TW200719127A - A heat dissipation apparatus and method for manufacturing the same - Google Patents
A heat dissipation apparatus and method for manufacturing the sameInfo
- Publication number
- TW200719127A TW200719127A TW094138809A TW94138809A TW200719127A TW 200719127 A TW200719127 A TW 200719127A TW 094138809 A TW094138809 A TW 094138809A TW 94138809 A TW94138809 A TW 94138809A TW 200719127 A TW200719127 A TW 200719127A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- fins
- substrate
- manufacturing
- dissipation apparatus
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a heat dissipation apparatus and a method for manufacturing the same. The apparatus includes a substrate and a number of fins, each of the fins includes a connection section, the connection section includes a bend portion, the substrate includes grooves correspond to the fins, the connection section is tightly combined with the substrate by heat pressing method. In the heat dissipation apparatus according to the present invention the heat resistance of the interface between the substrate and the fins is lowerd.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94138809A TWI345147B (en) | 2005-11-04 | 2005-11-04 | Method for manufacturing heat dissipation apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94138809A TWI345147B (en) | 2005-11-04 | 2005-11-04 | Method for manufacturing heat dissipation apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200719127A true TW200719127A (en) | 2007-05-16 |
TWI345147B TWI345147B (en) | 2011-07-11 |
Family
ID=45074968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94138809A TWI345147B (en) | 2005-11-04 | 2005-11-04 | Method for manufacturing heat dissipation apparatus |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI345147B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI468636B (en) * | 2011-11-09 | 2015-01-11 | Cooler Master Dev Corp | Heat dissipating fin, heat dissipating device and method of manufacturing the same |
TWI472292B (en) * | 2012-03-20 | 2015-02-01 | Asia Vital Components Co Ltd | Heat-dissipation unit and method of manufacturing same |
US9475156B2 (en) | 2012-04-24 | 2016-10-25 | Asia Vital Components Co., Ltd. | Heat-dissipation unit and method of manufacturing same |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI468638B (en) * | 2011-09-01 | 2015-01-11 | Kunshan Lemtech Prec Engineering Co Ltd | Radiator fin and base stamping combination method |
TWI475183B (en) | 2012-08-01 | 2015-03-01 | Asia Vital Components Co Ltd | Heat sink structure and method of manufacturing same |
TWI473962B (en) * | 2012-08-01 | 2015-02-21 | Asia Vital Components Co Ltd | Manufacturing method of heat sink |
-
2005
- 2005-11-04 TW TW94138809A patent/TWI345147B/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI468636B (en) * | 2011-11-09 | 2015-01-11 | Cooler Master Dev Corp | Heat dissipating fin, heat dissipating device and method of manufacturing the same |
TWI472292B (en) * | 2012-03-20 | 2015-02-01 | Asia Vital Components Co Ltd | Heat-dissipation unit and method of manufacturing same |
US9475156B2 (en) | 2012-04-24 | 2016-10-25 | Asia Vital Components Co., Ltd. | Heat-dissipation unit and method of manufacturing same |
Also Published As
Publication number | Publication date |
---|---|
TWI345147B (en) | 2011-07-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200719127A (en) | A heat dissipation apparatus and method for manufacturing the same | |
EP2259308A4 (en) | Substrate for power module with heat sink and method for producing the same, power module with heat sink, and substrate for power module | |
TW560835U (en) | Heat sink assembly with heat pipe | |
EP1889934A4 (en) | Copper alloy, copper alloy plate, and process for producing the same | |
EP1795574A4 (en) | Phosphor, method for producing same and light-emitting device | |
TW200517042A (en) | Heat sink | |
EP1994352A4 (en) | Flat tube, flat tube heat exchanger, and method of manufacturing same | |
HK1136862A1 (en) | Plate-type heat exchanger and method for producing the same | |
TW200709769A (en) | Composite heat dissipating apparatus | |
TW200711561A (en) | Electronic apparatus and thermal dissipating module thereof | |
EP1983067A4 (en) | Iridium-based alloy with high heat resistance and high strength and process for producing the same | |
CA2477186A1 (en) | Tong jaw and a method for constructing the tong jaw | |
WO2008119900A3 (en) | Method for producing a ceramic heat exchanger device and resulting devices | |
WO2007008734A8 (en) | A plate-type heater and a method for the manufacture thereof | |
DE60310992D1 (en) | HIGH PRESSURE HEAT EXCHANGE | |
EP2168144A4 (en) | Subassembly that includes a power semiconductor die and a heat sink and method of forming same | |
PT2250457E (en) | Plate-type heat exchanger, heat exchanger plate and method for producing the same | |
WO2008123488A1 (en) | Radiator for semiconductor device and method of producing the same | |
EP1702710A4 (en) | Tube producing method, heat exchanging tube produced by the method, and heat exchanger using the tube | |
EP1691159B8 (en) | Tube-fin heat exchanger, manufacturing process and expanding tool therefore | |
EP2168154A4 (en) | Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof | |
EP1753304A4 (en) | Heat seal die assembly | |
US20080047139A1 (en) | Method For Combining Axially Heated Heat Pipes And Heat-Conducting Base | |
IL172660A0 (en) | Positive pressure hot bonder | |
EP2033709A4 (en) | Metal base, method for producing the same, and catalyst |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |