TW200703677A - Packaging process of elements and manufactures thereof - Google Patents
Packaging process of elements and manufactures thereofInfo
- Publication number
- TW200703677A TW200703677A TW094122635A TW94122635A TW200703677A TW 200703677 A TW200703677 A TW 200703677A TW 094122635 A TW094122635 A TW 094122635A TW 94122635 A TW94122635 A TW 94122635A TW 200703677 A TW200703677 A TW 200703677A
- Authority
- TW
- Taiwan
- Prior art keywords
- packaging process
- elements
- manufactures
- integral
- packaged
- Prior art date
Links
Landscapes
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The present invention relates to a packaging process of elements and manufactures thereof. An integral housing substrate is connected to and combined with the interlocking latch of an integral lower substrate. The chip to be packaged is fixed onto the space between the integral housing substrate and the integral lower substrate. After that, singulation is proceeded to complete the packaging process of chips. By applying the steps of the present invention, the elements packaged can be reduced to thin and small sizes and has lands on the bottom to form land pattern as lead, making the packaging on printed circuit boards more easily. In addition, the invention is capable of increasing the yield and the quality of the packaging process so as to reduce the cost thereof.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94122635A TWI253762B (en) | 2005-07-05 | 2005-07-05 | Packaging process of elements and manufactures thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94122635A TWI253762B (en) | 2005-07-05 | 2005-07-05 | Packaging process of elements and manufactures thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI253762B TWI253762B (en) | 2006-04-21 |
TW200703677A true TW200703677A (en) | 2007-01-16 |
Family
ID=37586705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94122635A TWI253762B (en) | 2005-07-05 | 2005-07-05 | Packaging process of elements and manufactures thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI253762B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI499372B (en) * | 2012-01-20 | 2015-09-01 | Universal Scient Ind Co Ltd | Package structure with conformal shielding and detection method using the same |
TWI619224B (en) * | 2017-03-30 | 2018-03-21 | 矽品精密工業股份有限公司 | Electronic package and the manufacture thereof |
TWI666754B (en) * | 2015-09-18 | 2019-07-21 | 財團法人工業技術研究院 | Semiconductor package structure |
US10672677B2 (en) | 2015-09-18 | 2020-06-02 | Industrial Technology Research Institute | Semiconductor package structure |
-
2005
- 2005-07-05 TW TW94122635A patent/TWI253762B/en not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI499372B (en) * | 2012-01-20 | 2015-09-01 | Universal Scient Ind Co Ltd | Package structure with conformal shielding and detection method using the same |
TWI666754B (en) * | 2015-09-18 | 2019-07-21 | 財團法人工業技術研究院 | Semiconductor package structure |
US10672677B2 (en) | 2015-09-18 | 2020-06-02 | Industrial Technology Research Institute | Semiconductor package structure |
TWI619224B (en) * | 2017-03-30 | 2018-03-21 | 矽品精密工業股份有限公司 | Electronic package and the manufacture thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI253762B (en) | 2006-04-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009099834A3 (en) | Wafer level chip scale package and process of manufacture | |
WO2009002478A3 (en) | Integrated antenna and chip package and method of manufacturing thereof | |
WO2006035321A3 (en) | Structurally-enhanced integrated circuit package and method of manufacture | |
WO2004112095A3 (en) | Thermoplastic fluxing underfill composition and method | |
WO2010027890A3 (en) | Mainboard assembly including a package overlying a die directly attached to the mainboard | |
TW200710867A (en) | Semiconductor memory card and manufacturing method thereof | |
WO2009120633A3 (en) | Semiconductor package with embedded magnetic component and method of manufacture | |
WO2009105367A3 (en) | Integrated circuit package and method of manufacturing same | |
IL194564A0 (en) | An electronic inlay module for electronic cards and tags, electronic cards and methods for manufacturing such electronic inlay modules and cards | |
MY163911A (en) | Leadless integrated circuit package having high density contacts | |
TWI319616B (en) | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | |
TW200737444A (en) | Semiconductor device and method of forming the same | |
TW200644187A (en) | Semiconductor device and method for manufacturing semiconductor device | |
TW200627562A (en) | Chip electrical connection structure and fabrication method thereof | |
WO2011088384A3 (en) | Solder pillars in flip chip assembly and manufacturing method thereof | |
TW200620593A (en) | Flip chip package with anti-floating mechanism | |
TW200640315A (en) | Electrically connecting structure of circuit board and method for fabricating same | |
MY139752A (en) | Encapsulated chip scale package having flip-chip on lead frame structure and method | |
TW200703677A (en) | Packaging process of elements and manufactures thereof | |
TW200616241A (en) | Substrate design to improve chip package reliability | |
TW200723495A (en) | Chip package structure | |
TW200721415A (en) | Circuit under pad and method of forming a pad | |
TW200703608A (en) | Polygonal, rounded, and circular flip chip ball grid array board | |
TW200634646A (en) | RFID tag, module component, and RFID tag fabrication method | |
WO2010144823A3 (en) | Method for manufacturing tight pitch, flip chip integrated circuit packages |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |