TW200722867A - Illumination device and display device provided with the same - Google Patents
Illumination device and display device provided with the sameInfo
- Publication number
- TW200722867A TW200722867A TW095132022A TW95132022A TW200722867A TW 200722867 A TW200722867 A TW 200722867A TW 095132022 A TW095132022 A TW 095132022A TW 95132022 A TW95132022 A TW 95132022A TW 200722867 A TW200722867 A TW 200722867A
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- blue
- red
- color conversion
- converting
- Prior art date
Links
- 238000005286 illumination Methods 0.000 title abstract 3
- 238000006243 chemical reaction Methods 0.000 abstract 3
- 230000005284 excitation Effects 0.000 abstract 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 2
- 230000003287 optical effect Effects 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000000654 additive Substances 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 239000003086 colorant Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
- Led Devices (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005268517 | 2005-09-15 | ||
JP2005355736 | 2005-12-09 | ||
JP2006029856 | 2006-02-07 | ||
JP2006200347A JP4898332B2 (ja) | 2005-09-15 | 2006-07-24 | 表示装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200722867A true TW200722867A (en) | 2007-06-16 |
Family
ID=37854395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095132022A TW200722867A (en) | 2005-09-15 | 2006-08-30 | Illumination device and display device provided with the same |
Country Status (4)
Country | Link |
---|---|
US (1) | US7661841B2 (zh) |
JP (1) | JP4898332B2 (zh) |
CN (1) | CN1932370B (zh) |
TW (1) | TW200722867A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI508620B (zh) * | 2008-04-25 | 2015-11-11 | Sony Corp | A light emitting device, a display device, and a color conversion sheet |
Families Citing this family (53)
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US8272758B2 (en) * | 2005-06-07 | 2012-09-25 | Oree, Inc. | Illumination apparatus and methods of forming the same |
US8128272B2 (en) * | 2005-06-07 | 2012-03-06 | Oree, Inc. | Illumination apparatus |
US8215815B2 (en) * | 2005-06-07 | 2012-07-10 | Oree, Inc. | Illumination apparatus and methods of forming the same |
KR100900620B1 (ko) * | 2007-02-20 | 2009-06-02 | 삼성전기주식회사 | 백색 발광 장치 |
KR100874163B1 (ko) * | 2007-04-03 | 2008-12-17 | 유니나 | 직시형 컬러 발광 프레임을 갖는 엘시디 모듈 |
US20090001397A1 (en) * | 2007-05-29 | 2009-01-01 | Oree, Advanced Illumiation Solutions Inc. | Method and device for providing circumferential illumination |
WO2009028656A1 (ja) * | 2007-08-30 | 2009-03-05 | Nichia Corporation | 発光装置 |
JP5211667B2 (ja) * | 2007-12-07 | 2013-06-12 | ソニー株式会社 | 照明装置及び表示装置 |
US7907804B2 (en) * | 2007-12-19 | 2011-03-15 | Oree, Inc. | Elimination of stitch artifacts in a planar illumination area |
US7929816B2 (en) * | 2007-12-19 | 2011-04-19 | Oree, Inc. | Waveguide sheet containing in-coupling, propagation, and out-coupling regions |
CN101270862B (zh) * | 2008-02-20 | 2012-06-27 | 张丽红 | 一种led发光装置 |
CN101978297A (zh) * | 2008-03-05 | 2011-02-16 | 奥利高级照明解决公司 | 照明装置及其形成方法 |
US8297786B2 (en) * | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
US8301002B2 (en) * | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
US7888691B2 (en) * | 2008-08-29 | 2011-02-15 | Koninklijke Philips Electronics N.V. | Light source including a wavelength-converted semiconductor light emitting device and a filter |
