TW200721232A - Method for producing a tubular target - Google Patents

Method for producing a tubular target

Info

Publication number
TW200721232A
TW200721232A TW095141235A TW95141235A TW200721232A TW 200721232 A TW200721232 A TW 200721232A TW 095141235 A TW095141235 A TW 095141235A TW 95141235 A TW95141235 A TW 95141235A TW 200721232 A TW200721232 A TW 200721232A
Authority
TW
Taiwan
Prior art keywords
producing
tubular target
target
tubular
tube
Prior art date
Application number
TW095141235A
Other languages
Chinese (zh)
Inventor
Wilhelm Sagemuller
Peter Polcik
Christian Weratschnig
Original Assignee
Plansee Metall Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plansee Metall Gmbh filed Critical Plansee Metall Gmbh
Publication of TW200721232A publication Critical patent/TW200721232A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3491—Manufacturing of targets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)

Abstract

The invention relates to a method for producing a tubular target which comprises a tube of a target material and a supporting tube, which are connected by internal high-pressure forming.
TW095141235A 2005-11-23 2006-11-08 Method for producing a tubular target TW200721232A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0079705U AT8909U1 (en) 2005-11-23 2005-11-23 METHOD FOR PRODUCING A TUBE TARGET

Publications (1)

Publication Number Publication Date
TW200721232A true TW200721232A (en) 2007-06-01

Family

ID=37451363

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095141235A TW200721232A (en) 2005-11-23 2006-11-08 Method for producing a tubular target

Country Status (3)

Country Link
AT (1) AT8909U1 (en)
TW (1) TW200721232A (en)
WO (1) WO2007059546A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111926296B (en) * 2020-07-15 2022-10-04 先导薄膜材料（广东）有限公司 Rotary target binding method
CN115488333B (en) * 2022-09-27 2023-12-29 宁波江丰电子材料股份有限公司 Molybdenum-titanium alloy tube target and preparation method and application thereof
CN115740452A (en) * 2022-11-09 2023-03-07 有研亿金新材料(山东)有限公司 Preparation method of high-purity high-density fine-grain low-oxygen tungsten target material

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3278625D1 (en) * 1982-03-17 1988-07-14 Kawasaki Heavy Ind Ltd Method of producing multiple-wall, composite tubular structures
JPH069905B2 (en) * 1986-01-21 1994-02-09 日本発条株式会社 Composite material consisting of graphite and metal
JPH01301855A (en) * 1988-05-30 1989-12-06 Toshiba Corp Sputtering target
JP3079378B1 (en) * 1999-02-10 2000-08-21 東京タングステン株式会社 Mo sputtering target material and method of manufacturing the same
EP1787311A1 (en) * 2004-07-16 2007-05-23 Bekaert Advanced Coatings Cylindrical target obtained by hot isostatic pressing

Also Published As

Publication number Publication date
AT8909U1 (en) 2007-02-15
WO2007059546A2 (en) 2007-05-31
WO2007059546A3 (en) 2007-11-01

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