TW200707722A - Integrated circuit transformer devices for on-chip millimeter-wave applications - Google Patents
Integrated circuit transformer devices for on-chip millimeter-wave applicationsInfo
- Publication number
- TW200707722A TW200707722A TW095112387A TW95112387A TW200707722A TW 200707722 A TW200707722 A TW 200707722A TW 095112387 A TW095112387 A TW 095112387A TW 95112387 A TW95112387 A TW 95112387A TW 200707722 A TW200707722 A TW 200707722A
- Authority
- TW
- Taiwan
- Prior art keywords
- integrated circuit
- circuit transformer
- transformer devices
- millimeter
- wave applications
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5223—Capacitor integral with wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5225—Shielding layers formed together with wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/26—Push-pull amplifiers; Phase-splitters therefor
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/45—Differential amplifiers
- H03F3/45071—Differential amplifiers with semiconductor devices only
- H03F3/45076—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
- H03F3/4508—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using bipolar transistors as the active amplifying circuit
- H03F3/45085—Long tailed pairs
- H03F3/45089—Non-folded cascode stages
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/60—Amplifiers in which coupling networks have distributed constants, e.g. with waveguide resonators
- H03F3/602—Combinations of several amplifiers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Semiconductor Integrated Circuits (AREA)
- Microwave Amplifiers (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/102,292 US7427801B2 (en) | 2005-04-08 | 2005-04-08 | Integrated circuit transformer devices for on-chip millimeter-wave applications |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200707722A true TW200707722A (en) | 2007-02-16 |
TWI380440B TWI380440B (en) | 2012-12-21 |
Family
ID=37082407
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095112387A TWI380440B (en) | 2005-04-08 | 2006-04-07 | Integrated circuit transformer devices for on-chip millimeter-wave applications |
Country Status (6)
Country | Link |
---|---|
US (3) | US7427801B2 (zh) |
EP (1) | EP1866937B1 (zh) |
JP (1) | JP5065242B2 (zh) |
CN (1) | CN101142639B (zh) |
TW (1) | TWI380440B (zh) |
WO (1) | WO2006110207A2 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8797135B2 (en) | 2008-03-12 | 2014-08-05 | Mediatek Inc. | Transformer power combiner having a plurality of current combiners coupled in series and a voltage combiner coupled to a series connection of the current combiners |
US8994488B2 (en) | 2008-03-12 | 2015-03-31 | Mediatek Inc. | Transformer power splitter having primary winding conductors magnetically coupled to secondary winding conductors and configured in topology including series connection and parallel connection |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070069717A1 (en) * | 2005-09-28 | 2007-03-29 | Cheung Tak S | Self-shielded electronic components |
KR100758991B1 (ko) * | 2006-02-03 | 2007-09-17 | 삼성전자주식회사 | Rfid 시스템을 구비한 이동통신 단말기 |
JP5366932B2 (ja) * | 2007-05-08 | 2013-12-11 | スキャニメトリクス,インコーポレイテッド | 超高速信号送受信 |
US8362481B2 (en) | 2007-05-08 | 2013-01-29 | Scanimetrics Inc. | Ultra high speed signal transmission/reception |
US8261228B1 (en) | 2008-10-01 | 2012-09-04 | Cadence Design Systems, Inc. | Technique for modeling parasitics from layout during circuit design and for parasitic aware circuit design using modes of varying accuracy |
JP5556072B2 (ja) * | 2009-01-07 | 2014-07-23 | ソニー株式会社 | 半導体装置、その製造方法、ミリ波誘電体内伝送装置 |
US8143952B2 (en) * | 2009-10-08 | 2012-03-27 | Qualcomm Incorporated | Three dimensional inductor and transformer |
KR101075013B1 (ko) * | 2009-12-11 | 2011-10-19 | 전자부품연구원 | 빔 성형 rf 벡터모듈레이터 |
US20110161064A1 (en) * | 2009-12-31 | 2011-06-30 | Lorentz Solution, Inc. | Physics-based compact model generation from electromagnetic simulation data |
US20120002377A1 (en) * | 2010-06-30 | 2012-01-05 | William French | Galvanic isolation transformer |
CN102394578A (zh) * | 2011-10-20 | 2012-03-28 | 刘训春 | 一种低失真变压器输出的晶体管音频功率放大电路 |
EP2669906B1 (en) | 2012-06-01 | 2018-08-29 | Nxp B.V. | An integrated circuit based transformer |
DE102013101768A1 (de) * | 2013-02-22 | 2014-08-28 | Intel Mobile Communications GmbH | Transformator und elektrische Schaltung |
US8901714B2 (en) * | 2013-03-14 | 2014-12-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Transmission line formed adjacent seal ring |
CN104616557B (zh) * | 2015-01-30 | 2017-05-17 | 南车株洲电力机车有限公司 | 一种轨道车辆模拟电路生成方法、***及控制方法、*** |
CN104915527A (zh) * | 2015-07-15 | 2015-09-16 | 哈尔滨工业大学 | 一种基于变分积分离散拉格朗日模型的Buck-Boost变换器建模与非线性分析方法 |
JP6930427B2 (ja) * | 2016-01-14 | 2021-09-01 | ソニーグループ株式会社 | 半導体装置 |
WO2017210153A1 (en) * | 2016-05-30 | 2017-12-07 | Coventor, Inc. | System and method for electrical behavior modeling in a 3d virtual fabrication environment |
JP6766946B2 (ja) * | 2017-02-28 | 2020-10-14 | 株式会社村田製作所 | 積層型電子部品および積層型電子部品の製造方法 |
US10559561B2 (en) | 2018-01-19 | 2020-02-11 | Xilinx, Inc. | Isolation enhancement with on-die slot-line on power/ground grid structure |
US11270951B2 (en) * | 2018-12-13 | 2022-03-08 | Qualcomm Incorporated | Substrate comprising at least one patterned ground plane for shielding |
CN109920633A (zh) * | 2019-03-21 | 2019-06-21 | 惠州市纬特科技有限公司 | 减小电磁干扰的变压器 |
US11764739B2 (en) * | 2020-04-23 | 2023-09-19 | Smarter Microelectronics (Guang Zhou) Co., Ltd. | Radio frequency power amplifier with harmonic suppression |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60134440A (ja) * | 1983-12-23 | 1985-07-17 | Hitachi Ltd | 半導体集積回路装置 |
US5223800A (en) | 1991-09-30 | 1993-06-29 | Itt Corporation | Distributed arrays of microelectronic amplifiers |
JPH07235796A (ja) * | 1994-02-25 | 1995-09-05 | Hitachi Denshi Ltd | 多層基板を用いた高周波回路 |
US5477204A (en) | 1994-07-05 | 1995-12-19 | Motorola, Inc. | Radio frequency transformer |
US5760456A (en) * | 1995-12-21 | 1998-06-02 | Grzegorek; Andrew Z. | Integrated circuit compatible planar inductors with increased Q |
US5697088A (en) * | 1996-08-05 | 1997-12-09 | Motorola, Inc. | Balun transformer |
WO1998050956A1 (en) | 1997-05-02 | 1998-11-12 | The Board Of Trustees Of The Leland Stanford Junior University | Patterned ground shields for integrated circuit inductors |
FR2771843B1 (fr) * | 1997-11-28 | 2000-02-11 | Sgs Thomson Microelectronics | Transformateur en circuit integre |
US6137376A (en) | 1999-07-14 | 2000-10-24 | International Business Machines Corporation | Printed BALUN circuits |
JP2001060809A (ja) * | 1999-08-19 | 2001-03-06 | Sony Corp | 回路素子およびプリント配線板 |
ATE522979T1 (de) | 2000-10-10 | 2011-09-15 | California Inst Of Techn | Verteilte leistungsverstärkerarchitektur mit kreisförmiger geometrie |
US6856199B2 (en) | 2000-10-10 | 2005-02-15 | California Institute Of Technology | Reconfigurable distributed active transformers |
US6731166B1 (en) | 2001-11-26 | 2004-05-04 | Analog Devices, Inc. | Power amplifier system with multiple primary windings |
JP4274730B2 (ja) * | 2002-01-30 | 2009-06-10 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
JP2003257739A (ja) * | 2002-02-28 | 2003-09-12 | Koa Corp | 高周波デバイス |
TW200306062A (en) | 2002-03-11 | 2003-11-01 | California Inst Of Techn | Multi-cascode transistors |
AU2003225069A1 (en) * | 2002-04-18 | 2003-11-03 | University Of South Florida | Global equivalent circuit modeling system for substrate mounted circuit components incoporating substrate dependent characteristics |
US6794978B2 (en) * | 2002-05-15 | 2004-09-21 | John C. Tung | Accurate multi-ground inductors for high-speed integrated circuits |
US7091813B2 (en) | 2002-06-13 | 2006-08-15 | International Business Machines Corporation | Integrated circuit transformer for radio frequency applications |
TWI300617B (en) * | 2002-11-15 | 2008-09-01 | Via Tech Inc | Low substrate loss inductor |
JP4664619B2 (ja) * | 2003-05-16 | 2011-04-06 | パナソニック株式会社 | 相互誘導回路 |
JP4477964B2 (ja) * | 2003-07-31 | 2010-06-09 | 太陽誘電株式会社 | 高周波回路の設計方法及び設計装置と高周波回路の設計に係る表示方法 |
US7084728B2 (en) * | 2003-12-15 | 2006-08-01 | Nokia Corporation | Electrically decoupled integrated transformer having at least one grounded electric shield |
-
2005
- 2005-04-08 US US11/102,292 patent/US7427801B2/en active Active
-
2006
- 2006-02-10 EP EP06734927A patent/EP1866937B1/en active Active
- 2006-02-10 CN CN2006800083949A patent/CN101142639B/zh active Active
- 2006-02-10 WO PCT/US2006/005013 patent/WO2006110207A2/en active Search and Examination
- 2006-02-10 JP JP2008505294A patent/JP5065242B2/ja not_active Expired - Fee Related
- 2006-04-07 TW TW095112387A patent/TWI380440B/zh active
-
2008
- 2008-04-21 US US12/106,531 patent/US8122393B2/en active Active
-
2011
- 2011-11-09 US US13/292,585 patent/US8453078B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8797135B2 (en) | 2008-03-12 | 2014-08-05 | Mediatek Inc. | Transformer power combiner having a plurality of current combiners coupled in series and a voltage combiner coupled to a series connection of the current combiners |
US8994488B2 (en) | 2008-03-12 | 2015-03-31 | Mediatek Inc. | Transformer power splitter having primary winding conductors magnetically coupled to secondary winding conductors and configured in topology including series connection and parallel connection |
Also Published As
Publication number | Publication date |
---|---|
CN101142639A (zh) | 2008-03-12 |
US8453078B2 (en) | 2013-05-28 |
US20060226510A1 (en) | 2006-10-12 |
TWI380440B (en) | 2012-12-21 |
EP1866937B1 (en) | 2012-11-21 |
JP2008537849A (ja) | 2008-09-25 |
US7427801B2 (en) | 2008-09-23 |
EP1866937A2 (en) | 2007-12-19 |
US8122393B2 (en) | 2012-02-21 |
WO2006110207A3 (en) | 2007-07-19 |
WO2006110207A2 (en) | 2006-10-19 |
US20080195988A1 (en) | 2008-08-14 |
EP1866937A4 (en) | 2010-09-29 |
US20120060135A1 (en) | 2012-03-08 |
JP5065242B2 (ja) | 2012-10-31 |
CN101142639B (zh) | 2011-10-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200707722A (en) | Integrated circuit transformer devices for on-chip millimeter-wave applications | |
BRPI0718315A2 (pt) | Aparelho e dispersão de pó, método de fabricação e utilização do aparelho, e componentes que possam ser usados no aparelho e em outros dispositivos. | |
WO2003019693A3 (de) | Lösungen organischer halbleiter | |
EP1736520A4 (en) | RESIN COMPOSITION AND SEMICONDUCTOR EQUIPMENT MANUFACTURED THEREFOR | |
AU306197S (en) | Housing for electronic device | |
AU2003243260A8 (en) | Microstructured taggant particles, applications and methods of making the same | |
TW200704751A (en) | Novel materials for organic electroluminescent devices | |
TW200636046A (en) | Novel materials for organic electroluminescent devices | |
EP1854160A4 (en) | REDOX ACTIVE STRUCTURES AND THESE USES | |
WO2006072069A3 (en) | Thermoset nanocomposite particles, processing for their production, and their use in oil and natural gas drilling applications | |
TW200740956A (en) | Organic electroluminescent devices | |
TW200641971A (en) | High voltage metal-oxide-semiconductor transistor devices and method of making the same | |
TW200605586A (en) | Flexible accelerators for physical layer processing | |
IL171875A0 (en) | Pioglitazone salts,such as pioglitazone sulfate, and pharmaceutical compositions and processes using the same | |
WO2006029772A3 (de) | Thixotrope beschichtungsmassen | |
EP1976822A4 (en) | COMPOSITIONS CONTAINING NEW COMPOUNDS AND ELECTRONIC COMPONENTS MADE WITH SUCH COMPOSITIONS | |
GB2445514B (en) | Regioregular polyselenophenes | |
MY162185A (en) | Alumina particles and methods of making the same | |
ITMI20031170A0 (it) | Rubinetto miscelatore monocomando sottofinestra con canna abbattibile | |
ITTO20050447A1 (it) | Attrezzatura e metodo di miscelazione in sito per la formazione di diaframmi. | |
GB2461615A (en) | Assay devices and methods and components for use therein | |
ZA200304650B (en) | Liquid antacid compositions. | |
EP1877058A4 (en) | USE OF PHYCOTOXINES IN VETERINARY MEDICINE APPLICATIONS | |
TW200701545A (en) | Ring-shaped millimeter-wave filter | |
GB2460196A (en) | Fluidic methods |