US8294848B2 (en) * | 2008-10-01 | 2012-10-23 | Samsung Display Co., Ltd. | Liquid crystal display having light diffusion layer |
US20100098377A1 (en) * | 2008-10-16 | 2010-04-22 | Noam Meir | Light confinement using diffusers |
JP4772105B2 (ja) * | 2008-12-10 | 2011-09-14 | シャープ株式会社 | 半導体発光装置およびそれを用いた画像表示装置 |
US7995911B2 (en) * | 2009-01-26 | 2011-08-09 | Koninklijke Philips Electronics N.V. | Matching led flash to camera's ambient light compensation algorithm |
JP5717949B2 (ja) * | 2009-01-26 | 2015-05-13 | デクセリアルズ株式会社 | 光学部材および表示装置 |
US20100208469A1 (en) * | 2009-02-10 | 2010-08-19 | Yosi Shani | Illumination surfaces with reduced linear artifacts |
KR20100093981A (ko) | 2009-02-17 | 2010-08-26 | 엘지이노텍 주식회사 | 라이트 유닛 |
US8624527B1 (en) | 2009-03-27 | 2014-01-07 | Oree, Inc. | Independently controllable illumination device |
US8328406B2 (en) * | 2009-05-13 | 2012-12-11 | Oree, Inc. | Low-profile illumination device |
WO2010143176A1 (en) * | 2009-06-08 | 2010-12-16 | Beta-O2 Technologies Ltd. | Submerged planar illumination device |
WO2010150202A2 (en) | 2009-06-24 | 2010-12-29 | Oree, Advanced Illumination Solutions Inc. | Illumination apparatus with high conversion efficiency and methods of forming the same |
JP5255527B2 (ja) * | 2009-07-03 | 2013-08-07 | デクセリアルズ株式会社 | 色変換部材および表示装置 |
KR101091348B1 (ko) * | 2010-07-09 | 2011-12-07 | 엘지이노텍 주식회사 | 퀀텀 도트를 이용한 도광판과 그의 제조 방법, 및 백라이트 유닛 |
IT1401974B1 (it) * | 2010-09-28 | 2013-08-28 | Università Degli Studi Di Milano Bicocca | Dispositivo illuminante |
KR101210101B1 (ko) * | 2010-11-23 | 2012-12-07 | 엘지이노텍 주식회사 | 표시장치 |
DE102011078402A1 (de) | 2011-06-30 | 2013-01-03 | Osram Ag | Konversionselement und Leuchtdiode mit einem solchen Konversionselement |
US8591072B2 (en) | 2011-11-16 | 2013-11-26 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
US9857519B2 (en) | 2012-07-03 | 2018-01-02 | Oree Advanced Illumination Solutions Ltd. | Planar remote phosphor illumination apparatus |
DE102012109650A1 (de) * | 2012-10-10 | 2014-04-10 | Osram Opto Semiconductors Gmbh | Keramisches Konversionselement, optoelektronisches Halbleiterelement und Verfahren zur Herstellung eines keramischen Konversionselements |
DE102013222430A1 (de) | 2013-11-05 | 2015-05-07 | Osram Gmbh | Beleuchtungsvorrichtung und Verfahren zum Erzeugen von Licht mittels einer Wellenlängenkonversionsanordnung und eines Bandstoppfilters sowie Verfahren zum Bereitstellen eines Bandstoppfilters |
WO2015170814A1 (en) * | 2014-05-09 | 2015-11-12 | Lg Electronics Inc. | Apparatus of light source for display and apparatus of display using the same |
US10490711B2 (en) | 2014-10-07 | 2019-11-26 | Nichia Corporation | Light emitting device |
EP3045963B1 (en) * | 2015-01-13 | 2018-04-04 | Samsung Display Co., Ltd. | Display device |
KR102474116B1 (ko) * | 2015-11-03 | 2022-12-06 | 삼성디스플레이 주식회사 | 표시 장치 |
US20160349431A1 (en) * | 2015-05-29 | 2016-12-01 | Hon Hai Precision Industry Co., Ltd. | Backlight module and liquid crystal display device |
US10918747B2 (en) | 2015-07-30 | 2021-02-16 | Vital Vio, Inc. | Disinfecting lighting device |
CN206848650U (zh) * | 2017-05-04 | 2018-01-05 | 深圳市华星光电技术有限公司 | 一种光学膜组件、背光模组及显示设备 |
CN206848648U (zh) * | 2017-05-04 | 2018-01-05 | 深圳市华星光电技术有限公司 | 一种背光模组和显示设备 |
CN107703674A (zh) * | 2017-05-04 | 2018-02-16 | 深圳市华星光电技术有限公司 | 一种用于背光模组的光学膜、背光模组及显示设备 |
