TW200801822A - Slit nozzle and chemical-coating apparatus having the same - Google Patents

Slit nozzle and chemical-coating apparatus having the same

Info

Publication number
TW200801822A
TW200801822A TW096121373A TW96121373A TW200801822A TW 200801822 A TW200801822 A TW 200801822A TW 096121373 A TW096121373 A TW 096121373A TW 96121373 A TW96121373 A TW 96121373A TW 200801822 A TW200801822 A TW 200801822A
Authority
TW
Taiwan
Prior art keywords
chemical
slit nozzle
same
coating apparatus
body part
Prior art date
Application number
TW096121373A
Other languages
Chinese (zh)
Other versions
TWI360026B (en
Inventor
Jung-Hwan Lee
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of TW200801822A publication Critical patent/TW200801822A/en
Application granted granted Critical
Publication of TWI360026B publication Critical patent/TWI360026B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B05B1/04—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
    • B05B1/044—Slits, i.e. narrow openings defined by two straight and parallel lips; Elongated outlets for producing very wide discharges, e.g. fluid curtains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Nozzles (AREA)

Abstract

To provide a slit nozzle which can retain conditions of arrangement easily while feeding a chemical smoothly and a chemical coater equipped with it. The slit nozzle has a first body part having a feed hole for a chemical, a second body part arranged opposite to the first body part and spacer arranged between the first and second body parts to separate the body parts at a specified interval. The spacer preferably constitutes a discharge outlet connected with the feed hole between the first and second body parts.
TW096121373A 2006-06-15 2007-06-13 Slit nozzle and chemical-coating apparatus having TWI360026B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060053967A KR100782539B1 (en) 2006-06-15 2006-06-15 Slit nozzle and chemical-coating apparatus having the same

Publications (2)

Publication Number Publication Date
TW200801822A true TW200801822A (en) 2008-01-01
TWI360026B TWI360026B (en) 2012-03-11

Family

ID=38930939

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096121373A TWI360026B (en) 2006-06-15 2007-06-13 Slit nozzle and chemical-coating apparatus having

Country Status (4)

Country Link
JP (1) JP4511564B2 (en)
KR (1) KR100782539B1 (en)
CN (1) CN101088624B (en)
TW (1) TWI360026B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5007168B2 (en) * 2007-07-10 2012-08-22 日東電工株式会社 Die coater adjusting method and optical film manufacturing method
CN102371226A (en) * 2010-08-26 2012-03-14 昆山大阳机电设备制造有限公司 Fixed coating head for slit gluing
CN103801466B (en) * 2012-11-15 2015-11-18 沈阳芯源微电子设备有限公司 The wet processing process nozzle of the uniform flow of a kind of low impulsive force
CN104635436A (en) * 2013-11-07 2015-05-20 沈阳芯源微电子设备有限公司 Temperature variable curtain-like developing apparatus
CN104635437A (en) * 2013-11-07 2015-05-20 沈阳芯源微电子设备有限公司 Curtain-like developing nozzle
JP6955971B2 (en) * 2017-11-10 2021-10-27 株式会社ディスコ Cleaning nozzle
CN108187970A (en) * 2018-01-23 2018-06-22 佛山市雅路斯工业设备有限公司 A kind of valvular coating head of band
KR102078183B1 (en) * 2018-07-02 2020-04-02 스프레이시스템코리아 유한회사 Two-fluid slit nozzle capable of preventing backward flow
KR102152532B1 (en) * 2019-06-10 2020-09-04 박선길 Dispensor nozzle and mathod for manufacturing the same

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3102532B2 (en) * 1993-01-30 2000-10-23 住友金属工業株式会社 Painting equipment
JPH0731168U (en) * 1993-05-31 1995-06-13 平田機工株式会社 Fluid coating device
JPH07171471A (en) * 1993-12-21 1995-07-11 Sumitomo Metal Ind Ltd Coating method and coating nozzle
US5746875A (en) 1994-09-16 1998-05-05 Applied Materials, Inc. Gas injection slit nozzle for a plasma process reactor
JPH09234409A (en) * 1996-03-01 1997-09-09 Nippon Tokushu Toryo Co Ltd Method for coating automobile with strippable coating material and equipment therefor
JP3231660B2 (en) * 1997-05-26 2001-11-26 有限会社福田エンジニアリング Curtain-like flow-off device for flowing material
JPH11197576A (en) * 1998-01-08 1999-07-27 Konica Corp Coater and coating method
JPH11207236A (en) * 1998-01-20 1999-08-03 Konica Corp Die coater
JP3505498B2 (en) * 2000-09-29 2004-03-08 有限会社福田エンジニアリング Curtain-flowing device for flowing material
JP2004148184A (en) * 2002-10-30 2004-05-27 Toray Eng Co Ltd Coating method and coating apparatus
JP2004275810A (en) * 2003-03-12 2004-10-07 Pi R & D Co Ltd Coating die using shim plate and coating method using the same
JP3838990B2 (en) * 2003-04-14 2006-10-25 東京応化工業株式会社 Slit nozzle and treatment liquid supply apparatus using the slit nozzle
KR100538546B1 (en) * 2003-08-20 2005-12-22 세메스 주식회사 Facility and method for coating photoresist on substrates and apparatus for treating a slit-nozzle used in the facility
JP2005087796A (en) * 2003-09-12 2005-04-07 Tdk Corp Slit coating apparatus and slit coating method
KR100558928B1 (en) 2003-11-21 2006-03-10 세메스 주식회사 Apparatus for coating photoresist on a substrate for manufacturing flat panel display devices and nozzle used in the apparatus
JP4862114B2 (en) * 2005-05-02 2012-01-25 株式会社サンツール Method for applying adhesive to elastic string-like body in application line and apparatus for applying adhesive to elastic string-like body

Also Published As

Publication number Publication date
JP2007330960A (en) 2007-12-27
CN101088624A (en) 2007-12-19
JP4511564B2 (en) 2010-07-28
KR100782539B1 (en) 2007-12-06
TWI360026B (en) 2012-03-11
CN101088624B (en) 2012-08-29

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