Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compeq Mfg Co LtdfiledCriticalCompeq Mfg Co Ltd
Priority to TW095102536ApriorityCriticalpatent/TW200730049A/en
Publication of TW200730049ApublicationCriticalpatent/TW200730049A/en
This invention relates to a residue removal method used in circuit board laser drilling process, including: coating the circuit board with a dry film; performing drilling process, which generates copper residue on the dry film; and removing the copper residue simply by tearing off the dry film. Thus it ensures no copper residue on the circuit board after processing and, therefore, is able to improve yield of circuit board production.
TW095102536A2006-01-242006-01-24Residue removal method used in circuit board laser drilling process
TW200730049A
(en)