TW200709471A - Bendable high flux LED array - Google Patents

Bendable high flux LED array

Info

Publication number
TW200709471A
TW200709471A TW094129610A TW94129610A TW200709471A TW 200709471 A TW200709471 A TW 200709471A TW 094129610 A TW094129610 A TW 094129610A TW 94129610 A TW94129610 A TW 94129610A TW 200709471 A TW200709471 A TW 200709471A
Authority
TW
Taiwan
Prior art keywords
disposed above
led
bendable
dielectric material
heat spreaders
Prior art date
Application number
TW094129610A
Other languages
Chinese (zh)
Inventor
Shane Harrah
Original Assignee
Shane Harrah
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shane Harrah filed Critical Shane Harrah
Priority to TW094129610A priority Critical patent/TW200709471A/en
Publication of TW200709471A publication Critical patent/TW200709471A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Abstract

A bendable light emitting diode (LED) array in accordance with the present invention includes heat spreaders, dielectric material disposed above each heat spreader, and a bendable electrical interconnection layer disposed above these heat spreaders and electrically insulated from these heat spreaders by the dielectric material. At least one via passes through the dielectric material above each heat spreader, and at least one LED die is disposed above each via. The bendable electrical interconnection layer may be a lead frame comprising metal pathways that electrically interconnect some or all LED dice in series, in parallel, in anti-parallel, or in some combination of these configurations. Each via contains a thermally conductive material in thermal contact with the corresponding heat spreader below it and in thermal contact with the corresponding LED die above it. The LED dice may be thermally and electrically coupled to submounts disposed above corresponding heat spreaders in some embodiments.
TW094129610A 2005-08-29 2005-08-29 Bendable high flux LED array TW200709471A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094129610A TW200709471A (en) 2005-08-29 2005-08-29 Bendable high flux LED array

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094129610A TW200709471A (en) 2005-08-29 2005-08-29 Bendable high flux LED array

Publications (1)

Publication Number Publication Date
TW200709471A true TW200709471A (en) 2007-03-01

Family

ID=57911058

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129610A TW200709471A (en) 2005-08-29 2005-08-29 Bendable high flux LED array

Country Status (1)

Country Link
TW (1) TW200709471A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9179543B2 (en) 2010-11-03 2015-11-03 3M Innovative Properties Company Flexible LED device with wire bond free die
US9674938B2 (en) 2010-11-03 2017-06-06 3M Innovative Properties Company Flexible LED device for thermal management
US9716061B2 (en) 2011-02-18 2017-07-25 3M Innovative Properties Company Flexible light emitting semiconductor device
US9909063B2 (en) 2010-11-03 2018-03-06 3M Innovative Properties Company Polymer etchant and method of using same
CN108336040A (en) * 2017-01-19 2018-07-27 深圳奥比中光科技有限公司 Chip flush mounting
CN110959199A (en) * 2017-08-28 2020-04-03 奥斯兰姆奥普托半导体有限责任公司 Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9179543B2 (en) 2010-11-03 2015-11-03 3M Innovative Properties Company Flexible LED device with wire bond free die
US9564568B2 (en) 2010-11-03 2017-02-07 3M Innovative Properties Company Flexible LED device with wire bond free die
US9674938B2 (en) 2010-11-03 2017-06-06 3M Innovative Properties Company Flexible LED device for thermal management
US9909063B2 (en) 2010-11-03 2018-03-06 3M Innovative Properties Company Polymer etchant and method of using same
US9716061B2 (en) 2011-02-18 2017-07-25 3M Innovative Properties Company Flexible light emitting semiconductor device
CN108336040A (en) * 2017-01-19 2018-07-27 深圳奥比中光科技有限公司 Chip flush mounting
CN110959199A (en) * 2017-08-28 2020-04-03 奥斯兰姆奥普托半导体有限责任公司 Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
CN110959199B (en) * 2017-08-28 2023-12-15 奥斯兰姆奥普托半导体有限责任公司 Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component

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