TW200702914A - Radiation sensitive resin composition, projections, spacers, vertically aligned type liquid crystal display element, and the method for forming projections and spacers - Google Patents

Radiation sensitive resin composition, projections, spacers, vertically aligned type liquid crystal display element, and the method for forming projections and spacers

Info

Publication number
TW200702914A
TW200702914A TW095114620A TW95114620A TW200702914A TW 200702914 A TW200702914 A TW 200702914A TW 095114620 A TW095114620 A TW 095114620A TW 95114620 A TW95114620 A TW 95114620A TW 200702914 A TW200702914 A TW 200702914A
Authority
TW
Taiwan
Prior art keywords
spacers
projections
liquid crystal
resin composition
crystal display
Prior art date
Application number
TW095114620A
Other languages
Chinese (zh)
Inventor
Takaki Minowa
Eiji Takamoto
Masaaki Hanamura
Koji Mitani
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200702914A publication Critical patent/TW200702914A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Liquid Crystal (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

This invention provides a radiation sensitive resin composition suitably used to concurrently form projections and spacers of vertically aligned type liquid crystal display element. This invention provides a radiation sensitive resin composition used to concurrently form projections and spacers of vertically aligned type liquid crystal display element, which is characterized by comprising the following: [A] a copolymer copolymerized by the following (a1) to (a4), wherein (a1) is a unsaturated carboxylic acid and/or unsaturated carboxylic acid anhydride, (a2) epoxy-containing unsaturated compound, and (a3) unsaturated compounds represented by the following formula (1), and (a4) olefin unsaturated compounds other than the above mentioned components (a1), (a2) and (a3); (wherein, R1 is hydrogen atom or methyl, R2, R3 and R4 are independently each other, hydrogen atom, hydroxy or alkyl or alkoxy of 1 to 6 carbon atoms, n is a integer of 0 to 6); and [B] 1,2-quinodiazide compound.
TW095114620A 2005-04-26 2006-04-25 Radiation sensitive resin composition, projections, spacers, vertically aligned type liquid crystal display element, and the method for forming projections and spacers TW200702914A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005127255A JP4742662B2 (en) 2005-04-26 2005-04-26 Radiation-sensitive resin composition, protrusions and spacers formed therefrom, and liquid crystal display device comprising the same

Publications (1)

Publication Number Publication Date
TW200702914A true TW200702914A (en) 2007-01-16

Family

ID=37475614

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114620A TW200702914A (en) 2005-04-26 2006-04-25 Radiation sensitive resin composition, projections, spacers, vertically aligned type liquid crystal display element, and the method for forming projections and spacers

Country Status (4)

Country Link
JP (1) JP4742662B2 (en)
KR (1) KR20060112225A (en)
CN (1) CN101059651A (en)
TW (1) TW200702914A (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4713262B2 (en) * 2005-07-22 2011-06-29 昭和電工株式会社 Photosensitive resin composition
JP4644857B2 (en) * 2005-07-22 2011-03-09 昭和電工株式会社 Photosensitive resin composition
JP4656316B2 (en) * 2005-12-22 2011-03-23 Ｊｓｒ株式会社 Interlayer insulating film, microlens, and manufacturing method thereof
JP4884876B2 (en) * 2006-08-07 2012-02-29 東京応化工業株式会社 Photosensitive resin composition for interlayer insulation film
JP5158314B2 (en) * 2007-02-02 2013-03-06 Ｊｓｒ株式会社 Liquid crystal aligning agent and liquid crystal display element
JP5276003B2 (en) 2007-09-28 2013-08-28 東京応化工業株式会社 Copolymer, resin composition, display panel spacer, planarization film, thermosetting protective film, microlens, and copolymer production method
JP2009214419A (en) * 2008-03-11 2009-09-24 Fujifilm Corp Image forming method and cured matter made by using the same
JP5210201B2 (en) * 2009-02-24 2013-06-12 東京応化工業株式会社 Photosensitive resin composition, dry film, and pattern forming method
JP4516150B1 (en) * 2009-02-27 2010-08-04 昭和高分子株式会社 Photosensitive resin composition
JP5105113B2 (en) * 2010-03-05 2012-12-19 Ｊｓｒ株式会社 Manufacturing method of liquid crystal display element
TW201314389A (en) * 2011-09-29 2013-04-01 Wistron Corp Method of fabricating photo spacer and liquid crystal display and array substrate
JP6048117B2 (en) * 2012-03-22 2016-12-21 Jsr株式会社 Liquid crystal aligning agent, liquid crystal alignment film, liquid crystal display element, and method for manufacturing liquid crystal display element
KR102128536B1 (en) 2017-07-04 2020-06-30 주식회사 엘지화학 POSITIVE-WORKING PHOTORESIST COMPOSITION, PATTERN USING THE SAME, and MANUFACTURING METHOD OF THE PATTERN
CN107329330B (en) * 2017-07-28 2020-05-19 武汉华星光电技术有限公司 Liquid crystal display panel, manufacturing method thereof and columnar spacer
EP4166322A4 (en) * 2020-06-12 2024-02-28 Toppan Inc Resin composition and film

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3484808B2 (en) * 1995-03-24 2004-01-06 Ｊｓｒ株式会社 Radiation-sensitive resin composition for forming interlayer insulating film, interlayer insulating film and method of manufacturing the same
JP4492393B2 (en) * 2005-03-08 2010-06-30 チッソ株式会社 Photosensitive composition and display element using the same

Also Published As

Publication number Publication date
JP2006308612A (en) 2006-11-09
CN101059651A (en) 2007-10-24
JP4742662B2 (en) 2011-08-10
KR20060112225A (en) 2006-10-31

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