TW200725935A - High brightness light-emitting diode chip - Google Patents
High brightness light-emitting diode chipInfo
- Publication number
- TW200725935A TW200725935A TW094146118A TW94146118A TW200725935A TW 200725935 A TW200725935 A TW 200725935A TW 094146118 A TW094146118 A TW 094146118A TW 94146118 A TW94146118 A TW 94146118A TW 200725935 A TW200725935 A TW 200725935A
- Authority
- TW
- Taiwan
- Prior art keywords
- transparent package
- package object
- led chip
- light
- reflective
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Led Device Packages (AREA)
Abstract
This invention provided the package structure of a light-emitting diode (LED) chip. The main feature of this invention is that there is a transparent package object whose structure comprises a convex lens, and the transparent package object seals the LED chip and wires. At the periphery, there is a reflective plate having a reflective surface whose structure has a concave surface or an oblique plane. At the top view, the transparent package object and the LED chip are concentric circles whose axis is vertically extended upward from the center of the LED chip. At the lateral view, the transparent package object looks like a convex object with an upper and lower layer structure. The upper layer of the curve surface of the transparent package object can keep the lights upward emitting from the LED chip and passing the upper layer of the curve surface from reflecting that causes scattering or total reflection that reflects the light back to the inside of the transparent package object. The lower layer of the curve surface can refract the light passing through it to the reflective surface of the reflective plate arranged at the periphery of the transparent package object. The light can be then be reflected again from the reflective surface to the outside.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94146118A TWI265647B (en) | 2005-12-23 | 2005-12-23 | High brightness light-emitting diode chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94146118A TWI265647B (en) | 2005-12-23 | 2005-12-23 | High brightness light-emitting diode chip |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI265647B TWI265647B (en) | 2006-11-01 |
TW200725935A true TW200725935A (en) | 2007-07-01 |
Family
ID=38122276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94146118A TWI265647B (en) | 2005-12-23 | 2005-12-23 | High brightness light-emitting diode chip |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI265647B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102130252A (en) * | 2010-11-03 | 2011-07-20 | 映瑞光电科技(上海)有限公司 | Light emitting diode and manufacturing method thereof |
US8405096B2 (en) | 2009-10-27 | 2013-03-26 | Advanced Optoelectronic Technology, Inc. | LED package structure |
TWI474502B (en) * | 2009-03-30 | 2015-02-21 | Ind Tech Res Inst | Light emitting diode package structure and method for manufacturing the same |
-
2005
- 2005-12-23 TW TW94146118A patent/TWI265647B/en not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI474502B (en) * | 2009-03-30 | 2015-02-21 | Ind Tech Res Inst | Light emitting diode package structure and method for manufacturing the same |
US8405096B2 (en) | 2009-10-27 | 2013-03-26 | Advanced Optoelectronic Technology, Inc. | LED package structure |
CN102130252A (en) * | 2010-11-03 | 2011-07-20 | 映瑞光电科技(上海)有限公司 | Light emitting diode and manufacturing method thereof |
CN102130252B (en) * | 2010-11-03 | 2013-02-27 | 映瑞光电科技(上海)有限公司 | Light emitting diode and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI265647B (en) | 2006-11-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |