TW200710934A - Chip module having a flip chip mounted on a metal film (COM), a chip card and the metal film carrier - Google Patents
Chip module having a flip chip mounted on a metal film (COM), a chip card and the metal film carrierInfo
- Publication number
- TW200710934A TW200710934A TW094131174A TW94131174A TW200710934A TW 200710934 A TW200710934 A TW 200710934A TW 094131174 A TW094131174 A TW 094131174A TW 94131174 A TW94131174 A TW 94131174A TW 200710934 A TW200710934 A TW 200710934A
- Authority
- TW
- Taiwan
- Prior art keywords
- chip
- metal film
- flip
- film carrier
- com
- Prior art date
Links
Landscapes
- Wire Bonding (AREA)
Abstract
A chip module having a flip chip mounted on a metal film carrier, mainly includes a metal film carrier, an antisotropic conductive material/non-conductive paste (NCP), and a flip chip. The metal film carrier has a plurality of metal pads, the metal pads has a portion within a flip-chip bonding region of the metal film carrier, wherein the portion of at least one of the metal pads is formed as a flip-chip connecting finger. And the antisotropic conductive material or non-conductive paste is dispensed on the flip-chip bonding region. A plurality of bumps of the flip chip are electrically connected to the metal pads by the antisotropic conductive material/non-conductive paste. Accordingly, conventional double-layer flexible wiring board of conventional chip module including reflowed bumps can be replaced to save the carrier cost and provides faster and universal chip module with flip-chip bonding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94131174A TWI257657B (en) | 2005-09-09 | 2005-09-09 | Chip module having a flip chip mounted on a metal film (COM), a chip card and the metal film carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94131174A TWI257657B (en) | 2005-09-09 | 2005-09-09 | Chip module having a flip chip mounted on a metal film (COM), a chip card and the metal film carrier |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI257657B TWI257657B (en) | 2006-07-01 |
TW200710934A true TW200710934A (en) | 2007-03-16 |
Family
ID=37764221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94131174A TWI257657B (en) | 2005-09-09 | 2005-09-09 | Chip module having a flip chip mounted on a metal film (COM), a chip card and the metal film carrier |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI257657B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102254891A (en) * | 2011-08-01 | 2011-11-23 | 三星半导体(中国)研究开发有限公司 | Flip chip packaging structure and manufacturing method thereof |
-
2005
- 2005-09-09 TW TW94131174A patent/TWI257657B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102254891A (en) * | 2011-08-01 | 2011-11-23 | 三星半导体(中国)研究开发有限公司 | Flip chip packaging structure and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI257657B (en) | 2006-07-01 |
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