TW200703677A - Packaging process of elements and manufactures thereof - Google Patents

Packaging process of elements and manufactures thereof

Info

Publication number
TW200703677A
TW200703677A TW094122635A TW94122635A TW200703677A TW 200703677 A TW200703677 A TW 200703677A TW 094122635 A TW094122635 A TW 094122635A TW 94122635 A TW94122635 A TW 94122635A TW 200703677 A TW200703677 A TW 200703677A
Authority
TW
Taiwan
Prior art keywords
packaging process
elements
manufactures
integral
packaged
Prior art date
Application number
TW094122635A
Other languages
Chinese (zh)
Other versions
TWI253762B (en
Inventor
Ming-Xiong Liu
Original Assignee
Lingsen Precision Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lingsen Precision Ind Ltd filed Critical Lingsen Precision Ind Ltd
Priority to TW94122635A priority Critical patent/TWI253762B/en
Application granted granted Critical
Publication of TWI253762B publication Critical patent/TWI253762B/en
Publication of TW200703677A publication Critical patent/TW200703677A/en

Links

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

The present invention relates to a packaging process of elements and manufactures thereof. An integral housing substrate is connected to and combined with the interlocking latch of an integral lower substrate. The chip to be packaged is fixed onto the space between the integral housing substrate and the integral lower substrate. After that, singulation is proceeded to complete the packaging process of chips. By applying the steps of the present invention, the elements packaged can be reduced to thin and small sizes and has lands on the bottom to form land pattern as lead, making the packaging on printed circuit boards more easily. In addition, the invention is capable of increasing the yield and the quality of the packaging process so as to reduce the cost thereof.
TW94122635A 2005-07-05 2005-07-05 Packaging process of elements and manufactures thereof TWI253762B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94122635A TWI253762B (en) 2005-07-05 2005-07-05 Packaging process of elements and manufactures thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94122635A TWI253762B (en) 2005-07-05 2005-07-05 Packaging process of elements and manufactures thereof

Publications (2)

Publication Number Publication Date
TWI253762B TWI253762B (en) 2006-04-21
TW200703677A true TW200703677A (en) 2007-01-16

Family

ID=37586705

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94122635A TWI253762B (en) 2005-07-05 2005-07-05 Packaging process of elements and manufactures thereof

Country Status (1)

Country Link
TW (1) TWI253762B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI499372B (en) * 2012-01-20 2015-09-01 Universal Scient Ind Co Ltd Package structure with conformal shielding and detection method using the same
TWI619224B (en) * 2017-03-30 2018-03-21 矽品精密工業股份有限公司 Electronic package and the manufacture thereof
TWI666754B (en) * 2015-09-18 2019-07-21 財團法人工業技術研究院 Semiconductor package structure
US10672677B2 (en) 2015-09-18 2020-06-02 Industrial Technology Research Institute Semiconductor package structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI499372B (en) * 2012-01-20 2015-09-01 Universal Scient Ind Co Ltd Package structure with conformal shielding and detection method using the same
TWI666754B (en) * 2015-09-18 2019-07-21 財團法人工業技術研究院 Semiconductor package structure
US10672677B2 (en) 2015-09-18 2020-06-02 Industrial Technology Research Institute Semiconductor package structure
TWI619224B (en) * 2017-03-30 2018-03-21 矽品精密工業股份有限公司 Electronic package and the manufacture thereof

Also Published As

Publication number Publication date
TWI253762B (en) 2006-04-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees