TW200710876A - Electrically conductive paste, and flexible printed wiring board obtained using the same - Google Patents
Electrically conductive paste, and flexible printed wiring board obtained using the sameInfo
- Publication number
- TW200710876A TW200710876A TW095114875A TW95114875A TW200710876A TW 200710876 A TW200710876 A TW 200710876A TW 095114875 A TW095114875 A TW 095114875A TW 95114875 A TW95114875 A TW 95114875A TW 200710876 A TW200710876 A TW 200710876A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrically conductive
- conductive paste
- pts
- same
- wiring board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0239—Coupling agent for particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
To provide an electrically conductive paste which has high adhesiveness to polyimide of which a board is made, good bending-proof nature and good solvent resistance. The electrically conductive paste contains electrically conductive powder and a binder resin, wherein the binder resin is epoxide resin composite which includes one or more kinds of aluminum compounds and silane coupling agents. The electrically conductive paste is preferably composed of solvent of 5 to 100 pts.wt. The aluminum compounds of 0.01 to 5 pts.wt. And the silane coupling agents of 0.01 to 5 pts.wt. When the electrically conductive powder is 100 pts.wt.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005129627A JP2006310022A (en) | 2005-04-27 | 2005-04-27 | Electrically conductive paste, and flexible printed wiring board obtained using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200710876A true TW200710876A (en) | 2007-03-16 |
Family
ID=37307979
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095114875A TW200710876A (en) | 2005-04-27 | 2006-04-26 | Electrically conductive paste, and flexible printed wiring board obtained using the same |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2006310022A (en) |
TW (1) | TW200710876A (en) |
WO (1) | WO2006118181A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009066396A1 (en) * | 2007-11-22 | 2009-05-28 | Asahi Glass Company, Limited | Ink for conductive film formation and process for producing printed wiring board |
KR101982885B1 (en) * | 2011-07-29 | 2019-05-27 | 히타치가세이가부시끼가이샤 | Adhesive composition, film-like adhesive and circuit connecting material using same adhesive composition, connection structure for circuit member and manufacturing method for same |
JP6263146B2 (en) * | 2015-04-06 | 2018-01-17 | 株式会社ノリタケカンパニーリミテド | Substrate with conductive film, method for producing the same, and conductive paste for polyimide substrate |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63228525A (en) * | 1987-03-17 | 1988-09-22 | 東洋インキ製造株式会社 | Electron beam hardening type conducting paste |
JP3697401B2 (en) * | 2001-02-22 | 2005-09-21 | 株式会社ノリタケカンパニーリミテド | Conductor paste and method for producing the same |
US7674401B2 (en) * | 2001-12-18 | 2010-03-09 | Asahi Kasei Kabushiki Kaisha | Method of producing a thin conductive metal film |
JP4219822B2 (en) * | 2003-01-14 | 2009-02-04 | シャープ株式会社 | Wiring material, wiring board, manufacturing method thereof, and display panel |
-
2005
- 2005-04-27 JP JP2005129627A patent/JP2006310022A/en active Pending
-
2006
- 2006-04-26 TW TW095114875A patent/TW200710876A/en unknown
- 2006-04-27 WO PCT/JP2006/308816 patent/WO2006118181A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2006118181A1 (en) | 2006-11-09 |
JP2006310022A (en) | 2006-11-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200631034A (en) | Conductive paste and flexible printed wiring board formed by using it | |
EP1753277A3 (en) | Wiring circuit board | |
TW200613357A (en) | Thermosetting resin composition and laminate and circuit board including thermosetting resin composition | |
MY117791A (en) | Conductive ink composition | |
WO2008111489A1 (en) | Fire-retardant adhesive resin composition, and adhesive film using the same | |
TW200704743A (en) | Low stress conductive adhesive | |
WO2008143358A1 (en) | Electric device, connecting method and adhesive film | |
EP2194098A4 (en) | Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board | |
WO2007005617A3 (en) | Electrically conducting polymer glue, devices made therewith and methods of manufacture | |
WO2008099531A1 (en) | Backlight device and planar display device using the same | |
AU2003235203A1 (en) | Flame-retarded epoxy resin composition, prepregs containing the same, laminated sheets and printed wiring boards | |
WO2007100724A3 (en) | A halogen-free phosphorous epoxy resin composition | |
EP1453364A4 (en) | Film for circuit board | |
WO2017180350A3 (en) | Flexible printed circuit with enhanced ground plane connectivity | |
TW200620329A (en) | Conductive paste and electronic component mounting substrate using it | |
TW200603177A (en) | Composition of conductive paste | |
WO2008143058A1 (en) | Copper foil with resin layer | |
TW200618703A (en) | Connection method of conductive articles, and electric or electronic component with parts connected by the connection method | |
WO2008102709A1 (en) | Flexible printed wiring board | |
TW200710876A (en) | Electrically conductive paste, and flexible printed wiring board obtained using the same | |
EP1310525A4 (en) | Copper foil with resin and printed wiring boards made by using the same | |
TW200714665A (en) | Flame-retarding epoxy resin composition containing no halogen | |
TW200602405A (en) | Thermosetting resin composition and its cured film | |
JP2008078677A5 (en) | ||
TW200516126A (en) | Adhesive composition for semiconductor devices, coverlay films, adhesive sheets and copper-clad polyimide films using the composition |