TW200643231A - Electrolyte and method for depositing tin-bismuth alloy layers - Google Patents

Electrolyte and method for depositing tin-bismuth alloy layers

Info

Publication number
TW200643231A
TW200643231A TW095113052A TW95113052A TW200643231A TW 200643231 A TW200643231 A TW 200643231A TW 095113052 A TW095113052 A TW 095113052A TW 95113052 A TW95113052 A TW 95113052A TW 200643231 A TW200643231 A TW 200643231A
Authority
TW
Taiwan
Prior art keywords
electrolyte
depositing tin
alloy layers
bismuth alloy
tin
Prior art date
Application number
TW095113052A
Other languages
Chinese (zh)
Other versions
TWI328052B (en
Inventor
Manfred Jordan
Original Assignee
Schlotter Gmbh & Co Kg Max Dr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlotter Gmbh & Co Kg Max Dr filed Critical Schlotter Gmbh & Co Kg Max Dr
Publication of TW200643231A publication Critical patent/TW200643231A/en
Application granted granted Critical
Publication of TWI328052B publication Critical patent/TWI328052B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Abstract

The present invention describes an acid electrolyte for depositing tin-bismuth alloys, comprising one .or more alkylsulfonic acids and/or alkanolsulfonic acids, one or more soluble tin (II) salts, one or more soluble bismuth (III) salts, one or more nonionic surfactants, and one or more thiazole and/or thiadiazole compounds. In addition, a method that uses the electrolyte, the coating obtained by using the method, and the use of the electrolyte for coating electronic components will be made available.
TW095113052A 2005-04-12 2006-04-12 Electrolyte and method for depositing tin-bismuth alloy layers TWI328052B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510016819 DE102005016819B4 (en) 2005-04-12 2005-04-12 Electrolyte, process for the deposition of tin-bismuth alloy layers and use of the electrolyte
PCT/EP2006/002183 WO2006108476A2 (en) 2005-04-12 2006-03-09 Electrolyte and method for depositing tin bismuth alloy layers

Publications (2)

Publication Number Publication Date
TW200643231A true TW200643231A (en) 2006-12-16
TWI328052B TWI328052B (en) 2010-08-01

Family

ID=36527525

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113052A TWI328052B (en) 2005-04-12 2006-04-12 Electrolyte and method for depositing tin-bismuth alloy layers

Country Status (5)

Country Link
JP (1) JP5278675B2 (en)
KR (1) KR20070120592A (en)
DE (1) DE102005016819B4 (en)
TW (1) TWI328052B (en)
WO (1) WO2006108476A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115029745A (en) * 2022-07-08 2022-09-09 云南锡业集团（控股）有限责任公司研发中心 Method capable of reducing element plating process steps and improving welding spot reliability

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2419551A2 (en) * 2009-03-18 2012-02-22 Basf Se Electrolyte and surface-active additives for the galvanic deposition of smooth, dense aluminum layers from ionic liquids
US8940433B2 (en) * 2009-12-15 2015-01-27 Basf Se Thiazole compounds as additives in electrolyte solutions in electrochemical cells and batteries
CN112701351B (en) * 2020-12-29 2022-08-19 中国科学院宁波材料技术与工程研究所 Non-aqueous electrolyte, preparation method thereof and lithium ion battery
CN113293409B (en) * 2021-05-28 2022-06-24 中南大学 Method for preparing compact and flat bismuth metal through electrolysis

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JPH0781196B2 (en) * 1986-07-04 1995-08-30 株式会社大和化成研究所 Bismuth and bismuth alloy plating baths from organic sulfonates
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
BR8807847A (en) * 1988-10-14 1990-11-13 Atochem North America METHOD, BATH AND CELL FOR THE ELECTRODEPOSITION OF TIN-BISMUT ALLOYS
JP3274232B2 (en) * 1993-06-01 2002-04-15 ディップソール株式会社 Tin-bismuth alloy plating bath and plating method using the same
JPH1025595A (en) * 1996-07-12 1998-01-27 Ishihara Chem Co Ltd Tin and tin alloy plating bath
JP3292055B2 (en) * 1996-09-03 2002-06-17 上村工業株式会社 Tin-bismuth alloy electroplating bath and plating method using the same
JP2000100850A (en) * 1998-09-24 2000-04-07 Ebara Udylite Kk Formation of low-melting point metal bump
JP4077119B2 (en) * 1999-06-30 2008-04-16 エヌ・イーケムキャット株式会社 Tin-bismuth alloy electroplating bath and plating method
JP2001040497A (en) * 1999-07-27 2001-02-13 Ne Chemcat Corp Electronic parts coated with tin-bismuth alloy plated film
EP1167582B1 (en) * 2000-07-01 2005-09-14 Shipley Company LLC Metal alloy compositions and plating method related thereto
US6726827B2 (en) * 2002-01-17 2004-04-27 Lucent Technologies Inc. Electroplating solution for high speed plating of tin-bismuth solder
JP4441726B2 (en) * 2003-01-24 2010-03-31 石原薬品株式会社 Method for producing tin or tin alloy aliphatic sulfonic acid plating bath
JP4441725B2 (en) * 2003-11-04 2010-03-31 石原薬品株式会社 Electric tin alloy plating method
JP4524483B2 (en) * 2004-04-28 2010-08-18 石原薬品株式会社 Tin or tin alloy plating method
JP4389083B2 (en) * 2004-08-10 2009-12-24 石原薬品株式会社 Lead-free tin-bismuth alloy electroplating bath
JP4605359B2 (en) * 2004-10-20 2011-01-05 石原薬品株式会社 Lead-free acid tin-bismuth alloy electroplating bath
JP4273266B2 (en) * 2005-03-23 2009-06-03 石原薬品株式会社 Dissolving current suppression type tin alloy electroplating method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115029745A (en) * 2022-07-08 2022-09-09 云南锡业集团（控股）有限责任公司研发中心 Method capable of reducing element plating process steps and improving welding spot reliability

Also Published As

Publication number Publication date
WO2006108476A3 (en) 2007-05-31
JP5278675B2 (en) 2013-09-04
DE102005016819A1 (en) 2006-10-19
WO2006108476A2 (en) 2006-10-19
TWI328052B (en) 2010-08-01
JP2008536011A (en) 2008-09-04
DE102005016819B4 (en) 2009-10-01
KR20070120592A (en) 2007-12-24

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