TW200633809A - Method and device for separating products with a controlled cut edge, and separated product - Google Patents
Method and device for separating products with a controlled cut edge, and separated productInfo
- Publication number
- TW200633809A TW200633809A TW095109431A TW95109431A TW200633809A TW 200633809 A TW200633809 A TW 200633809A TW 095109431 A TW095109431 A TW 095109431A TW 95109431 A TW95109431 A TW 95109431A TW 200633809 A TW200633809 A TW 200633809A
- Authority
- TW
- Taiwan
- Prior art keywords
- cut edge
- separated product
- separating products
- controlled cut
- relates
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/3568—Modifying rugosity
- B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/08—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for flash removal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Abstract
The invention relates to a method for separating products, in particular semiconductor circuits, from a shared carrier by means of laser cutting. The invention also relates to a device for applying this method. The invention further also relates to a product, in particular a semiconductor mounted on a carrier, separated by means of a laser beam using such a method.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1028588A NL1028588C2 (en) | 2005-03-22 | 2005-03-22 | Method and device for separating products with a controlled cut edge and separated product. |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200633809A true TW200633809A (en) | 2006-10-01 |
TWI465310B TWI465310B (en) | 2014-12-21 |
Family
ID=35453332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095109431A TWI465310B (en) | 2005-03-22 | 2006-03-20 | Method and device for separating products with a controlled cut edge, and separated product |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1905067A1 (en) |
JP (1) | JP2008537511A (en) |
KR (1) | KR20070121793A (en) |
CN (1) | CN101147241B (en) |
NL (1) | NL1028588C2 (en) |
TW (1) | TWI465310B (en) |
WO (1) | WO2006118454A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104465414B (en) * | 2009-07-06 | 2017-08-15 | 瑞萨电子株式会社 | The manufacture method of semiconductor devices |
WO2016033477A1 (en) * | 2014-08-28 | 2016-03-03 | Ipg Photonics Corporation | Multi-laser system and method for cutting and post-cut processing hard dielectric materials |
CN106346143B (en) * | 2016-11-24 | 2018-05-25 | 武汉华星光电技术有限公司 | A kind of laser cutting machine and its cutting method |
SI25748A (en) * | 2018-12-07 | 2020-06-30 | Intech-Les, Razvojni Center D.O.O. | Area roughness improvement with laser |
EP3685954B1 (en) * | 2019-01-22 | 2024-01-24 | Synova S.A. | Method for cutting a workpiece with a complex fluid-jet-guided laser beam |
EP4035823B1 (en) * | 2019-02-25 | 2024-02-21 | WSoptics technologies GmbH | Process for beam processing of a plate or tubular workpiece |
JP7387870B2 (en) * | 2019-07-29 | 2023-11-28 | ダブリュ・エス・オプティクス テクノロジーズ ゲー・エム・ベー・ハー | Method for beam machining plate or tubular workpieces |
CN113199149B (en) * | 2020-01-15 | 2023-08-11 | 大族激光科技产业集团股份有限公司 | Processing technology for removing coating by laser |
CN112404745A (en) * | 2020-11-02 | 2021-02-26 | 中国航空工业集团公司北京长城航空测控技术研究所 | Ultrafast laser leveling method for cut surface of thin crystal device |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3626143A (en) * | 1969-04-02 | 1971-12-07 | American Can Co | Scoring of materials with laser energy |
US5368900A (en) * | 1991-11-04 | 1994-11-29 | Motorola, Inc. | Multistep laser ablation method for making optical waveguide reflector |
EP0820640B1 (en) * | 1996-02-09 | 2011-07-13 | Advanced Laser Separation International (ALSI) B.V. | Laser separation of semiconductor elements formed in a wafer of semiconductor material |
JP4396953B2 (en) * | 1998-08-26 | 2010-01-13 | 三星電子株式会社 | Laser cutting apparatus and cutting method |
US6413839B1 (en) * | 1998-10-23 | 2002-07-02 | Emcore Corporation | Semiconductor device separation using a patterned laser projection |
US6420678B1 (en) * | 1998-12-01 | 2002-07-16 | Brian L. Hoekstra | Method for separating non-metallic substrates |
AU6178200A (en) * | 1999-08-03 | 2001-02-19 | Xsil Technology Limited | A circuit singulation system and method |
KR100634750B1 (en) * | 1999-12-07 | 2006-10-16 | 삼성전자주식회사 | Laser cutting equipment |
WO2001076808A2 (en) * | 2000-04-11 | 2001-10-18 | Gsi Lumonics Inc. | A method and system for laser drilling |
IE20010944A1 (en) * | 2000-12-15 | 2002-08-21 | Xsil Technology Ltd | Laser machining of semiconductor materials |
US6677552B1 (en) * | 2001-11-30 | 2004-01-13 | Positive Light, Inc. | System and method for laser micro-machining |
-
2005
- 2005-03-22 NL NL1028588A patent/NL1028588C2/en not_active IP Right Cessation
-
2006
- 2006-03-20 TW TW095109431A patent/TWI465310B/en not_active IP Right Cessation
- 2006-03-21 CN CN2006800092257A patent/CN101147241B/en not_active Expired - Fee Related
- 2006-03-21 EP EP06716694A patent/EP1905067A1/en not_active Withdrawn
- 2006-03-21 JP JP2008502936A patent/JP2008537511A/en not_active Ceased
- 2006-03-21 WO PCT/NL2006/050061 patent/WO2006118454A1/en active Application Filing
- 2006-03-21 KR KR1020077024212A patent/KR20070121793A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
NL1028588C2 (en) | 2006-09-25 |
CN101147241B (en) | 2011-01-12 |
JP2008537511A (en) | 2008-09-18 |
KR20070121793A (en) | 2007-12-27 |
CN101147241A (en) | 2008-03-19 |
TWI465310B (en) | 2014-12-21 |
WO2006118454A1 (en) | 2006-11-09 |
EP1905067A1 (en) | 2008-04-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |