TW200746336A - Tool health information monitoring and tool performance analysis in semiconductor processing - Google Patents

Tool health information monitoring and tool performance analysis in semiconductor processing

Info

Publication number
TW200746336A
TW200746336A TW096109005A TW96109005A TW200746336A TW 200746336 A TW200746336 A TW 200746336A TW 096109005 A TW096109005 A TW 096109005A TW 96109005 A TW96109005 A TW 96109005A TW 200746336 A TW200746336 A TW 200746336A
Authority
TW
Taiwan
Prior art keywords
tool
semiconductor processing
health information
information monitoring
performance analysis
Prior art date
Application number
TW096109005A
Other languages
Chinese (zh)
Other versions
TWI382483B (en
Inventor
Susan Weiher
Stefan Soens
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200746336A publication Critical patent/TW200746336A/en
Application granted granted Critical
Publication of TWI382483B publication Critical patent/TWI382483B/en

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31477—Display correlated data so as to represent the degree of correlation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32221—Correlation between defect and measured parameters to find origin of defect
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Factory Administration (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A computer-implemented method, system and computer program device are provided for monitoring production of semiconductor products to detect potential defect excursions. Equipment based data is collected reflecting equipment performance for a plurality of semiconductor manufacturing tools used for processing a plurality of semiconductor products. Also, product level data is collected reflecting product quality for the plurality of semiconductor products processed on the plurality of manufacturing tools. At least a portion of the product level data and at least a portion of the equipment based data are then correlated. At least one report is generated of the correlation of data.
TW096109005A 2006-03-15 2007-03-15 Tool health information monitoring and tool performance analysis in semiconductor processing TWI382483B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/375,908 US7454312B2 (en) 2006-03-15 2006-03-15 Tool health information monitoring and tool performance analysis in semiconductor processing

Publications (2)

Publication Number Publication Date
TW200746336A true TW200746336A (en) 2007-12-16
TWI382483B TWI382483B (en) 2013-01-11

Family

ID=38518982

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101128052A TWI495028B (en) 2006-03-15 2007-03-15 Tool health information monitoring and tool performance analysis in semiconductor processing
TW096109005A TWI382483B (en) 2006-03-15 2007-03-15 Tool health information monitoring and tool performance analysis in semiconductor processing

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW101128052A TWI495028B (en) 2006-03-15 2007-03-15 Tool health information monitoring and tool performance analysis in semiconductor processing

Country Status (3)

Country Link
US (2) US7454312B2 (en)
TW (2) TWI495028B (en)
WO (1) WO2007108995A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI569344B (en) * 2011-11-21 2017-02-01 克萊譚克公司 Inspection method, non-transitory computer-readable medium and inspection system for spectral matching based calibration
CN111062920A (en) * 2019-12-13 2020-04-24 北京百度网讯科技有限公司 Method and device for generating semiconductor detection report

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US7454312B2 (en) 2006-03-15 2008-11-18 Applied Materials, Inc. Tool health information monitoring and tool performance analysis in semiconductor processing
US20090089359A1 (en) * 2007-09-27 2009-04-02 Rockwell Automation Technologies, Inc. Subscription and notification in industrial systems
US7908360B2 (en) * 2007-09-28 2011-03-15 Rockwell Automation Technologies, Inc. Correlation of non-times series events in industrial systems
US8725667B2 (en) * 2008-03-08 2014-05-13 Tokyo Electron Limited Method and system for detection of tool performance degradation and mismatch
US8078552B2 (en) * 2008-03-08 2011-12-13 Tokyo Electron Limited Autonomous adaptive system and method for improving semiconductor manufacturing quality
US8190543B2 (en) * 2008-03-08 2012-05-29 Tokyo Electron Limited Autonomous biologically based learning tool
US8396582B2 (en) 2008-03-08 2013-03-12 Tokyo Electron Limited Method and apparatus for self-learning and self-improving a semiconductor manufacturing tool
US20090265137A1 (en) * 2008-04-18 2009-10-22 Hamamatsu Photonics K.K. Computer-based methods and systems for failure analysis
US8340800B2 (en) * 2008-07-17 2012-12-25 International Business Machines Corporation Monitoring a process sector in a production facility
US8954184B2 (en) * 2011-01-19 2015-02-10 Tokyo Electron Limited Tool performance by linking spectroscopic information with tool operational parameters and material measurement information
US20130080372A1 (en) * 2011-07-27 2013-03-28 Tom Thuy Ho Architecture and methods for tool health prediction
US9915940B2 (en) * 2011-10-31 2018-03-13 Applied Materials, Llc Bi-directional association and graphical acquisition of time-based equipment sensor data and material-based metrology statistical process control data
TWI499879B (en) * 2012-12-21 2015-09-11 Ind Tech Res Inst Workflow monitoring and analysis system and method thereof
US10120372B2 (en) * 2013-08-01 2018-11-06 Applied Materials, Inc. Event processing based system for manufacturing yield improvement
US10361105B2 (en) 2014-12-03 2019-07-23 Kla-Tencor Corporation Determining critical parameters using a high-dimensional variable selection model
JP6055058B1 (en) * 2015-09-30 2016-12-27 ファナック株式会社 Production facilities equipped with machine learners and assembly / testers
US10360671B2 (en) * 2017-07-11 2019-07-23 Kla-Tencor Corporation Tool health monitoring and matching
US11187992B2 (en) * 2017-10-23 2021-11-30 Applied Materials, Inc. Predictive modeling of metrology in semiconductor processes
JP7181033B2 (en) * 2018-09-20 2022-11-30 株式会社Ｓｃｒｅｅｎホールディングス DATA PROCESSING METHOD, DATA PROCESSING APPARATUS, AND DATA PROCESSING PROGRAM
US11960830B2 (en) 2020-02-03 2024-04-16 International Business Machines Corporation Exploratory data interface
US11302545B2 (en) * 2020-03-20 2022-04-12 Nanya Technology Corporation System and method for controlling semiconductor manufacturing equipment
US20220077005A1 (en) * 2020-09-09 2022-03-10 Changxin Memory Technologies, Inc. Data analysis method and electronic device, and storage medium

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US5716856A (en) 1995-08-22 1998-02-10 Advanced Micro Devices, Inc. Arrangement and method for detecting sequential processing effects in manufacturing using predetermined sequences within runs
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI569344B (en) * 2011-11-21 2017-02-01 克萊譚克公司 Inspection method, non-transitory computer-readable medium and inspection system for spectral matching based calibration
US10088413B2 (en) 2011-11-21 2018-10-02 Kla-Tencor Corporation Spectral matching based calibration
CN111062920A (en) * 2019-12-13 2020-04-24 北京百度网讯科技有限公司 Method and device for generating semiconductor detection report
CN111062920B (en) * 2019-12-13 2023-06-20 北京百度网讯科技有限公司 Method and device for generating semiconductor detection report

Also Published As

Publication number Publication date
US7454312B2 (en) 2008-11-18
WO2007108995A2 (en) 2007-09-27
TWI382483B (en) 2013-01-11
WO2007108995A3 (en) 2009-01-08
TWI495028B (en) 2015-08-01
US7630858B1 (en) 2009-12-08
TW201246423A (en) 2012-11-16
US20070219738A1 (en) 2007-09-20

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