TW200739892A - An image sensor with Cu wiring and method of eliminating high reflectivity interfaces therefrom - Google Patents
An image sensor with Cu wiring and method of eliminating high reflectivity interfaces therefromInfo
- Publication number
- TW200739892A TW200739892A TW095112265A TW95112265A TW200739892A TW 200739892 A TW200739892 A TW 200739892A TW 095112265 A TW095112265 A TW 095112265A TW 95112265 A TW95112265 A TW 95112265A TW 200739892 A TW200739892 A TW 200739892A
- Authority
- TW
- Taiwan
- Prior art keywords
- pixel
- image sensor
- barrier layer
- array
- layer metal
- Prior art date
Links
Abstract
An Image sensor and method of fabrication wherein the sensor includes Copper (Cu) metallization levels allowing for incorporation of a thinner interlevel dielectric stack to result in a pixel array exhibiting increased light sensitivity. The image sensor includes structures having a minimum thickness of barrier layer metal that traverses the optical path of each pixel in the sensor array or, that have portions of barrier layer metal selectively removed from the optical paths of each pixel, thereby minimizing reflectance. That is, by implementing various block or single mask methodologies, portions of the barrier layer metal are completely removed at locations of the optical path for each pixel in the array. In a further embodiment, the barrier metal layer may be formed atop the Cu metallazation by a self-aligned deposition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095112265A TW200739892A (en) | 2006-04-06 | 2006-04-06 | An image sensor with Cu wiring and method of eliminating high reflectivity interfaces therefrom |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095112265A TW200739892A (en) | 2006-04-06 | 2006-04-06 | An image sensor with Cu wiring and method of eliminating high reflectivity interfaces therefrom |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200739892A true TW200739892A (en) | 2007-10-16 |
Family
ID=57913893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095112265A TW200739892A (en) | 2006-04-06 | 2006-04-06 | An image sensor with Cu wiring and method of eliminating high reflectivity interfaces therefrom |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200739892A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9343356B2 (en) | 2013-02-20 | 2016-05-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Back end of the line (BEOL) interconnect scheme |
| JP2021528847A (en) * | 2018-06-18 | 2021-10-21 | ケーエルエー コーポレイション | Backside illumination sensor and sensor manufacturing method |
-
2006
- 2006-04-06 TW TW095112265A patent/TW200739892A/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9343356B2 (en) | 2013-02-20 | 2016-05-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Back end of the line (BEOL) interconnect scheme |
| JP2021528847A (en) * | 2018-06-18 | 2021-10-21 | ケーエルエー コーポレイション | Backside illumination sensor and sensor manufacturing method |
| TWI809124B (en) * | 2018-06-18 | 2023-07-21 | 美商克萊譚克公司 | Back-illuminated sensor and a method of manufacturing a sensor |
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