KR102448122B1 (ko) * | 2017-05-23 | 2022-09-27 | 인터매틱스 코포레이션 | 컬러 액정 디스플레이 및 디스플레이 백라이트 |
KR20190086611A (ko) | 2018-01-12 | 2019-07-23 | 삼성디스플레이 주식회사 | 백라이트 유닛 및 이를 포함하는 표시 장치 |
US10413626B1 (en) | 2018-03-29 | 2019-09-17 | Vital Vio, Inc. | Multiple light emitter for inactivating microorganisms |
JPWO2020085204A1 (ja) | 2018-10-22 | 2021-10-07 | シャープ株式会社 | 光学素子および光学装置 |
CN110454733A (zh) * | 2019-08-05 | 2019-11-15 | 陈军 | 光伏稀土储能自发光道路导引灯 |
WO2021030748A1 (en) | 2019-08-15 | 2021-02-18 | Vital Vio, Inc. | Devices configured to disinfect interiors |
US11878084B2 (en) | 2019-09-20 | 2024-01-23 | Vyv, Inc. | Disinfecting light emitting subcomponent |
TWI783282B (zh) * | 2020-10-23 | 2022-11-11 | 欣興電子股份有限公司 | 具有顯示功能的後視鏡 |
CN114506276A (zh) * | 2020-10-23 | 2022-05-17 | 欣兴电子股份有限公司 | 具有显示功能的后视镜 |
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JPH11109326A (ja) * | 1997-09-30 | 1999-04-23 | Kawaguchiko Seimitsu Kk | 反射型液晶パネル |
KR100730433B1 (ko) * | 1998-10-28 | 2007-06-19 | 다이니폰 인사츠 가부시키가이샤 | 액정표시장치 |
EP1104799A1 (en) * | 1999-11-30 | 2001-06-06 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Red emitting luminescent material |
JP2003014748A (ja) * | 2001-06-28 | 2003-01-15 | Fuji Photo Film Co Ltd | 生体関連物質分析用の複合材料シート |
US6806856B2 (en) * | 2001-08-09 | 2004-10-19 | Microsoft Corporation | Reflective displays with color filter cross-talk compensation |
US6806642B2 (en) * | 2001-09-04 | 2004-10-19 | Durel Corporation | Light source with cascading dyes and BEF |
JP2003100126A (ja) * | 2001-09-20 | 2003-04-04 | Citizen Electronics Co Ltd | 導光板による色度補正 |
TW563261B (en) * | 2002-06-07 | 2003-11-21 | Solidlite Corp | A method and of manufacture for tri-color white LED |
US6637905B1 (en) * | 2002-09-26 | 2003-10-28 | Agilent Technologies, Inc. | Method and system for providing backlighting utilizing a luminescent impregnated material |
JP4107057B2 (ja) * | 2002-11-12 | 2008-06-25 | 日亜化学工業株式会社 | 蛍光体シートを用いる発光装置 |
JP4072632B2 (ja) * | 2002-11-29 | 2008-04-09 | 豊田合成株式会社 | 発光装置及び発光方法 |
US7250715B2 (en) * | 2004-02-23 | 2007-07-31 | Philips Lumileds Lighting Company, Llc | Wavelength converted semiconductor light emitting devices |
US7204630B2 (en) * | 2004-06-30 | 2007-04-17 | 3M Innovative Properties Company | Phosphor based illumination system having a plurality of light guides and an interference reflector |
US8324640B2 (en) * | 2004-07-02 | 2012-12-04 | GE Lighting Solutions, LLC | LED-based edge lit illumination system |
JP2008010556A (ja) * | 2006-06-28 | 2008-01-17 | Stanley Electric Co Ltd | Led光源装置およびそれを使用したledバックライト |
-
2006
- 2006-07-24 JP JP2006200347A patent/JP4898332B2/ja not_active Expired - Fee Related
- 2006-08-30 TW TW095132022A patent/TW200722867A/zh unknown
- 2006-09-14 US US11/521,044 patent/US7661841B2/en active Active
- 2006-09-15 CN CN2006101539556A patent/CN1932370B/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI508620B (zh) * | 2008-04-25 | 2015-11-11 | Sony Corp | A light emitting device, a display device, and a color conversion sheet |
Also Published As
Publication number | Publication date |
---|---|
CN1932370A (zh) | 2007-03-21 |
JP2007243135A (ja) | 2007-09-20 |
CN1932370B (zh) | 2012-03-14 |
JP4898332B2 (ja) | 2012-03-14 |
US20070057626A1 (en) | 2007-03-15 |
US7661841B2 (en) | 2010-02-16 |
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