TW200718324A - Laminated circuit board - Google Patents

Laminated circuit board

Info

Publication number
TW200718324A
TW200718324A TW095126191A TW95126191A TW200718324A TW 200718324 A TW200718324 A TW 200718324A TW 095126191 A TW095126191 A TW 095126191A TW 95126191 A TW95126191 A TW 95126191A TW 200718324 A TW200718324 A TW 200718324A
Authority
TW
Taiwan
Prior art keywords
circuit board
mum
conductive paste
foil
laminated circuit
Prior art date
Application number
TW095126191A
Other languages
Chinese (zh)
Other versions
TWI386141B (en
Inventor
Yuuji Suzuki
Yuuki Kikuchi
Satoru Zama
Original Assignee
Furukawa Circuit Foil
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Circuit Foil, Furukawa Electric Co Ltd filed Critical Furukawa Circuit Foil
Publication of TW200718324A publication Critical patent/TW200718324A/en
Application granted granted Critical
Publication of TWI386141B publication Critical patent/TWI386141B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

A through-hole type laminated circuit board is given with high reliability of electrical connection using copper foil and conductive paste containing low melting point metal without generating harmful void and crack at boundary between the copper foil and conductive paste metal. The laminated circuit board is made by laminating a multiple number of resin boards with roughening treated copper foils at least on their one surface sides with roughening projection deposition of less than 150 mg/dm<2 >to make surface roughness Rz of 0.3 to 10 mum and height of the projection to be 0.3 to 10 mum. Surface roughness of the original foil is 0.1 to 5 mum and the amount of copper metal atoms of roughening treated layer is set at 4 times or less than the amount of diffusible conductive paste metal atoms containing low melting point metal into the roughening treated layer on the foil surface.
TW095126191A 2005-08-01 2006-07-18 Laminated circuit board TWI386141B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005222316A JP4609850B2 (en) 2005-08-01 2005-08-01 Multilayer circuit board

Publications (2)

Publication Number Publication Date
TW200718324A true TW200718324A (en) 2007-05-01
TWI386141B TWI386141B (en) 2013-02-11

Family

ID=37700723

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095126191A TWI386141B (en) 2005-08-01 2006-07-18 Laminated circuit board

Country Status (4)

Country Link
JP (1) JP4609850B2 (en)
KR (1) KR101173444B1 (en)
CN (1) CN100581325C (en)
TW (1) TWI386141B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479958B (en) * 2009-03-27 2015-04-01 Jx Nippon Mining & Metals Corp Copper foil for printed wiring board and manufacturing method thereof

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101622380B (en) * 2007-03-02 2012-05-30 古河电气工业株式会社 Production method and device of surface roughened copper plate, and surface roughened copper plate
TWI402009B (en) * 2007-12-10 2013-07-11 Furukawa Electric Co Ltd Surface treatment of copper foil and circuit substrate
KR101851882B1 (en) * 2013-07-23 2018-04-24 제이엑스금속주식회사 Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method
JP6503633B2 (en) * 2014-04-24 2019-04-24 味の素株式会社 Method of manufacturing circuit board
JP7055049B2 (en) * 2017-03-31 2022-04-15 Ｊｘ金属株式会社 Surface-treated copper foil and laminated boards using it, copper foil with carriers, printed wiring boards, electronic devices, and methods for manufacturing printed wiring boards.
TWI740154B (en) * 2019-06-05 2021-09-21 鷹克國際股份有限公司 Method for forming a solder mask layer on a circuit board using liquid type solder mask materials
CN112433405B (en) * 2020-11-24 2022-04-19 中国科学技术大学 Liquid crystal polymer substrate and processing method thereof
CN112635772B (en) * 2020-12-18 2022-06-17 江西理工大学 Porous copper foil for lithium battery and preparation method and application thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02241087A (en) * 1989-03-15 1990-09-25 Matsushita Electric Works Ltd Treatment of copper circuit of circuit board for internal layer
JP3476264B2 (en) * 1993-12-24 2003-12-10 三井金属鉱業株式会社 Copper foil for printed circuit inner layer and method of manufacturing the same
TW317575B (en) * 1994-01-21 1997-10-11 Olin Corp
JP3574738B2 (en) * 1998-01-29 2004-10-06 京セラ株式会社 Wiring board
JP2001024328A (en) * 1999-07-05 2001-01-26 Asahi Chem Ind Co Ltd Multilayered wiring board
JP3473601B2 (en) * 2000-12-26 2003-12-08 株式会社デンソー Printed circuit board and method of manufacturing the same
JP2002217510A (en) * 2001-01-15 2002-08-02 Matsushita Electric Ind Co Ltd Connecting structure of board, and its manufacturing method
JP4062907B2 (en) * 2001-11-12 2008-03-19 松下電器産業株式会社 Circuit board and manufacturing method thereof
JP4129166B2 (en) * 2002-10-29 2008-08-06 京セラ株式会社 Electrolytic copper foil, film with electrolytic copper foil, multilayer wiring board, and manufacturing method thereof
JP4268476B2 (en) * 2003-08-25 2009-05-27 京セラ株式会社 Conductive paste, wiring board and manufacturing method thereof
JP2005129727A (en) * 2003-10-23 2005-05-19 Sony Corp Multilayer wiring board and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479958B (en) * 2009-03-27 2015-04-01 Jx Nippon Mining & Metals Corp Copper foil for printed wiring board and manufacturing method thereof

Also Published As

Publication number Publication date
CN1909765A (en) 2007-02-07
JP2007042696A (en) 2007-02-15
TWI386141B (en) 2013-02-11
KR101173444B1 (en) 2012-08-16
CN100581325C (en) 2010-01-13
KR20070015858A (en) 2007-02-06
JP4609850B2 (en) 2011-01-12

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