TW200731558A - Light-emitting diode package structure - Google Patents
Light-emitting diode package structureInfo
- Publication number
- TW200731558A TW200731558A TW095104639A TW95104639A TW200731558A TW 200731558 A TW200731558 A TW 200731558A TW 095104639 A TW095104639 A TW 095104639A TW 95104639 A TW95104639 A TW 95104639A TW 200731558 A TW200731558 A TW 200731558A
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- emitting diode
- package structure
- diode package
- encapsulation material
- Prior art date
Links
Landscapes
- Led Device Packages (AREA)
Abstract
A light-emitting diode package structure includes a substrate, a light-emitting semiconductor device, and an encapsulation material with phosphor. The light-emitting diode is mounted on the substrate and the encapsulation material is overlying light-emitting semiconductor device on the substrate. The encapsulation material is formed like a convex. The phosphor is deposited on the cambered side of the convex encapsulation material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95104639A TWI323042B (en) | 2006-02-10 | 2006-02-10 | Light-emitting diode package structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95104639A TWI323042B (en) | 2006-02-10 | 2006-02-10 | Light-emitting diode package structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200731558A true TW200731558A (en) | 2007-08-16 |
TWI323042B TWI323042B (en) | 2010-04-01 |
Family
ID=45074016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95104639A TWI323042B (en) | 2006-02-10 | 2006-02-10 | Light-emitting diode package structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI323042B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9024341B2 (en) | 2010-10-27 | 2015-05-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Refractive index tuning of wafer level package LEDs |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102800782B (en) * | 2011-05-25 | 2015-03-11 | 展晶科技(深圳)有限公司 | Light-emitting diode (LED) light source device |
-
2006
- 2006-02-10 TW TW95104639A patent/TWI323042B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9024341B2 (en) | 2010-10-27 | 2015-05-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Refractive index tuning of wafer level package LEDs |
Also Published As
Publication number | Publication date |
---|---|
TWI323042B (en) | 2010-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MC4A | Revocation of granted patent |