TW200637930A - Film forming device, film forming method, and method of producing organic el element - Google Patents

Film forming device, film forming method, and method of producing organic el element

Info

Publication number
TW200637930A
TW200637930A TW095105911A TW95105911A TW200637930A TW 200637930 A TW200637930 A TW 200637930A TW 095105911 A TW095105911 A TW 095105911A TW 95105911 A TW95105911 A TW 95105911A TW 200637930 A TW200637930 A TW 200637930A
Authority
TW
Taiwan
Prior art keywords
film forming
substrate
forming device
producing organic
magnet
Prior art date
Application number
TW095105911A
Other languages
Chinese (zh)
Other versions
TWI327175B (en
Inventor
Tatsuya Kataoka
Kenji Nagao
Kenichi Saito
Original Assignee
Mitsui Shipbuilding Eng
Vieetech Japan Co Ltd
Choshu Industry Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Shipbuilding Eng, Vieetech Japan Co Ltd, Choshu Industry Company Ltd filed Critical Mitsui Shipbuilding Eng
Publication of TW200637930A publication Critical patent/TW200637930A/en
Application granted granted Critical
Publication of TWI327175B publication Critical patent/TWI327175B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02664—Aftertreatments
    • H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H01L21/02678—Beam shaping, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A film forming device has a source for feeding a film forming material and a substrate on which a film of the film forming material is formed. The film forming device is constructed from a mask (36) provided on the front side of the substrate so as to be movable in a direction approaching and leaving the front surface of the substrate; a magnet (22) provided on the rear side of the substrate so as to be movable in a direction approaching and leaving the rear side of the substrate; and a movement limitation means (24) for limiting the movement of the magnet (22) within a predetermined range.
TW095105911A 2005-03-24 2006-02-22 Film forming device, film forming method, and method of producing organic el element TW200637930A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005086687A JP4609759B2 (en) 2005-03-24 2005-03-24 Deposition equipment

Publications (2)

Publication Number Publication Date
TW200637930A true TW200637930A (en) 2006-11-01
TWI327175B TWI327175B (en) 2010-07-11

Family

ID=37023545

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105911A TW200637930A (en) 2005-03-24 2006-02-22 Film forming device, film forming method, and method of producing organic el element

Country Status (5)

Country Link
JP (1) JP4609759B2 (en)
KR (1) KR100925362B1 (en)
CN (2) CN101090995A (en)
TW (1) TW200637930A (en)
WO (1) WO2006100867A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475736B (en) * 2011-07-26 2015-03-01 Innolux Corp Manufacturing method of electroluminescent display apparatus and plating machine

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US20100273387A1 (en) * 2007-12-27 2010-10-28 Canon Anelva Corporation Processing Apparatus and Method of Manufacturing Electron Emission Element and Organic EL Display
KR101107181B1 (en) * 2010-01-04 2012-01-25 삼성모바일디스플레이주식회사 Magnetic assembly for contacting a mask
KR101084185B1 (en) 2010-01-12 2011-11-17 삼성모바일디스플레이주식회사 Method for forming pattern and manufacturing method for organic light emitting device
KR101203171B1 (en) 2012-05-22 2012-11-21 주식회사 아이.엠.텍 Align the device for glass substrate bonding
KR101951029B1 (en) * 2012-06-13 2019-04-26 삼성디스플레이 주식회사 Mask for deposition and method for manufacturing organic light emitting diode display using the same
KR102000718B1 (en) * 2012-11-15 2019-07-19 삼성디스플레이 주식회사 Mask assembly for thin film vapor deposition and manufacturing method thereof
KR102081282B1 (en) * 2013-05-27 2020-02-26 삼성디스플레이 주식회사 Substrate transfer unit for deposition, deposition apparatus comprising the same, method for manufacturing organic light emitting display apparatus using the same, organic light emitting display apparatus manufacture by the method
KR102270080B1 (en) * 2013-10-30 2021-06-29 삼성디스플레이 주식회사 Thin film depositing apparatus
KR102273050B1 (en) 2014-09-17 2021-07-06 삼성디스플레이 주식회사 Apparatus for deposition comprising a mask assembly for deposition and depositing method using a mask assembly for deposition
KR102250047B1 (en) 2014-10-31 2021-05-11 삼성디스플레이 주식회사 Mask frame assembly, manufacturing method of the same and manufacturing method of organic light emitting display device there used
KR102280269B1 (en) 2014-11-05 2021-07-22 삼성디스플레이 주식회사 Mask frame assembly for deposition, manufacturing method of the same
US10947616B2 (en) 2015-04-17 2021-03-16 Dai Nippon Printing Co., Ltd. Method for forming vapor deposition pattern, pressing-plate-integrated type pressing member, vapor deposition apparatus, and method for producing organic semiconductor element
KR102404576B1 (en) 2015-04-24 2022-06-03 삼성디스플레이 주식회사 Mask frame assembly for thin layer deposition, manufacturing method of the same and manufacturing method of display device there used
JP6298138B2 (en) * 2015-11-25 2018-03-20 キヤノントッキ株式会社 Film forming system, magnetic body part, and film manufacturing method
CN105428552B (en) * 2015-12-31 2017-06-09 昆山国显光电有限公司 OLED luminescent layer forming method
CN105568224B (en) * 2016-01-28 2018-09-21 京东方科技集团股份有限公司 Vapor deposition radical occlusion device and evaporated device
KR102505877B1 (en) 2016-01-29 2023-03-06 삼성디스플레이 주식회사 Mask frame assembly and method for manufacturing display apparatus using the same
JP6662102B2 (en) * 2016-02-29 2020-03-11 富士ゼロックス株式会社 Optical device manufacturing method, substrate device, optical device, and optical device manufacturing device
US20190292653A1 (en) * 2016-05-18 2019-09-26 Stefan Bangert Apparatus and method for transportation of a deposition source
CN106048536A (en) * 2016-06-06 2016-10-26 京东方科技集团股份有限公司 Evaporation device and machining method for to-be-evaporated base plate
JP6309048B2 (en) * 2016-07-01 2018-04-11 キヤノントッキ株式会社 Mask suction device
KR102544244B1 (en) 2016-07-19 2023-06-19 삼성디스플레이 주식회사 Mask frame assembly
CN106399936B (en) * 2016-12-09 2018-12-21 京东方科技集团股份有限公司 A kind of evaporated device and evaporation coating method
CN106978585A (en) * 2017-04-25 2017-07-25 昆山国显光电有限公司 Fixing device and evaporation coating device
CN107686960B (en) * 2017-07-25 2019-12-17 武汉华星光电半导体显示技术有限公司 Film forming device
KR101952521B1 (en) * 2017-10-31 2019-02-26 캐논 톡키 가부시키가이샤 Film forming apparatus, film forming method and manufacturing method of electronic device
KR101993532B1 (en) * 2017-11-29 2019-06-26 캐논 톡키 가부시키가이샤 Film formation apparatus, film formation method and manufacturing method of electronic device
KR101953038B1 (en) * 2017-12-13 2019-02-27 캐논 톡키 가부시키가이샤 Electrostatic chuck device, mask attaching device, film-forming apparatus, film-forming method, and method for manufacturing electronic device
JP7188973B2 (en) * 2018-10-15 2022-12-13 キヤノントッキ株式会社 Film forming apparatus, manufacturing system, organic EL panel manufacturing system, film forming method, and organic EL element manufacturing method
JP7118864B2 (en) * 2018-11-07 2022-08-16 キヤノントッキ株式会社 Film deposition equipment, manufacturing system, organic EL panel manufacturing system
KR20200104969A (en) * 2019-02-27 2020-09-07 캐논 톡키 가부시키가이샤 Alignment apparatus, film forming apparatus, alignment method, film forming method and manufacturing method of electronic device
CN109837509B (en) * 2019-04-04 2024-03-01 江苏集萃有机光电技术研究所有限公司 Substrate sample holder, coating equipment and control method
JP7420496B2 (en) * 2019-07-05 2024-01-23 キヤノントッキ株式会社 Mask holding mechanisms, vapor deposition equipment, and electronic device manufacturing equipment
KR20210081700A (en) * 2019-12-24 2021-07-02 캐논 톡키 가부시키가이샤 Film forming apparatus and electronic device manufacturing method using the same
KR102464025B1 (en) * 2021-02-03 2022-11-07 파인원 주식회사 Magnet plate assembly

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TWI475736B (en) * 2011-07-26 2015-03-01 Innolux Corp Manufacturing method of electroluminescent display apparatus and plating machine

Also Published As

Publication number Publication date
JP4609759B2 (en) 2011-01-12
KR100925362B1 (en) 2009-11-09
TWI327175B (en) 2010-07-11
CN101090995A (en) 2007-12-19
WO2006100867A1 (en) 2006-09-28
CN103820755A (en) 2014-05-28
JP2006265650A (en) 2006-10-05
KR20070090018A (en) 2007-09-04

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