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Application filed by Taiwan Solutions Systems CorpfiledCriticalTaiwan Solutions Systems Corp
Priority to TW94134857ApriorityCriticalpatent/TWI291239B/en
Publication of TW200715579ApublicationCriticalpatent/TW200715579A/en
Application grantedgrantedCritical
Publication of TWI291239BpublicationCriticalpatent/TWI291239B/en
A chip package structure and the manufacturing method, which electrically connects different metal layers to replace the traditional method of connecting the same metal layer only. The protective layer is filled directly with the metal layer to cover the chip and the electric connection structure, which is different from ordinary solder mask coating method. Further, it can make lighter and thinner substrate by using carrier board as support. The disclosed manufacturing method can use existing process in package industry and doesn't need extra equipment or process. It can reduce the flow path of printed circuit board to reduce the cost of package.
TW94134857A2005-10-052005-10-05Manufacturing method for chip package structure
TWI291239B
(en)