TW200801121A - Curable resin, curable resin compositions and moldings thereof - Google Patents

Curable resin, curable resin compositions and moldings thereof

Info

Publication number
TW200801121A
TW200801121A TW096109534A TW96109534A TW200801121A TW 200801121 A TW200801121 A TW 200801121A TW 096109534 A TW096109534 A TW 096109534A TW 96109534 A TW96109534 A TW 96109534A TW 200801121 A TW200801121 A TW 200801121A
Authority
TW
Taiwan
Prior art keywords
curable resin
structural units
equivalent
value
those
Prior art date
Application number
TW096109534A
Other languages
Chinese (zh)
Other versions
TWI411648B (en
Inventor
Takashi Saito
Hideki Andoh
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200801121A publication Critical patent/TW200801121A/en
Application granted granted Critical
Publication of TWI411648B publication Critical patent/TWI411648B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58—Metal-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G79/00—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L85/00—Compositions of macromolecular compounds obtained by reactions forming a linkage in the main chain of the macromolecule containing atoms other than silicon, sulfur, nitrogen, oxygen and carbon; Compositions of derivatives of such polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

A curable resin which exhibits strength, transparency, heat resistance and dimensional stability which are equivalent to those of inorganic glass respectively as well as high toughness and fabricability which are equivalent to those of plastics respectively. A curable resin having a molecular structure of the general formula (1) consisting of dense structural units (A) and thin structural units (B), in which the dense structural units (A) consist of a metal oxide having a Kp value of 0.68 to 0.8 and the thin structural units (B) have Kp values of less than 0.68 and comprises an organic substance and an organometallic oxide, with each Kp value being calculated by free volume fraction according to the formula (2), and which has an (A)/(B) weight ratio is 0.01 to 5.00, at least one unsaturated bond, and a number-average molecular weight of 800 to 60000: -((A)-(B)m)n- (1), Kp=An*Vw*p/Mw (2) wherein An is Avogadro's number; Vw is van der Waals volume; p is density; and Mw is molecular weight.
TW096109534A 2006-03-27 2007-03-20 A hardening resin and a hardened resin composition and a molded body TWI411648B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006085491 2006-03-27

Publications (2)

Publication Number Publication Date
TW200801121A true TW200801121A (en) 2008-01-01
TWI411648B TWI411648B (en) 2013-10-11

Family

ID=38609261

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096109534A TWI411648B (en) 2006-03-27 2007-03-20 A hardening resin and a hardened resin composition and a molded body

Country Status (5)

Country Link
JP (1) JP5108751B2 (en)
KR (1) KR101075358B1 (en)
CN (1) CN101410437B (en)
TW (1) TWI411648B (en)
WO (1) WO2007119477A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI513767B (en) * 2010-11-04 2015-12-21 Daicel Corp Curable resin composition and cured product

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006030003A1 (en) * 2006-05-11 2007-11-15 Wacker Chemie Ag Silicone resin coating for electronic components
JP5234909B2 (en) * 2007-12-27 2013-07-10 新日鉄住金化学株式会社 Alkoxy group-containing cage-type siloxane compound, silanol group-containing cage-type siloxane compound, and methods for producing them
KR101504308B1 (en) * 2007-12-27 2015-03-19 신닛테츠 수미킨 가가쿠 가부시키가이샤 Curable silicone copolymer containing cage structure and process for production thereof, and curable resin composition comprising curable silicone copolymer containing cage structure and cured product thereof
JP5625210B2 (en) * 2007-12-27 2014-11-19 ナガセケムテックス株式会社 Curable composition
JP5342795B2 (en) * 2008-03-24 2013-11-13 新日鉄住金化学株式会社 籠 Structure-containing curable silicone copolymer, method for producing the same, curable resin composition using 籠 structure-containing curable silicone copolymer, and cured product thereof
JP2010254927A (en) * 2009-04-28 2010-11-11 Kaneka Corp Photo-polymerizable composition
JP2012149131A (en) * 2011-01-17 2012-08-09 Shin-Etsu Chemical Co Ltd Silicone resin composition and optical semiconductor device using the composition
CN104387968A (en) * 2014-12-08 2015-03-04 江苏诺飞新材料科技有限公司 Flame retardant coating used for solar panels
CN110387043A (en) * 2019-07-12 2019-10-29 湖北大学 Dendroid organo-silicon compound and preparation method thereof with multiterminal functional group

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0348705A3 (en) * 1988-06-29 1991-02-27 Akademie der Wissenschaften der DDR Organophilic double-ring silicilic-acid derivatives with cage structures, process for their preparation and their use
DE4316101A1 (en) * 1993-05-13 1994-11-17 Wacker Chemie Gmbh Organosilicon compounds with a cage-like structure
JPH1171462A (en) * 1997-08-29 1999-03-16 Toshiba Silicone Co Ltd Novel silicon-containing polymer
JP2979145B1 (en) * 1998-11-18 1999-11-15 工業技術院長 New silsesquioxane-containing polymer and method for producing the same
JP2000265066A (en) * 1999-03-17 2000-09-26 Dow Corning Asia Ltd Organic-solvent-soluble hydrogenated octasilsesquioxane /vinyl group-containing copolymer and insulation material comprising the same
JP2000265065A (en) * 1999-03-17 2000-09-26 Dow Corning Asia Ltd Production of organic-solvent-soluble hydrogenated octasilsesquioxane/vinyl group-containing copolymer
US6252030B1 (en) * 1999-03-17 2001-06-26 Dow Corning Asia, Ltd. Hydrogenated octasilsesquioxane-vinyl group-containing copolymer and method for manufacture
JP2002363414A (en) * 2001-06-12 2002-12-18 Asahi Kasei Corp Basket-like silsesquioxane-containing composition
JP4381636B2 (en) * 2001-11-05 2009-12-09 新日鐵化学株式会社 Silicone resin composition and silicone resin molded article
JP4142385B2 (en) * 2002-10-03 2008-09-03 新日鐵化学株式会社 Silicone resin composition and silicone resin molded article
JP2005290352A (en) * 2004-03-12 2005-10-20 Asahi Kasei Corp Compound having basket-shaped silsesquioxane structure
JP4742216B2 (en) * 2004-07-08 2011-08-10 Ｊｎｃ株式会社 Silicon compounds
JP2006265514A (en) * 2005-02-25 2006-10-05 Asahi Kasei Corp Copolymer and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI513767B (en) * 2010-11-04 2015-12-21 Daicel Corp Curable resin composition and cured product

Also Published As

Publication number Publication date
KR20080108307A (en) 2008-12-12
TWI411648B (en) 2013-10-11
JP5108751B2 (en) 2012-12-26
KR101075358B1 (en) 2011-10-19
WO2007119477A1 (en) 2007-10-25
CN101410437A (en) 2009-04-15
JPWO2007119477A1 (en) 2009-08-27
CN101410437B (en) 2012-01-04

Similar Documents

Publication Publication Date Title
TW200801121A (en) Curable resin, curable resin compositions and moldings thereof
JP2008538791A5 (en)
MX2009012868A (en) Composition with increased stress cracking resistance.
TW200700484A (en) Biodegradable resin composition and molded article produced from the same
ATE521664T1 (en) POLYMER COMPOSITION AND USES THEREOF
EP1988127A4 (en) Curable composition
ATE504631T1 (en) FLAME RESISTANT AND SCRATCH RESISTANT THERMOPLASTIC POLYCARBONATE COMPOSITIONS
DE502008003027D1 (en) CURABLE COMPOSITIONS OF SILANES WITH TWO HYDROLISABLE GROUPS
ATE470680T1 (en) RADIATION CURED MICHAEL ADDITION RESINS WITH BUILT-IN PHOTOINITIATORS
MX2012001581A (en) Improved polypropylene for use in bopp applications.
AR058529A1 (en) COPOLIMEROS PRODUCED BY REACTIONING A GLICIDIL ESTER AND / OR ETER WITH A POLYOL AND USE OF COPOLIMERPOS IN COATING COMPOSITIONS
EP1990352A4 (en) Ethylene polymer and products of molding thereof
MX2010000929A (en) Glass fiber-reinforced polycarbonate molding materials.
WO2009065950A3 (en) Curable compositions consisting of silanes with three hydrolysable groups
ATE536389T1 (en) POLYMER COMPOSITIONS AND PRESSURE-RESISTANT PIPES MADE THEREFROM
DE602008001882D1 (en) HARDENABLE AND BASE-RESISTANT FLUORELASTOMERS
CN103554825A (en) Weather-resistant toughened polyformaldehyde material as well as preparation method thereof
WO2008123252A1 (en) Lens
TW200613425A (en) Rubber-reinforced resin and process for producing the same, and rubber-reinforced thermoplastic resin composition
PH12020550087A1 (en) Curable composition, sealing material composition, and adhesive composition
TW200634082A (en) Vinyl chloride resin dope composition
TW200634086A (en) Thermoplastic resin composition
배성호 et al. The Study of Mechanical and Electrical Properties of Vitrimer Filled with Non-covalently Functionalized MWCNT
최민혁 et al. Solvent-less Surface Coating Using Organic/Inorganic Hybrid Ladder-like Poly (silsesquioxane)
강승현 et al. Solvent-less Surface Coating using Organic/Inorganic Hybrid Ladder-like Poly (silsesquioxane)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees