en) 2006-02-16 2007-02-15 Laser processing device and processing method thereof

Country Status (4)

Country Link
JP (1) JP5034015B2 (en)
CN (1) CN101025576B (en)
HK (1) HK1107594A1 (en)
TW (1) TWI416267B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009082932A (en) * 2007-09-28 2009-04-23 Pulstec Industrial Co Ltd Laser beam machining apparatus and laser beam machining method
KR101220641B1 (en) 2008-01-25 2013-01-10 아사히 가세이 가부시키가이샤 Manufacturing method for seamless mold
JP4972015B2 (en) 2008-03-10 2012-07-11 富士フイルム株式会社 Mold processing method and manufacturing method
JP4911104B2 (en) * 2008-04-21 2012-04-04 パルステック工業株式会社 Laser processing apparatus and laser processing method
JP5181919B2 (en) * 2008-08-19 2013-04-10 パルステック工業株式会社 Laser processing apparatus and laser processing method
JP5336793B2 (en) 2008-08-29 2013-11-06 富士フイルム株式会社 Pattern forming body manufacturing method and electromagnetic beam processing apparatus
JP5111305B2 (en) 2008-08-29 2013-01-09 富士フイルム株式会社 Pattern forming body and manufacturing method thereof
EP2163339B1 (en) * 2008-09-11 2016-11-02 Bystronic Laser AG Laser cutting assembly for cutting a work piece with a laser beam with a variable cutting speed
JP4962508B2 (en) * 2009-02-24 2012-06-27 パルステック工業株式会社 Laser processing apparatus and pulse signal output method for laser driving in laser processing apparatus
CN102495534B (en) * 2011-12-12 2013-12-25 中国科学院上海光学精密机械研究所 Galvanometer type laser direct writing photoetching machine
JP6651123B2 (en) * 2015-01-08 2020-02-19 株式会社リコー Light source driving device, light source device, distance measuring device, moving body device, laser beam machine, and light source driving method
JP6392804B2 (en) * 2016-03-29 2018-09-19 ファナック株式会社 Laser processing apparatus that performs gap sensor correction and reflected light profile measurement simultaneously, and correlation table generation method for laser processing apparatus
US9835959B1 (en) * 2016-10-17 2017-12-05 Cymer, Llc Controlling for wafer stage vibration
CN106918920B (en) * 2017-04-20 2023-02-07 长春理工大学 Using polarized CO 2 Device and method for processing antifogging structure of lens by laser interference
CN109353011B (en) * 2018-10-30 2021-07-20 大族激光科技产业集团股份有限公司 Monitoring method of laser welding plastic
US11273520B2 (en) * 2019-01-31 2022-03-15 General Electric Company System and method for automated laser ablation

Family Cites Families (13)

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JPH0768396A (en) * 1993-09-02 1995-03-14 Hitachi Constr Mach Co Ltd Laser beam machine
JPH08174255A (en) * 1994-12-27 1996-07-09 Komatsu Ltd Focus detector for laser beam machine
JP3746555B2 (en) * 1996-02-06 2006-02-15 株式会社フジクラ Laser processing apparatus and laser processing method using the same
JPH10113781A (en) * 1996-10-09 1998-05-06 Hitachi Seiko Ltd Laser beam machining method
CN1124917C (en) * 1997-12-26 2003-10-22 三菱电机株式会社 Laser machining apparatus
DE19782307T1 (en) * 1997-12-26 2001-02-01 Mitsubishi Electric Corp Laser processing machine
JP2000292934A (en) * 1999-04-08 2000-10-20 Seiko Epson Corp Laser plotting system and laser plotting method
JP2001015017A (en) * 1999-06-30 2001-01-19 Toshiba Lighting & Technology Corp Fluorescent lamp and its manufacture
JP2001133987A (en) * 1999-11-04 2001-05-18 Seiko Epson Corp Method and device for laser plotting
TW478032B (en) * 1999-11-04 2002-03-01 Seiko Epson Corp Method and device for laser plotting, hologram master and the manufacturing method thereof
JP2001150171A (en) * 1999-11-26 2001-06-05 Nippon Sharyo Seizo Kaisha Ltd Focus adjustment method and apparatus for laser beam machine
JP2001208993A (en) * 2000-01-25 2001-08-03 Sumitomo Heavy Ind Ltd Laser plotting method and plotting device
JP4479065B2 (en) * 2000-06-22 2010-06-09 株式会社Ｉｈｉ Laser processing equipment

Also Published As

Publication number Publication date
HK1107594A1 (en) 2008-04-11
CN101025576B (en) 2012-02-08
JP2007216263A (en) 2007-08-30
JP5034015B2 (en) 2012-09-26
TWI416267B (en) 2013-11-21
CN101025576A (en) 2007-08-29

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