TW200723352A - Medium pressure plasma system for removal of surface layers without substrate loss - Google Patents

Medium pressure plasma system for removal of surface layers without substrate loss

Info

Publication number
TW200723352A
TW200723352A TW094143380A TW94143380A TW200723352A TW 200723352 A TW200723352 A TW 200723352A TW 094143380 A TW094143380 A TW 094143380A TW 94143380 A TW94143380 A TW 94143380A TW 200723352 A TW200723352 A TW 200723352A
Authority
TW
Taiwan
Prior art keywords
medium pressure
photoresist
removal
surface layers
pressure plasma
Prior art date
Application number
TW094143380A
Other languages
Chinese (zh)
Inventor
John Wolfe
Aseem Srivastava
Ivan Berry
Palani Sakthivel
Original Assignee
Axcelis Tech Inc
Univ Houston
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Tech Inc, Univ Houston filed Critical Axcelis Tech Inc
Publication of TW200723352A publication Critical patent/TW200723352A/en

Links

Abstract

A system and method for removing photoresist or other organic compounds form semiconductor wafers is provided. Non-fluorinated reactant gases (O2, H2, H2O, N2, etc.) are activated in a quartz tube by a medium pressure surface wave discharge. As the plasma jet impinges on a substrate, volatile reaction products (H2O, CO2, or low molecular weight hydrocarbons) selectively remove the photoresist from the surface. The medium pressure also enables high gas temperatures that provide an effective source of heat in the reactive zone on the wafer that enhances etch rates and provides a practical means of removing ion implanted photoresist.
TW094143380A 2004-12-06 2005-12-08 Medium pressure plasma system for removal of surface layers without substrate loss TW200723352A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US63367304P 2004-12-06 2004-12-06

Publications (1)

Publication Number Publication Date
TW200723352A true TW200723352A (en) 2007-06-16

Family

ID=57912265

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094143380A TW200723352A (en) 2004-12-06 2005-12-08 Medium pressure plasma system for removal of surface layers without substrate loss

Country Status (1)

Country Link
TW (1) TW200723352A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472882B (en) * 2008-05-06 2015-02-11 Novellus Systems Inc Photoresist stripping method and apparatus
US9835388B2 (en) 2012-01-06 2017-12-05 Novellus Systems, Inc. Systems for uniform heat transfer including adaptive portions
US10347547B2 (en) 2016-08-09 2019-07-09 Lam Research Corporation Suppressing interfacial reactions by varying the wafer temperature throughout deposition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472882B (en) * 2008-05-06 2015-02-11 Novellus Systems Inc Photoresist stripping method and apparatus
US9835388B2 (en) 2012-01-06 2017-12-05 Novellus Systems, Inc. Systems for uniform heat transfer including adaptive portions
US10347547B2 (en) 2016-08-09 2019-07-09 Lam Research Corporation Suppressing interfacial reactions by varying the wafer temperature throughout deposition
US11075127B2 (en) 2016-08-09 2021-07-27 Lam Research Corporation Suppressing interfacial reactions by varying the wafer temperature throughout deposition

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