TW200718268A - Mask, mask chip, manufacturing method of mask, manufacturing method of mask chip, and electronic device - Google Patents
Mask, mask chip, manufacturing method of mask, manufacturing method of mask chip, and electronic deviceInfo
- Publication number
- TW200718268A TW200718268A TW095126046A TW95126046A TW200718268A TW 200718268 A TW200718268 A TW 200718268A TW 095126046 A TW095126046 A TW 095126046A TW 95126046 A TW95126046 A TW 95126046A TW 200718268 A TW200718268 A TW 200718268A
- Authority
- TW
- Taiwan
- Prior art keywords
- mask
- section
- manufacturing
- chip
- electronic device
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Printing Plates And Materials Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005209535A JP4438710B2 (ja) | 2005-07-20 | 2005-07-20 | マスク、マスクチップ、マスクの製造方法及びマスクチップの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200718268A true TW200718268A (en) | 2007-05-01 |
Family
ID=37656969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095126046A TW200718268A (en) | 2005-07-20 | 2006-07-17 | Mask, mask chip, manufacturing method of mask, manufacturing method of mask chip, and electronic device |
Country Status (5)
Country | Link |
---|---|
US (1) | US7268406B2 (zh) |
JP (1) | JP4438710B2 (zh) |
KR (1) | KR100791530B1 (zh) |
CN (1) | CN100447946C (zh) |
TW (1) | TW200718268A (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9283592B2 (en) | 2012-08-29 | 2016-03-15 | Chunghwa Picture Tubes, Ltd. | Mask and fabrication method of organic light emitting material layer |
TWI561652B (zh) * | 2012-01-12 | 2016-12-11 | Dainippon Printing Co Ltd | |
TWI601838B (zh) * | 2012-01-12 | 2017-10-11 | 大日本印刷股份有限公司 | A method of manufacturing a vapor deposition mask, and a method of manufacturing an organic semiconductor element |
US10160000B2 (en) | 2012-01-12 | 2018-12-25 | Dai Nippon Printing Co., Ltd. | Vapor deposition mask with metal plate |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100984749B1 (ko) * | 2008-02-15 | 2010-10-01 | (주)미코씨엔씨 | 용사 돌기 형성용 마스크, 상기 마스크를 이용한 용사 돌기형성 방법 및 상기 마스크를 이용한 기판 지지대 제조방법 |
WO2010047101A1 (ja) * | 2008-10-21 | 2010-04-29 | 株式会社アルバック | マスク及びマスクを用いた成膜方法 |
KR101029999B1 (ko) * | 2009-12-15 | 2011-04-20 | 삼성모바일디스플레이주식회사 | 마스크, 마스크 제조 방법 및 마스크 제조 장치 |
KR101274718B1 (ko) * | 2010-01-28 | 2013-06-12 | 엘지디스플레이 주식회사 | 증착마스크 및 그를 포함하는 마스크 어셈블리 |
KR101309864B1 (ko) * | 2010-02-02 | 2013-09-16 | 엘지디스플레이 주식회사 | 마스크 어셈블리 |
JP5599217B2 (ja) * | 2010-04-13 | 2014-10-01 | 株式会社ディスコ | すだれ状円板及びすだれ状円板の製造方法 |
US9865125B2 (en) * | 2010-11-15 | 2018-01-09 | Bally Gaming, Inc. | System and method for augmented reality gaming |
KR101784467B1 (ko) * | 2011-01-10 | 2017-10-12 | 삼성디스플레이 주식회사 | 분할 마스크 및 그것을 이용한 마스크 프레임 조립체의 조립방법 |
KR101813549B1 (ko) * | 2011-05-06 | 2018-01-02 | 삼성디스플레이 주식회사 | 분할 마스크와 그 분할 마스크를 포함한 마스크 프레임 조립체의 조립장치 |
JP5943755B2 (ja) * | 2012-07-20 | 2016-07-05 | キヤノン株式会社 | 液体吐出ヘッドの基板の製造方法 |
CN103045996A (zh) * | 2012-12-10 | 2013-04-17 | 陕西科技大学 | 一种有机电致发光器件蒸镀用掩模板调节装置 |
TWI452416B (zh) * | 2013-01-21 | 2014-09-11 | Univ Nat Kaohsiung Applied Sci | 可調式光罩 |
US9365923B2 (en) | 2013-02-04 | 2016-06-14 | Sharp Kabushiki Kaisha | Vapor deposition device and vapor deposition method |
KR20150019695A (ko) * | 2013-08-14 | 2015-02-25 | 삼성디스플레이 주식회사 | 단위 마스크 및 마스크 조립체 |
JP5455099B1 (ja) | 2013-09-13 | 2014-03-26 | 大日本印刷株式会社 | 金属板、金属板の製造方法、および金属板を用いてマスクを製造する方法 |
JP5516816B1 (ja) | 2013-10-15 | 2014-06-11 | 大日本印刷株式会社 | 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法 |
JP5641462B1 (ja) | 2014-05-13 | 2014-12-17 | 大日本印刷株式会社 | 金属板、金属板の製造方法、および金属板を用いてマスクを製造する方法 |
EP3626852B1 (en) | 2015-02-10 | 2022-04-06 | Dai Nippon Printing Co., Ltd. | Method for manufacturing a deposition mask |
US10562055B2 (en) | 2015-02-20 | 2020-02-18 | Si-Ware Systems | Selective step coverage for micro-fabricated structures |
KR102549358B1 (ko) * | 2015-11-02 | 2023-06-29 | 삼성디스플레이 주식회사 | 증착 마스크 조립체 및 이를 이용한 표시 장치의 제조 방법 |
CN105892157A (zh) | 2016-06-07 | 2016-08-24 | 深圳市华星光电技术有限公司 | 对液晶面板进行光配向的方法及光罩 |
CN105892156B (zh) | 2016-06-07 | 2019-05-03 | 深圳市华星光电技术有限公司 | 对透明基板进行曝光的方法 |
EP3521482A4 (en) * | 2016-09-29 | 2020-08-12 | Dai Nippon Printing Co., Ltd. | VAPOR DEPOSIT MASK PACKAGING AND VAPOR DEPOSIT MASK PACKAGING PROCESS |
US10808314B2 (en) | 2017-09-28 | 2020-10-20 | Sharp Kabushiki Kaisha | Vapor deposition mask and method for manufacturing vapor deposition mask |
CN107841710A (zh) * | 2017-12-08 | 2018-03-27 | 唐军 | 高精密支撑掩膜版 |
CN113215527B (zh) * | 2021-04-23 | 2022-12-09 | 京东方科技集团股份有限公司 | 掩膜板框架、掩膜板组件及其制作方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3298418B2 (ja) | 1996-06-14 | 2002-07-02 | 株式会社村田製作所 | 電子部品の電極形成方法およびそれに用いる電極形成装置 |
JP2001185350A (ja) | 1999-12-24 | 2001-07-06 | Sanyo Electric Co Ltd | 被着用マスク、その製造方法、エレクトロルミネッセンス表示装置及びその製造方法 |
JP2001273976A (ja) | 2000-03-28 | 2001-10-05 | Tohoku Pioneer Corp | 有機エレクトロルミネセンス表示パネル、その製造方法、及びその成膜装置 |
US7396558B2 (en) * | 2001-01-31 | 2008-07-08 | Toray Industries, Inc. | Integrated mask and method and apparatus for manufacturing organic EL device using the same |
JP2003022987A (ja) * | 2001-07-09 | 2003-01-24 | Sanyo Electric Co Ltd | 化合物半導体装置の製造方法 |
JP2003026222A (ja) * | 2001-07-16 | 2003-01-29 | Haishiito Kogyo Kk | 通気性パッキング |
JP2003067454A (ja) | 2001-08-27 | 2003-03-07 | Sharp Corp | 光結合素子の生産システム |
KR100490534B1 (ko) * | 2001-12-05 | 2005-05-17 | 삼성에스디아이 주식회사 | 유기 전자 발광 소자의 박막 증착용 마스크 프레임 조립체 |
JP3996439B2 (ja) | 2002-05-16 | 2007-10-24 | 大日本印刷株式会社 | 有機el素子製造に用いる真空蒸着用マスク装置 |
US6729927B2 (en) * | 2002-08-01 | 2004-05-04 | Eastman Kodak Company | Method and apparatus for making a shadow mask array |
KR100525819B1 (ko) * | 2003-05-06 | 2005-11-03 | 엘지전자 주식회사 | 유기 이엘 디스플레이 패널 제조용 새도우 마스크 |
JP4349031B2 (ja) * | 2003-08-04 | 2009-10-21 | 株式会社ジェイテクト | 車両用操舵装置 |
US7045904B2 (en) * | 2003-12-10 | 2006-05-16 | Texas Instruments Incorporated | Patterned plasma treatment to improve distribution of underfill material |
-
2005
- 2005-07-20 JP JP2005209535A patent/JP4438710B2/ja not_active Expired - Fee Related
-
2006
- 2006-06-21 US US11/425,396 patent/US7268406B2/en not_active Expired - Fee Related
- 2006-07-17 TW TW095126046A patent/TW200718268A/zh unknown
- 2006-07-18 CN CNB2006101056565A patent/CN100447946C/zh not_active Expired - Fee Related
- 2006-07-19 KR KR1020060067432A patent/KR100791530B1/ko not_active IP Right Cessation
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI561652B (zh) * | 2012-01-12 | 2016-12-11 | Dainippon Printing Co Ltd | |
US9548453B2 (en) | 2012-01-12 | 2017-01-17 | Dai Nippon Printing Co., Ltd. | Multiple-surface imposition vapor deposition mask |
TWI595104B (zh) * | 2012-01-12 | 2017-08-11 | 大日本印刷股份有限公司 | A method of manufacturing an imposition vapor deposition mask, and a method of manufacturing an organic semiconductor device |
TWI601838B (zh) * | 2012-01-12 | 2017-10-11 | 大日本印刷股份有限公司 | A method of manufacturing a vapor deposition mask, and a method of manufacturing an organic semiconductor element |
US10160000B2 (en) | 2012-01-12 | 2018-12-25 | Dai Nippon Printing Co., Ltd. | Vapor deposition mask with metal plate |
US10189042B2 (en) | 2012-01-12 | 2019-01-29 | Dai Nippon Printing Co., Ltd. | Vapor deposition mask with metal plate |
US10391511B2 (en) | 2012-01-12 | 2019-08-27 | Dai Nippon Printing Co., Ltd. | Vapor deposition mask with metal plate |
US10894267B2 (en) | 2012-01-12 | 2021-01-19 | Dai Nippon Printing Co., Ltd. | Vapor deposition mask with metal plate |
US11511301B2 (en) | 2012-01-12 | 2022-11-29 | Dai Nippon Printing Co., Ltd. | Vapor deposition mask with metal plate |
US9283592B2 (en) | 2012-08-29 | 2016-03-15 | Chunghwa Picture Tubes, Ltd. | Mask and fabrication method of organic light emitting material layer |
Also Published As
Publication number | Publication date |
---|---|
CN100447946C (zh) | 2008-12-31 |
KR20070011165A (ko) | 2007-01-24 |
JP2007023358A (ja) | 2007-02-01 |
KR100791530B1 (ko) | 2008-01-04 |
CN1901138A (zh) | 2007-01-24 |
US7268406B2 (en) | 2007-09-11 |
US20070017895A1 (en) | 2007-01-25 |
JP4438710B2 (ja) | 2010-03-24 |
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