TW200744790A - Apparatus and method for polishing objects using object cleaners - Google Patents

Apparatus and method for polishing objects using object cleaners

Info

Publication number
TW200744790A
TW200744790A TW095133211A TW95133211A TW200744790A TW 200744790 A TW200744790 A TW 200744790A TW 095133211 A TW095133211 A TW 095133211A TW 95133211 A TW95133211 A TW 95133211A TW 200744790 A TW200744790 A TW 200744790A
Authority
TW
Taiwan
Prior art keywords
cleaners
polishing objects
object cleaner
polishing
objects
Prior art date
Application number
TW095133211A
Other languages
English (en)
Inventor
In-Kwon Jeong
Original Assignee
Inopla Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inopla Inc filed Critical Inopla Inc
Publication of TW200744790A publication Critical patent/TW200744790A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095133211A 2005-09-09 2006-09-08 Apparatus and method for polishing objects using object cleaners TW200744790A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US71575105P 2005-09-09 2005-09-09
US83025806P 2006-07-12 2006-07-12

Publications (1)

Publication Number Publication Date
TW200744790A true TW200744790A (en) 2007-12-16

Family

ID=37836553

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095133211A TW200744790A (en) 2005-09-09 2006-09-08 Apparatus and method for polishing objects using object cleaners

Country Status (5)

Country Link
US (1) US7674154B2 (zh)
JP (1) JP2009507660A (zh)
KR (1) KR100981766B1 (zh)
TW (1) TW200744790A (zh)
WO (1) WO2007030779A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI654047B (zh) 2014-10-10 2019-03-21 日商荏原製作所股份有限公司 拋光處理裝置、基板處理裝置及拋光處理方法

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US7775853B2 (en) * 2006-06-14 2010-08-17 Komico Technology, Inc. Configurable polishing apparatus
CN102119202A (zh) * 2008-06-23 2011-07-06 圣戈班磨料磨具有限公司 高孔隙率的超级磨料树脂产品以及制造方法
WO2010008430A1 (en) 2008-06-23 2010-01-21 Saint-Gobain Abrasives, Inc. High porosity vitrified superabrasive products and method of preparation
KR101040082B1 (ko) * 2008-10-29 2011-06-09 주식회사 케이씨텍 화학 기계적 연마장치
JP5635112B2 (ja) 2009-10-27 2014-12-03 サンーゴバン アブレイシブズ，インコーポレイティド ガラス質ボンド砥粒
EP2493660A4 (en) 2009-10-27 2015-08-26 Saint Gobain Abrasives Inc RESIN-BONDED GRINDING
US20110104997A1 (en) * 2009-11-03 2011-05-05 Jeong In-Kwon Apparatuses and methods for polishing and cleaning semiconductor wafers
WO2012016477A1 (zh) * 2010-08-05 2012-02-09 清华大学 化学机械抛光机及具有它的化学机械抛光设备
CN101934496B (zh) * 2010-08-05 2012-02-15 清华大学 化学机械抛光机及具有它的化学机械抛光设备
US9266220B2 (en) 2011-12-30 2016-02-23 Saint-Gobain Abrasives, Inc. Abrasive articles and method of forming same
JP6727044B2 (ja) * 2016-06-30 2020-07-22 株式会社荏原製作所 基板処理装置
JP2020131367A (ja) * 2019-02-20 2020-08-31 株式会社ディスコ 研削装置
CN111524833B (zh) * 2020-04-28 2023-04-21 华海清科股份有限公司 一种化学机械抛光***和化学机械抛光方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3583490B2 (ja) * 1994-12-28 2004-11-04 株式会社荏原製作所 ポリッシング装置
US6212714B1 (en) * 1995-01-03 2001-04-10 Hill-Rom, Inc. Hospital bed and mattress having a retracting foot section
JP3231659B2 (ja) * 1997-04-28 2001-11-26 日本電気株式会社 自動研磨装置
JP2000108023A (ja) * 1998-10-05 2000-04-18 Speedfam-Ipec Co Ltd 片面研磨装置及びワークピース配置方法
US6309279B1 (en) * 1999-02-19 2001-10-30 Speedfam-Ipec Corporation Arrangements for wafer polishing
WO2001064391A2 (en) * 2000-02-29 2001-09-07 Applied Materials, Inc. Planarization system with a wafer transfer corridor and multiple polishing modules
US6413356B1 (en) * 2000-05-02 2002-07-02 Applied Materials, Inc. Substrate loader for a semiconductor processing system
TWI222154B (en) * 2001-02-27 2004-10-11 Asm Nutool Inc Integrated system for processing semiconductor wafers
JP4197103B2 (ja) * 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
JP2006524142A (ja) * 2003-04-21 2006-10-26 イノプラ インコーポレーテッド 一つ以上の研磨面を使用して半導体ウェーハを研磨するための装置及び方法
JP4464113B2 (ja) * 2003-11-27 2010-05-19 株式会社ディスコ ウエーハの加工装置
US7195219B2 (en) * 2003-12-10 2007-03-27 A-Dec, Inc. Modular dental chair equipment mounting system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI654047B (zh) 2014-10-10 2019-03-21 日商荏原製作所股份有限公司 拋光處理裝置、基板處理裝置及拋光處理方法

Also Published As

Publication number Publication date
WO2007030779A3 (en) 2007-09-20
KR20080042867A (ko) 2008-05-15
US7674154B2 (en) 2010-03-09
KR100981766B1 (ko) 2010-09-14
US20070060023A1 (en) 2007-03-15
WO2007030779A2 (en) 2007-03-15
JP2009507660A (ja) 2009-02-26

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