TW200730049A - Residue removal method used in circuit board laser drilling process - Google Patents

Residue removal method used in circuit board laser drilling process

Info

Publication number
TW200730049A
TW200730049A TW095102536A TW95102536A TW200730049A TW 200730049 A TW200730049 A TW 200730049A TW 095102536 A TW095102536 A TW 095102536A TW 95102536 A TW95102536 A TW 95102536A TW 200730049 A TW200730049 A TW 200730049A
Authority
TW
Taiwan
Prior art keywords
circuit board
drilling process
method used
removal method
laser drilling
Prior art date
Application number
TW095102536A
Other languages
Chinese (zh)
Inventor
Wilson Yang
Cheng-Yuan Lin
Chun-Hsien Lu
Original Assignee
Compeq Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compeq Mfg Co Ltd filed Critical Compeq Mfg Co Ltd
Priority to TW095102536A priority Critical patent/TW200730049A/en
Publication of TW200730049A publication Critical patent/TW200730049A/en

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  • Manufacturing Of Printed Wiring (AREA)

Abstract

This invention relates to a residue removal method used in circuit board laser drilling process, including: coating the circuit board with a dry film; performing drilling process, which generates copper residue on the dry film; and removing the copper residue simply by tearing off the dry film. Thus it ensures no copper residue on the circuit board after processing and, therefore, is able to improve yield of circuit board production.
TW095102536A 2006-01-24 2006-01-24 Residue removal method used in circuit board laser drilling process TW200730049A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095102536A TW200730049A (en) 2006-01-24 2006-01-24 Residue removal method used in circuit board laser drilling process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095102536A TW200730049A (en) 2006-01-24 2006-01-24 Residue removal method used in circuit board laser drilling process

Publications (1)

Publication Number Publication Date
TW200730049A true TW200730049A (en) 2007-08-01

Family

ID=57913032

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102536A TW200730049A (en) 2006-01-24 2006-01-24 Residue removal method used in circuit board laser drilling process

Country Status (1)

Country Link
TW (1) TW200730049A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8450621B2 (en) 2008-09-16 2013-05-28 Unimicron Technology Corp. Wiring board and process for fabricating the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8450621B2 (en) 2008-09-16 2013-05-28 Unimicron Technology Corp. Wiring board and process for fabricating the same

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