TW200632576A - Exposure apparatus, exposure method and manufacturing method of device - Google Patents

Exposure apparatus, exposure method and manufacturing method of device

Info

Publication number
TW200632576A
TW200632576A TW094142437A TW94142437A TW200632576A TW 200632576 A TW200632576 A TW 200632576A TW 094142437 A TW094142437 A TW 094142437A TW 94142437 A TW94142437 A TW 94142437A TW 200632576 A TW200632576 A TW 200632576A
Authority
TW
Taiwan
Prior art keywords
optical element
exposure
space
gas
liquid
Prior art date
Application number
TW094142437A
Other languages
English (en)
Inventor
Takaya Okada
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200632576A publication Critical patent/TW200632576A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/12—Fluid-filled or evacuated lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electroluminescent Light Sources (AREA)
TW094142437A 2004-12-02 2005-12-02 Exposure apparatus, exposure method and manufacturing method of device TW200632576A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004349729 2004-12-02

Publications (1)

Publication Number Publication Date
TW200632576A true TW200632576A (en) 2006-09-16

Family

ID=36565152

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094142437A TW200632576A (en) 2004-12-02 2005-12-02 Exposure apparatus, exposure method and manufacturing method of device

Country Status (8)

Country Link
US (1) US20080192222A1 (zh)
EP (1) EP1830394A4 (zh)
JP (1) JP4720747B2 (zh)
KR (1) KR20070083492A (zh)
CN (1) CN100483625C (zh)
IL (1) IL183515A0 (zh)
TW (1) TW200632576A (zh)
WO (1) WO2006059720A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI700557B (zh) * 2012-07-20 2020-08-01 日商尼康股份有限公司 液浸構件、曝光裝置、曝光方法、元件製造方法、程式、及記錄媒體

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007081390A (ja) * 2005-08-17 2007-03-29 Nikon Corp 観察装置、計測装置、露光装置及び露光方法、並びにデバイス製造方法、デバイス製造用基板、位置決め装置
US7804577B2 (en) * 2005-11-16 2010-09-28 Asml Netherlands B.V. Lithographic apparatus
US7864292B2 (en) 2005-11-16 2011-01-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8027023B2 (en) 2006-05-19 2011-09-27 Carl Zeiss Smt Gmbh Optical imaging device and method for reducing dynamic fluctuations in pressure difference
DE102006023876A1 (de) * 2006-05-19 2007-11-22 Carl Zeiss Smt Ag Optische Abbildungseinrichtung
US7826030B2 (en) 2006-09-07 2010-11-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20110261344A1 (en) * 2009-12-31 2011-10-27 Mapper Lithography Ip B.V. Exposure method
JP2012134290A (ja) * 2010-12-21 2012-07-12 Nikon Corp 露光装置、露光装置のステージ製造方法及びデバイス製造方法
CN104808446B (zh) 2015-05-07 2021-02-02 合肥京东方光电科技有限公司 一种涂布机
NL2017691A (en) 2015-11-20 2017-06-02 Asml Netherlands Bv Lithographic Apparatus and Method
CN112684675B (zh) * 2020-12-30 2023-02-21 浙江启尔机电技术有限公司 真空***及使用该真空***的浸没式光刻机

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346164A (en) * 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPS57153433A (en) * 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JP2753930B2 (ja) * 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
US5874820A (en) * 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US5528118A (en) * 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US5623853A (en) * 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
JPH08316124A (ja) * 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
US5825043A (en) * 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
US6043863A (en) * 1996-11-14 2000-03-28 Nikon Corporation Holder for reflecting member and exposure apparatus having the same
WO1998028665A1 (en) * 1996-12-24 1998-07-02 Koninklijke Philips Electronics N.V. Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device
WO1999010917A1 (fr) * 1997-08-26 1999-03-04 Nikon Corporation Dispositif d'alignement, procede d'exposition, procede de regulation de la pression d'un systeme optique de projection, et procede de montage du dispositif d'alignement
JP2000031024A (ja) * 1998-07-14 2000-01-28 Mitsubishi Electric Corp 投影露光装置およびそれを用いた露光方法
DE10000193B4 (de) * 2000-01-05 2007-05-03 Carl Zeiss Smt Ag Optisches System
CN101424881B (zh) * 2002-11-12 2011-11-30 Asml荷兰有限公司 光刻投射装置
SG131766A1 (en) * 2002-11-18 2007-05-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7948604B2 (en) * 2002-12-10 2011-05-24 Nikon Corporation Exposure apparatus and method for producing device
KR20130010039A (ko) * 2002-12-10 2013-01-24 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
EP1571698A4 (en) * 2002-12-10 2006-06-21 Nikon Corp EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
JP4608876B2 (ja) * 2002-12-10 2011-01-12 株式会社ニコン 露光装置及びデバイス製造方法
JP4595320B2 (ja) * 2002-12-10 2010-12-08 株式会社ニコン 露光装置、及びデバイス製造方法
KR20050085236A (ko) * 2002-12-10 2005-08-29 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
DE10324477A1 (de) * 2003-05-30 2004-12-30 Carl Zeiss Smt Ag Mikrolithographische Projektionsbelichtungsanlage
KR101520591B1 (ko) * 2003-06-13 2015-05-14 가부시키가이샤 니콘 노광 방법, 기판 스테이지, 노광 장치, 및 디바이스 제조 방법
EP1503244A1 (en) * 2003-07-28 2005-02-02 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method
KR101441840B1 (ko) * 2003-09-29 2014-11-04 가부시키가이샤 니콘 노광장치, 노광방법 및 디바이스 제조방법
JP4466300B2 (ja) * 2003-09-29 2010-05-26 株式会社ニコン 露光装置及び露光方法並びにデバイス製造方法、計測装置
JP4515209B2 (ja) * 2003-10-02 2010-07-28 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法
DE602004027162D1 (de) * 2004-01-05 2010-06-24 Nippon Kogaku Kk Belichtungsvorrichtung, belichtungsverfahren und bauelementeherstellungsverfahren
US20060244938A1 (en) * 2004-05-04 2006-11-02 Karl-Heinz Schuster Microlitographic projection exposure apparatus and immersion liquid therefore
JP5130609B2 (ja) * 2004-06-10 2013-01-30 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法
US8692973B2 (en) * 2005-01-31 2014-04-08 Nikon Corporation Exposure apparatus and method for producing device
TW200702939A (en) * 2005-04-28 2007-01-16 Nikon Corp Exposure method, exposure apparatus, and device producing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI700557B (zh) * 2012-07-20 2020-08-01 日商尼康股份有限公司 液浸構件、曝光裝置、曝光方法、元件製造方法、程式、及記錄媒體

Also Published As

Publication number Publication date
KR20070083492A (ko) 2007-08-24
WO2006059720A1 (ja) 2006-06-08
EP1830394A4 (en) 2009-05-27
US20080192222A1 (en) 2008-08-14
CN101069265A (zh) 2007-11-07
IL183515A0 (en) 2007-09-20
JPWO2006059720A1 (ja) 2008-06-05
CN100483625C (zh) 2009-04-29
JP4720747B2 (ja) 2011-07-13
EP1830394A1 (en) 2007-09-05

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