TW200710934A - Chip module having a flip chip mounted on a metal film (COM), a chip card and the metal film carrier - Google Patents

Chip module having a flip chip mounted on a metal film (COM), a chip card and the metal film carrier

Info

Publication number
TW200710934A
TW200710934A TW094131174A TW94131174A TW200710934A TW 200710934 A TW200710934 A TW 200710934A TW 094131174 A TW094131174 A TW 094131174A TW 94131174 A TW94131174 A TW 94131174A TW 200710934 A TW200710934 A TW 200710934A
Authority
TW
Taiwan
Prior art keywords
chip
metal film
flip
film carrier
com
Prior art date
Application number
TW094131174A
Other languages
Chinese (zh)
Other versions
TWI257657B (en
Inventor
Tien-Kuo Chang
Wen-Chuan Lu
Shu-Chen Tai
Original Assignee
Int Semiconductor Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Semiconductor Tech Ltd filed Critical Int Semiconductor Tech Ltd
Priority to TW94131174A priority Critical patent/TWI257657B/en
Application granted granted Critical
Publication of TWI257657B publication Critical patent/TWI257657B/en
Publication of TW200710934A publication Critical patent/TW200710934A/en

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Abstract

A chip module having a flip chip mounted on a metal film carrier, mainly includes a metal film carrier, an antisotropic conductive material/non-conductive paste (NCP), and a flip chip. The metal film carrier has a plurality of metal pads, the metal pads has a portion within a flip-chip bonding region of the metal film carrier, wherein the portion of at least one of the metal pads is formed as a flip-chip connecting finger. And the antisotropic conductive material or non-conductive paste is dispensed on the flip-chip bonding region. A plurality of bumps of the flip chip are electrically connected to the metal pads by the antisotropic conductive material/non-conductive paste. Accordingly, conventional double-layer flexible wiring board of conventional chip module including reflowed bumps can be replaced to save the carrier cost and provides faster and universal chip module with flip-chip bonding.
TW94131174A 2005-09-09 2005-09-09 Chip module having a flip chip mounted on a metal film (COM), a chip card and the metal film carrier TWI257657B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94131174A TWI257657B (en) 2005-09-09 2005-09-09 Chip module having a flip chip mounted on a metal film (COM), a chip card and the metal film carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94131174A TWI257657B (en) 2005-09-09 2005-09-09 Chip module having a flip chip mounted on a metal film (COM), a chip card and the metal film carrier

Publications (2)

Publication Number Publication Date
TWI257657B TWI257657B (en) 2006-07-01
TW200710934A true TW200710934A (en) 2007-03-16

Family

ID=37764221

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94131174A TWI257657B (en) 2005-09-09 2005-09-09 Chip module having a flip chip mounted on a metal film (COM), a chip card and the metal film carrier

Country Status (1)

Country Link
TW (1) TWI257657B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102254891A (en) * 2011-08-01 2011-11-23 三星半导体(中国)研究开发有限公司 Flip chip packaging structure and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102254891A (en) * 2011-08-01 2011-11-23 三星半导体(中国)研究开发有限公司 Flip chip packaging structure and manufacturing method thereof

Also Published As

Publication number Publication date
TWI257657B (en) 2006-07-01

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