TW200718268A - Mask, mask chip, manufacturing method of mask, manufacturing method of mask chip, and electronic device - Google Patents

Mask, mask chip, manufacturing method of mask, manufacturing method of mask chip, and electronic device

Info

Publication number
TW200718268A
TW200718268A TW095126046A TW95126046A TW200718268A TW 200718268 A TW200718268 A TW 200718268A TW 095126046 A TW095126046 A TW 095126046A TW 95126046 A TW95126046 A TW 95126046A TW 200718268 A TW200718268 A TW 200718268A
Authority
TW
Taiwan
Prior art keywords
mask
section
manufacturing
chip
electronic device
Prior art date
Application number
TW095126046A
Other languages
English (en)
Inventor
Shinichi Yotsuya
Takayuki Kuwahara
Hiroshi Koeda
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200718268A publication Critical patent/TW200718268A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Printing Plates And Materials Therefor (AREA)
TW095126046A 2005-07-20 2006-07-17 Mask, mask chip, manufacturing method of mask, manufacturing method of mask chip, and electronic device TW200718268A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005209535A JP4438710B2 (ja) 2005-07-20 2005-07-20 マスク、マスクチップ、マスクの製造方法及びマスクチップの製造方法

Publications (1)

Publication Number Publication Date
TW200718268A true TW200718268A (en) 2007-05-01

Family

ID=37656969

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095126046A TW200718268A (en) 2005-07-20 2006-07-17 Mask, mask chip, manufacturing method of mask, manufacturing method of mask chip, and electronic device

Country Status (5)

Country Link
US (1) US7268406B2 (zh)
JP (1) JP4438710B2 (zh)
KR (1) KR100791530B1 (zh)
CN (1) CN100447946C (zh)
TW (1) TW200718268A (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9283592B2 (en) 2012-08-29 2016-03-15 Chunghwa Picture Tubes, Ltd. Mask and fabrication method of organic light emitting material layer
TWI561652B (zh) * 2012-01-12 2016-12-11 Dainippon Printing Co Ltd
TWI601838B (zh) * 2012-01-12 2017-10-11 大日本印刷股份有限公司 A method of manufacturing a vapor deposition mask, and a method of manufacturing an organic semiconductor element
US10160000B2 (en) 2012-01-12 2018-12-25 Dai Nippon Printing Co., Ltd. Vapor deposition mask with metal plate

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100984749B1 (ko) * 2008-02-15 2010-10-01 (주)미코씨엔씨 용사 돌기 형성용 마스크, 상기 마스크를 이용한 용사 돌기형성 방법 및 상기 마스크를 이용한 기판 지지대 제조방법
WO2010047101A1 (ja) * 2008-10-21 2010-04-29 株式会社アルバック マスク及びマスクを用いた成膜方法
KR101029999B1 (ko) * 2009-12-15 2011-04-20 삼성모바일디스플레이주식회사 마스크, 마스크 제조 방법 및 마스크 제조 장치
KR101274718B1 (ko) * 2010-01-28 2013-06-12 엘지디스플레이 주식회사 증착마스크 및 그를 포함하는 마스크 어셈블리
KR101309864B1 (ko) * 2010-02-02 2013-09-16 엘지디스플레이 주식회사 마스크 어셈블리
JP5599217B2 (ja) * 2010-04-13 2014-10-01 株式会社ディスコ すだれ状円板及びすだれ状円板の製造方法
US9865125B2 (en) * 2010-11-15 2018-01-09 Bally Gaming, Inc. System and method for augmented reality gaming
KR101784467B1 (ko) * 2011-01-10 2017-10-12 삼성디스플레이 주식회사 분할 마스크 및 그것을 이용한 마스크 프레임 조립체의 조립방법
KR101813549B1 (ko) * 2011-05-06 2018-01-02 삼성디스플레이 주식회사 분할 마스크와 그 분할 마스크를 포함한 마스크 프레임 조립체의 조립장치
JP5943755B2 (ja) * 2012-07-20 2016-07-05 キヤノン株式会社 液体吐出ヘッドの基板の製造方法
CN103045996A (zh) * 2012-12-10 2013-04-17 陕西科技大学 一种有机电致发光器件蒸镀用掩模板调节装置
TWI452416B (zh) * 2013-01-21 2014-09-11 Univ Nat Kaohsiung Applied Sci 可調式光罩
US9365923B2 (en) 2013-02-04 2016-06-14 Sharp Kabushiki Kaisha Vapor deposition device and vapor deposition method
KR20150019695A (ko) * 2013-08-14 2015-02-25 삼성디스플레이 주식회사 단위 마스크 및 마스크 조립체
JP5455099B1 (ja) 2013-09-13 2014-03-26 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いてマスクを製造する方法
JP5516816B1 (ja) 2013-10-15 2014-06-11 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
JP5641462B1 (ja) 2014-05-13 2014-12-17 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いてマスクを製造する方法
EP3626852B1 (en) 2015-02-10 2022-04-06 Dai Nippon Printing Co., Ltd. Method for manufacturing a deposition mask
US10562055B2 (en) 2015-02-20 2020-02-18 Si-Ware Systems Selective step coverage for micro-fabricated structures
KR102549358B1 (ko) * 2015-11-02 2023-06-29 삼성디스플레이 주식회사 증착 마스크 조립체 및 이를 이용한 표시 장치의 제조 방법
CN105892157A (zh) 2016-06-07 2016-08-24 深圳市华星光电技术有限公司 对液晶面板进行光配向的方法及光罩
CN105892156B (zh) 2016-06-07 2019-05-03 深圳市华星光电技术有限公司 对透明基板进行曝光的方法
EP3521482A4 (en) * 2016-09-29 2020-08-12 Dai Nippon Printing Co., Ltd. VAPOR DEPOSIT MASK PACKAGING AND VAPOR DEPOSIT MASK PACKAGING PROCESS
US10808314B2 (en) 2017-09-28 2020-10-20 Sharp Kabushiki Kaisha Vapor deposition mask and method for manufacturing vapor deposition mask
CN107841710A (zh) * 2017-12-08 2018-03-27 唐军 高精密支撑掩膜版
CN113215527B (zh) * 2021-04-23 2022-12-09 京东方科技集团股份有限公司 掩膜板框架、掩膜板组件及其制作方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3298418B2 (ja) 1996-06-14 2002-07-02 株式会社村田製作所 電子部品の電極形成方法およびそれに用いる電極形成装置
JP2001185350A (ja) 1999-12-24 2001-07-06 Sanyo Electric Co Ltd 被着用マスク、その製造方法、エレクトロルミネッセンス表示装置及びその製造方法
JP2001273976A (ja) 2000-03-28 2001-10-05 Tohoku Pioneer Corp 有機エレクトロルミネセンス表示パネル、その製造方法、及びその成膜装置
US7396558B2 (en) * 2001-01-31 2008-07-08 Toray Industries, Inc. Integrated mask and method and apparatus for manufacturing organic EL device using the same
JP2003022987A (ja) * 2001-07-09 2003-01-24 Sanyo Electric Co Ltd 化合物半導体装置の製造方法
JP2003026222A (ja) * 2001-07-16 2003-01-29 Haishiito Kogyo Kk 通気性パッキング
JP2003067454A (ja) 2001-08-27 2003-03-07 Sharp Corp 光結合素子の生産システム
KR100490534B1 (ko) * 2001-12-05 2005-05-17 삼성에스디아이 주식회사 유기 전자 발광 소자의 박막 증착용 마스크 프레임 조립체
JP3996439B2 (ja) 2002-05-16 2007-10-24 大日本印刷株式会社 有機ｅｌ素子製造に用いる真空蒸着用マスク装置
US6729927B2 (en) * 2002-08-01 2004-05-04 Eastman Kodak Company Method and apparatus for making a shadow mask array
KR100525819B1 (ko) * 2003-05-06 2005-11-03 엘지전자 주식회사 유기 이엘 디스플레이 패널 제조용 새도우 마스크
JP4349031B2 (ja) * 2003-08-04 2009-10-21 株式会社ジェイテクト 車両用操舵装置
US7045904B2 (en) * 2003-12-10 2006-05-16 Texas Instruments Incorporated Patterned plasma treatment to improve distribution of underfill material

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561652B (zh) * 2012-01-12 2016-12-11 Dainippon Printing Co Ltd
US9548453B2 (en) 2012-01-12 2017-01-17 Dai Nippon Printing Co., Ltd. Multiple-surface imposition vapor deposition mask
TWI595104B (zh) * 2012-01-12 2017-08-11 大日本印刷股份有限公司 A method of manufacturing an imposition vapor deposition mask, and a method of manufacturing an organic semiconductor device
TWI601838B (zh) * 2012-01-12 2017-10-11 大日本印刷股份有限公司 A method of manufacturing a vapor deposition mask, and a method of manufacturing an organic semiconductor element
US10160000B2 (en) 2012-01-12 2018-12-25 Dai Nippon Printing Co., Ltd. Vapor deposition mask with metal plate
US10189042B2 (en) 2012-01-12 2019-01-29 Dai Nippon Printing Co., Ltd. Vapor deposition mask with metal plate
US10391511B2 (en) 2012-01-12 2019-08-27 Dai Nippon Printing Co., Ltd. Vapor deposition mask with metal plate
US10894267B2 (en) 2012-01-12 2021-01-19 Dai Nippon Printing Co., Ltd. Vapor deposition mask with metal plate
US11511301B2 (en) 2012-01-12 2022-11-29 Dai Nippon Printing Co., Ltd. Vapor deposition mask with metal plate
US9283592B2 (en) 2012-08-29 2016-03-15 Chunghwa Picture Tubes, Ltd. Mask and fabrication method of organic light emitting material layer

Also Published As

Publication number Publication date
CN100447946C (zh) 2008-12-31
KR20070011165A (ko) 2007-01-24
JP2007023358A (ja) 2007-02-01
KR100791530B1 (ko) 2008-01-04
CN1901138A (zh) 2007-01-24
US7268406B2 (en) 2007-09-11
US20070017895A1 (en) 2007-01-25
JP4438710B2 (ja) 2010-03-24

Similar Documents

Publication Publication Date Title
TW200718268A (en) Mask, mask chip, manufacturing method of mask, manufacturing method of mask chip, and electronic device
TW200620017A (en) Computer automated design method, computer automated design system, and method of manufacturing integrated circuit
TW200705229A (en) Method of adding fabrication monitors to integrated circuit chips
TW200640325A (en) Wiring board manufacturing method
EP1921675A4 (en) PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MODULE USING THE SAME, MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD
TW200733275A (en) Semiconductor device and method of manufacturing the same
TW200715491A (en) The arrangement of conductive pads on grid array package and on circuit board
HK1073965A1 (en) Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
EP1489657A4 (en) SEMICONDUCTOR CHIP MOUNTING PLATE, METHOD FOR THE PRODUCTION THEREOF AND SEMICONDUCTOR MODULE
TW200627535A (en) Semiconductor wafer, manufacturing method of semiconductor device, and semiconductor device
GB2441265B (en) Method for manufacturing a circuit board structure, and a circuit board structure
TW200715708A (en) Electronic substrate, manufacturing method for electronic substrate, and electronic device
TW200705624A (en) Laminated semiconductor package
TW200703590A (en) Method of fabricating wiring board and method of fabricating semiconductor device
DE60309422D1 (de) Multichip-modul und Herstellungsverfahren
TW200618696A (en) Structure of circuit layout and method thereof
TW200723441A (en) Method and circuit for reducing device performance mismatch
TW200713422A (en) Semiconductor device having dummy pattern and method for manufacturing the same
TW200627561A (en) Chip package
EP2020023A4 (en) METHOD FOR PRODUCING C4 COMPOUNDS ON IC CHIPS AND COMPONENTS PRODUCED THEREFOR
TW200719468A (en) Package, package module and manufacturing method of the package
TW200715352A (en) Exclusion zone for stress-sensitive circuit design
TW200605739A (en) Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same
WO2005060712A3 (en) Processes for foreshortening fibrous structures
TW200743191A (en) Chip structure and fabricating process thereof