TW200734086A - Nickel powder and its production process, and polymer PTC device using said nickel powder - Google Patents

Nickel powder and its production process, and polymer PTC device using said nickel powder

Info

Publication number
TW200734086A
TW200734086A TW095144043A TW95144043A TW200734086A TW 200734086 A TW200734086 A TW 200734086A TW 095144043 A TW095144043 A TW 095144043A TW 95144043 A TW95144043 A TW 95144043A TW 200734086 A TW200734086 A TW 200734086A
Authority
TW
Taiwan
Prior art keywords
nickel powder
particle
conductive
production process
primary particle
Prior art date
Application number
TW095144043A
Other languages
Chinese (zh)
Other versions
TWI402116B (en
Inventor
Toshihiro Kato
Kenya Itou
Syuuji Okada
Arata Tanaka
Keiichiro Nomura
Original Assignee
Tyco Electronics Raychem Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Raychem Kk filed Critical Tyco Electronics Raychem Kk
Publication of TW200734086A publication Critical patent/TW200734086A/en
Application granted granted Critical
Publication of TWI402116B publication Critical patent/TWI402116B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06526—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Thermistors And Varistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

The present invention provides an inexpensive nickel powder having low electrical resistance while being kneaded with a resin, and having good antiweatherability which is thus stable over a lengthy period and could be used as a conductive particle of a conductive paste and a conductive particle of a conductive resin. The nickel powder of the present invention contains 1~20% of cobalt and rest of nickel and other unavoidable impurities, and is composed of a secondary particle aggregated from a primary particle, wherein an average particle diameter of the primary particle is 1.0~3.0 μm, a ratio σ/d of a standard deviation of the primary particle σ and the average particle diameter of the primary particle d is below 0.4, an average particle diameter of the secondary particle is 5~60 μm, a tap density is 1.0~3.5 g/mL, and a specific surface area is below 2.0 m<SP>2</SP>/g.
TW095144043A 2005-11-29 2006-11-28 Nickel powder and its production process, and polymer ptc device using said nickel powder TWI402116B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005344631A JP4942333B2 (en) 2005-11-29 2005-11-29 Nickel powder, method for producing the same, and polymer PTC element using the nickel powder

Publications (2)

Publication Number Publication Date
TW200734086A true TW200734086A (en) 2007-09-16
TWI402116B TWI402116B (en) 2013-07-21

Family

ID=38092184

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095144043A TWI402116B (en) 2005-11-29 2006-11-28 Nickel powder and its production process, and polymer ptc device using said nickel powder

Country Status (6)

Country Link
EP (1) EP1974840A4 (en)
JP (1) JP4942333B2 (en)
KR (1) KR101356377B1 (en)
CN (1) CN101316673B (en)
TW (1) TWI402116B (en)
WO (1) WO2007063851A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009013482A (en) * 2007-07-06 2009-01-22 Ist Corp Nickel powder or nickel alloy powder, and production method therefor
CN102686341A (en) * 2009-10-05 2012-09-19 株式会社村田制作所 Flat Ni particle, multilayer ceramic electronic component using the same, and production method for flat Ni particle
CN101728039B (en) * 2009-12-31 2016-02-24 上海长园维安电子线路保护有限公司 Over-current protecting element
CN102489718A (en) * 2011-12-14 2012-06-13 丹阳市博高新材料技术有限公司 Method for preparing submicron flaky superfine nickel powder
JP6357347B2 (en) * 2013-05-14 2018-07-11 積水化学工業株式会社 Conductive particles, conductive materials, and connection structures
JP2015138915A (en) * 2014-01-23 2015-07-30 住友金属鉱山株式会社 Nickel-based alloy fine particle for laminate capacitors, and method for manufacturing the same
JP6270035B2 (en) * 2014-02-25 2018-01-31 住友金属鉱山株式会社 Method for producing nickel powder
WO2015152048A1 (en) * 2014-03-31 2015-10-08 Ｄｏｗａエレクトロニクス株式会社 Fe-co alloy powder, manufacturing method therefor, antenna, inductor, and emi filter
JP6843370B2 (en) * 2017-03-16 2021-03-17 住友金属鉱山株式会社 Nickel powder manufacturing method
CN110799285B (en) * 2017-07-05 2022-04-29 东邦钛株式会社 Metal powder and method for producing same
WO2019075685A1 (en) * 2017-10-19 2019-04-25 Littelfuse, Inc. Surface mounted fuse device having positive temperature coefficient body
WO2020158593A1 (en) * 2019-01-28 2020-08-06 三井金属鉱業株式会社 Metal particles, and magnetic body paste, powder magnetic core and inductor each using same, and method for producing metal particles
CN112630110B (en) * 2020-12-14 2023-04-25 百尔罗赫塑料添加剂（江苏）有限公司 Zinc oxide powder particle size testing method and application

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5378407A (en) * 1992-06-05 1995-01-03 Raychem Corporation Conductive polymer composition
SE502754C2 (en) * 1994-03-31 1995-12-18 Sandvik Ab Ways to make coated hardened powder
SE502931C2 (en) * 1994-06-10 1996-02-26 Sandvik Ab Method for producing powder for WC hard material
CN1060982C (en) * 1997-11-17 2001-01-24 北京有色金属研究总院 Preparation of ultrafine metal powders
JP4301646B2 (en) 1999-07-28 2009-07-22 Ｄｏｗａホールディングス株式会社 Nickel powder manufacturing method
KR100330919B1 (en) * 2000-04-08 2002-04-03 권문구 Electrical device including ptc conductive composites
JP2002025345A (en) 2000-07-05 2002-01-25 Nisshin Steel Co Ltd Conductive particle with excellent migration resistance property
JP2002043734A (en) 2000-07-24 2002-02-08 Senju Metal Ind Co Ltd Method and apparatus for soldering printed circuit board
JP4864195B2 (en) 2000-08-30 2012-02-01 三井金属鉱業株式会社 Coated copper powder
WO2005023461A1 (en) * 2003-08-29 2005-03-17 Sumitomo Metal Mining Co., Ltd. Nickel powder and process for producing the same
CN1272128C (en) * 2003-09-24 2006-08-30 中南大学 Method for preparing fibred cobalt nickel powder and composite oxides powder of cobalt nicker
JP2005240164A (en) * 2004-02-27 2005-09-08 Sumitomo Metal Mining Co Ltd Nickel powder and manufacturing method therefor
KR20070024706A (en) * 2004-06-08 2007-03-02 타이코 일렉트로닉스 레이켐 케이. 케이. Polymer ptc device

Also Published As

Publication number Publication date
KR101356377B1 (en) 2014-01-27
TWI402116B (en) 2013-07-21
JP2007146251A (en) 2007-06-14
CN101316673A (en) 2008-12-03
WO2007063851A1 (en) 2007-06-07
EP1974840A4 (en) 2011-11-09
EP1974840A1 (en) 2008-10-01
JP4942333B2 (en) 2012-05-30
CN101316673B (en) 2011-11-09
KR20080072081A (en) 2008-08-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees