TW200627022A - Illumination assembly and method of making same - Google Patents
Illumination assembly and method of making sameInfo
- Publication number
- TW200627022A TW200627022A TW094143503A TW94143503A TW200627022A TW 200627022 A TW200627022 A TW 200627022A TW 094143503 A TW094143503 A TW 094143503A TW 94143503 A TW94143503 A TW 94143503A TW 200627022 A TW200627022 A TW 200627022A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive substrate
- thermally conductive
- illumination assembly
- making same
- thermally
- Prior art date
Links
- 238000005286 illumination Methods 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 6
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Devices (AREA)
Abstract
An illumination assembly including a thermally conductive substrate, a reflective layer proximate a first major surface of the thermally conductive substrate, a patterned conductive layer positioned between the reflective layer and the first major surface of the thermally conductive substrate and electrically isolated from the thermally conductive substrate, and at least one LED including a post that is attached to the thermally conductive substrate is disclosed. The at least one LED can be thermally connected to the thermally conductive substrate through the post and electrically connected to the patterned conductive layer.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/018,961 US7296916B2 (en) | 2004-12-21 | 2004-12-21 | Illumination assembly and method of making same |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200627022A true TW200627022A (en) | 2006-08-01 |
Family
ID=36594551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094143503A TW200627022A (en) | 2004-12-21 | 2005-12-09 | Illumination assembly and method of making same |
Country Status (7)
Country | Link |
---|---|
US (1) | US7296916B2 (en) |
EP (1) | EP1829125A2 (en) |
JP (1) | JP4728346B2 (en) |
KR (1) | KR20070089183A (en) |
CN (1) | CN100530717C (en) |
TW (1) | TW200627022A (en) |
WO (1) | WO2006068762A2 (en) |
Families Citing this family (64)
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-
2004
- 2004-12-21 US US11/018,961 patent/US7296916B2/en not_active Expired - Fee Related
-
2005
- 2005-11-23 JP JP2007548235A patent/JP4728346B2/en not_active Expired - Fee Related
- 2005-11-23 WO PCT/US2005/042640 patent/WO2006068762A2/en active Application Filing
- 2005-11-23 CN CNB200580044080XA patent/CN100530717C/en not_active Expired - Fee Related
- 2005-11-23 EP EP05852145A patent/EP1829125A2/en not_active Withdrawn
- 2005-11-23 KR KR1020077014006A patent/KR20070089183A/en active IP Right Grant
- 2005-12-09 TW TW094143503A patent/TW200627022A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2008524826A (en) | 2008-07-10 |
CN100530717C (en) | 2009-08-19 |
EP1829125A2 (en) | 2007-09-05 |
WO2006068762A3 (en) | 2006-11-02 |
CN101084585A (en) | 2007-12-05 |
US20060131596A1 (en) | 2006-06-22 |
KR20070089183A (en) | 2007-08-30 |
JP4728346B2 (en) | 2011-07-20 |
US7296916B2 (en) | 2007-11-20 |
WO2006068762A2 (en) | 2006-06-29 |
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