TW200801176A - Cleaning solution for substrate for use in semiconductor device and cleaning method using the same - Google Patents

Cleaning solution for substrate for use in semiconductor device and cleaning method using the same

Info

Publication number
TW200801176A
TW200801176A TW096110921A TW96110921A TW200801176A TW 200801176 A TW200801176 A TW 200801176A TW 096110921 A TW096110921 A TW 096110921A TW 96110921 A TW96110921 A TW 96110921A TW 200801176 A TW200801176 A TW 200801176A
Authority
TW
Taiwan
Prior art keywords
cleaning solution
semiconductor device
cleaning
substrate
independently represent
Prior art date
Application number
TW096110921A
Other languages
English (en)
Inventor
Yoshinori Nishiwaki
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW200801176A publication Critical patent/TW200801176A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/72—Ethers of polyoxyalkylene glycols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/72—Ethers of polyoxyalkylene glycols
    • C11D1/721—End blocked ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2075—Carboxylic acids-salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3707—Polyethers, e.g. polyalkyleneoxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
TW096110921A 2006-03-30 2007-03-29 Cleaning solution for substrate for use in semiconductor device and cleaning method using the same TW200801176A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006095445A JP4804986B2 (ja) 2006-03-30 2006-03-30 半導体デバイス用基板の洗浄液及びそれを用いた洗浄方法

Publications (1)

Publication Number Publication Date
TW200801176A true TW200801176A (en) 2008-01-01

Family

ID=38559959

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096110921A TW200801176A (en) 2006-03-30 2007-03-29 Cleaning solution for substrate for use in semiconductor device and cleaning method using the same

Country Status (3)

Country Link
US (1) US20070232512A1 (zh)
JP (1) JP4804986B2 (zh)
TW (1) TW200801176A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI503878B (zh) * 2008-11-07 2015-10-11 Uwiz Technology Co Ltd 化學機械平坦化後用之酸性清潔組成物
CN106133104A (zh) * 2014-03-28 2016-11-16 福吉米株式会社 研磨用组合物

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4777197B2 (ja) * 2006-09-11 2011-09-21 富士フイルム株式会社 洗浄液及びそれを用いた洗浄方法
KR100873894B1 (ko) * 2007-06-29 2008-12-15 삼성전자주식회사 반도체 장치의 제조 방법
JP5412661B2 (ja) * 2008-03-28 2014-02-12 富士フイルム株式会社 半導体デバイス用洗浄剤及びそれを用いた半導体デバイスの洗浄方法
CN101972755B (zh) * 2010-07-21 2012-02-01 河北工业大学 Ulsi铜材料抛光后表面清洗方法
WO2012043767A1 (ja) * 2010-10-01 2012-04-05 三菱化学株式会社 半導体デバイス用基板の洗浄液及び洗浄方法
WO2016043924A1 (en) * 2014-09-18 2016-03-24 Applied Materials, Inc. Method and apparatus for high efficiency post cmp clean using engineered viscous fluid
CN104845745A (zh) * 2015-05-11 2015-08-19 长沙市宇顺显示技术有限公司 导电墨水布线用清洗剂、印刷电子电路板清洗方法
WO2017213255A1 (ja) * 2016-06-09 2017-12-14 日立化成株式会社 Ｃｍｐ用研磨液及び研磨方法
CN110712119B (zh) * 2019-11-15 2021-04-13 河北工业大学 一种利用cmp设备进行硅片后清洗的方法
CN113680721B (zh) * 2021-08-20 2022-07-12 淮安澳洋顺昌光电技术有限公司 去除蓝宝石单抛衬底背面色差的清洗方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS597760B2 (ja) * 1980-09-30 1984-02-20 ライオン株式会社 浴室用洗浄剤組成物
JPH10259397A (ja) * 1997-03-19 1998-09-29 Olympus Optical Co Ltd 洗浄組成物
US7208049B2 (en) * 2003-10-20 2007-04-24 Air Products And Chemicals, Inc. Process solutions containing surfactants used as post-chemical mechanical planarization treatment
US7348300B2 (en) * 1999-05-04 2008-03-25 Air Products And Chemicals, Inc. Acetylenic diol ethylene oxide/propylene oxide adducts and processes for their manufacture
JP2001089882A (ja) * 1999-09-22 2001-04-03 Ebara Udylite Kk 酸性脱脂剤
JP2002156765A (ja) * 2000-08-01 2002-05-31 Nagase Chemtex Corp リンスおよび剥離液組成物
US6498131B1 (en) * 2000-08-07 2002-12-24 Ekc Technology, Inc. Composition for cleaning chemical mechanical planarization apparatus
JP5072144B2 (ja) * 2001-03-29 2012-11-14 ディバーシー・アイピー・インターナショナル・ビー・ヴイ 殺菌洗浄剤組成物
JP4530121B2 (ja) * 2001-08-01 2010-08-25 日信化学工業株式会社 紙コート剤
JP4324341B2 (ja) * 2002-03-22 2009-09-02 ディバーシー・アイピー・インターナショナル・ビー・ヴイ 自動食器洗浄機用液体洗浄剤組成物
JP2005146171A (ja) * 2003-11-18 2005-06-09 Fuji Photo Film Co Ltd 洗浄処理液並びにそれを用いた着色画像の形成方法、カラーフィルターの製造方法、及び、カラーフィルター付きアレイ基板の製造方法
JP5004494B2 (ja) * 2006-04-14 2012-08-22 富士フイルム株式会社 化学的機械的研磨方法
JP2008124377A (ja) * 2006-11-15 2008-05-29 Jsr Corp 化学機械研磨用水系分散体および化学機械研磨方法、ならびに化学機械研磨用水系分散体を調製するためのキット

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI503878B (zh) * 2008-11-07 2015-10-11 Uwiz Technology Co Ltd 化學機械平坦化後用之酸性清潔組成物
CN106133104A (zh) * 2014-03-28 2016-11-16 福吉米株式会社 研磨用组合物

Also Published As

Publication number Publication date
JP4804986B2 (ja) 2011-11-02
US20070232512A1 (en) 2007-10-04
JP2007269918A (ja) 2007-10-18

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