TW200731558A - Light-emitting diode package structure - Google Patents

Light-emitting diode package structure

Info

Publication number
TW200731558A
TW200731558A TW095104639A TW95104639A TW200731558A TW 200731558 A TW200731558 A TW 200731558A TW 095104639 A TW095104639 A TW 095104639A TW 95104639 A TW95104639 A TW 95104639A TW 200731558 A TW200731558 A TW 200731558A
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
package structure
diode package
encapsulation material
Prior art date
Application number
TW095104639A
Other languages
Chinese (zh)
Other versions
TWI323042B (en
Inventor
Yi-Tsuo Wu
Original Assignee
Everlight Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Everlight Electronics Co Ltd filed Critical Everlight Electronics Co Ltd
Priority to TW95104639A priority Critical patent/TWI323042B/en
Publication of TW200731558A publication Critical patent/TW200731558A/en
Application granted granted Critical
Publication of TWI323042B publication Critical patent/TWI323042B/en

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  • Led Device Packages (AREA)

Abstract

A light-emitting diode package structure includes a substrate, a light-emitting semiconductor device, and an encapsulation material with phosphor. The light-emitting diode is mounted on the substrate and the encapsulation material is overlying light-emitting semiconductor device on the substrate. The encapsulation material is formed like a convex. The phosphor is deposited on the cambered side of the convex encapsulation material.
TW95104639A 2006-02-10 2006-02-10 Light-emitting diode package structure TWI323042B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95104639A TWI323042B (en) 2006-02-10 2006-02-10 Light-emitting diode package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95104639A TWI323042B (en) 2006-02-10 2006-02-10 Light-emitting diode package structure

Publications (2)

Publication Number Publication Date
TW200731558A true TW200731558A (en) 2007-08-16
TWI323042B TWI323042B (en) 2010-04-01

Family

ID=45074016

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95104639A TWI323042B (en) 2006-02-10 2006-02-10 Light-emitting diode package structure

Country Status (1)

Country Link
TW (1) TWI323042B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9024341B2 (en) 2010-10-27 2015-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Refractive index tuning of wafer level package LEDs

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102800782B (en) * 2011-05-25 2015-03-11 展晶科技(深圳)有限公司 Light-emitting diode (LED) light source device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9024341B2 (en) 2010-10-27 2015-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Refractive index tuning of wafer level package LEDs

Also Published As

Publication number Publication date
TWI323042B (en) 2010-04-01

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Legal Events

Date Code Title Description
MC4A Revocation of granted patent