TW200801087A - Polyimide film and method for production thereof - Google Patents

Polyimide film and method for production thereof

Info

Publication number
TW200801087A
TW200801087A TW096101630A TW96101630A TW200801087A TW 200801087 A TW200801087 A TW 200801087A TW 096101630 A TW096101630 A TW 096101630A TW 96101630 A TW96101630 A TW 96101630A TW 200801087 A TW200801087 A TW 200801087A
Authority
TW
Taiwan
Prior art keywords
polyimide film
polyamic acid
production
poises
viscosity
Prior art date
Application number
TW096101630A
Other languages
English (en)
Inventor
Hisayasu Kaneshiro
Takashi Kikuchi
Shogo Fujimoto
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Publication of TW200801087A publication Critical patent/TW200801087A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Moulding By Coating Moulds (AREA)
TW096101630A 2006-01-20 2007-01-16 Polyimide film and method for production thereof TW200801087A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006011962 2006-01-20
JP2006072135 2006-03-16

Publications (1)

Publication Number Publication Date
TW200801087A true TW200801087A (en) 2008-01-01

Family

ID=38287481

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096101630A TW200801087A (en) 2006-01-20 2007-01-16 Polyimide film and method for production thereof

Country Status (3)

Country Link
US (1) US20090011223A1 (zh)
TW (1) TW200801087A (zh)
WO (1) WO2007083527A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9415137B2 (en) * 2012-08-22 2016-08-16 Biomet Manufacturing, Llc. Directional porous coating
CN103665866B (zh) * 2013-12-16 2016-01-13 宁波今山电子材料有限公司 石墨烯聚酰亚胺复合薄膜的制备方法
JP6735542B2 (ja) * 2015-08-25 2020-08-05 東レ・デュポン株式会社 ポリイミドフィルム及びその製造方法
CN113528155A (zh) * 2021-07-05 2021-10-22 合肥中聚合臣电子材料有限公司 一种提高液晶显示残像性能的取向剂

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0730247B2 (ja) * 1986-10-09 1995-04-05 宇部興産株式会社 芳香族ポリアミック酸溶液組成物
US5066770A (en) * 1988-04-10 1991-11-19 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Process and apparatus for manufacturing polymers
US5302652A (en) * 1992-12-15 1994-04-12 E. I. Du Pont De Nemours And Company Process for preparing a pigmented polyimide shaped article
JP2990636B2 (ja) * 1993-01-21 1999-12-13 信越化学工業株式会社 易滑性ポリイミドフィルムの製造法
JP2001015778A (ja) * 1999-06-29 2001-01-19 Mitsubishi Chemicals Corp 太陽電池用基板
JP4008249B2 (ja) * 2001-01-31 2007-11-14 住友ベークライト株式会社 絶縁樹脂組成物及び絶縁樹脂シート並びにプリント配線板
JP2005306940A (ja) * 2004-04-19 2005-11-04 Kaneka Corp ポリイミドフィルム

Also Published As

Publication number Publication date
WO2007083527A1 (ja) 2007-07-26
US20090011223A1 (en) 2009-01-08

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