TW200717185A - Exposure method, exposure apparatus and device manufacturing method - Google Patents
Exposure method, exposure apparatus and device manufacturing methodInfo
- Publication number
- TW200717185A TW200717185A TW095124741A TW95124741A TW200717185A TW 200717185 A TW200717185 A TW 200717185A TW 095124741 A TW095124741 A TW 095124741A TW 95124741 A TW95124741 A TW 95124741A TW 200717185 A TW200717185 A TW 200717185A
- Authority
- TW
- Taiwan
- Prior art keywords
- exposure
- reticle
- scanning
- wafer
- area
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
In scanning exposure, while performing synchronous scanning to a reticle and a wafer, under prescribed exposure conditions, to an illuminating area (IAR) whereupon illuminating light is applied and an exposure area, respectively, a pattern in a pattern area (PA) on the reticle is transferred on the wafer (W) through a projection optical system. At the time of correcting relative positions of the reticle and the wafer during the scanning exposure, nonparametric information relating to relative position shift quantities of the reticle and the wafer within an XY plane during the synchronous scanning, namely, a correction map including a relative position shift correcting quantity at each sample position in the scanning direction in the synchronous scanning, is used.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005200365 | 2005-07-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200717185A true TW200717185A (en) | 2007-05-01 |
TWI422980B TWI422980B (en) | 2014-01-11 |
Family
ID=37637019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095124741A TWI422980B (en) | 2005-07-08 | 2006-07-07 | Exposure method and exposure apparatus, and component manufacturing method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5045927B2 (en) |
TW (1) | TWI422980B (en) |
WO (1) | WO2007007626A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI418954B (en) * | 2007-06-15 | 2013-12-11 | Asml Netherlands Bv | Multivariable solver for optical proximity correction |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI454860B (en) * | 2012-08-17 | 2014-10-01 | Univ Nat Taipei Technology | Image alignment apparatus |
KR20200125986A (en) * | 2018-03-29 | 2020-11-05 | 에이에스엠엘 네델란즈 비.브이. | Control method for scanning exposure apparatus |
JP7431319B2 (en) * | 2019-09-10 | 2024-02-14 | エーエスエムエル ネザーランズ ビー.ブイ. | Subfield control of lithography process and related equipment |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000228344A (en) * | 1999-02-04 | 2000-08-15 | Canon Inc | Scanning projection aligner and device-manufacturing method |
TW511146B (en) * | 2000-05-31 | 2002-11-21 | Nikon Corp | Evaluation method, position detection method, exposure method and device manufacturing method, and exposure apparatus |
JP4905617B2 (en) * | 2001-05-28 | 2012-03-28 | 株式会社ニコン | Exposure method and device manufacturing method |
JP2002222760A (en) * | 2001-01-29 | 2002-08-09 | Canon Inc | Method and apparatus for exposure and method of manufacturing device |
JP4400745B2 (en) * | 2003-11-28 | 2010-01-20 | 株式会社ニコン | EXPOSURE METHOD, DEVICE MANUFACTURING METHOD, EXPOSURE APPARATUS, AND PROGRAM |
JP2005166951A (en) * | 2003-12-02 | 2005-06-23 | Nikon Corp | Exposure method, exposure apparatus, and lithography system |
-
2006
- 2006-07-06 JP JP2007524602A patent/JP5045927B2/en active Active
- 2006-07-06 WO PCT/JP2006/313459 patent/WO2007007626A1/en active Application Filing
- 2006-07-07 TW TW095124741A patent/TWI422980B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI418954B (en) * | 2007-06-15 | 2013-12-11 | Asml Netherlands Bv | Multivariable solver for optical proximity correction |
Also Published As
Publication number | Publication date |
---|---|
TWI422980B (en) | 2014-01-11 |
JP5045927B2 (en) | 2012-10-10 |
WO2007007626A1 (en) | 2007-01-18 |
JPWO2007007626A1 (en) | 2009-01-29 |
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