TW200715464A - Clamp for use in processing semiconductor workpieces - Google Patents

Clamp for use in processing semiconductor workpieces

Info

Publication number
TW200715464A
TW200715464A TW095123733A TW95123733A TW200715464A TW 200715464 A TW200715464 A TW 200715464A TW 095123733 A TW095123733 A TW 095123733A TW 95123733 A TW95123733 A TW 95123733A TW 200715464 A TW200715464 A TW 200715464A
Authority
TW
Taiwan
Prior art keywords
layer
clamping
workpiece
insulator
support
Prior art date
Application number
TW095123733A
Other languages
Chinese (zh)
Inventor
Richard Muka
Paul Murphy
David E Suuronen
Original Assignee
Varian Semiconductor Equipment
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/263,113 external-priority patent/US7595972B2/en
Application filed by Varian Semiconductor Equipment filed Critical Varian Semiconductor Equipment
Publication of TW200715464A publication Critical patent/TW200715464A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Abstract

An apparatus is provided to improve clamping of a work piece to a support surface. The apparatus includes a support base, an insulator layer disposed on the support layer, an electrode layer disposed on the insulator layer, and a clamping layer comprising aluminum oxynitride disposed on the electrode layer wherein the workpiece is clamped to the surface of the clamping layer. The apparatus provides a higher clamping force for the workpiece while reducing gas leakage and particle levels in addition to maintaining a declamping time suitable for high throughput processing. The apparatus may further provide a raised surface geometry or embossments on the dielectric or a dielectric comprising an outer ring a center cavity for reducing particle contamination to the backside of the workpiece. Also, a thin wall sleeve may be provided between the base and the insulator and alternating current may be applied to opposite ones of interdigitated electrode pairs to reduce particle contamination and improve the implantation uniformity.
TW095123733A 2005-06-30 2006-06-30 Clamp for use in processing semiconductor workpieces TW200715464A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US69567305P 2005-06-30 2005-06-30
US11/263,113 US7595972B2 (en) 2004-04-09 2005-10-31 Clamp for use in processing semiconductor workpieces

Publications (1)

Publication Number Publication Date
TW200715464A true TW200715464A (en) 2007-04-16

Family

ID=37309716

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095123733A TW200715464A (en) 2005-06-30 2006-06-30 Clamp for use in processing semiconductor workpieces

Country Status (2)

Country Link
TW (1) TW200715464A (en)
WO (1) WO2007005925A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI459501B (en) * 2010-09-08 2014-11-01
TWI663681B (en) * 2014-02-07 2019-06-21 美商恩特葛瑞斯股份有限公司 Electrostatic chuck and method of making same

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100709589B1 (en) 2005-11-14 2007-04-20 (주)소슬 Embossing chuck which can take off wafer easily
TWI473203B (en) * 2009-01-20 2015-02-11 Gudeng Prec Industral Co Ltd Reticle clamping apparatus
US8574728B2 (en) 2011-03-15 2013-11-05 Kennametal Inc. Aluminum oxynitride coated article and method of making the same
US9017809B2 (en) 2013-01-25 2015-04-28 Kennametal Inc. Coatings for cutting tools
US9138864B2 (en) 2013-01-25 2015-09-22 Kennametal Inc. Green colored refractory coatings for cutting tools
US9427808B2 (en) 2013-08-30 2016-08-30 Kennametal Inc. Refractory coatings for cutting tools

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL56224A (en) * 1978-01-16 1982-08-31 Veeco Instr Inc Substrate clamp for use in semiconductor fabrication
US5636098A (en) * 1994-01-06 1997-06-03 Applied Materials, Inc. Barrier seal for electrostatic chuck
US6278600B1 (en) * 1994-01-31 2001-08-21 Applied Materials, Inc. Electrostatic chuck with improved temperature control and puncture resistance
US5729423A (en) * 1994-01-31 1998-03-17 Applied Materials, Inc. Puncture resistant electrostatic chuck

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI459501B (en) * 2010-09-08 2014-11-01
TWI663681B (en) * 2014-02-07 2019-06-21 美商恩特葛瑞斯股份有限公司 Electrostatic chuck and method of making same

Also Published As

Publication number Publication date
WO2007005925A1 (en) 2007-01-11

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