TW200708560A - Semiconductor encapsulating epoxy resin composition and semiconductor device - Google Patents

Semiconductor encapsulating epoxy resin composition and semiconductor device

Info

Publication number
TW200708560A
TW200708560A TW095114556A TW95114556A TW200708560A TW 200708560 A TW200708560 A TW 200708560A TW 095114556 A TW095114556 A TW 095114556A TW 95114556 A TW95114556 A TW 95114556A TW 200708560 A TW200708560 A TW 200708560A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
weight
parts
semiconductor
Prior art date
Application number
TW095114556A
Other languages
Chinese (zh)
Other versions
TWI389969B (en
Inventor
Shoichi Osada
Yasuo Kimura
Eiichi Asano
Toshio Shiobara
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200708560A publication Critical patent/TW200708560A/en
Application granted granted Critical
Publication of TWI389969B publication Critical patent/TWI389969B/en

Links

Landscapes

  • Chemical & Material Sciences (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)

Abstract

An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a phosphazene compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.
TW95114556A 2005-04-25 2006-04-24 Epoxy resin composition for semiconductor sealing and semiconductor device TWI389969B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005125950 2005-04-25
JP2006105251A JP4844726B2 (en) 2005-04-25 2006-04-06 Epoxy resin composition for semiconductor encapsulation and semiconductor device

Publications (2)

Publication Number Publication Date
TW200708560A true TW200708560A (en) 2007-03-01
TWI389969B TWI389969B (en) 2013-03-21

Family

ID=37550384

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95114556A TWI389969B (en) 2005-04-25 2006-04-24 Epoxy resin composition for semiconductor sealing and semiconductor device

Country Status (3)

Country Link
JP (1) JP4844726B2 (en)
KR (1) KR101191537B1 (en)
TW (1) TWI389969B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5470680B2 (en) 2007-02-06 2014-04-16 日亜化学工業株式会社 LIGHT EMITTING DEVICE, MANUFACTURING METHOD THEREOF, AND MOLDED BODY

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3137202B2 (en) * 1990-10-30 2001-02-19 大日本インキ化学工業株式会社 Epoxy resin, method for producing the same, and epoxy resin composition
JP2705527B2 (en) * 1993-05-25 1998-01-28 松下電工株式会社 Epoxy resin composition
JP3022135B2 (en) * 1994-01-26 2000-03-15 信越化学工業株式会社 Epoxy resin composition
JP3824063B2 (en) * 2001-11-06 2006-09-20 信越化学工業株式会社 Flame-retardant epoxy resin composition for semiconductor encapsulation and semiconductor device
JP3824064B2 (en) * 2001-11-06 2006-09-20 信越化学工業株式会社 Flame-retardant epoxy resin composition for semiconductor encapsulation and semiconductor device
JP4661033B2 (en) * 2003-06-27 2011-03-30 Ｄｉｃ株式会社 Epoxy resin composition, semiconductor sealing material, and semiconductor device

Also Published As

Publication number Publication date
KR20060111852A (en) 2006-10-30
JP2006328363A (en) 2006-12-07
JP4844726B2 (en) 2011-12-28
KR101191537B1 (en) 2012-10-15
TWI389969B (en) 2013-03-21

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