TW200732564A - Component cooling apparatus - Google Patents

Component cooling apparatus

Info

Publication number
TW200732564A
TW200732564A TW095140281A TW95140281A TW200732564A TW 200732564 A TW200732564 A TW 200732564A TW 095140281 A TW095140281 A TW 095140281A TW 95140281 A TW95140281 A TW 95140281A TW 200732564 A TW200732564 A TW 200732564A
Authority
TW
Taiwan
Prior art keywords
duct
side mount
housing
fan
portions
Prior art date
Application number
TW095140281A
Other languages
Chinese (zh)
Other versions
TWI390115B (en
Inventor
Masashi Miyazawa
Toshiki Ogawara
Tomoaki Ikeda
Original Assignee
Sanyo Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co filed Critical Sanyo Electric Co
Publication of TW200732564A publication Critical patent/TW200732564A/en
Application granted granted Critical
Publication of TWI390115B publication Critical patent/TWI390115B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention provides a component cooling apparatus in which it is possible to suppress resonation of a fan housing due to the rotation of the fan. Four extended portions 33A, 33B extending into an air suction opening 25a are integrally formed with the duct 5. Projected portions 35A, 35B projecting toward the fan 3 are integrally formed with the extended portions 33A, 33B respectively. The end portions of the projected portions 35A, 35B are arranged in contact with end portions of corner portions which are located around the housing-side mount holes 21a of the flange portion 21. The fan 3 is fixed inside the duct 5 by inserting a mounting member such as a screw and a bolt into each pair of a housing-side mount hole 21a and a duct-side mount hole 33a with four housing-side mount hole 21a and four duct-side mount hole 33a being aligned with each other. Accordingly, the fan housing 11 and the duct 5 are not in contact with each other except at mounting portions around the housing-side mount holes 21a. The mounting portion of the fan housing 11 and the mounted portion of the duct 5 are in contact with each other only at peripheries of opposing openings of each pair of the housing-side mount hole 21a and the duct-side mount hole 33a that have been aligned.
TW095140281A 2005-11-30 2006-10-31 Component cooling apparatus TWI390115B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005346878 2005-11-30

Publications (2)

Publication Number Publication Date
TW200732564A true TW200732564A (en) 2007-09-01
TWI390115B TWI390115B (en) 2013-03-21

Family

ID=38088147

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095140281A TWI390115B (en) 2005-11-30 2006-10-31 Component cooling apparatus

Country Status (3)

Country Link
US (1) US20070123162A1 (en)
CN (1) CN1975178B (en)
TW (1) TWI390115B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018000203A1 (en) * 2016-06-28 2018-01-04 黄冠 High-muting duct fan

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6351380B1 (en) * 1999-11-12 2002-02-26 Dell Products, L.P. Cooling fan mounting arrangement
US20030121645A1 (en) * 2001-12-28 2003-07-03 Tien-Lai Wang Heat dissipater for a central processing unit
DE20307981U1 (en) * 2003-05-22 2003-09-11 Arctic Cooling Gmbh Pfaeffikon Axial fan for computers
US7255529B2 (en) * 2004-12-17 2007-08-14 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Cooling fan mounting arrangement with vibration isolation member
TWM275458U (en) * 2005-04-01 2005-09-11 Foxconn Tech Co Ltd Heat dissipation device

Also Published As

Publication number Publication date
US20070123162A1 (en) 2007-05-31
CN1975178B (en) 2011-06-22
TWI390115B (en) 2013-03-21
CN1975178A (en) 2007-06-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees