TW200715010A - The photosensitive resin medium - Google Patents

The photosensitive resin medium

Info

Publication number
TW200715010A
TW200715010A TW095125271A TW95125271A TW200715010A TW 200715010 A TW200715010 A TW 200715010A TW 095125271 A TW095125271 A TW 095125271A TW 95125271 A TW95125271 A TW 95125271A TW 200715010 A TW200715010 A TW 200715010A
Authority
TW
Taiwan
Prior art keywords
photosensitive polymer
photosensitive resin
equation
resin medium
photosensitive
Prior art date
Application number
TW095125271A
Other languages
Chinese (zh)
Other versions
TWI406062B (en
Inventor
Kazuo Takebe
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW200715010A publication Critical patent/TW200715010A/en
Application granted granted Critical
Publication of TWI406062B publication Critical patent/TWI406062B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Liquid Crystal (AREA)
  • Graft Or Block Polymers (AREA)

Abstract

The invention is a kind of the photosensitive resin medium. It includes a bonding resin (A), a photosensitive polymer (B), a photosensitive polymer catalyst (C) and a solution. The characteristics is that photosensitive polymer (B) possesses the compound of equation (I). And in the equation (I), the mass percentage rate in quantity of the photosensitive polymer (B) contrast to the bonding resin (A), photosensitive polymer (B) and photosensitive polymer catalyst(C) is 5~60 mass %. Equation (I), R1~R6 indicates hydrogen atoms or the any one of groups in equations (I-1)~(I~3), respectively. The group of R1~R6 are at least four of any one of groups of equations (I-1)~(I-3). The group of R1~R6 at least is (I-2)or(I-3).
TW095125271A 2005-07-29 2006-07-11 A photosensitive resin composition for optical spacers, an optical spacers, and a liquid crystal display device TWI406062B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005220340 2005-07-29
JP2006090550 2006-03-29

Publications (2)

Publication Number Publication Date
TW200715010A true TW200715010A (en) 2007-04-16
TWI406062B TWI406062B (en) 2013-08-21

Family

ID=38080643

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125271A TWI406062B (en) 2005-07-29 2006-07-11 A photosensitive resin composition for optical spacers, an optical spacers, and a liquid crystal display device

Country Status (3)

Country Link
KR (1) KR101373984B1 (en)
CN (1) CN1904732B (en)
TW (1) TWI406062B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100849360B1 (en) * 2007-02-13 2008-07-29 동우 화인켐 주식회사 A colored photosensitive resin composition, patterning method thereof, color filter, liquid crystal display device and imaging device having the same
KR100973644B1 (en) * 2007-07-18 2010-08-02 동우 화인켐 주식회사 A colored photosensitive resin composition, color filter and liquid crystal display device having the same
CN102067025B (en) * 2009-07-13 2014-10-08 株式会社艾迪科 Sealing agent for liquid crystal dripping method
KR102437844B1 (en) 2015-04-02 2022-08-31 롬엔드하스전자재료코리아유한회사 Colored photosensitive resin composition and black column spacer prepared therefrom
JP2020076945A (en) * 2018-09-21 2020-05-21 旭化成株式会社 Photosensitive resin composition

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3365434B2 (en) * 1993-06-22 2003-01-14 三菱化学株式会社 Photopolymerizable composition and photosensitive material
JP4330096B2 (en) * 1999-12-16 2009-09-09 日本化薬株式会社 Resin composition, film thereof and cured product thereof
EP1172693A4 (en) * 2000-01-25 2006-04-05 Daicel Chem Photocurable resin compositions
TW473647B (en) * 2000-01-29 2002-01-21 Chi Mei Corp Photosensitive resin composition
TW576950B (en) * 2000-12-27 2004-02-21 Chisso Corp Photosensitive resin compound, spacer, forming material, colorfilter forming material and the liquid crystal display device
JP4713753B2 (en) * 2001-03-29 2011-06-29 太陽ホールディングス株式会社 Photocurable thermosetting resin composition and cured product thereof
JP4641685B2 (en) * 2001-09-14 2011-03-02 株式会社日本触媒 Photosensitive resin composition for image formation
KR100869040B1 (en) * 2001-09-27 2008-11-17 에이제토 엘렉토로닉 마티리알즈 가부시키가이샤 Photosensitive resin composition
CN1191301C (en) * 2001-10-15 2005-03-02 奇美实业股份有限公司 Photosensitive resin composite for gap body of liquid crystal display
JP2003177525A (en) * 2001-12-13 2003-06-27 Sumitomo Chem Co Ltd Colored photosensitive resin composition
JP3894477B2 (en) * 2002-02-27 2007-03-22 Ａｚエレクトロニックマテリアルズ株式会社 Photosensitive resin composition
JP2003345015A (en) * 2002-05-29 2003-12-03 Sumitomo Chem Co Ltd Photosensitive resin composition
JP2005049842A (en) * 2003-07-11 2005-02-24 Sumitomo Chemical Co Ltd Photosensitive resin composition
CN1291279C (en) * 2003-08-22 2006-12-20 奇美实业股份有限公司 Light sensitive resin composition for gap

Also Published As

Publication number Publication date
CN1904732B (en) 2011-09-14
KR20070014991A (en) 2007-02-01
KR101373984B1 (en) 2014-03-12
CN1904732A (en) 2007-01-31
TWI406062B (en) 2013-08-21

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